WO2001001453A2 - Procede et appareil modifiant les caracteristiques electriques des traces de signaux dans des plaquettes de circuits multicouches - Google Patents

Procede et appareil modifiant les caracteristiques electriques des traces de signaux dans des plaquettes de circuits multicouches Download PDF

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Publication number
WO2001001453A2
WO2001001453A2 PCT/US2000/017618 US0017618W WO0101453A2 WO 2001001453 A2 WO2001001453 A2 WO 2001001453A2 US 0017618 W US0017618 W US 0017618W WO 0101453 A2 WO0101453 A2 WO 0101453A2
Authority
WO
WIPO (PCT)
Prior art keywords
recited
trace
insulating material
electrical characteristic
height
Prior art date
Application number
PCT/US2000/017618
Other languages
English (en)
Other versions
WO2001001453A3 (fr
Inventor
Istvan Novak
Original Assignee
Sun Microsystems, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sun Microsystems, Inc. filed Critical Sun Microsystems, Inc.
Priority to AU57693/00A priority Critical patent/AU5769300A/en
Publication of WO2001001453A2 publication Critical patent/WO2001001453A2/fr
Publication of WO2001001453A3 publication Critical patent/WO2001001453A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
    • H01P11/003—Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1903—Structure including wave guides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09318—Core having one signal plane and one power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Definitions

  • the electrical properties of other traces will not be affected.
  • the layer of different material on the trace may cover the entire length of the trace, or it cover one or more parts of the trace, as the adjustment of the electrical properties requires.
  • Figures 4A and 4B illustrate an embodiment of the invention in which the composition of the insulating material in the vicinity of the trace is modified to vary the trace electrical characteristics.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

On peut modifier les caractéristiques électriques des tracés de signaux dans des plaquettes des circuits en faisant varier sélectivement la constante diélectrique et/ou la perméabilité magnétique d'une couche de matériau isolant disposée à proximité d'une interconnexion de signaux. La modification s'obtient par adjonction à la plaquette d'une couche d'un matériau différent, au-dessus ou en dessous du plan contenant les tracés. Le matériau ajouté peut être tout matériau de constante diélectrique ou de perméabilité magnétique différente. Lors du laminage de la plaquette, on peut ne recouvrir que l'un des tracés sélectionnés, de la couche de matériau différent, ce qui n'altère pas les propriétés électriques des autres tracés. On peut aussi ne recouvrir qu'une partie d'un tracé, selon l'importance de la modification des propriétés électriques requise. Dans une autre exécution, le matériau isolant séparant le tracé du plan de référence est remplacé par un matériau différent au voisinage du tracé sélectionné. Dans encore une autre exécution, le matériau isolant séparant le tracé du plan de référence est modifié pour que sa constante diélectrique ou sa perméabilité magnétique varie au voisinage du tracé sélectionné
PCT/US2000/017618 1999-06-29 2000-06-27 Procede et appareil modifiant les caracteristiques electriques des traces de signaux dans des plaquettes de circuits multicouches WO2001001453A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU57693/00A AU5769300A (en) 1999-06-29 2000-06-27 Method and apparatus for adjusting electrical characteristics of signal traces in layered circuit boards

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US34313299A 1999-06-29 1999-06-29
US09/343,132 1999-06-29

Publications (2)

Publication Number Publication Date
WO2001001453A2 true WO2001001453A2 (fr) 2001-01-04
WO2001001453A3 WO2001001453A3 (fr) 2001-07-26

Family

ID=23344839

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2000/017618 WO2001001453A2 (fr) 1999-06-29 2000-06-27 Procede et appareil modifiant les caracteristiques electriques des traces de signaux dans des plaquettes de circuits multicouches

Country Status (2)

Country Link
AU (1) AU5769300A (fr)
WO (1) WO2001001453A2 (fr)

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1376741A1 (fr) * 2002-06-27 2004-01-02 Harris Corporation Filtres interdigitals à haute efficacité
EP1376750A1 (fr) * 2002-06-27 2004-01-02 Harris Corporation Transformateur quart d'onde à large efficacité
EP1376745A1 (fr) * 2002-06-27 2004-01-02 Harris Corporation Filtre à impedances échelonnées à large efficacité
EP1376739A1 (fr) * 2002-06-27 2004-01-02 Harris Corporation Ligne résonnante à haut rendement avec porte unique
EP1376749A1 (fr) * 2002-06-27 2004-01-02 Harris Corporation Transformateurs d' impédance à large bande
EP1376753A1 (fr) * 2002-06-27 2004-01-02 Harris Corporation Coupleur directionnel à haute efficacité
EP1376736A1 (fr) * 2002-06-27 2004-01-02 Harris Corporation Amélioration d'un substrat pour réaliser des caractéristiques de signaux améliorées dans une ligne de transmission discontinue
EP1376759A2 (fr) * 2002-06-27 2004-01-02 Harris Corporation Antenne à substrat diélectrique incluant des régions à différentes constantes diélectrique et perméabilité
EP1376754A1 (fr) * 2002-06-27 2004-01-02 Harris Corporation Ligne résonante à haute efficacité
EP1570543A2 (fr) * 2002-12-03 2005-09-07 Harris Corporation Antenne a alimentation par fente, microruban, a plaque et a rendement eleve
US6975279B2 (en) 2003-05-30 2005-12-13 Harris Foundation Efficient radome structures of variable geometry
US6982671B2 (en) 2003-02-25 2006-01-03 Harris Corporation Slot fed microstrip antenna having enhanced slot electromagnetic coupling
US6985118B2 (en) 2003-07-07 2006-01-10 Harris Corporation Multi-band horn antenna using frequency selective surfaces
EP1614190A2 (fr) * 2003-03-31 2006-01-11 Harris Corporation Antenne a microruban a haut rendement introduite par fente dotee d'une manchette amelioree
EP1614189A2 (fr) * 2003-03-31 2006-01-11 Harris Corporation Antenne plaque microruban a fente croisee haute efficacite
US6990729B2 (en) 2003-09-05 2006-01-31 Harris Corporation Method for forming an inductor
US6992628B2 (en) 2003-08-25 2006-01-31 Harris Corporation Antenna with dynamically variable operating band
US7006052B2 (en) 2003-05-15 2006-02-28 Harris Corporation Passive magnetic radome
US7030834B2 (en) 2003-09-03 2006-04-18 Harris Corporation Active magnetic radome
US7088308B2 (en) 2003-10-08 2006-08-08 Harris Corporation Feedback and control system for radomes
EP1376743B1 (fr) * 2002-06-27 2006-08-23 Harris Corporation Filtre passe-bas à haute efficacité
EP1376744B1 (fr) * 2002-06-27 2006-08-23 Harris Corporation Filtres à haute efficacité avec des lignes couplées
US7158005B2 (en) 2005-02-10 2007-01-02 Harris Corporation Embedded toroidal inductor
US7196607B2 (en) 2004-03-26 2007-03-27 Harris Corporation Embedded toroidal transformers in ceramic substrates
DE102005017331B4 (de) * 2004-04-28 2009-04-09 Qimonda Ag Schaltungsplatine
US9479083B2 (en) 2012-07-30 2016-10-25 Fanuc Corporation Power converter in which switching elements are driven in parallel
EP4050726A1 (fr) * 2021-02-24 2022-08-31 Intel Corporation Supports de circuits intégrés à microrubans

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0317256A2 (fr) * 1987-11-20 1989-05-24 Junkosha Co. Ltd. Un substrat pour circuit imprimé
EP0502614A2 (fr) * 1991-02-07 1992-09-09 Fujitsu Limited Substrat pour circuit à film mince et procédé de sa fabrication
JPH04352498A (ja) * 1991-05-30 1992-12-07 Mitsui Toatsu Chem Inc 高透磁率を有する電磁シールド用絶縁ペースト
JPH05206591A (ja) * 1992-01-28 1993-08-13 Hitachi Ltd プリント配線板およびその製造方法
JPH05299792A (ja) * 1992-04-23 1993-11-12 Nitto Denko Corp 高周波用回路基板
JPH06132418A (ja) * 1992-10-14 1994-05-13 Mitsubishi Electric Corp 高周波混成集積回路装置
JPH06283909A (ja) * 1993-03-24 1994-10-07 Nippon Chemicon Corp マイクロストリップラインの回路素子
JPH06283907A (ja) * 1993-03-24 1994-10-07 Nippon Chemicon Corp マイクロストリップライン
JPH0774442A (ja) * 1993-09-02 1995-03-17 Nec Corp プリント基板
US5450286A (en) * 1992-12-04 1995-09-12 Parlex Corporation Printed circuit having a dielectric covercoat
US5569488A (en) * 1990-04-12 1996-10-29 Arlon, Inc. Method of making multi-dielectric laminates
JPH09260797A (ja) * 1996-03-22 1997-10-03 Sony Corp 配線基板
US5777526A (en) * 1994-09-01 1998-07-07 Hitachi, Ltd. Method of manufacturing a microstrip transmission device

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0317256A2 (fr) * 1987-11-20 1989-05-24 Junkosha Co. Ltd. Un substrat pour circuit imprimé
US5569488A (en) * 1990-04-12 1996-10-29 Arlon, Inc. Method of making multi-dielectric laminates
EP0502614A2 (fr) * 1991-02-07 1992-09-09 Fujitsu Limited Substrat pour circuit à film mince et procédé de sa fabrication
JPH04352498A (ja) * 1991-05-30 1992-12-07 Mitsui Toatsu Chem Inc 高透磁率を有する電磁シールド用絶縁ペースト
JPH05206591A (ja) * 1992-01-28 1993-08-13 Hitachi Ltd プリント配線板およびその製造方法
JPH05299792A (ja) * 1992-04-23 1993-11-12 Nitto Denko Corp 高周波用回路基板
JPH06132418A (ja) * 1992-10-14 1994-05-13 Mitsubishi Electric Corp 高周波混成集積回路装置
US5450286A (en) * 1992-12-04 1995-09-12 Parlex Corporation Printed circuit having a dielectric covercoat
JPH06283907A (ja) * 1993-03-24 1994-10-07 Nippon Chemicon Corp マイクロストリップライン
JPH06283909A (ja) * 1993-03-24 1994-10-07 Nippon Chemicon Corp マイクロストリップラインの回路素子
JPH0774442A (ja) * 1993-09-02 1995-03-17 Nec Corp プリント基板
US5777526A (en) * 1994-09-01 1998-07-07 Hitachi, Ltd. Method of manufacturing a microstrip transmission device
JPH09260797A (ja) * 1996-03-22 1997-10-03 Sony Corp 配線基板

Non-Patent Citations (8)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 017, no. 214 (E-1357), 27 April 1993 (1993-04-27) & JP 04 352498 A (MITSUI TOATSU CHEM), 7 December 1992 (1992-12-07) *
PATENT ABSTRACTS OF JAPAN vol. 017, no. 640 (E-1465), 26 November 1993 (1993-11-26) -& JP 05 206591 A (HITACHI COMPUT ENG CORP), 13 August 1993 (1993-08-13) *
PATENT ABSTRACTS OF JAPAN vol. 018, no. 095 (E-1509), 16 February 1994 (1994-02-16) & JP 05 299792 A (NITTO DENKO CORP), 12 November 1993 (1993-11-12) *
PATENT ABSTRACTS OF JAPAN vol. 018, no. 425 (E-1590), 9 August 1994 (1994-08-09) & JP 06 132418 A (MITSUBISHI ELECTRIC CORP), 13 May 1994 (1994-05-13) *
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 01, 28 February 1995 (1995-02-28) & JP 06 283907 A (NIPPON CHEMICON CORP), 7 October 1994 (1994-10-07) *
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 01, 28 February 1995 (1995-02-28) & JP 06 283909 A (NIPPON CHEMICON CORP), 7 October 1994 (1994-10-07) *
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 06, 31 July 1995 (1995-07-31) & JP 07 074442 A (NEC CORP), 17 March 1995 (1995-03-17) *
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 02, 30 January 1998 (1998-01-30) & JP 09 260797 A (SONY CORP), 3 October 1997 (1997-10-03) *

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US6750740B2 (en) 2002-06-27 2004-06-15 Harris Corporation High efficiency interdigital filters
US6838954B2 (en) 2002-06-27 2005-01-04 Harris Corporation High efficiency quarter-wave transformer
EP1376745A1 (fr) * 2002-06-27 2004-01-02 Harris Corporation Filtre à impedances échelonnées à large efficacité
EP1376739A1 (fr) * 2002-06-27 2004-01-02 Harris Corporation Ligne résonnante à haut rendement avec porte unique
EP1376749A1 (fr) * 2002-06-27 2004-01-02 Harris Corporation Transformateurs d' impédance à large bande
EP1376753A1 (fr) * 2002-06-27 2004-01-02 Harris Corporation Coupleur directionnel à haute efficacité
EP1376736A1 (fr) * 2002-06-27 2004-01-02 Harris Corporation Amélioration d'un substrat pour réaliser des caractéristiques de signaux améliorées dans une ligne de transmission discontinue
EP1376759A2 (fr) * 2002-06-27 2004-01-02 Harris Corporation Antenne à substrat diélectrique incluant des régions à différentes constantes diélectrique et perméabilité
EP1376754A1 (fr) * 2002-06-27 2004-01-02 Harris Corporation Ligne résonante à haute efficacité
US6727785B2 (en) 2002-06-27 2004-04-27 Harris Corporation High efficiency single port resonant line
EP1376743B1 (fr) * 2002-06-27 2006-08-23 Harris Corporation Filtre passe-bas à haute efficacité
US6731244B2 (en) 2002-06-27 2004-05-04 Harris Corporation High efficiency directional coupler
EP1376759A3 (fr) * 2002-06-27 2004-09-08 Harris Corporation Antenne à substrat diélectrique incluant des régions à différentes constantes diélectrique et perméabilité
US6781486B2 (en) 2002-06-27 2004-08-24 Harris Corporation High efficiency stepped impedance filter
EP1376741A1 (fr) * 2002-06-27 2004-01-02 Harris Corporation Filtres interdigitals à haute efficacité
US6825743B2 (en) 2002-06-27 2004-11-30 Harris Corporation Substrate enhancement for improved signal characteristics on a discontinuous transmission line
EP1376750A1 (fr) * 2002-06-27 2004-01-02 Harris Corporation Transformateur quart d'onde à large efficacité
EP1376744B1 (fr) * 2002-06-27 2006-08-23 Harris Corporation Filtres à haute efficacité avec des lignes couplées
US6963259B2 (en) 2002-06-27 2005-11-08 Harris Corporation High efficiency resonant line
US6737932B2 (en) 2002-06-27 2004-05-18 Harris Corporation Broadband impedance transformers
EP1876670A1 (fr) 2002-12-03 2008-01-09 Harris Corporation Antenne à plaque microruban à fente croisée haute efficacité
EP1570543A4 (fr) * 2002-12-03 2005-11-30 Harris Corp Antenne a alimentation par fente, microruban, a plaque et a rendement eleve
EP1570543A2 (fr) * 2002-12-03 2005-09-07 Harris Corporation Antenne a alimentation par fente, microruban, a plaque et a rendement eleve
US6982671B2 (en) 2003-02-25 2006-01-03 Harris Corporation Slot fed microstrip antenna having enhanced slot electromagnetic coupling
EP1614190A4 (fr) * 2003-03-31 2006-05-03 Harris Corp Antenne a microruban a haut rendement introduite par fente dotee d'une manchette amelioree
EP1614190A2 (fr) * 2003-03-31 2006-01-11 Harris Corporation Antenne a microruban a haut rendement introduite par fente dotee d'une manchette amelioree
US6995711B2 (en) 2003-03-31 2006-02-07 Harris Corporation High efficiency crossed slot microstrip antenna
EP1614189A2 (fr) * 2003-03-31 2006-01-11 Harris Corporation Antenne plaque microruban a fente croisee haute efficacite
EP1614189A4 (fr) * 2003-03-31 2006-05-17 Harris Corp Antenne plaque microruban a fente croisee haute efficacite
US7006052B2 (en) 2003-05-15 2006-02-28 Harris Corporation Passive magnetic radome
US6975279B2 (en) 2003-05-30 2005-12-13 Harris Foundation Efficient radome structures of variable geometry
US6985118B2 (en) 2003-07-07 2006-01-10 Harris Corporation Multi-band horn antenna using frequency selective surfaces
US6992628B2 (en) 2003-08-25 2006-01-31 Harris Corporation Antenna with dynamically variable operating band
US7030834B2 (en) 2003-09-03 2006-04-18 Harris Corporation Active magnetic radome
US7253711B2 (en) 2003-09-05 2007-08-07 Harris Corporation Embedded toroidal inductors
US6990729B2 (en) 2003-09-05 2006-01-31 Harris Corporation Method for forming an inductor
US7513031B2 (en) 2003-09-05 2009-04-07 Harris Corporation Method for forming an inductor in a ceramic substrate
US7088308B2 (en) 2003-10-08 2006-08-08 Harris Corporation Feedback and control system for radomes
US7196607B2 (en) 2004-03-26 2007-03-27 Harris Corporation Embedded toroidal transformers in ceramic substrates
DE102005017331B4 (de) * 2004-04-28 2009-04-09 Qimonda Ag Schaltungsplatine
US7158005B2 (en) 2005-02-10 2007-01-02 Harris Corporation Embedded toroidal inductor
US9479083B2 (en) 2012-07-30 2016-10-25 Fanuc Corporation Power converter in which switching elements are driven in parallel
EP4050726A1 (fr) * 2021-02-24 2022-08-31 Intel Corporation Supports de circuits intégrés à microrubans

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AU5769300A (en) 2001-01-31
WO2001001453A3 (fr) 2001-07-26

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