WO2001048834A2 - Element piezo-electrique - Google Patents

Element piezo-electrique Download PDF

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Publication number
WO2001048834A2
WO2001048834A2 PCT/DE2000/004622 DE0004622W WO0148834A2 WO 2001048834 A2 WO2001048834 A2 WO 2001048834A2 DE 0004622 W DE0004622 W DE 0004622W WO 0148834 A2 WO0148834 A2 WO 0148834A2
Authority
WO
WIPO (PCT)
Prior art keywords
piezoelectric element
parylene
electrodes
piezoceramic
element according
Prior art date
Application number
PCT/DE2000/004622
Other languages
German (de)
English (en)
Other versions
WO2001048834A3 (fr
Inventor
Michael Riedel
Andreas Joseph Schmid
Herbert Hofmann
Original Assignee
Siemens Aktiengesellschaft
Hofmann, Renate
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft, Hofmann, Renate filed Critical Siemens Aktiengesellschaft
Publication of WO2001048834A2 publication Critical patent/WO2001048834A2/fr
Publication of WO2001048834A3 publication Critical patent/WO2001048834A3/fr

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2041—Beam type
    • H10N30/2042—Cantilevers, i.e. having one fixed end
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure

Definitions

  • the invention relates to a piezoelectric element with at least ⁇ least one electrode disposed between piezoceramic layer which is particularly suitable for use m a wet or corrosive environments.
  • a piezoelectric element of the type mentioned is primarily used for utilization of the indirect or converse piezoelectric effect, the conversion of electrical ie ⁇ shear m mechanical energy. Nevertheless, a ⁇ the like piezoelectric element but also to convert mechanical energy into electrical energy is suitable. The direct piezoelectric effect is used here.
  • Such applications are e.g. as a piezoelectric printhead for an inkjet printer, as a sound pick-up or generator for microphones or loudspeakers, as a sensor for acceleration or pressure measurement, as a control element in Braille lines, in reading devices for the blind, m textile machines, in pneumatic valves, m injection valves or m writing measuring devices and m non-contact surface measuring instruments etc.
  • a piezoelectric element is constructed in a layer structure.
  • a piezoceramic layer is applied to improve the mechanical stability of the element or for the purpose of better conversion of electrical mechanical energy or vice versa onto a carrier or supporting body.
  • For the electrical contact is the piezoceramic
  • the carrier can be provided on one or two sides with the described layer sequence of piezoceramic layer and electrodes.
  • a plurality of layers of piezoceramic layers can confining ⁇ Lich the electrodes may be stacked. With such a stacking, the supporting body need not be present.
  • the number of piezoelectrically active layers one speaks of a mono, - bi, - tri or then multi orphen piezoelectric element.
  • a designed as a bending transducer mono- or bimorph pie ⁇ zoelektharis element is found for example m the DE 196 20 826 C2.
  • a multimorph piezoelectric element, also designed as a bending transducer, is disclosed in WO 99/17383 A.
  • Piezoelectric elements without a supporting body with a multilayer structure are known, for example, from DE 196 46 676 Cl or from EP 0 844 678 AI. Such piezoelectric elements, also known as “actuators”, are used as drive elements for pneumatic or injection valves.
  • Piezoelectric elements designed as control elements are gradually replacing conventional control elements based on magnetic technology. Also in the
  • the piezoelectric element has an outer coating made of parylene.
  • Parylene is a group name for thermoplastic polymer films made of poly-para-xylylene, where the aromatic hydrogen atoms can be replaced by chlorine atoms. Accordingly, one speaks at a unsubstitu- lerten poly-para-xylylene from Parylene N, in the case of the substitution of a hydrogen atom by a chlorine atom by Pary ⁇ lene C and in the case of substitution of two aromatic hydrogen atoms by two chlorine Atoms by Parylene D.
  • Parylene is formed from p-xylene, which forms e dimeric paracyclophane in a first reaction stage, which is pyrolyzed in a sublimation chamber at about 600 to 680 ° C. to form monomeric, biradical p-xylylene.
  • This polymerized film-like at temperatures below 35 ° C to form polymers with n of about 5000 and a molecu ⁇ large weight of about 500,000.
  • parylene N parylene N
  • parylene C parylene D
  • parylene D see also FIGS. 6, 7 and 8, respectively.
  • Parylene is commercially available as the solid dimer. To coat a wide variety of materials, the solid dimer is evaporated at approximately 150 ° C. in a first step.
  • the dimer is pyrolyzed at about 680 ° C., which contains the stable monomeric diradiaclic para-xylylene.
  • This monomer is then adsorbed at room temperature and low pressure in a coating chamber on the surface of the substrate to be coated, during which it polymerizes.
  • Be Anlagenungsverf no limitation to represent the Aufbnngens a äuße ⁇ ren coating of parylene on the piezoelectric Ele ⁇ ment according to the invention.
  • the process described is one of the gangigsten method for applying a coating of Parylene, there are of course in addition a number of other coating methods that can separate the individual parameters or steps under ⁇ .
  • the piezoelectric element has a carrier which carries the piezoceramic layer.
  • a piezoelectric element is particularly suitable as em flexural transducers, ie em ⁇ adjustment or control, m many technical applications where starting a mechanical ⁇ cal Ausler- is invalid demanded by an electronic control pulse.
  • Such applications are, for example textile machines, where m is dependent subject a loop on the deflection of the bending transducer or not or Ven ⁇ tile, the deflection m which a bending transducer for closing or opening of the valve is used.
  • the piezoelectric element has at least one stack of a multi ⁇ plurality of piezoceramic layers and interposed electrodes. Due to the thin piezoceramic individual layers and the associated small distance between adjacent electrodes, a high electric field can be achieved at the location of the piezoceramic. At a comparable thickness of the stack and a single piezoelectric ceramic layer is accordingly provided with the same supply voltage of ei ⁇ nem piezoelectric element comprising a stack of piezoceramic layers a higher mechanical power for disposal. With regard to the connection of the electrodes to an external supply voltage, it is advantageous if the electrodes are electrically contacted via at least one bonded contact wire.
  • This technique is known, for example, from microelectronics, with the connections of a microchip being led to the outside via a fine contact wire bonded to a contact pin.
  • the contact wire ⁇ is mechanically contacted by a fine solder joint with the connections generally. This process is called a Bondmg process.
  • Bondmg process Such a method also lends itself to a piezoelectric element, particularly when it becomes necessary to combine many individual piezoelectric elements into one module.
  • the contact wires can then also be mechanically bonded directly to the electrodes and guided to the outside of a contact pin.
  • the electrodes can be drawn in the form of a metallization onto the free part of the carrier and bonded there with the contact wire. If the piezoelectric element has no carrier, the electrodes are contacted to the outside in accordance with the desired voltage supply with an outer, flat electrode arranged on a side surface of the piezoelectric element. This outer electrode can then also be bonded to the contact wire.
  • a thickness of 20 to 200 ⁇ m is appropriate for a contact wire which is contacted with an electrode of a piezoelectric element in accordance with the Bondmg method. In so-called thin wire bonding, thicknesses between 20 and 100 ⁇ m are particularly common.
  • Such a contact wire is also coated with parylene on at least one part. It has been shown that due to such a Layering with parylene, the thin contact wires have increased mechanical strength against breakage.
  • An external coating made of parylene C is particularly advantageous for a piezoelectric element in a moist environment. Such a coating shows a reduced water permeability in comparison with a coating with parylene D or parylene N. If a high temperature resistance up to a high 125 ° C is required, Parylene N. is recommended.
  • the thickness of the outer coating of parylene is advantageously 20 to 50 ⁇ m. With such a thickness, there is sufficient resistance to chemical, mechanical, gaseous and fluidic environmental influences.
  • a coating m of the specified thickness also shows high insulation properties due to the large dielectric number of parylene e. In this way, a high dielectric strength and thus good insulation against external contact is achieved.
  • the outer geometry of the piezoelectric element is not changed ⁇ changed by the coating of parylene in the specified thickness. In addition, the swelling behavior of parylene is minimal even on piezo ceramics under water vapor.
  • An outer coating made of parylene not only offers excellent protection against external influences and chemical resistance against a variety of gaseous, fluidic and solid media, but also serves to isolate the piezoelectric element and thus contributes to increasing its safety against contact.
  • conventional coatings for insulation such as lacquers and the like, can be dispensed with.
  • the piezoelectric element is still safe to touch even with an outer metal layer.
  • the metal layer advantageously consists of silver, copper , aluminum, tin or titanium.
  • FIG. 1 shows a longitudinal section of a monomorphic piezoelectric element with a single piezoceramic layer which is applied to a carrier
  • FIG 3 em in a longitudinal section multimorphes piezoelectric cell having a transmitter, the shipping on both sides in each case comprising a stack of piezoceramic layers ⁇
  • FIG. 4 shows an enlarged section of the cross section according to FIG. 2, an outer coating made of parylene, on which an additional metal layer is applied
  • IG 5 m a cross section e piezoelectric element made of a plurality of piezoceramic layers
  • FIG. 7 shows the chemical structure of parylene C and FIG. 8 shows the chemical structure of parylene D.
  • Figure 1 is a longitudinal section em piezoelectric
  • the piezoceramic layer 1 is located between an outer electrode 4 and an inner electrode 5. Both electrodes 4, 5 are applied flat as a metallization.
  • the piezoceramic layer 1 provided with the electrodes 4, 5 is firmly connected to the supporting body 2 via an additional conductive covering 7.
  • the piezoceramic layer 1 consists of a lead titanate zirconate oxide ceramic (PZT ceramic), the chemical composition of which allows adaptation to the various electrical and mechanical properties required.
  • the carrier itself can consist of a metal, a plastic and in particular a fiber-reinforced epoxy resin.
  • the additional conductive assignment 7 between the inner electrode 5 and the carrier 2 increases the failure safety of the piezoelectric element in the case of a non-conductive carrier 2, for example made of a glass fiber reinforced epoxy resin.
  • a non-conductive carrier 2 for example made of a glass fiber reinforced epoxy resin.
  • the electrical contacting of the outer electrode 4 is not shown. However, this can be done via a direct bonded directly to the outer electrode 4 wei ⁇ contact wire.
  • the thickness of the coating P made of parylene is 30 ⁇ m. Due to the deposition and polymerization of parylene from the gas phase on the surface of the piezoelectric element, the outer coating P made of parylene also lies easily over the edges and corners of the piezoelectric element. Arise such as paints ken by the appearance of Menis ⁇ or "noses" considerable problems just at these locations in conventional coatings, because the outer shape is not maintained. This is precisely not the case with an external coating P with parylene.
  • the piezoelectric element shown in Figure 1 is particularly suitable as a so-called bending transducer.
  • the piezoceramic is formed at the location
  • Layer 1 an electric field. Because of this electrical field, the piezoceramic layer 1 expands or compresses, depending on the polarization direction. In the present case, the expansion or compression perpendicular to the direction of the electrical field and m longitudinal direction of the carrier 2 is used.
  • An expansion or compression of the piezoceramic layer 1 in the longitudinal direction of the carrier 2 leads to a bending of the carrier 2 with respect to its normal position. If the carrier 2 is fixed at its fixed end, the deflection of the bending transducer at the other end of the carrier 2 can be used to control or actuate a further mechanical component.
  • Figure 2 shows a cross-section m, the piezoelectric element according to figure 1. It is clearly seen that the outer coating Be ⁇ P surrounds the piezoelectric element together with the side surfaces and the outer electrode 4 of parylene completely.
  • FIG. 3 shows a further piezoelectric element in a longitudinal section.
  • This piezoelectric element includes a first stack and a second stack Sl S2 each with 10.
  • the two stacks Sl and S2 are opposite on a Tra ⁇ ger 11 is applied a plurality of piezoelectric ceramic layers.
  • the carrier 11 can be made from a wide variety of materials such as metal, steel, plastic, etc.
  • the carrier 11 itself can also be made of a piezoceramic.
  • the carrier 11 can be used to improve the conversion of mechanical electrical energy (or vice versa). However, it can also have the function of a mere intermediate layer between the first stack S1 and the second stack S2. Such an intermediate layer relieves mechanical stresses between the first stack S1 and the second stack S2.
  • the first stack S 1 has first electrodes 12 formed as a metallization layer and adjacent second electrodes 13.
  • the second stack S2 has first electrodes 14 between the piezoceramic layers 10 and second electrodes 16 adjacent to them.
  • the first electrodes 12 are - not shown in detail - contacted via the contact wire 17.
  • the second electrodes 13 are contacted via an outer electrode, also not shown in more detail, and a second contact wire 18 bonded to it.
  • the first electrodes 14 of the second stack S2 are electrically contacted via the third contact wire 19 and the second electrodes 16 of the second stack S2 via the fourth contact wire 20. All contact wires 17, 18, 19 and 20 are bonded to a corresponding connection electrode via a solder joint.
  • the entire piezoelectric element according to FIG. 3 is in turn completely coated with an outer coating P made of parylene.
  • the copper, approximately 100 ⁇ m thick Ken contact wires are coated with parylene to increase mechanical stability.
  • the piezoelectric element shown in FIG. 3 is also suitable as a bending transducer, but has a higher actuating force than the bending transducer in FIG. 1 with the same supply voltage.
  • FIG. 4 shows in an enlarged detail A from FIG. 2 the coating of the piezoelectric element, as shown in FIGS. 1 and 2.
  • the outer coating of Pary P ⁇ lene C is additionally coated with a metallic layer M.
  • the metal layer M consists of silver and was applied to the outer coating P made of parylene by metallization (for example by deposition from the gas phase). Due to the double coating with parylene and metal layer M, the piezoelectric element is extremely effectively protected against external influences and in particular against the penetration of water vapor.
  • FIG. 5 shows a cross section of a further piezoelectric element which has a single stack S3 composed of a number of piezoceramic layers 21 with first electrodes 22 and second electrodes 23 lying between them.
  • the piezoelectric ceramic layers in parallel or anti-parallel to the electric field exploited ⁇ the.
  • the entire piezoelectric element according to FIG. 5 expands or compresses when an electrical voltage is applied to the first electrodes 22 and the second electrodes 23 in the stacking direction.
  • Trodes for connecting the first electrode 22 and the second contact 23 Elek ⁇ wires 25 and 26 are provided. These are electrically contacted via outer electrodes arranged on the side surfaces of the piezoelectric element and in each case only contacted with every second electrode.
  • the piezoelectric element shown in FIG. 5 is suitable, for example, as an actuator for actuating an actuator in a valve.
  • the piezoelectric element according to FIG. 5 can be used with pneumatic, injection or other valves. This element also shows a high positioning force due to the layer structure (also called multilayer structure).
  • the entire piezoelectric element according to FIG. 5 is provided with an outer coating P made of parylene N. This enables use at temperatures up to approx. 160 ° C.
  • the contact wires 25 and 26 are also coated with parylene.
  • FIGS. 6, 7 and 8 each show the chemical structures of parylene N, parylene C and parylene D, respectively.
  • Parylene N according to FIG. 6 has no substitution of the aromatic hydrogen atoms.
  • parylene C according to FIG. 7 an aromatic hydrogen atom is replaced by an chlorine atom, as shown.
  • parylene D shows a substitution of two aromatic hydrogen atoms by two chlorine atoms.
  • n is about 5000.

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Abstract

L'invention concerne un élément piézo-électrique doté d'au moins une couche (1,10,21) céramique piézo-électrique disposée entre des électrodes (4,5,12,13,14,16,22,23). Un tel élément peut être utilisé comme capteur, élément de réglage, actionneur ou autre dispositif semblable. Afin d'augmenter sa longévité, surtout lorsqu'il est utilisé dans une atmosphère humide ou chimiquement agressive ou bien dans des liquides, l'élément piézo-électrique est recouvert d'une couche extérieure (P) en parylène.
PCT/DE2000/004622 1999-12-23 2000-12-22 Element piezo-electrique WO2001048834A2 (fr)

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DE19962621 1999-12-23
DE19962621.9 1999-12-23

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WO2001048834A3 WO2001048834A3 (fr) 2001-12-27

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Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003023873A2 (fr) * 2001-09-07 2003-03-20 Drei-S-Werk Präzisionswerkzeuge GmbH & Co. Fertigungs-KG Actionneur ou capteur plat soumis a une precontrainte interne
EP1677369A1 (fr) * 2003-09-25 2006-07-05 Kyocera Corporation Dispositif piezoelectrique multicouche
DE102005018322A1 (de) * 2005-04-20 2006-10-26 Siemens Ag Piezoaktor und Verfahren zu seiner Herstellung
DE102005040648A1 (de) * 2005-08-27 2007-03-01 Leybold Vacuum Gmbh Beschichtete Gegenstände
WO2007122227A2 (fr) * 2006-04-26 2007-11-01 Siemens Aktiengesellschaft Piézo-actionneur comportant un encapsulage multicouche et procédé de fabrication
WO2007125059A2 (fr) * 2006-04-28 2007-11-08 Siemens Aktiengesellschaft Activateur piézoélectrique avec une couche d'encapsulation à gradient et son procédé de fabrication
EP1973176A2 (fr) 2007-03-19 2008-09-24 Robert Bosch Gmbh Procédé et dispositif destinés à la fabrication d'un module d'actionneur piézoélectrique doté d'un actionneur piézoélectrique enrobé et un module d'actionneur piézoélectrique
EP1981097A3 (fr) * 2007-04-10 2009-01-07 Robert Bosch Gmbh Actionneur piézoélectrique
DE102007040249A1 (de) 2007-08-27 2009-03-05 Robert Bosch Gmbh Verfahren zur Herstellung eines Piezoaktors mit elektrisch isolierender Schutzschicht sowie Piezoaktormodul und Piezoaktor mit elektrisch isolierender Schutzschicht
DE102007040508A1 (de) 2007-08-28 2009-03-05 Robert Bosch Gmbh Piezoaktormodul und Piezoaktor mit einer medienbeständigen Schutzschicht und ein Verfahren zur Herstellung der Schutzschicht auf dem Piezoaktor
EP2034532A1 (fr) 2007-09-06 2009-03-11 Robert Bosch GmbH Module d'actionneur piézoélectrique comprenant un système de couche de protection et son procédé de fabrication
EP2034531A2 (fr) 2007-09-06 2009-03-11 Robert Bosch GmbH Module piézoactionneur doté d'un système de couche de protection et son procédé de fabrication
DE102007042400A1 (de) 2007-09-06 2009-03-12 Robert Bosch Gmbh Piezoaktormodul mit einem Schutzschichtsystem und ein Verfahren zu dessen Herstellung
EP2058873A2 (fr) 2007-11-08 2009-05-13 Robert Bosch Gmbh Piézoactionneur et module de piézoactionneur doté d'un système de couche de protection
EP2086029A2 (fr) 2008-02-01 2009-08-05 Robert Bosch Gmbh Module piézoactionneur et piézoactionneur doté d'un système de couche de protection comportant au moins le piézoactionneur
EP2109160A1 (fr) 2008-04-11 2009-10-14 Robert Bosch GmbH Module piézoactionneur pour un agencement entouré par un milieu fluide
DE102008042110A1 (de) 2008-08-13 2010-02-18 Robert Bosch Gmbh Piezoaktor mit einem Mehrlagenaufbau und ein Verfahren zu dessen Herstellung
WO2010108710A1 (fr) 2009-03-27 2010-09-30 Robert Bosch Gmbh Actionneur piézoélectrique à structure multicouche et procédé pour sa fabrication

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WO1999025033A1 (fr) * 1997-11-12 1999-05-20 Deka Products Limited Partnership Actionneur piezo-electrique utilisable dans un fluide electrolytique

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WO1999025033A1 (fr) * 1997-11-12 1999-05-20 Deka Products Limited Partnership Actionneur piezo-electrique utilisable dans un fluide electrolytique

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Cited By (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003023873A3 (fr) * 2001-09-07 2003-11-27 Drei S Werk Praez Swerkzeuge G Actionneur ou capteur plat soumis a une precontrainte interne
WO2003023873A2 (fr) * 2001-09-07 2003-03-20 Drei-S-Werk Präzisionswerkzeuge GmbH & Co. Fertigungs-KG Actionneur ou capteur plat soumis a une precontrainte interne
US7759847B2 (en) 2003-09-25 2010-07-20 Kyocera Corporation Multi-layer piezoelectric device
EP1677369A1 (fr) * 2003-09-25 2006-07-05 Kyocera Corporation Dispositif piezoelectrique multicouche
EP1988585A3 (fr) * 2003-09-25 2008-11-19 Kyocera Corporation Dispositif piézoélectrique multicouche
US7902726B2 (en) 2003-09-25 2011-03-08 Kyocera Corporation Multi-layer piezoelectric device
EP1677369A4 (fr) * 2003-09-25 2007-10-03 Kyocera Corp Dispositif piezoelectrique multicouche
US7679272B2 (en) 2003-09-25 2010-03-16 Kyocera Corporation Multi-layer piezoelectric element
DE102005018322A1 (de) * 2005-04-20 2006-10-26 Siemens Ag Piezoaktor und Verfahren zu seiner Herstellung
DE102005018322B4 (de) * 2005-04-20 2007-03-08 Siemens Ag Piezoaktor und Verfahren zu seiner Herstellung
DE102005040648A1 (de) * 2005-08-27 2007-03-01 Leybold Vacuum Gmbh Beschichtete Gegenstände
WO2007122227A3 (fr) * 2006-04-26 2007-12-13 Siemens Ag Piézo-actionneur comportant un encapsulage multicouche et procédé de fabrication
WO2007122227A2 (fr) * 2006-04-26 2007-11-01 Siemens Aktiengesellschaft Piézo-actionneur comportant un encapsulage multicouche et procédé de fabrication
US7851978B2 (en) 2006-04-26 2010-12-14 Siemens Aktiengesellschaft Piezo actuator comprising a multilayer encapsulation, and method for the production thereof
WO2007125059A3 (fr) * 2006-04-28 2007-12-21 Siemens Ag Activateur piézoélectrique avec une couche d'encapsulation à gradient et son procédé de fabrication
US8198783B2 (en) 2006-04-28 2012-06-12 Siemens Aktiengesellschaft Piezoelectric actuator with encapsulation layer having a thickness-varying property gradient
WO2007125059A2 (fr) * 2006-04-28 2007-11-08 Siemens Aktiengesellschaft Activateur piézoélectrique avec une couche d'encapsulation à gradient et son procédé de fabrication
DE102007042216A1 (de) 2007-03-19 2008-09-25 Robert Bosch Gmbh Verfahren und Vorrichtung zur Herstellung eines Piezoaktormoduls mit einem umhüllten Piezoaktor und ein Piezoaktormodul
EP1973176A2 (fr) 2007-03-19 2008-09-24 Robert Bosch Gmbh Procédé et dispositif destinés à la fabrication d'un module d'actionneur piézoélectrique doté d'un actionneur piézoélectrique enrobé et un module d'actionneur piézoélectrique
EP1981097A3 (fr) * 2007-04-10 2009-01-07 Robert Bosch Gmbh Actionneur piézoélectrique
DE102007040249A1 (de) 2007-08-27 2009-03-05 Robert Bosch Gmbh Verfahren zur Herstellung eines Piezoaktors mit elektrisch isolierender Schutzschicht sowie Piezoaktormodul und Piezoaktor mit elektrisch isolierender Schutzschicht
DE102007040508A1 (de) 2007-08-28 2009-03-05 Robert Bosch Gmbh Piezoaktormodul und Piezoaktor mit einer medienbeständigen Schutzschicht und ein Verfahren zur Herstellung der Schutzschicht auf dem Piezoaktor
EP2034531A2 (fr) 2007-09-06 2009-03-11 Robert Bosch GmbH Module piézoactionneur doté d'un système de couche de protection et son procédé de fabrication
DE102007042401A1 (de) 2007-09-06 2009-03-12 Robert Bosch Gmbh Piezoaktormodul mit einem Schutzschichtsystem und ein Verfahren zu dessen Herstellung
EP2034532A1 (fr) 2007-09-06 2009-03-11 Robert Bosch GmbH Module d'actionneur piézoélectrique comprenant un système de couche de protection et son procédé de fabrication
DE102007042400A1 (de) 2007-09-06 2009-03-12 Robert Bosch Gmbh Piezoaktormodul mit einem Schutzschichtsystem und ein Verfahren zu dessen Herstellung
DE102007042402A1 (de) 2007-09-06 2009-03-12 Robert Bosch Gmbh Piezoaktormodul mit einem Schutzschichtsystem und ein Verfahren zu dessen Herstellung
DE102007053303A1 (de) 2007-11-08 2009-05-14 Robert Bosch Gmbh Piezoaktor und Piezoaktormodul mit einem Schutzschichtsystem
EP2058873A2 (fr) 2007-11-08 2009-05-13 Robert Bosch Gmbh Piézoactionneur et module de piézoactionneur doté d'un système de couche de protection
EP2086029A2 (fr) 2008-02-01 2009-08-05 Robert Bosch Gmbh Module piézoactionneur et piézoactionneur doté d'un système de couche de protection comportant au moins le piézoactionneur
DE102008007200A1 (de) 2008-02-01 2009-08-06 Robert Bosch Gmbh Piezoaktormodul und Piezoaktor mit einem mindestens den Piezoaktor umgebenden Schutzschichtsystem
EP2109160A1 (fr) 2008-04-11 2009-10-14 Robert Bosch GmbH Module piézoactionneur pour un agencement entouré par un milieu fluide
DE102008018342A1 (de) 2008-04-11 2009-10-15 Robert Bosch Gmbh Piezoaktormodul für eine von einem Medium umströmte Anordnung
DE102008042110A1 (de) 2008-08-13 2010-02-18 Robert Bosch Gmbh Piezoaktor mit einem Mehrlagenaufbau und ein Verfahren zu dessen Herstellung
DE102009001938A1 (de) 2009-03-27 2010-09-30 Robert Bosch Gmbh Piezoaktor mit einem Mehrlagenaufbau und ein Verfahren zu dessen Herstellung
WO2010108710A1 (fr) 2009-03-27 2010-09-30 Robert Bosch Gmbh Actionneur piézoélectrique à structure multicouche et procédé pour sa fabrication

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