WO2000079028A1 - Plaque de cathode - Google Patents

Plaque de cathode Download PDF

Info

Publication number
WO2000079028A1
WO2000079028A1 PCT/AU2000/000669 AU0000669W WO0079028A1 WO 2000079028 A1 WO2000079028 A1 WO 2000079028A1 AU 0000669 W AU0000669 W AU 0000669W WO 0079028 A1 WO0079028 A1 WO 0079028A1
Authority
WO
WIPO (PCT)
Prior art keywords
groove
metal
cathode
envelope
deposited
Prior art date
Application number
PCT/AU2000/000669
Other languages
English (en)
Inventor
David Bailey
Revill Wayne Armstrong
Original Assignee
Copper Refineries Pty Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Copper Refineries Pty Ltd filed Critical Copper Refineries Pty Ltd
Priority to ES00936537.0T priority Critical patent/ES2627807T3/es
Priority to AU51997/00A priority patent/AU768314B2/en
Priority to JP2001505369A priority patent/JP2003502512A/ja
Priority to BR0011752-8A priority patent/BR0011752A/pt
Priority to MXPA01013036A priority patent/MXPA01013036A/es
Priority to CA002377364A priority patent/CA2377364C/fr
Priority to ROA200101366A priority patent/RO121039B1/ro
Priority to PL352310A priority patent/PL201085B1/pl
Priority to EP00936537.0A priority patent/EP1230440B1/fr
Publication of WO2000079028A1 publication Critical patent/WO2000079028A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C7/00—Constructional parts, or assemblies thereof, of cells; Servicing or operating of cells
    • C25C7/02—Electrodes; Connections thereof
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C7/00—Constructional parts, or assemblies thereof, of cells; Servicing or operating of cells
    • C25C7/06—Operating or servicing
    • C25C7/08—Separating of deposited metals from the cathode

Definitions

  • the present invention relates to a cathode plate for use in electro-deposition of
  • the bottom edge of the cathode mother plate is generally
  • a release compound such as wax or a plastic edge strip to prevent
  • enveloped cathode process In such a process the lower edge of the cathode sheet is not waxed and the electro-deposited metal is allowed to grow on both sides of
  • the envelope is then closed and rotated from its vertical
  • cathode mother sheet is to at least partially separate either side of the deposited envelope
  • enveloped cathode comprises cathode sheets 20 and 30 deposited on the cathode mother
  • the cathode mother sheet is firstly flexed to provide separation of at least the upper end portion 50 of the sheets 20. 30.
  • apparatus includes a wedge stripper or air blaster 130. These wedge strippers 130 enter
  • cathode mother plate may be confirmed by the grippers 25, 35 as follows.
  • grippers 25 and 35 rotates sheets 20 and 30 upwardly and downwardly until the
  • groove 15 is formed in the bottom edge of the cathode mother plate as a 'growth
  • deposited metal may not cleanly release from the cathode plate or split into two
  • the metal envelope separates into two sheets with a lip 25 attached to one sheet. This lip
  • the present invention provides a method of electro-depositing an
  • envelope of metal on a cathode said envelope including deposited metal on either side of
  • the method comprising providing a groove on said cathode plate whereby metal
  • the groove is shaped as a V, with the line of weakness being
  • the arc of the V-groove is between 75 and 105 degrees and
  • the arc of the V-groove is substantially 90 degrees.
  • the present applicant has determined that the size and shape of the groove in the
  • cathode mother plate has an impact on the ability to separate the deposited metal
  • the fracture line may be
  • One sheet may be
  • the shape of the groove is a balance between allowing growth of the
  • the groove may be shaped to permit deposited
  • the groove is
  • the present invention provides a cathode plate for electro-
  • said cathode plate having a groove along at least one edge
  • Figures 1A-2D are end elevational views of the process for stripping electro-
  • Figure 3 is an end elevational view of a cathode mother plate with a deposited
  • Figure 4 is an end elevational view of an embodiment of the present invention.
  • Figures 5 and 6 are end elevational views showing different shaped bottom edges
  • groove 150 shown in Figure 4 is 90 degrees, however, as will be appreciated from the
  • V-groove 150 The shape and size of V-groove 150 is designed to perform several functions. Its
  • mother plate 100 into two substantially equivalent sheets 122 and 124.
  • the copper will take the path of least resistance and endeavour to deposit on the cathode as quickly as possible. Accordingly, it will be appreciated that it is easier for
  • V-groove 150 is shaped to allow deposition of copper in the V-groove
  • the groove 150 shown in Figure 4 can be compared with the V-groove shown in
  • the bridge 80 can act to strongly bind the two
  • the V-groove can be sized and shaped to trap gaseous

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

La présente invention concerne un procédé permettant de déposer par électrolyse une enveloppe de métal sur une cathode. L'enveloppe de métal (120) comprend des feuilles métalliques (122, 124) de chaque côté de la plaque de cathode (100). Une rainure (150) est formée le long d'un bord de la plaque de cathode, grâce à laquelle le métal déposé sur la rainure ou à proximité de celle-ci constitue une partie frangible (140). La rainure possède une forme telle qu'une ligne de faiblesse (A) se forme dans le métal déposé à l'intérieur de la rainure, de façon que la séparation des deux feuilles de métal déposé s'opère le long de la ligne de faiblesse.
PCT/AU2000/000669 1999-06-18 2000-06-16 Plaque de cathode WO2000079028A1 (fr)

Priority Applications (9)

Application Number Priority Date Filing Date Title
ES00936537.0T ES2627807T3 (es) 1999-06-18 2000-06-16 Placa de cátodo
AU51997/00A AU768314B2 (en) 1999-06-18 2000-06-16 Cathode plate
JP2001505369A JP2003502512A (ja) 1999-06-18 2000-06-16 陰極板
BR0011752-8A BR0011752A (pt) 1999-06-18 2000-06-16 Método de eletrodeposição de um envoltório de metal sobre um catodo, e placa de catodo
MXPA01013036A MXPA01013036A (es) 1999-06-18 2000-06-16 Placa de catodo.
CA002377364A CA2377364C (fr) 1999-06-18 2000-06-16 Plaque de cathode
ROA200101366A RO121039B1 (ro) 1999-06-18 2000-06-16 Metodă de depunere electrolitică a unui înveliş metalic pe un catod şi plăcuţă catodică
PL352310A PL201085B1 (pl) 1999-06-18 2000-06-16 Sposób elektroosadzania warstwy metalu na płycie katodowej i płyta katodowa do elektroosadzania warstwy metalu
EP00936537.0A EP1230440B1 (fr) 1999-06-18 2000-06-16 Plaque de cathode

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AUPQ1066A AUPQ106699A0 (en) 1999-06-18 1999-06-18 Cathode plate
AUPQ1066 1999-06-18

Publications (1)

Publication Number Publication Date
WO2000079028A1 true WO2000079028A1 (fr) 2000-12-28

Family

ID=3815257

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/AU2000/000669 WO2000079028A1 (fr) 1999-06-18 2000-06-16 Plaque de cathode

Country Status (17)

Country Link
EP (1) EP1230440B1 (fr)
JP (1) JP2003502512A (fr)
CN (1) CN1263897C (fr)
AR (1) AR024402A1 (fr)
AU (1) AUPQ106699A0 (fr)
BR (1) BR0011752A (fr)
CA (1) CA2377364C (fr)
ES (1) ES2627807T3 (fr)
MX (1) MXPA01013036A (fr)
OA (1) OA11970A (fr)
PE (1) PE20010502A1 (fr)
PL (1) PL201085B1 (fr)
RO (1) RO121039B1 (fr)
RU (1) RU2247799C2 (fr)
TR (1) TR200103610T2 (fr)
WO (1) WO2000079028A1 (fr)
ZA (1) ZA200110359B (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007000553A1 (de) 2007-10-22 2009-04-23 Wacker Chemie Ag Fluorpolymer-Silicon-Verbunde und Verfahren zur Herstellung

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI115727B (fi) * 2003-12-01 2005-06-30 Outokumpu Oy Laitteisto ja menetelmä elektrolyyttisessä puhdistuksessa syntyneen saostuman irrottamiseksi
JP4640637B2 (ja) * 2005-03-28 2011-03-02 Ｊｘ日鉱日石金属株式会社 カソード板ｖグルーブの管理方法
JP5103635B2 (ja) * 2008-03-10 2012-12-19 三井金属エンジニアリング株式会社 析出金属板の剥離装置および剥離方法
FI121238B (fi) * 2008-10-01 2010-08-31 Outotec Oyj Kestokatodi
JP2013040366A (ja) * 2011-08-12 2013-02-28 Mesco Inc 電着金属の剥ぎ取り装置および電着金属の剥ぎ取り方法
CN104674299B (zh) * 2015-03-25 2016-11-09 大冶有色金属有限责任公司 铜电解精炼中不锈钢板附着少量纯铜的回收方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU7885887A (en) * 1986-10-03 1988-04-14 Outokumpu Oy Method and apparatus for stripping electrolytic precipitate from supporting structures
GB2196989A (en) * 1986-11-04 1988-05-11 Mim Techn Marketing Ltd Stripping electrolytically deposited copper

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1427348A (en) * 1972-08-14 1976-03-10 Imp Metal Ind Kynoch Ltd Method of removing an electrodeposited metal from a cathod3
GB1366987A (en) * 1972-10-11 1974-09-18 Gen Electric Co Ltd Filament mount structures for use in electric incandescent filament lamps
DD140624A3 (de) * 1976-02-26 1980-03-19 Dietmar Schab Mutterblech mit kanten-und flaechenisolation zur herstellung vonstarterblechen
JPS5912753B2 (ja) * 1976-05-20 1984-03-26 住友金属鉱山株式会社 １枚の母板から複数の電着金属片をうる方法
JPH09228090A (ja) * 1996-02-21 1997-09-02 Nikko Kinzoku Kk 湿式電解採取または電解精製用陰極板
FI982569A (fi) * 1998-11-27 2000-05-28 Outokumpu Oy Laite metallisaostuman erottamiseksi katodilta

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU7885887A (en) * 1986-10-03 1988-04-14 Outokumpu Oy Method and apparatus for stripping electrolytic precipitate from supporting structures
GB2196989A (en) * 1986-11-04 1988-05-11 Mim Techn Marketing Ltd Stripping electrolytically deposited copper

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1230440A4 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007000553A1 (de) 2007-10-22 2009-04-23 Wacker Chemie Ag Fluorpolymer-Silicon-Verbunde und Verfahren zur Herstellung

Also Published As

Publication number Publication date
PL201085B1 (pl) 2009-03-31
CN1357059A (zh) 2002-07-03
PL352310A1 (en) 2003-08-11
CA2377364C (fr) 2008-10-28
TR200103610T2 (tr) 2002-05-21
CA2377364A1 (fr) 2000-12-28
ZA200110359B (en) 2002-12-18
MXPA01013036A (es) 2003-08-20
AUPQ106699A0 (en) 1999-07-08
RO121039B1 (ro) 2006-11-30
AR024402A1 (es) 2002-10-02
BR0011752A (pt) 2002-04-02
JP2003502512A (ja) 2003-01-21
PE20010502A1 (es) 2001-04-27
OA11970A (en) 2006-04-17
EP1230440B1 (fr) 2017-03-22
RU2247799C2 (ru) 2005-03-10
CN1263897C (zh) 2006-07-12
ES2627807T3 (es) 2017-07-31
EP1230440A4 (fr) 2005-06-01
EP1230440A1 (fr) 2002-08-14

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