WO2001008460A1 - Appareil de dissipation de chaleur a couplage thermique pour dispositifs electroniques - Google Patents

Appareil de dissipation de chaleur a couplage thermique pour dispositifs electroniques Download PDF

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Publication number
WO2001008460A1
WO2001008460A1 PCT/US1999/016503 US9916503W WO0108460A1 WO 2001008460 A1 WO2001008460 A1 WO 2001008460A1 US 9916503 W US9916503 W US 9916503W WO 0108460 A1 WO0108460 A1 WO 0108460A1
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WO
WIPO (PCT)
Prior art keywords
thermally
heat sink
heat dissipation
dissipation apparatus
coupled
Prior art date
Application number
PCT/US1999/016503
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English (en)
Inventor
Richard K. Allman
Original Assignee
Allman Richard K
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Allman Richard K filed Critical Allman Richard K
Priority to PCT/US1999/016503 priority Critical patent/WO2001008460A1/fr
Priority to AU52213/99A priority patent/AU5221399A/en
Priority to US09/367,788 priority patent/US6181556B1/en
Publication of WO2001008460A1 publication Critical patent/WO2001008460A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • This invention relates to heat dissipators for electronic devices. More particularly, it relates to a thermally-coupled heat dissipation apparatus for use with high-heat generating solid state electronic components and devices.
  • heat is a natural occurring by-product of any working solid state electronic device. This is due to the intimate relationship between heat and power. As a solid state device draws power and completes its task to which it is designed to accomplish, heat is generated. In some devices, the heat generated, and therefore subjected upon the device, is low in comparison to the total "heat stress" that the device can stand. In other devices however, heat is the enemy.
  • the device relies on a single heat sink and fan assembly.
  • This type of configuration may be adequate for an older style processor, such as a 486-based processor, but is surely not adequate for dissipating the heat generated by Pentium-based and other faster style processors.
  • the single fan assembly does not provide any redundancy to the heat dissipation system. If the single fan fails, the cooling system will not provide the necessary cooling ability required. The result is thermal run-away of the CPU and its subsequent failure in operation. Still further, the "stacking" of a heat sink and fan on top of a processor tends to cause spacing problems when used with today's processors. This can be attributed to the large heat sinks required for today's processors.
  • the size of the heat sink tends to be proportional to the amount of heat generated by a fast-speed processor. In other words, very fast processors require very large heat sinks.
  • many of today' s processors are mounted on a daughter board which in turn plugs into the motherboard at a ninety degree angle (i.e., Slot 1 or Slot A configuration) , distinguishing those mounted directly to the motherboard in a parallel relationship (i.e., Socket 7 configuration) - also known as a "socketed" processor.
  • the daughter board mounts (Slot 1 or Slot A) require the conservative use of space, especially when a pair of mounts or slots are provided for dual processing capabilities.
  • this system would not work well with a CPU mounted on a daughter board, due to the fact that the circular-shaped heat sink does not provide an adequate means for attaching the heat sink and fan to the CPU. All daughter board mounted cooling assemblies require some form of mounting means which will retain the cooling system to the CPU when the daughter board is plugged into the motherboard at the ninety degree angle. Still further, this system does not provide adequate redundancy, in that only one fan is employed.
  • U.S. Patent No. 5,457,342 to Herbst II teaches a traditional prior art "stacked" cooling system with an additional cooling element - namely, a Peltier Effect cooling module.
  • Peltier Effect cooling modules are electrical "heat pumps" which conduct heat from one side of the module to another through a conductor layer. Accordingly, when working properly, there is one hot and one cold side on any Peltier Effect module.
  • Peltier Effect modules are inserted between the CPU and the heat sink. When working properly, the Peltier Effect module provides additional cooling to the CPU.
  • the two sections are spaced from one another by a single second cooling duct positioned perpendicular to the plurality of first cooling ducts.
  • a fan is mounted on top of the heat sink.
  • the product utilizes a pair of heat sinks for surrounding a processor mounted on a daughter board. Fans are provided on the heat sink which is placed proximal to the die of the processor (front-side) .
  • a second heat sink is merely placed proximal to the back-side of daughter board, where the solder connections of the electrical components are located. Since 90% of all heat generated by a CPU emanates from the die area (front-side) of the processor, the second back-side heat sink provides essentially no additional heat dissipation for the processor, since the back-side heat sink fails to communicate in any manner with the front-side heat sink.
  • An improved cooling system is needed for computer CPUs and other solid state devices that generate substantial heat.
  • the improved system should address all of the deficiencies seen in the prior art.
  • an improved system should be provided which adequately dissipates heat from the high heat generating processors used in today's computers.
  • Redundant fan assemblies should be provided to avoid thermal run-away of a processor due to the failure of the single fan.
  • Additional heat sinks, thermally coupled, should also be provided which can assist in the conduction of the heat away from the processor, especially the heat generated on the front-side of a Slot 1 mounted processor. Adequate spacing should be provided for those processors mounted in Slot 1 or Slot A configurations.
  • Such a system should also be non-product specific, working universally with all types of processors.
  • Peltier Effect modules are to be employed with the improved cooling system, the potential failure of the Peltier Effect module should be addressed for avoiding thermal run-away of the processor. In addition, the possible cooling of the processor to a point where condensation may form on the processor should also be addressed when considering the use of Peltier Effect modules . Disclosure of Invention
  • My device can work with a plurality of solid state devices and in its preferred embodiment is used with computer CPUs mounted in Slot 1 or Slot A configurations.
  • My device overcomes all of the deficiencies seen in the prior art and specifically, although not limited to, those discussed hereinabove. Component reliability of the devices to be cooled and MTBF (mean time between failure) is greatly improved with the device of the present invention.
  • the novel device can maintain a component temperature below 40 degrees Celsius when the ambient temperature is at 25 degrees Celsius and while under full operational load, thereby dramatically extending the useful life of the electronic component being cooled.
  • the device of the present invention includes a plurality of thermally-bridged heat sinks.
  • the plurality of heat sinks surround a processor mounted on an adapter board which connects directly into a slot of a computer motherboard (i.e., Slot 1 or Slot A).
  • At least two heat sinks, employed in a spaced and parallel relationship, are thermally coupled by either an additional heat sink, a thin metal plate or a flat heat pipe mounted on top of the at least two parallel positioned heat sinks.
  • a plurality of independently powered fans are mounted on outer surfaces of the heat sinks.
  • a plurality of hairpin or hitch- pin style spring clips are used to hold the at least two heat sinks together and provide a means for changing the spacing therebetween, thereby permitting the present invention to be used with a multitude of different processors.
  • Additional or secondary active cooling elements such as Peltier Effect modules, are used in alternate embodiments and can be positioned on outer edges of the device (i.e., not laid directly over the die of the processor) to provide additional cooling for the processor.
  • Alternate embodiments of the present invention permit it to be used with a main board socketed processor or other solid state device wherein a thermal transfer column is employed to transfer heat from the socketed device upwardly for dissipation by the device of the present invention.
  • Fig. 1 is a perspective view of a prior art cooling system for a computer CPU
  • Fig. 2 is a perspective view of the preferred embodiment of the solid state device cooling system of the present invention installed on a computer mother board in a Slot 1 configuration;
  • Fig. 3 is an exploded view of the preferred embodiment of the device of the present invention.
  • Fig. 4 is a perspective view of a first alternate embodiment of the device of the present invention.
  • Fig. 5 is an exploded view of a second alternate embodiment of the device of the present invention.
  • Fig. 6 is a side elevational view of a third alternate embodiment of the present invention illustrating one portion of the cooling device
  • Fig. 7 is a side elevational view of the third alternate embodiment illustrating the entire cooling device.
  • Fig. 8 is a side elevational view of a fourth alternate embodiment of the present invention illustrating use of the device with a socketed processor
  • Fig. 9 is a side elevational view of a thermal transfer column used in the fourth alternate embodiment of Fig. 8 ;
  • Fig. 10 is a front view of the thermal transfer column of Fig. 9;
  • Fig. 11 is a side elevational view of a fifth alternate embodiment of the present invention illustrating use of the device with a socketed processor
  • Fig. 12 is a side elevational view of a thermal transfer block used in the fifth alternate embodiment of Fig. 11;
  • Fig. 13 is a front view of the thermal transfer block of Fig . 12 .
  • FIGs. 2 and 3 show a thermally-bridged heat dissipation device 10 for surrounding a computer CPU.
  • device 10 surrounds a processor 12 (the computer CPU) mounted on either a daughter board 14 or bridge adapter (not shown) .
  • processor 12 the computer CPU
  • bridge adapter not shown
  • daughter board configurations are essentially identical to bridge adapter configurations, wherein and the use of either is dictated by the type of processor employed.
  • Both daughter boards and bridge adapters are configured to insert within a slot on a main or motherboard 16. Examples of such slots include those known as Slot 1 and Slot A.
  • processors that use a daughter board for inserting within a motherboard Slot 1 include, but are not limited to, the Intel Celeron, Pentium-II and Pentium-III family.
  • An example of a processor that uses a bridge adapter for inserting within a motherboard Slot 1 includes, but is not limited to, the Intel Socket 370 family.
  • processors sold under the AMD, Cyrix, Rise and Motorola brand names also mount to a daughter board for inserting within Slot A (not shown) of motherboard 14 (Slot A and Slot 1 being essentially identical except for the number and placement of the pin connections) . All of the above listed examples of processors, and others not mentioned herein, can be used with device 10 of the present invention, even though each family of processors requires different spacing requirements for surrounding the processor. Hence, device 10 can be universally employed with all processors which mount to either a daughter board or bridge adapter configuration.
  • device 10 includes a primary and secondary heat sink 18 and 20, respectively.
  • Extrusion type heat sinks represent the preferred choice of passive cooling elements to be used with the present invention, although other types of heat dissipating passive cooling elements could be employed, such as, for example, folded fin heat sinks, heat pipes and heat exchangers.
  • processor 12 is a Celeron processor and is being depicted for illustration purposes only, since a plurality of processors, as discussed above, can be used with device 10.
  • Primary heat sink 18 is positioned on a front side 22 of daughter board 14 such that a back side 26 of primary heat sink 18 mates with the die 24 of processor 12.
  • a thin layer of thermal transfer compound such as thermal paste, grease or cement or a piece of thermal tape is intermediately positioned between die 24 and primary heat sink back side 26 to improve the heat transfer from processor 12 to primary heat sink 18.
  • Secondary heat sink 20 has a back side 34 which mates with a back side 28 of daughter board 14 such that primary and secondary heat sink 18 and 20 are in a spaced and parallel relationship surrounding processor 12 on either daughter board 14 or a bridge adapter (which ever is applicable) .
  • a pair of hairpin or hitch-pin style spring clips 30 are used to hold primary and secondary heat sinks 18 and 20 together and for sandwiching processor 12 (and daughter board 14 or an appropriate bridge adapter) therebetween.
  • Clips 30 insert within channels 32 formed in primary and secondary heat sinks 18 and 20.
  • clips 30 of varying size and width are employed to hold heat sinks 18 and 20 together.
  • Fig. 4 depicts device 10 surrounding a plastic encased processor (such as the Pentium-II or Pentium-Ill family processor)
  • Figs. 2 and 3 depict device 10 surrounding a "bare" processor mounted on daughter board 14.
  • Cooling apparatus and systems of the prior art are almost all product specific (i.e., a cooling system for a Celeron processor will not attach to a Pentium-II, Pentium-Ill or AMD processor).
  • a typical prior art cooling device is shown. This prior art device 1 will not work with the plastic encased processors of the Pentium-II and Pentium-III family.
  • the present invention in its preferred embodiment, is employed in computer CPUs. But, the present invention can be used with any solid state device which requires cooling so long as it is mounted on a circuit board having similar construction as that of daughter board 14 or that of a main board socketed device (to be discussed in further detail hereinafter) .
  • solid state devices include, but are not limited to, power amplifier modules for audio frequency and radio frequency devices, robotic or automated machine motor servo amplifier systems, variable frequency motor drives, solid state relays and IGBT (insulated-gate bipolar transistor) modules. Applicant is not aware of any prior art cooling apparatus or system which can be used with both computer CPUs and other heat generating solid state devices wherein the only consideration for employment of the device is a change in the spacing between at least two passive cooling elements.
  • thermal bridge 38 is provided for thermally coupling primary and secondary heat sinks 18 and 20.
  • thermal bridge 38 is also a passive heat dissipation device, such as a heat sink.
  • thermal bridge 38 provides a third side of heat dissipation to the single heat generating device (processor 12) .
  • the practical application of this novel invention and that which represents the preferred embodiment, is to provide a heat dissipation device which acts as a heat sink three times larger than all existing designs in the prior art, and one which can be "folded" around processor 12 or any other heat generating solid state device to be cooled.
  • This ability to thermally couple a primary heat dissipator (heat sink 18) to a secondary heat dissipator (heat sink 20) increases the overall performance of the entire device 10 proportional to the increase in radiating area of the thermal dissipator (the heat sinks) . Since, as explained above, 90% of the heat generated on a typical computer CPU is radiated from a front side of the processor (at the die) , device 10 can now dissipate a greater majority of the radiated heat through the entire device by moving the heat from primary heat sink 18 through thermal bridge 38 into secondary heat sink 20.
  • device 10 permits far lesser percentages to be dissipated at the front side heat sink.
  • Device 10 dissipates generally equal percentages of heat at each of the heat sinks employed.
  • thermal bridge 38 is also a heat sink
  • one-third of the total heat generated by processor 12 is dispersed and dissipated at each of the three heat sinks employed.
  • two heat sinks are employed, thermally coupled by a metal plate, one-half of the heat generated is dispersed and dissipated by each of the two heat sinks employed.
  • the thermal bridge 38 (the third heat sink) could further include a pair of flat metal pieces (not shown) positioned on either end of the thermal bridge 38 spaced from one another along a bottom side of thermal bridge 38. A set of fans 42 would then be positioned on a top side of thermal bridge 38.
  • the pair of metal pieces can attach by screws, rivets, clamps or bonding and provides further mechanical and thermal communication between thermal bridge 38, primary heat sink 18 and secondary heat sink 20.
  • a mechanical stability element is provided in the form of a heat sink brace 68.
  • Primary heat sink 18 extends outward from processor 12 and rests upon a top surface 70 of brace 68 and ensures that stress incurred upon device 10, due to the mass thereof, is distributed more evenly.
  • thermal bridge 38 is a flat metal plate, made from a material having good thermal properties, such as, for example, aluminum, copper, brass or steel. The preferred material is aluminum.
  • the thickness of the metal plate is ideally equal to or greater than the thickness of the base substrate of primary and secondary heat sinks 18 and 20.
  • the metal plate transfers heat gathered by heat sink 18, located on the front side of processor 12, to heat sink 20, located on the back side of processor 12. As noted above, the total heat generated by processor 12 is dissipated approximately in equal amounts (50% by each heat sink) .
  • the metal plate could also be substituted with a flat heat pipe.
  • thermal bridge 38 can be mechanically coupled to primary and secondary heat sinks 18 and 20 in a plurality of different manners. Examples of coupling include the use of screws, rivets, clamps or bonding. As shown in Figs. 2, 3 and 4, the preferred means of coupling is four clamps 40. It is also noted that a thin layer of thermal transfer compound such as thermal paste, grease or cement or a piece of thermal tape should be deployed between thermal bridge 38 and the surface to which it contacts primary and secondary heat sinks 18 and 20 to ensure proper heat transfer.
  • thermal transfer compound such as thermal paste, grease or cement or a piece of thermal tape should be deployed between thermal bridge 38 and the surface to which it contacts primary and secondary heat sinks 18 and 20 to ensure proper heat transfer.
  • At least one active cooling element is employed with the present invention.
  • active cooling elements include, but are not limited to, electric fans, Peltier Effect modules, and electrical heat pumps .
  • six fans 42 are employed for the active cooling elements.
  • Each fan 42 is independently powered and receives 12v from a DC power supply (not shown) . This ensures that upon failure of any given fan, or even more than one fan, redundancy for the active cooling element of the device is provided.
  • thermal bridge 38 all but one fan could fail and the device of the present invention would still retain enough active cooling to ensure a proper operating temperature for processor 12 or other solid state device being cooled.
  • alternate embodiments of the present invention could employ a single fan and still provide adequate active cooling. Since there is not a requirement that six fans be employed, a user of the device of the present invention retains a great amount of flexibility. Since, as explained before, space is limited in today's small business and personal computers, eliminating a particular fan or set of fans to ensure proper spacing of the device will not render it ineffective. Further, larger fans can potentially be employed since their placement on the front side of processor 12 is no longer critical. If a particular high profile fan can not be located on the front side of processor 12, due to limited space, the high profile fan can be located on top of thermal bridge 38 or on secondary heat sink 20.
  • Fans 42 can be attached to heat sinks 18 and 20 in variety of manners, such as, for example, through the use of screws (the preferred manner - see Figs. 2-7), rivets, clamps, clips, adhesives or double-sided tape.
  • a second alternate embodiment is disclosed where the novel device of the present invention is represented by the numeral 44.
  • Device 44 is a hybrid of preferred device 10 and first alternate device 36 with an additional active cooling element.
  • second alternate device 44 includes thermal bridge 38 employed in the form of a metal plate.
  • a third heat sink 52 is deployed on top of the metal plate. Inserted therebetween is the additional active cooling element - namely, a pair of Peltier Effect modules 46.
  • a thin layer of thermal transfer compound 48 such as thermal paste, grease or cement or a piece of thermal tape, is positioned between the bottom plates of each Peltier Effect module 46 and a top surface 50 of the metal plate.
  • a pair of fans 42 can be attached on top of the third heat sink 52.
  • Fig. 6 is a side elevational view depicting how third alternate device 54 deploys the various active and passive cooling elements. It is understood that Fig. 6 merely depicts the primary passive cooling element (a set of three heat sinks) and the associated active cooling elements. Device 54 additionally employs, as shown in Fig. 7, a secondary passive cooling element (another set of three heat sinks) and the associated active cooling elements and thermal bridge 38 (yet another set of three heat sinks) .
  • Varying embodiments of the third alternate embodiment include changes to thermal bridge 38 wherein thermal bridge 38 can be (1) a metal plate; (2) a heat sink and set of fans; or (3) a metal plate, a heat sink, a set of fans and a pair of Peltier Effect modules inserted between the metal plate and heat sink.
  • processor 12 mates with a metal plate 56 which has good thermal properties.
  • a pair of Peltier Effect modules 46 are in turn placed on top surface 50 of metal plate 56 at opposed edges 58 and 60.
  • a set of three heat sinks are in turn stacked on top of the pair of Peltier Effect modules 46 such that a first middle heat sink 62 inserts between the pair of Peltier Effect modules 46 in direct thermal contact with metal plate top surface 50.
  • a second and third heat sink 64 and 66, respectively, are in direct thermal contact with the pair of Peltier Effect modules 46.
  • a set of three fans 42 are attached to the three heat sinks 62, 64 and 66 along outer surfaces.
  • the third alternate embodiment 54 can be seen in its complete form.
  • the set of heat sinks located at the top portion of device 54 represents thermal bridge 38.
  • a plurality of hairpin or hitch-pin style clips 30, identical to those used in the preferred, first and second alternate embodiments, are employed to hold the primary and secondary passive cooling elements (the pair of heat sink sets in the spaced parallel relationship) together.
  • a plurality of clamps 40 are used to hold the primary and secondary cooling elements to thermal bridge 38.
  • a thin layer of thermal transfer compound 48 such as thermal paste, grease or cement or a piece of thermal tape should be deployed between the heat sinks and the metal plates, the Peltier Effect Modules and the metal plates, the Peltier Effect modules and the heat sinks and the die of the processor and the metal plate to which it contacts.
  • a fourth alternate embodiment is shown and is represented by the numeral 72.
  • Device 72 is similar to that of the preferred device 10 but works to dissipate heat from a socketed solid state device instead of one mounted on an adapter board.
  • device 72 is used with a socketed processor 12, such as one mounted in a computer Socket 7 or Socket 370 configuration and that which is depicted in Fig. 8.
  • a socketed processor 12 such as one mounted in a computer Socket 7 or Socket 370 configuration and that which is depicted in Fig. 8.
  • device 72 could be employed with other main board socketed devices including, but not limited to, power amplifier modules for audio frequency and radio frequency devices, robotic or automated machine motor servo amplifier systems, variable frequency motor drives, solid state relays and IGBT modules .
  • thermal transfer column 74 which sits directly upon main board socketed processor 12.
  • thermal transfer column 74 has an inverted t-shaped including a horizontal and vertical member 76 and 78, respectively.
  • a channel 80 is formed through vertical member 78 along a bottom portion directly above horizontal member 76 permitting a c-shaped spring clip 82 to insert therethrough, thereby holding thermal transfer column 74 down against processor 12 and the main board to which processor 12 is socketed.
  • Alternate means of attaching thermal transfer column 74 include the use screws, rivets, thermal cement and double-sided tape.
  • Vertical member 78 extends upwardly from the main board to which processor 12 is socketed.
  • Primary and secondary heats sinks 18 and 20 surround vertical member 78 of thermal transfer column 74 in a manner similar to that of the preferred device 10 surrounding processor 12 mounted on an adapter board.
  • Thermal bridge 38 is mounted along a top end of primary and secondary heat sinks 18 and 20.
  • device 72 employs a heat sink for thermal bridge 38, although a metal plate or flat heat pipe could be employed as a substitute therefor.
  • Peltier Effect modules 46 can be inserted between primary and secondary heat sinks 18 and 20 and vertical member 78 of thermal transfer column 74.
  • a third Peltier Effect module could also be inserted between thermal bridge 38 and the top end of primary and secondary heat sinks 18 and 20.
  • thermal transfer column 74 can be either a solid block of metal or a hollow extrusion with a closed end.
  • a fifth alternate embodiment is shown and is represented by the numeral 84.
  • Device 84 is similar to that of the fourth alternate device 72 which works to dissipate heat generated by a socketed solid state device.
  • device 84 is used with a socketed processor 12, such as one mounted in a computer Socket 7 or Socket 370 configuration and that which is depicted in Fig. 11.
  • a socketed processor 12 such as one mounted in a computer Socket 7 or Socket 370 configuration and that which is depicted in Fig. 11.
  • device 84 could be employed with other main board socketed devices including, but not limited to, power amplifier modules for audio frequency and radio frequency devices, robotic or automated machine motor servo amplifier systems, variable frequency motor drives, solid state relays and IGBT modules.
  • Device 84 employs a thermal transfer block 86 which sits directly upon main board socketed processor 12.
  • thermal transfer block 86 is rectangular in shape.
  • a channel 88 as seen in Figs. 12 and 13, is formed through a bottom portion 90 permitting a c-shaped spring clip 82 to insert therethrough and hold thermal transfer block 86 down against processor 12 and the main board to which processor 12 is socketed.
  • Thermal transfer block 86 extends upwardly from the main board to which processor 12 is socketed.
  • Primary and secondary heats sinks 18 and 20 surround thermal transfer block 86 in a manner similar to that of the fourth alternate device 72 surrounding vertical member 78 of thermal transfer column 74.
  • Thermal bridge 38 is mounted along a top end of primary and secondary heat sinks 18 and 20.
  • device 84 employs a heat sink for thermal bridge 38, although a metal plate or flat heat pipe could be employed as a substitute therefor.
  • Peltier Effect modules 46 can be inserted between primary and secondary heat sinks 18 and 20 and thermal transfer block 86.
  • a third Peltier Effect module could also be inserted between thermal bridge 38 and the top end of primary and secondary heat sinks 18 and 20.
  • Any suitable material having good thermal transfer properties could be employed for thermal transfer block 86, including, but not limited to, aluminum, copper, brass or steel - the preferred material being aluminum.
  • thermal transfer block 86 can be either a solid block of metal or a hollow extrusion with a closed end.
  • a proprietarily designed heat pipe could be substituted for thermal transfer column 74 or thermal transfer block 86 for improved thermal transfer efficiency from processor 12 (or other solid state device) to the thermally bridged heat sink assembly.
  • EM or RF radiation can be eliminated or reduced to a non-critical level by attaching a ground wire (not shown) to one of the heat sinks. Since processor 12 is surrounded by the metal of heat sinks 18 and 20 and thermal bridge 38, the grounding of these units will help shunt or drain EM and RF energy to ground.
  • temperature monitoring of processor 12 can be provided.
  • a thermal sensor (not shown) can be mounted to the thermally-bridged heat dissipation device and coupled to either the thermal header of motherboard 16 or to an auxiliary temperature monitoring device (i.e., LCD or LED display module) .
  • the preferred thermal sensor is a 10K ohm @ 25 degree Celsius thermistor.
  • the preferred heat sink for primary and secondary heat sink 18 and 20 is made of aluminum and has a plurality of radiating surfaces and includes extruded fin, pin fin, folded/corrugated fin or bonded fin type heat sinks.
  • the preferred style of heat sink should be a finned or pin finned style heat sink, such as model VEK 12 manufactured by Globalwin Ltd. of Taiwan.

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  • Condensed Matter Physics & Semiconductors (AREA)
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Abstract

Cette invention se rapporte à un appareil de dissipation de chaleur à couplage thermique (10), qui entoure un dispositif électronique à semi-conducteur monté sur une carte à circuit adaptateur (14) ou sur une colonne de transfert thermique (74) placée en position droite sur un dispositif enfiché dans une carte principale. Cet appareil (10) comprend au moins deux puits de chaleur (18 et 20) disposés parallèles et distants sur les côtés avant et arrière (22 et 28) de la carte à circuit adaptateur (14) ou de la colonne de transfert thermique (74). Une passerelle (38) assure le couplage thermique des deux puits de chaleur (18 et 20). Plusieurs ventilateurs (42) sont montés le long des surfaces externes des puits de chaleur (18 et 20). Dans un mode de réalisation préféré, la passerelle (38) forme un puits de chaleur supplémentaire et elle peut toutefois, dans des variantes, être constituée par une plaque métallique. Le dispositif préféré devant être refroidi à l'aide de cette invention est un processeur d'ordinateur (12).
PCT/US1999/016503 1999-07-21 1999-07-21 Appareil de dissipation de chaleur a couplage thermique pour dispositifs electroniques WO2001008460A1 (fr)

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Application Number Priority Date Filing Date Title
PCT/US1999/016503 WO2001008460A1 (fr) 1999-07-21 1999-07-21 Appareil de dissipation de chaleur a couplage thermique pour dispositifs electroniques
AU52213/99A AU5221399A (en) 1999-07-21 1999-07-21 Thermally-coupled heat dissipation apparatus for electronic devices
US09/367,788 US6181556B1 (en) 1999-07-21 1999-07-21 Thermally-coupled heat dissipation apparatus for electronic devices

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PCT/US1999/016503 WO2001008460A1 (fr) 1999-07-21 1999-07-21 Appareil de dissipation de chaleur a couplage thermique pour dispositifs electroniques

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CN108231708A (zh) * 2016-12-14 2018-06-29 达纳加拿大公司 用于双面冷却电子模块的换热器
CN113775488A (zh) * 2020-06-09 2021-12-10 新疆金风科技股份有限公司 冷却系统及风力发电机组

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CN108231708B (zh) * 2016-12-14 2023-08-04 达纳加拿大公司 用于双面冷却电子模块的换热器
CN113775488A (zh) * 2020-06-09 2021-12-10 新疆金风科技股份有限公司 冷却系统及风力发电机组
CN113775488B (zh) * 2020-06-09 2024-04-19 金风科技股份有限公司 冷却系统及风力发电机组

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