WO2001050826A1 - Procede et dispositif permettant la realisation d'une structure conductrice sur un substrat - Google Patents

Procede et dispositif permettant la realisation d'une structure conductrice sur un substrat Download PDF

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Publication number
WO2001050826A1
WO2001050826A1 PCT/EP2000/013335 EP0013335W WO0150826A1 WO 2001050826 A1 WO2001050826 A1 WO 2001050826A1 EP 0013335 W EP0013335 W EP 0013335W WO 0150826 A1 WO0150826 A1 WO 0150826A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
conductive structure
carrier
metallization
producing
Prior art date
Application number
PCT/EP2000/013335
Other languages
German (de)
English (en)
Inventor
Carsten Nieland
Christine Kallmayer
Ralf Miessner
Rolf Aschenbrenner
Andreas Ostmann
Original Assignee
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. filed Critical Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
Publication of WO2001050826A1 publication Critical patent/WO2001050826A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0534—Offset printing, i.e. transfer of a pattern from a carrier onto the substrate by using an intermediate member
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Definitions

  • the present invention relates to methods and devices for producing conductive structures on a substrate or on a circuit carrier.
  • the metal is applied to the entire surface of the substrate material.
  • the structuring then takes place in a second step by means of mechanical methods, for example by milling, or by a combination of photolithographic processes and etching methods. The latter two methods are often the cost determining factors in PCB manufacturing. These cost-intensive steps have to be applied to the structuring of each individual substrate. In the known method described, cost reductions are therefore only possible by combining several substrates for one benefit, since here all le substrates of benefit go through a process step simultaneously.
  • the conductor tracks are reinforced via chemical or electrochemical processes or provided with additional functional layers, for example made of nickel or gold.
  • Filled polymer pastes are often used to produce conductor tracks in the production of smart card or label inlets.
  • the printing of polymer conductor tracks is usually unsuitable for producing very fine structures with a conductor path spacing of approximately 100 ⁇ m. Rather, structuring of metal layers on the substrate carrier by means of photolithography and subsequent etching process is necessary. This can result in increased tolerances for the conductor track geometry, in particular when producing conductor tracks on flexible circuit carriers, which can only be processed in small uses or from roll to roll.
  • the object of the present invention is to provide an inexpensive method for producing a conductive structure on a substrate, which also enables the production of very fine, highly precise structures, and also devices which can be used in such a method.
  • a first exemplary embodiment of a reusable tool carrier which can be used according to the invention comprises a carrier element and a primary metallization which is formed on the carrier element and which is structured depending on the conductive structure to be produced, on which the conductive structure can be selectively deposited.
  • a second exemplary embodiment of a reusable tool carrier has a primary metallization and a cover layer which is formed on the primary metallization and, depending on the conductive structure to be produced, has recesses up to the primary metallization.
  • a third exemplary embodiment of a reusable tool carrier for producing a conductive structure comprises recesses which are formed depending on the conductive structure to be produced, into which paste-like or liquid material can be introduced and can be converted into a solid state, in order thereby to produce the conductive structure.
  • the present invention thus creates a method which is composed of two basic processes.
  • the first basic process is the production of a conductive structure, preferably a structured metallization layer, using a reusable tool.
  • the second basic process is then the transfer of this generated conductive structure to a substrate, preferably a circuit carrier.
  • the structuring process of the metallization which is to be the later conductor track, does not take place directly on the substrate, but in a separate step. This means that the substrate does not come into contact with the required structuring processes.
  • the metallization layer is not first applied to the substrate and then structured, nor is the metallization layer produced in a structuring process on the substrate, as is the case, for example, when producing conductor tracks from filled polymer pastes by means of screen printing or when hot stamping metal foils ,
  • the conductive structure is produced on a reusable tool carrier, the same being transferred to the substrate only after completion.
  • conductive structures can be produced in a removable manner on reusable tool carriers. This is possible, for example, if a metallization layer is deposited chemically or electrochemically on a primary metallization. It has been shown that this peelability occurs with a large number of materials, for example stainless steel, titanium, tungsten, vanadium, palladium, chromium or alloys thereof can preferably be used as the primary metallization.
  • the conductive structure can then be produced from copper, aluminum or gold, for example become. Excellent removability has been shown in a preferred exemplary embodiment when using a TiW layer as the primary metallization and the chemical deposition of copper as the conductive structure thereon.
  • an adhesive layer can be provided on the substrate or the intermediate carrier.
  • the reusable tool carrier is again available for reapplication or introduction of a material for producing a conductive structure, as long as it is not damaged by wear. With the conductor track layout remaining the same, a new structuring of the carrier is not necessary.
  • the reusable tool holder is therefore a so-called multiple tool.
  • the method of producing the conductive structures or conductor tracks independently of the substrate on an external carrier, ie the reusable tool carrier, and the subsequent transmission method have decisive advantages over conventional methods for producing conductor tracks on substrates.
  • the tool carrier can be reused for several process runs, depending on the wear. This reusability of the carrier saves costs and environmental pollution due to the structuring processes, ie lithography and etching processes, which are eliminated in comparison with conventional methods.
  • the substrates to which the conductive structure is to be applied come with the structuring process not in contact, so that a reduced load on the substrates takes place.
  • the structuring or the minimal structure widths and spacings that can be generated are independent of the substrate to which the corresponding conductive structure is to be applied.
  • FIG. 1 schematically shows the steps of a preferred method for producing a conductive structure on a substrate according to the present invention
  • Fig. 2 shows schematically the steps of a method for producing a preferred embodiment of a reusable tool holder according to the invention.
  • the method according to the invention can advantageously produce, for example, coil metallizations on ticking foils for labels or contactless chip cards. After the coil metallizations have been produced by the method according to the invention, the foils can then still be provided with corresponding components, e.g. a transponder C, and then laminated.
  • a reusable tool carrier 2 is first provided, which in the exemplary embodiment shown has a carrier element 4 and a primary metallization 6 formed on the carrier element 4.
  • the primary metallization 6 is structured depending on the conductive structure to be produced, so that the conductive structure can be selectively deposited thereon. A method of manufacturing such a reusable tool carrier as shown in FIG. 1 will be explained later with reference to FIG. 2.
  • the carrier element 4 can be formed, for example, by a silicon wafer, a ceramic, a metal plate or a rigid or flexible carrier made of plastic.
  • the structured primary metallization 6 is formed from titanium-tungsten.
  • the conductor metallization 8 is now produced on the primary metallization 6 by selective metal deposition being carried out in a chemical or electrochemical process.
  • the metallization of the reusable tool carrier referred to herein as the primary metallization
  • the adhesion of these metallizations to be deposited on the primary metallization must be sufficiently low to enable the conductor metallization to be removed later.
  • the deposition of the metallization must take place selectively on the primary metallization, wherein deposition on the carrier element 4 must be prevented.
  • the interconnect metallization 8 is produced by chemically depositing a copper layer on the structured titanium-tungsten primary metallization.
  • the tool carrier 2 on which the conductor metallization 8 is produced is shown at S2 in FIG. 1.
  • This interconnect metallization 8 is now transferred to the actual substrate 10, which is shown at S3 in FIG. 1.
  • an adhesive layer 12 preferably an adhesive layer, is provided on a lower surface of the substrate, that is to say the circuit carrier 10.
  • the surface of the tool carrier 2 on which the conductor track metallization 8 is formed and the surface of the substrate 10 on which the adhesive layer 12 is formed are brought together, as shown at S4 in FIG. 1.
  • the reusable tool carrier 2 and the substrate 10 are separated, as a result of which the interconnect metallization 8 is detached from the original metallization 6 due to the detachability thereof and due to the adhesive effect of the adhesive layer 12 the substrate 10 remains.
  • the reusable tool carrier 2 is available for a new metal deposition, as shown at S5 in FIG. 1.
  • S6 in FIG. 1 there is the substrate 10 provided with the conductor track metallization 8.
  • the reusable tool carrier can be used in many ways as long as the primary metallization 6 is not damaged.
  • the substrate shown at S6 in FIG. 1 can then be processed further, for example by applying a transponder IC over the schematically illustrated conductor ends 8 ′ and 8 ′′ of the schematically illustrated coil metallization 8.
  • the carrier element 4 is provided in a step S10. As indicated above, this can be a silicon wafer, a ceramic, a metal plate or a rigid or flexible carrier made of plastic.
  • a primary metallization 30 is then applied to the entire surface of this carrier element 4 in a step S12.
  • the preferred exemplary embodiment of the present invention is titanium tungsten.
  • other materials can be used, on which electrochemically or After germination, have other conductive materials deposited chemically, but which have a low adhesion to the primary metallization.
  • stainless steel, titanium, tungsten, vanadium, palladium, chromium or alloys thereof can be used as the primary metallization.
  • the application of the full-surface primary metallization 30 can be carried out in any conventional manner, for example the rolling on of metal foils, chemical or electrochemical deposition or vapor deposition processes, such as e.g. Sputtering, PVD and CVD.
  • step S14 the original metallization 30 applied over the entire surface is structured using a photoresist 32 which is exposed via a mask 34, as is indicated schematically by the illustration of an incandescent lamp 36. After the exposure, a corresponding etching is carried out to complete the structuring, so that after the structuring step S14, the finished, reusable tool carrier 2, which has a carrier element 4 on which the structured primary metallization 6 is formed, is present.
  • the primary metallization layer 30 can also, for example, by mechanical methods such as Milling or evaporation using a laser can be structured.
  • the structure remaining when the plan view of the carrier element is viewed from above is a mirrored image of the conductor track to be produced later on the substrate carrier.
  • the interconnect metallization 8 was produced by means of selective deposition on a structured primary metallization 6.
  • a reusable tool carrier which has a full-surface primary metallization which is covered by a covering layer which is formed thereon and, depending on the conductive structure to be produced, has recesses up to the primary metallization.
  • a full-surface primary metallization is covered with a mask, or a structured cover layer is produced thereon.
  • the part of the material of the primary metallization which does not belong to the conductor track structure to be produced is covered by this cover layer, while the openings of this cover layer which extend to the surface of the primary metallization represent the corresponding mirror image of the subsequent conductor track.
  • the desired prevention of the deposition of the conductor metallization to be applied later in the areas in which no conductor structures are to be achieved is achieved by the mask above the primary metallization.
  • the conductor path metallization then grows, starting from the surface of the primary metallization, only in the openings of the mask or cover layer.
  • the cover layer can be produced, for example, by applying a photoresist, for example by spin coating, and subsequently photostructuring the same.
  • the carrier element can be formed by the primary metallization itself.
  • the above-mentioned materials are again suitable as the primary metallization material, stainless steel, for example, which is used for electrodeposition, being suitable if the external carrier is formed by the primary metallization itself. With the above described example of a reusable tool carrier, a coating of a separately manufactured carrier with a primary metallization is no longer necessary.
  • the reusable tool carrier can be a one-piece element in which, depending on the conductive structure to be produced, recesses are formed, into which paste-like or liquid material can be introduced and converted into a solid state, in order to thereby generate the conductive structure.
  • the recesses formed correspond to a mirror image, i.e. a negative, the conductive structure to be produced.
  • the conductor track can be produced by using pastes or dispersed liquids which are conductive, at least in the solidified state. Examples of these are conductive polymer pastes.
  • the corresponding conductor track shape is worked into the tool carrier, for example by mechanical methods, such as Milling, chemical processes, e.g.
  • the paste or liquid is then introduced into this introduced form, for example by printing, pouring or dispensing.
  • the conductor track is transferred to the actual substrate in the transfer process.
  • the surface of the tool carrier is preferably provided with a material on which the conductor track adheres poorly. This material depends on the conductor paste or conductor liquid used.
  • Teflon Polytetraflurethylene
  • the entire carrier or at least parts thereof can be made of PTFE.
  • the surface of the substrate 10 to which the conductor track structure 8 was to be applied is provided with an adhesive layer 12.
  • the conductor path is detached from the tool carrier and adheres to the substrate due to the adhesive force of the adhesive layer of the substrate and the low adhesive strength of the conductor track metallization on the primary metallization.
  • This removal can take place simultaneously over the entire surface, or step by step by unrolling or pulling off the substrate obliquely from the tool carrier.
  • the adhesive layer can also be provided on the conductor track metallization still located on the tool carrier.
  • the adhesive layer is preferably applied to the entire surface of the substrate.
  • the substrate it is possible for the substrate to be provided with the adhesive layer selectively only on partial areas, for example the areas on which the conductor tracks come to lie.
  • the adhesion between the substrate and the respective free surfaces on the tool carrier, on which there is no interconnect metallization, must be as low as possible so that only the interconnect metallizations are detached.
  • the required adhesive effect between the interconnect metallization and the determination substrate to which it is to be applied can also be generated in other ways.
  • the conductor track can be at least partially pressed into the substrate material, so that the adhesion between the substrate and the conductor track metallization is produced in this way.
  • the conductor track metallization has been applied directly from the tool carrier to the determination substrate, it is possible to use an intermediate carrier, so that a double transfer process, contrary to the single transfer process described above, process results. In any case, it is necessary that the adhesion between the primary metallization and the interconnect metallization is less than that between the interconnect metallization and the substrate to which the interconnect metallization is to be applied.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

La présente invention concerne un procédé permettant la réalisation d'une structure conductrice (8) sur un substrat (10), au moyen d'un procédé de transfert/transmission. Selon ce procédé, un dépôt métallique chimique ou électrochimique sélectif est tout d'abord réalisé sur une couche métallique structurée (6) qui est formée sur un support réutilisable (2), de manière à former une structure conductrice. La structure conductrice (8) obtenue est transférée sur le substrat (10), le support réutilisable (2) étant alors séparé du substrat (10).
PCT/EP2000/013335 1999-12-30 2000-12-29 Procede et dispositif permettant la realisation d'une structure conductrice sur un substrat WO2001050826A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19963850.0 1999-12-30
DE1999163850 DE19963850A1 (de) 1999-12-30 1999-12-30 Verfahren und Vorrichtung zum Erzeugen einer leitfähigen Struktur auf einem Substrat

Publications (1)

Publication Number Publication Date
WO2001050826A1 true WO2001050826A1 (fr) 2001-07-12

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ID=7935047

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2000/013335 WO2001050826A1 (fr) 1999-12-30 2000-12-29 Procede et dispositif permettant la realisation d'une structure conductrice sur un substrat

Country Status (2)

Country Link
DE (1) DE19963850A1 (fr)
WO (1) WO2001050826A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2224795A1 (fr) * 2009-02-26 2010-09-01 ZYRUS Beteiligungsgesellschaft mbH & Co. Patente I KG Procédé destiné à la fabrication d'une structure de métal sur un substrat
EP2458950A1 (fr) * 2012-01-18 2012-05-30 ZYRUS Beteiligungsgesellschaft mbH & Co. Patente I KG Procédé et électrode de structure destinés à la fabrication d'une structure à pistes conductrices métallique

Citations (6)

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Publication number Priority date Publication date Assignee Title
US3230163A (en) * 1961-09-04 1966-01-18 Electronique & Automatisme Sa Reusable transfer plate for making printed circuitry
EP0185998A1 (fr) * 1984-12-14 1986-07-02 Dynamics Research Corporation Fabrication de circuits d'interconnexion par électroformage de transfert
EP0476867A1 (fr) * 1990-09-11 1992-03-25 Hughes Aircraft Company Procédé utilisant une matrice permanente pour la production de circuits électriques
US5201268A (en) * 1990-12-25 1993-04-13 Matsushita Electric Industrial Co., Ltd. Intaglio printing process and its application
JPH0671853A (ja) * 1992-08-25 1994-03-15 Dainippon Printing Co Ltd 微細パターンの形成方法
EP0836892A2 (fr) * 1996-10-21 1998-04-22 Dai Nippon Printing Co., Ltd. Feuille de transfert et procédé de formation de motifs

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US3181986A (en) * 1961-03-31 1965-05-04 Intellux Inc Method of making inlaid circuits
US4832255A (en) * 1988-07-25 1989-05-23 International Business Machines Corporation Precision solder transfer method and means
DE19533169C2 (de) * 1995-09-08 2002-02-07 Fraunhofer Ges Forschung Lotdepotträger
DE19637551A1 (de) * 1996-09-14 1998-03-19 Philips Patentverwaltung Transferdruckverfahren für Vielschichtbauelemente
DE19829248A1 (de) * 1998-06-30 2000-01-05 Thomson Brandt Gmbh Verfahren zur Herstellung eines elektrotechnischen Bauteiles

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3230163A (en) * 1961-09-04 1966-01-18 Electronique & Automatisme Sa Reusable transfer plate for making printed circuitry
EP0185998A1 (fr) * 1984-12-14 1986-07-02 Dynamics Research Corporation Fabrication de circuits d'interconnexion par électroformage de transfert
EP0476867A1 (fr) * 1990-09-11 1992-03-25 Hughes Aircraft Company Procédé utilisant une matrice permanente pour la production de circuits électriques
US5201268A (en) * 1990-12-25 1993-04-13 Matsushita Electric Industrial Co., Ltd. Intaglio printing process and its application
JPH0671853A (ja) * 1992-08-25 1994-03-15 Dainippon Printing Co Ltd 微細パターンの形成方法
EP0836892A2 (fr) * 1996-10-21 1998-04-22 Dai Nippon Printing Co., Ltd. Feuille de transfert et procédé de formation de motifs

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 018, no. 317 (M - 1622) 16 June 1994 (1994-06-16) *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2224795A1 (fr) * 2009-02-26 2010-09-01 ZYRUS Beteiligungsgesellschaft mbH & Co. Patente I KG Procédé destiné à la fabrication d'une structure de métal sur un substrat
WO2010097230A3 (fr) * 2009-02-26 2011-01-20 Zyrus Beteiligungsgesellschaft Mbh & Co. Patente I Kg Procédé de réalisation d'une structure métallique sur un substrat
EP2458950A1 (fr) * 2012-01-18 2012-05-30 ZYRUS Beteiligungsgesellschaft mbH & Co. Patente I KG Procédé et électrode de structure destinés à la fabrication d'une structure à pistes conductrices métallique

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