WO2000074449A1 - Main board with printed circuit board mounted thereon - Google Patents

Main board with printed circuit board mounted thereon Download PDF

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Publication number
WO2000074449A1
WO2000074449A1 PCT/DE2000/001345 DE0001345W WO0074449A1 WO 2000074449 A1 WO2000074449 A1 WO 2000074449A1 DE 0001345 W DE0001345 W DE 0001345W WO 0074449 A1 WO0074449 A1 WO 0074449A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
base plate
printed circuit
layer
insulation layer
Prior art date
Application number
PCT/DE2000/001345
Other languages
German (de)
French (fr)
Inventor
Karl Smirra
Frank Franzen
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO2000074449A1 publication Critical patent/WO2000074449A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5387—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • the invention relates to a method for short-circuit-proof attachment of a printed circuit board to a base plate and an arrangement of base plate and printed circuit board mounted thereon.
  • circuits consisting of a printed circuit board with electrical components mounted thereon and electrically contacted by the printed circuit board are used.
  • the wiring of the circuit is usually realized by the circuit board.
  • the circuit board typically consists of one
  • Layer system which comprises one or more interconnect layers and one or more insulation layers electrically separating the interconnect layers.
  • circuit boards are mostly produced as prefabricated individual elements, bestuckt below with the electrical components and then applied to the base plate up ⁇ .
  • the circuit board can also be populated after it has been attached to the base plate.
  • the bottom layer layer of the printed circuit board facing the base plate always consists of an insulation layer in order to rule out the possibility of a short circuit m in the lowest interconnect level can, provided the circuit board is attached to a metallic base plate.
  • US Pat. No. 4,495,378 describes a circuit board structure specially designed for high heat dissipation, which consists of a metal or carbon core on which a copper or silver layer is attached. An aluminum layer is provided on top. The aluminum layer is provided with an electrically insulating, anodized surface layer on which the conductor tracks of the circuit board run.
  • German patent application DE 40 30 532 AI describes a multi-layer circuit constructed in hybrid technology.
  • Several flexible glass ceramic foils with printed circuit structures are placed on top of one another on a metal base body and are fired in a sintering process to form a glass ceramic body.
  • the bottom glass ceramic layer connects to the metal body.
  • an electronic control module which comprises a circuit board body which is glued to a base plate of the housing via an adhesive film.
  • control device which contains a circuit board which is carried by a floor of the housing.
  • An electrically insulating filler is provided between the housing floor and the printed circuit board.
  • the invention has for its object to provide an inexpensive method for attaching a prefabricated circuit board on a base plate. Furthermore, the invention aims to provide an arrangement of base plate and printed circuit board mounted thereon which can be produced cost-effectively. When using a metallic base plate in particular good heat dissipation from the circuit board to the base plate can also be achieved.
  • a lowermost layer of insulation layer on the printed circuit board is omitted, i.e. the circuit board is manufactured without an insulation layer on the bottom. This leads to significant cost savings in the manufacture of the circuit board due to material savings and lower manufacturing costs.
  • inexpensive printed circuit boards can therefore be used.
  • the base plate is made of an electrically conductive material, the short-circuit protection when the printed circuit board is applied to the base plate is made possible by the electrically insulating material previously produced on the surface of the base plate
  • An electrically non-conductive adhesive is preferably used to fix the circuit board to the base plate.
  • the plate with the circuit board to a flexible circuit ⁇ wherein the insulation layer (s) consist of a plastic film.
  • Flexible printed circuit boards are preferably used as connection and assembly elements for compact, lightweight and m predetermined housing shapes, adaptable electrical circuits. They can be implemented as one-sided flexible printed circuit boards (ie only one side of an insulation layer layer serving as a base plastic film), as two-sided flexible printed circuit boards (ie printed circuit layers are realized on both sides of an insulation layer layer serving as a base plastic film) and as multilayer systems. Electrical through-contacts between the individual conductor track layers can be provided at suitable points on the circuit board.
  • a further preferred embodiment of the invention is characterized in that the printed circuit board is a printed circuit board with an insulation layer layer (s) consisting of a glass fiber reinforced plastic plate.
  • Printed circuit boards constructed in this way are also known in the art as FR4 printed circuit boards. Single-sided or double-sided printed circuit boards as well as multilayer systems can be used.
  • a third preferred variant of the invention is characterized in that the printed circuit board is a printed circuit board with an insulating layer layer (s) consisting of a ceramic material.
  • Such circuit boards are generally referred to as ceramic substrates.
  • Various forms of implementation are known, such as HTCC (high temperature cofired ceramics), LTCC (low temperature cofired ceramics) and DCB substrates and are suitable for the invention. Cost advantages are in turn achieved through material savings and simplified production of the ceramic substrates.
  • a first preferred possibility is to use an electrically insulating layer on the base plate surface
  • the choice of coating method depends both on the material of the base plate to be coated and on the requirements (e.g. with regard to mechanical and chemical resistance) which the circuit board, which is preferably glued to the base plate, must meet.
  • the electrically insulating layer can advantageously be produced by etching.
  • etching When enamelling, a glass-like coating is formed on the top of the base plate, which due to its good chemical resistance and high hardness is well suited for safe electrical insulation.
  • a fundamentally different procedure which is also preferred within the scope of the invention, consists of the electrically insulating layer on the base plate top side by means of a to generate structural transformation of the base plate surface.
  • chemical conversion processes are particularly suitable because they can be largely automated and can be carried out very inexpensively.
  • the insulating layer is preferably produced by anodizing (electrolytic oxidizing). This process is particularly suitable for a base plate made of aluminum.
  • a metal oxide layer Al 2 Oj
  • Al 2 Oj is produced on the surface of the aluminum base plate which, in contrast to the A1_0, -Pass ⁇ v ⁇ réellessch ⁇ cht already created by natural oxidation processes, has a sufficiently large thickness to ensure reliable electrical insulation. Due to the high hardness of the anodized layer, the risk of damage to the same is relatively low, for example due to the introduction of scratches during the manufacturing process.
  • the electrically insulating layers produced by anodizing, chromating and phosphating offer a good primer for additional paint or enamel coatings that can be applied.
  • the arrangement according to the invention has, in addition to the advantageous properties and manufacturing advantages already mentioned, the further advantage that it is generally thinner than a comparable conventional arrangement, since even if an electrically insulating layer has to be applied to a metallic base plate, the latter can regularly be made thinner than the insulation layer layer saved on the printed circuit board.
  • Figure 1 is a schematic sectional view of a metallic base plate with a flexible printed circuit board mounted thereon according to the prior art.
  • FIG. 2 shows a schematic sectional illustration of a metallic base plate with a flexible printed circuit board attached thereon according to a first exemplary embodiment of the invention
  • Fig. 3 is a schematic, partially cut perspec ⁇ tivansicht a metallic base plate with thereon anbritter ceramic circuit board according to a second exemplary embodiment of the invention.
  • FIG. 4 shows a schematic sectional illustration through the arrangement shown in FIG. 3 along the line I-I in FIG. 3.
  • the flexible circuit board 2 comprises a base foil 3, a cover foil 4 and in between a conductor track layer 5.
  • the conductor track layer 5 comprises individual conductor tracks 6, usually made of Cu, which are embedded in an optional filling compound 7 made of adhesive.
  • FIG. 2 shows a schematic sectional illustration of a metallic base plate 1 with a flexible printed circuit board 20 attached thereon according to a first exemplary embodiment of the invention.
  • the same parts as m Fig. 1 are identified by the same reference numerals.
  • the flexible circuit board 20 shown in FIG. 2 corresponds to the conventional circuit board 2.
  • the essential difference is that there is no bottom-side
  • Insulation layer (m Fig. 1, the base film 3) is present.
  • the printed circuit board 20 can be applied directly to the surface of the base plate.
  • a thin metal foil for example Cu foil, is first rolled or electrolytically deposited on the cover foil 4 (here with the adhesive 7 located thereon) which realizes the base material. Rolling or deposition takes place in a roll-to-roll process.
  • the conductor track image (i.e. the individual conductor tracks 6) is then formed using photolithographic and etching techniques.
  • a conven- tional circuit board 2 will now for the preparation of the surface-side exposed Lei ⁇ terbahnen 6 with a further, optionally provided with an adhesive layer insulation film layer covered. This process does not apply to the printed circuit board 20 shown in FIG. 2.
  • circuit board 20 has a plurality of conductor track levels 5, these can be electrically or selectively connected to one another by forming suitable plated-through holes.
  • the exposed conductor tracks 6 of the circuit board 20 can still be protected against tarnishing by applying an organic material that evaporates at low temperatures to the conductor tracks 6.
  • the tarnish protection does not provide sufficient electrical insulation of the conductor tracks 6, which would make it possible to bring the circuit board 20 directly into contact with an electrically conductive surface.
  • the electrically insulating layer 8 is applied to the surface of the base plate 1.
  • a possible process sequence for this - namely the anodizing of an Al base plate 1 - is described below.
  • the AI -Grundplatte 1 is surface-side acidic with dilute sodium hydroxide or mixtures of nitric acid m, river ⁇ or chromic acid pickled and then compared with egg ner insoluble electrode an acidic electrolyte Siert anodic m.
  • an as is "hard anodising” used denote ⁇ tes cocurrent process, the working temperatures at reduced Tem ⁇ (about 0 ° C) and particularly hard and scratch generated ⁇ solid oxide layers also have good thermal conductivity also.
  • the hardness and abrasion resistance of the oxide layer produced is increased by compacting the layer in hot water, steam or in salt solutions. This process increases the dielectric strength of the layer.
  • the attachment of the printed circuit board 20 to the base plate 1 is described below:
  • an electrically non-conductive adhesive based on epoxy, acrylic or phenol is applied either to the anodized surface layer 8 of the base plate 1 or to the underside of the printed circuit board 20 (i.e. also to the exposed conductor tracks 6).
  • the adhesive can be identical with the adhesive filling compound 7 that was used to build up the conductor track layer 5 of the printed circuit board 20.
  • the two components (base plate 1 and printed circuit board 20) are glued together.
  • the electrically non-conductive adhesive provided between the conductor tracks 6 and the base plate 1 - provided that there was no insulating surface layer 8 - could not guarantee short-circuit protection sufficient in practice.
  • the insulating layer 8 produced on the metallic base plate 1 is therefore imperative in order to achieve effective, safe and long-term electrical insulation of the conductor tracks 6 from the base plate metal.
  • FIG. 3 shows a perspective view of a second exemplary embodiment of the invention, which differs from the first exemplary embodiment essentially only in the use of a different type of printed circuit board.
  • the same parts are also designated with the same reference numerals here.
  • the printed circuit board is designed in the form of a multilayer ceramic substrate 200, which is constructed from alternately arranged ceramic layer layers 204 and conductor track layers 205.
  • Base side of the ceramic substrate 200 is a printed circuit ⁇ web layer 205 consisting of exposed individual conductors ⁇ tracks provided 206th
  • the top of the ceramic substrate 200 can be realized by a ceramic layer layer 204 with conductor tracks 206 running thereon.
  • the conductor tracks 206 running on the upper side of the ceramic substrate 200 contact electrical components, such as ICs 209 or thin film resistors 210, which are glued to the ceramic substrate 200.
  • the individual conductor tracks 206 of different conductor track layers 205 are selectively in electrical contact with one another via electrical bushings 207.
  • Fig. 4 illustrates the structure of circuit board 200 and
  • Base plate 1 based on a sectional view along the Li
  • the ceramic substrate 200 is produced from a ceramic raw material (green tape), which is rolled off a roll and cut into m matching pieces with the same contours.
  • the holes for the vias 207 are then punched out and filled with a metallic paste.
  • the conductor pattern is then applied to the individual ceramic raw material pieces by screen printing or a photolithography process.
  • the individual pieces are stacked on top of one another in the correct order and in a last step of the printed circuit board production, the multilayer stack is sintered, i.e. pressed to a ceramic solid at high temperatures.
  • co-fire technology can be used to produce HTCC or LTCC circuit boards according to the sintering temperature.
  • the plated-through ceramic raw material pieces can first be fired individually, subsequently are provided with the conductor tracks 206, are stacked and later fired or sintered again.
  • Printed circuit boards manufactured using this technology are referred to as FC (fired ceramics) printed circuit boards and can also be used.
  • DCB substrate Another type of ceramic circuit board that can be used within the scope of the invention is known in the art as a DCB substrate or also thermal clad.
  • the exemplary embodiments described have in common that the coating and surface conversion processes for producing the insulating layer 8 can be combined with one another and that, in addition to or instead of the processes already mentioned, powder coating processes, roll coating processes and hot dip processes can be used.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention relates to a method for attaching a printed circuit board (20) to a main board (1), which is based on a printed circuit board (20) consisting of printed-conductor layers (5) and insulating layers (4). The printed circuit board (20) has no insulating layer (4) on the bottom side. If the main board (1) is electrically conductive an electrically insulating layer (8) is produced on the surface of the main board (1) facing the printed circuit board (20), after which said printed circuit board (20) is mounted on the main board (1).

Description

Beschreibungdescription
Grundplatte mit darauf angebrachter LeiterplatteBase plate with printed circuit board attached to it
Die Erfindung betrifft ein Verfahren zum kurzschlußsicheren Anbringen einer Leiterplatte an einer Grundplatte sowie eine Anordnung aus Grundplatte und darauf angebrachter Leiterplatte .The invention relates to a method for short-circuit-proof attachment of a printed circuit board to a base plate and an arrangement of base plate and printed circuit board mounted thereon.
In vielen elektrischen Geraten werden elektrische Schaltungen bestehend aus einer Leiterplatte mit darauf montierten und von der Leiterplatte elektrisch kontaktierten elektrischen Bauelementen verwendet. Die Verdrahtung der Schaltung wird m der Regel durch die Leiterplatte realisiert. Zu diesem Zweck besteht die Leiterplatte typischerweise aus einemIn many electrical devices, electrical circuits consisting of a printed circuit board with electrical components mounted thereon and electrically contacted by the printed circuit board are used. The wiring of the circuit is usually realized by the circuit board. For this purpose, the circuit board typically consists of one
Schichtsystem, das eine oder mehrere Leiterbahnlagen und eine oder auch mehrere die Leiterbahnlagen elektrisch trennende I- solationsschichten umfaßt.Layer system which comprises one or more interconnect layers and one or more insulation layers electrically separating the interconnect layers.
Es ist bereits bekannt, derartige Leiterplatten auf mechanisch stabile Grundplatten aufzukleben. Die Verwendung einer Grundplatte kann erforderlich sein, um eine mechanisch stabi¬ le Unterlage für diverse elektrische Kontaktierungsverfahren wie beispielsweise das Bonden auf einer flexiblen Leiterplat- te bereitzustellen. Darüber hinaus werden aus einem gut wärmeleitenden Metallmaterial bestehende Grundplatten zur Abfuhrung der Verlustwarme der elektrischen Schaltung eingesetzt.It is already known to glue circuit boards of this type onto mechanically stable base plates. The use of a base plate may be required to provide a mechanically stable ¬ le support for various electrical contacting methods such as bonding to a flexible printed circuit boards provide te. In addition, base plates made of a good heat-conducting metal material are used to dissipate the heat loss of the electrical circuit.
In der Praxis werden Leiterplatten zumeist als vorgefertigte Einzelelemente produziert, nachfolgend mit den elektrischen Bauelementen bestuckt und dann auf die Grundplatte aufge¬ bracht. Das Bestucken der Leiterplatte kann auch nach ihrer Anbringung auf der Grundplatte erfolgen. Die der Grundplatte zugewandte, bodenseitige Schichtlage der Leiterplatte besteht dabei stets aus einer Isolationsschicht, um auszuschließen, daß ein Kurzschluß m der untersten Leiterbahnebene entstehen kann, sofern die Leiterplatte auf einer metallischen Grundplatte befestigt wird.In practice, circuit boards are mostly produced as prefabricated individual elements, bestuckt below with the electrical components and then applied to the base plate up ¬. The circuit board can also be populated after it has been attached to the base plate. The bottom layer layer of the printed circuit board facing the base plate always consists of an insulation layer in order to rule out the possibility of a short circuit m in the lowest interconnect level can, provided the circuit board is attached to a metallic base plate.
Die US-Patentschrift 4,495,378 beschreibt eine speziell für eine hohe Wärmeableitung konzipierte Leiterplattenstruktur, welche aus einem Metall- oder Carbonkern besteht, auf welchem eine Kupfer- oder Silberschicht angebracht ist. Darüber ist eine Aluminiumschicht vorgesehen. Die Aluminiumschicht ist mit einer elektrisch isolierenden, eloxierten Oberflachen- schicht versehen, auf welcher die Leiterbahnen der Leiterplatte verlaufen.US Pat. No. 4,495,378 describes a circuit board structure specially designed for high heat dissipation, which consists of a metal or carbon core on which a copper or silver layer is attached. An aluminum layer is provided on top. The aluminum layer is provided with an electrically insulating, anodized surface layer on which the conductor tracks of the circuit board run.
Die deutsche Patentanmeldung DE 40 30 532 AI beschreibt eine m Hybridtechnik aufgebaute Mehrlagenschaltung. Auf einem Metallgrundkorper sind mehrere biegsame Glaskeramikfolien mit aufgedruckten Schaltungsstrukturen übereinander aufgelegt und werden m einem Sintervorgang zu einem Glaskeramikkorper gebrannt. Dabei verbindet sich die unterste Glaskeramikschicht mit dem Metallgrundkorper.The German patent application DE 40 30 532 AI describes a multi-layer circuit constructed in hybrid technology. Several flexible glass ceramic foils with printed circuit structures are placed on top of one another on a metal base body and are fired in a sintering process to form a glass ceramic body. The bottom glass ceramic layer connects to the metal body.
In der Schrift DE 195 05 180 AI ist ein elektronisches Steuermodul beschrieben, welches einen Leiterplattenkorper umfaßt, der über einen Klebefilm auf einer Grundplatte des Gehäuses angeklebt ist.In the document DE 195 05 180 AI an electronic control module is described which comprises a circuit board body which is glued to a base plate of the housing via an adhesive film.
In der Schrift DE 195 28 632 AI ist ein Steuergerat beschrieben, welches eine Leiterplatte beinhaltet, die von einem Gehauseboden getragen wird. Zwischen dem Gehauseboden und der Leiterplatte ist ein elektrisch isolierender Füllstoff vorge- sehen.In the document DE 195 28 632 AI a control device is described which contains a circuit board which is carried by a floor of the housing. An electrically insulating filler is provided between the housing floor and the printed circuit board.
Der Erfindung liegt die Aufgabe zugrunde, ein kostengünstiges Verfahren zum Anbringen einer vorgefertigten Leiterplatte auf einer Grundplatte anzugeben. Ferner zielt die Erfindung dar- auf ab, eine kostengünstig herstellbare Anordnung aus Grundplatte und darauf angebrachter Leiterplatte zu schaffen. Bei Verwendung einer metallischen Grundplatte soll insbesondere auch eine gute Wärmeableitung von der Leiterplatte zu der Grundplatte erreichbar sein.The invention has for its object to provide an inexpensive method for attaching a prefabricated circuit board on a base plate. Furthermore, the invention aims to provide an arrangement of base plate and printed circuit board mounted thereon which can be produced cost-effectively. When using a metallic base plate in particular good heat dissipation from the circuit board to the base plate can also be achieved.
Diese Aufgabenstellung wird durch die Merkmale der unabhangi- gen Ansprüche gelost.This task is solved by the characteristics of the independent claims.
Bei dem erfindungsgemaßen Verfahren und der erfmdungsgemaßen Anordnung entfallt eine unterste Isolationsschichtlage an der Leiterplatte, d.h. die Leiterplatte wird ohne bodenseitige I- solationsschichtlage hergestellt. Dies fuhrt infolge Materialeinsparung und geringerem Fertigungsaufwand zu einer deutlichen Kostenersparnis bei der Herstellung der Leiterplatte. Im Rahmen des erfindungsgemaßen Prozesses sowie zur Herstellung der erfindungsgemaßen Anordnung können daher kostenguns- tige Leiterplatten verwendet werden.In the method according to the invention and the arrangement according to the invention, a lowermost layer of insulation layer on the printed circuit board is omitted, i.e. the circuit board is manufactured without an insulation layer on the bottom. This leads to significant cost savings in the manufacture of the circuit board due to material savings and lower manufacturing costs. In the context of the process according to the invention and for the production of the arrangement according to the invention, inexpensive printed circuit boards can therefore be used.
Sofern die Grundplatte aus einem elektrisch leitenden Material besteht, wird die Kurzschlußsicherheit beim Aufbringen der Leiterplatte auf die Grundplatte durch die zuvor an der Ober- flache der Grundplatte erzeugte elektrisch isolierendeIf the base plate is made of an electrically conductive material, the short-circuit protection when the printed circuit board is applied to the base plate is made possible by the electrically insulating material previously produced on the surface of the base plate
Schicht gewährleistet. Da die Kosteneinsparung durch Weglassen der bodenseitigen Isolationsschichtlage an der Leiterplatte generell großer ist als die Zusatzkosten, die mit der Erzeugung der isolierenden Schicht auf der elektrisch leiten- den Grundplatte verbunden sind, kann auch m diesem Fall insgesamt eine Kostenersparnis erreicht werden.Layer guaranteed. Since the cost saving by omitting the bottom layer of insulation layer on the printed circuit board is generally greater than the additional costs associated with the production of the insulating layer on the electrically conductive base plate, overall cost savings can also be achieved in this case.
Zur Fixierung der Leiterplatte an der Grundplatte wird vorzugsweise ein elektrisch nichtleitender Klebstoff eingesetzt.An electrically non-conductive adhesive is preferably used to fix the circuit board to the base plate.
Grundsatzlich können im Rahmen der Erfindung alle bekannten Leiterplattentypen mit Vorteil eingesetzt werden.In principle, all known types of printed circuit boards can advantageously be used within the scope of the invention.
Nach einer besonders bevorzugten Ausgestaltung der Erfindung handelt es sich bei der Leiterplatte um eine flexible Leiter¬ platte, bei der die Isolationsschichtlage (n) aus einer Kunststoffolie bestehen. Flexible Leiterplatten werden be- vorzugt als Verbmdungs- und Aufbauelemente für kompakte, leichte und m vorgegebene Gehauseformen einpaßbare elektrische Schaltungen verwendet. Sie können als einseitige flexible Leiterplatten (d.h. nur auf einer Seite einer als Ba- siskunststoffolie dienenden Isolationsschichtlage ist eine Leiterbahnlage realisiert) , als zweiseitige flexible Leiterplatten (d.h. zu beiden Seiten einer als Basiskunststoffolie dienenden Isolationsschichtlage sind Leiterbahnlagen realisiert) und als Multilagensysteme realisiert sein. An geeig- neten Stellen der Leiterplatte können elektrische Durchkon- taktierungen zwischen den einzelnen Leiterbahnlagen vorgesehen sein.According to a particularly preferred embodiment of the invention, the plate with the circuit board to a flexible circuit ¬, wherein the insulation layer (s) consist of a plastic film. Flexible printed circuit boards are preferably used as connection and assembly elements for compact, lightweight and m predetermined housing shapes, adaptable electrical circuits. They can be implemented as one-sided flexible printed circuit boards (ie only one side of an insulation layer layer serving as a base plastic film), as two-sided flexible printed circuit boards (ie printed circuit layers are realized on both sides of an insulation layer layer serving as a base plastic film) and as multilayer systems. Electrical through-contacts between the individual conductor track layers can be provided at suitable points on the circuit board.
Eine weitere bevorzugte Ausgestaltung der Erfindung kenn- zeichnet sich dadurch, daß es sich bei der Leiterplatte um eine Leiterplatte mit Isolationsschichtlage (n) bestehend aus einer glasfaserverstärkten Kunststoffplatte handelt. Derart aufgebaute Leiterplatten sind m der Technik auch als FR4- Leiterplatten bekannt. Es können wiederum einseitige oder zweiseitige Leiterplatten sowie Multilagensysteme eingesetzt werden .A further preferred embodiment of the invention is characterized in that the printed circuit board is a printed circuit board with an insulation layer layer (s) consisting of a glass fiber reinforced plastic plate. Printed circuit boards constructed in this way are also known in the art as FR4 printed circuit boards. Single-sided or double-sided printed circuit boards as well as multilayer systems can be used.
Da glasfaserverstärkte Kunststoffplatten ausgesprochen kos¬ tengünstig sind, liegt das Kostenemsparungspotential bei Verwendung von glasfaserverstärkten Kunststoffplatten (im Vergleich zu flexiblen Leiterplatten, die als Isolations- schichtlagen teurere Kunststoffolien verwenden) weniger im Bereich der Materialeinsparung sondern hauptsächlich im Be¬ reich der Fertigungstechnik. Dabei ist zu berücksichtigen, daß bei Leiterplatten mit glasfaserverstärkten Kunststoffplatten - anders als bei flexiblen Leiterplatten - zum Aufbau der Leiterplatte kein kostengünstiger Rolle-zu-Rolle- Fertigungsprozeß möglich ist, sondern daß teurere Emzelplat- tenFertigungsverfa ren eingesetzt werden müssen, die durch das Entfallen des einen Aufbringschrittes für die bodenseiti- ge Isolationsschichtlage entsprechend kostengünstiger ausgeführt werden können. Eine dritte bevorzugte Variante der Erfindung kennzeichnet sich dadurch, daß es sich bei der Leiterplatte um eine Leiterplatte mit Isolationsschichtlage (n) bestehend aus einem Keramik aterial handelt. Derartige Leiterplatten werden allgemein als Keramik-Substrate bezeichnet. Es sind verschiedene Realisierungsformen wie beispielsweise HTCC- (high tempe- rature cofired ceramics-), LTCC- (low temperature cofired ce- ramics-) und DCB-Substrate bekannt und f r die Erfindung ge- eignet. Kostenvorteile werden wiederum durch Materialeinsparung und vereinfachte Fertigung der Keramik-Substrate erzielt .Since fiberglass reinforced plastic panels are extremely kos ¬-effectively, the Kostenemsparungspotential is using fiberglass reinforced plastic panels (compared to flexible circuit boards as an insulating layer were expensive plastic use) less in material savings but mainly at Be ¬ rich production technology. It should be taken into account that, in the case of printed circuit boards with glass fiber-reinforced plastic plates - in contrast to flexible printed circuit boards - an inexpensive roll-to-roll manufacturing process is not possible for the construction of the printed circuit board, but that more expensive single-board manufacturing processes must be used, which are eliminated by the elimination of the an application step for the bottom layer of insulation layer can be carried out correspondingly more cost-effectively. A third preferred variant of the invention is characterized in that the printed circuit board is a printed circuit board with an insulating layer layer (s) consisting of a ceramic material. Such circuit boards are generally referred to as ceramic substrates. Various forms of implementation are known, such as HTCC (high temperature cofired ceramics), LTCC (low temperature cofired ceramics) and DCB substrates and are suitable for the invention. Cost advantages are in turn achieved through material savings and simplified production of the ceramic substrates.
Samtlichen vorstehend beschriebenen Leiterplattentypen ist gemeinsam, daß sie separat von der Grundplatte als Einzelteile vorgefertigt werden.All types of printed circuit boards described above have in common that they are prefabricated separately from the base plate as individual parts.
Bei Verwendung einer elektrisch leitenden Grundplatte besteht eine erste bevorzugte Möglichkeit darin, die elektrisch ISO- lierende Schicht auf der Grundplattenoberflache durch einenWhen using an electrically conductive base plate, a first preferred possibility is to use an electrically insulating layer on the base plate surface
Beschichtungsprozeß zu erzeugen. Die Wahl des Beschichtungs- verfahrens hangt dabei sowohl von dem Material der zu beschichtenden Grundplatte als auch von den Anforderungen (z.B. in Hinblick auf mechanische und chemische Beständigkeit) ab, denen die vorzugsweise auf die Grundplatte aufgeklebte Leiterplatte genügen muß.To produce coating process. The choice of coating method depends both on the material of the base plate to be coated and on the requirements (e.g. with regard to mechanical and chemical resistance) which the circuit board, which is preferably glued to the base plate, must meet.
Insbesondere bei einer Stahl- oder Grauguß-Grundplatte kann die elektrisch isolierende Schicht mit Vorteil durch E ail- lieren hergestellt werden. Beim Emaillieren entsteht auf der Grundplattenoberseite ein glasartiger Überzug, der aufgrund seiner guten chemischen Resistenz und seiner hohen Harte für eine sichere elektrische Isolation gut geeignet ist.In the case of a steel or gray cast iron base plate in particular, the electrically insulating layer can advantageously be produced by etching. When enamelling, a glass-like coating is formed on the top of the base plate, which due to its good chemical resistance and high hardness is well suited for safe electrical insulation.
Eine grundsatzlich andere, ebenfalls im Rahmen der Erfindung bevorzugte Vorgehensweise besteht darin, die elektrisch isolierende Schicht auf der Grundplattenoberseite durch eine strukturelle Umwandlung der Grundplattenoberflache zu erzeugen. Neben physikalischen Umwandlungsverfahren (z.B. Laserstrahl-, Elektronenstrahl- und Ultraschallverfahren) sind besonders chemische Umwandlungsprozesse geeignet, da sie weit- gehend automatisierbar sind und sehr kostengünstig durchgeführt werden können.A fundamentally different procedure, which is also preferred within the scope of the invention, consists of the electrically insulating layer on the base plate top side by means of a to generate structural transformation of the base plate surface. In addition to physical conversion processes (eg laser beam, electron beam and ultrasound processes), chemical conversion processes are particularly suitable because they can be largely automated and can be carried out very inexpensively.
Vorzugsweise wird die isolierende Schicht durch Eloxieren (e- lektrolytisches Oxidieren) hergestellt. Insbesondere bei ei- ner aus Aluminium bestehenden Grundplatte bietet sich dieser Prozeß an. Es wird eine Metalloxidschicht (Al2Oj) auf der 0- berflache der Aluminium-Grundplatte erzeugt, die im Gegensatz zu der bereits durch naturliche Oxidationsprozesse entstehenden A1_0 ,-Passιvιerungsschιcht eine ausreichend große Dicke aufweist, um eine sichere elektrische Isolierung zu gewährleisten. Aufgrund der hohen Harte der Eloxidschicht ist die Gefahr einer Beschädigung derselben beispielsweise durch das Einbringen von Kratzern wahrend des Fertigungsprozesses verhältnismäßig gering.The insulating layer is preferably produced by anodizing (electrolytic oxidizing). This process is particularly suitable for a base plate made of aluminum. A metal oxide layer (Al 2 Oj) is produced on the surface of the aluminum base plate which, in contrast to the A1_0, -Passιvιerungsschιcht already created by natural oxidation processes, has a sufficiently large thickness to ensure reliable electrical insulation. Due to the high hardness of the anodized layer, the risk of damage to the same is relatively low, for example due to the introduction of scratches during the manufacturing process.
Weitere vorteilhafte chemische Verfahren für die Umwandlung der Grundplattenoberflache sind ferner das Phosphatieren und/oder das Chromatieren insbesondere von Stahl- oder Aluminium-Grundplatten. Beide Verfahren erzeugen Isolations- schichten mit ebenfalls guten elektrischen Isolationseigen- schaften gegenüber der von ihnen abgedeckten, elektrisch leitenden Grundplatte. Ferner sind beide Prozesse analog dem E- loxieren als Standardprozesse m Serienfertigungen einsetzbar, wodurch sie wesentlich kostengünstiger realisierbar sind als das Vorsehen einer zusätzlichen Isolationsschichtlage auf einer Leiterplatte.Further advantageous chemical processes for converting the base plate surface are also the phosphating and / or the chromating, in particular of steel or aluminum base plates. Both processes produce insulation layers with equally good electrical insulation properties compared to the electrically conductive base plate they cover. Furthermore, both processes can be used as standard processes in mass production analogously to anodizing, which means that they can be implemented much more cost-effectively than the provision of an additional layer of insulation layer on a printed circuit board.
Umwandlungsverfahren und Beschichtungsprozesse können miteinander kombiniert werden. Beispielsweise bieten die durch E- loxieren, Chromatieren und Phosphatieren erzeugten elektrisch isolierenden Schichten einen guten Haftgrund für zusätzlich aufbringbare Lack- oder Emaillebeschichtungen. Die erfmdungsgemaße Anordnung weist neben den bereits angegebenen gunstigen Eigenschaften und fertigungstechnischen Vorzügen den weiteren Vorteil auf, daß sie m der Regel dunner als eine vergleichbare konventionelle Anordnung ist, da selbst dann, wenn bei einer metallischen Grundplatte eine e- lektrisch isolierende Schicht aufgebracht werden muß, letztere regelmäßig dunner als die an der Leiterplatte eingesparte Isolationsschichtlage realisiert werden kann.Conversion processes and coating processes can be combined with one another. For example, the electrically insulating layers produced by anodizing, chromating and phosphating offer a good primer for additional paint or enamel coatings that can be applied. The arrangement according to the invention has, in addition to the advantageous properties and manufacturing advantages already mentioned, the further advantage that it is generally thinner than a comparable conventional arrangement, since even if an electrically insulating layer has to be applied to a metallic base plate, the latter can regularly be made thinner than the insulation layer layer saved on the printed circuit board.
Weitere vorteilhafte Ausgestaltungen der Erfindung sind m den Unteranspruchen angegeben.Further advantageous embodiments of the invention are specified in the subclaims.
Die Erfindung wird nachfolgend anhand von zwei Ausfuhrungs- beispielen unter Bezugnahme auf die Zeichnung erläutert; m dieser zeigt:The invention is explained below using two exemplary embodiments with reference to the drawing; m this shows:
Fig. 1 eine schematische Schnittdarstellung einer metallischen Grundplatte mit darauf angebrachter flexibler Leiterplatte nach dem Stand der Technik;Figure 1 is a schematic sectional view of a metallic base plate with a flexible printed circuit board mounted thereon according to the prior art.
Fig. 2 eine schematische Schnittdarstellung einer metallischen Grundplatte mit darauf angebrachter flexibler Leiterplatte nach einem ersten Ausfuhrungsbeispiel der Erfindung;2 shows a schematic sectional illustration of a metallic base plate with a flexible printed circuit board attached thereon according to a first exemplary embodiment of the invention;
Fig. 3 eine schematische, teilweise aufgeschnittene Perspek¬ tivansicht einer metallischen Grundplatte mit darauf anbgebrachter Keramik-Leiterplatte nach einem zweiten Ausfuhrungsbeispiel der Erfindung; undFig. 3 is a schematic, partially cut perspec ¬ tivansicht a metallic base plate with thereon anbgebrachter ceramic circuit board according to a second exemplary embodiment of the invention; and
Fig. 4 eine schematische Schnittdarstellung durch die m Fig. 3 gezeigte Anordnung entlang der Linie I-I m Fig. 3.FIG. 4 shows a schematic sectional illustration through the arrangement shown in FIG. 3 along the line I-I in FIG. 3.
Fig. 1 zeigt den Aufbau einer metallischen Grundplatte 1 mit darauf angebrachter flexibler Leiterplatte 2 nach dem Stand der Technik. Die flexible Leiterplatte 2 umfaßt eine Basis- folie 3, eine Deckfolie 4 und zwischenliegend eine Leiterbahnlage 5. Die Leiterbahnlage 5 umfaßt einzelne, üblicherweise aus Cu bestehende Leiterbahnen 6, die m einer optionalen Füllmasse 7 aus Klebstoff eingebettet sind.1 shows the structure of a metallic base plate 1 with a flexible printed circuit board 2 according to the prior art attached to it. The flexible circuit board 2 comprises a base foil 3, a cover foil 4 and in between a conductor track layer 5. The conductor track layer 5 comprises individual conductor tracks 6, usually made of Cu, which are embedded in an optional filling compound 7 made of adhesive.
Zwischen der Leiterplatte 2 und der Grundplatte 1 befindet sich eine Laminationsschicht 9, mittels der die Leiterplatte 2 auf der Grundplatte 1 aufgeklebt ist.Between the printed circuit board 2 and the base plate 1 there is a lamination layer 9, by means of which the printed circuit board 2 is glued to the base plate 1.
Der in Fig. 1 exemplarisch anhand einer flexiblen Leiterplatte 2 erläuterte Aufbau des Verbunds aus Grundplatte und Leiterplatte gilt m analoger Weise auch bei Einsatz anderer bekannter Leiterplattentypen.The example of the structure of the composite of base plate and printed circuit board explained in FIG. 1 using a flexible printed circuit board 2 also applies analogously when other known types of printed circuit boards are used.
Fig. 2 zeigt eine schematische Schnittdarstellung einer metallischen Grundplatte 1 mit darauf angebrachter flexibler Leiterplatte 20 nach einem ersten Ausfuhrungsbeispiel der Erfindung. Gleiche Teile wie m Fig. 1 sind mit denselben Bezugszeichen gekennzeichnet.2 shows a schematic sectional illustration of a metallic base plate 1 with a flexible printed circuit board 20 attached thereon according to a first exemplary embodiment of the invention. The same parts as m Fig. 1 are identified by the same reference numerals.
In Hinblick auf die Deckfolie 4 und die Leiterbahnlage (n) 5 mit optionaler Klebstoff-Füllmasse 7 und darin enthaltenen Leiterbahnen 6 entspricht die m Fig. 2 dargestellte flexible Leiterplatte 20 der konventionellen Leiterplatte 2. Der we- sentliche Unterschied besteht darin, daß keine bodenseitigeWith regard to the cover film 4 and the conductor track layer (s) 5 with optional adhesive filling compound 7 and conductor tracks 6 contained therein, the flexible circuit board 20 shown in FIG. 2 corresponds to the conventional circuit board 2. The essential difference is that there is no bottom-side
Isolationsschicht (m Fig. 1 die Basisfolie 3) vorhanden ist.Insulation layer (m Fig. 1, the base film 3) is present.
Bei einer Grundplatte aus einem elektrisch nichtleitenden Material (beispielsweise Kunststoff) kann die Leiterplatte 20 direkt auf die Oberflache der Grundplatte aufgebracht sein.In the case of a base plate made of an electrically non-conductive material (for example plastic), the printed circuit board 20 can be applied directly to the surface of the base plate.
Bei der hier dargestellten metallischen Grundplatte 1 wurde eine solche Vorgehensweise unmittelbar zu einem Kurzschluß der Leiterbahnen 6 fuhren oder es konnte zumindest keine aus- reichende Kurzschlußsicherheit bezüglich der Leiterbahnen 6 gewährleistet werden. Zwischen der Oberflache der Grundplatte 1 und der Leiterplatte 20 erstreckt sich daher eine iso- lierende Schicht 8, die auf vielfaltige Weise, beispielsweise durch Eloxieren der Grundplattenoberflache, erzeugt sein kann.In the case of the metallic base plate 1 shown here, such a procedure led directly to a short circuit in the conductor tracks 6, or at least no sufficient short-circuit protection with respect to the conductor tracks 6 could be guaranteed. An iso- therefore extends between the surface of the base plate 1 and the circuit board 20. layer 8, which can be produced in a variety of ways, for example by anodizing the base plate surface.
Die Herstellung des m Fig. 2 gezeigten Aufbaus ist wie folgt:The construction of the structure shown in FIG. 2 is as follows:
Zunächst wird die Herstellung der flexiblen Leiterplatte 20 beschrieben. Die Deckfolie 4 - und bei einer mehrlagigen flexiblen Leiterplatte 20 auch die anderen Isolationsschicht- lagen - bestehen aus Polyester, Polyimid oder Teflon. Im Herstellungsprozeß wird zunächst eine dünne Metallfolie, beispielsweise Cu-Folie auf die hier das Basismaterial realisierende Deckfolie 4 (gegebenenfalls mit darauf befindlichem Klebstoff 7) aufgewalzt oder elektrolytisch abgeschieden. Das Aufwalzen oder Abscheiden erfolgt m einem Rolle-zu- Rolle-Prozeß .First, the manufacture of the flexible circuit board 20 will be described. The cover film 4 - and in the case of a multi-layer flexible printed circuit board 20 also the other insulation layer layers - consist of polyester, polyimide or Teflon. In the manufacturing process, a thin metal foil, for example Cu foil, is first rolled or electrolytically deposited on the cover foil 4 (here with the adhesive 7 located thereon) which realizes the base material. Rolling or deposition takes place in a roll-to-roll process.
Sofern an der (oberseitigen) Deckfolie 4 metallische Be- Schichtungen zur Kontaktierung von elektrischen Bauelementen benotigt werden, können die dafür erforderlichen Aussparungen bereits vor dem Aufbringen der Cu-Folie auf die Deckfolie 4 aus letzterer ausgestanzt werden.If metallic coatings for contacting electrical components are required on the (top) cover film 4, the recesses required for this can be punched out of the cover film 4 before the Cu film is applied to the latter.
Anschließend wird das Leiterbahnbild (d.h. die einzelnen Leiterbahnen 6) durch photolithographische und atztechnische Verfahren herausgebildet.The conductor track image (i.e. the individual conductor tracks 6) is then formed using photolithographic and etching techniques.
Üblicherweise werden nun zur Herstellung einer konventionel- len Leiterplatte 2 die oberflachenseitig freiliegenden Lei¬ terbahnen 6 mit einer weiteren, gegebenenfalls mit einer Klebstoffschicht versehenen Isolationsschichtlage abgedeckt. Dieser Prozeß entfallt bei der m Fig. 2 gezeigten Leiterplatte 20.Typically, a conven- tional circuit board 2 will now for the preparation of the surface-side exposed Lei ¬ terbahnen 6 with a further, optionally provided with an adhesive layer insulation film layer covered. This process does not apply to the printed circuit board 20 shown in FIG. 2.
Sodann werden an den ausgesparten Kontaktierungsstellen der Deckfolie 4 metallische Kontaktflachen ausgebildet, Bauteil- und/oder Befestigungslocher an geeigneter Stelle m den Lagenverbund eingebracht und einzelne Leiterplatten 20 aus dem Lagenverbund ausgestanzt. Sofern die Leiterplatte 20 mehrere Leiterbahnebenen 5 aufweist, können diese selektiv oder ge- meinsam durch Ausbildung geeigneter Durchkontaktierungen e- lektrisch miteinander verbunden werden.Then 4 metallic contact surfaces are formed at the recessed contact points of the cover film, component and / or mounting holes are introduced at a suitable point in the layer composite and individual printed circuit boards 20 are punched out of the layer composite. If the circuit board 20 has a plurality of conductor track levels 5, these can be electrically or selectively connected to one another by forming suitable plated-through holes.
Die freiliegenden Leiterbahnen 6 der Leiterplatte 20 können noch gegen Anlaufen geschützt werden, indem ein organisches Material, das bei niedrigen Temperaturen verdampft, auf die Leiterbahnen 6 aufgetragen wird. Der Anlaufschutz schafft keine ausreichende elektrische Isolierung der Leiterbahnen 6, die es ermöglichen wurde, die Leiterplatte 20 direkt m Kontakt mit einer elektrisch leitfahigen Oberflache zu bringen.The exposed conductor tracks 6 of the circuit board 20 can still be protected against tarnishing by applying an organic material that evaporates at low temperatures to the conductor tracks 6. The tarnish protection does not provide sufficient electrical insulation of the conductor tracks 6, which would make it possible to bring the circuit board 20 directly into contact with an electrically conductive surface.
Parallel zu der beschriebenen Vorbereitung der Leiterplatte 20 wird die elektrisch isolierende Schicht 8 an der Oberflache der Grundplatte 1 angebracht. Im folgenden wird ein hierfür möglicher Prozeßablauf - nämlich das Eloxieren einer AI-Grundplatte 1 - beschrieben.In parallel to the preparation of the printed circuit board 20 described, the electrically insulating layer 8 is applied to the surface of the base plate 1. A possible process sequence for this - namely the anodizing of an Al base plate 1 - is described below.
Die AI -Grundplatte 1 wird oberflachenseitig mit verdünnter Natronlauge oder m Sauregemischen aus Salpetersaure, Flu߬ saure oder Chromsaure gebeizt und anschließend gegenüber ei- ner unlöslichen Elektrode m einem sauren Elektrolyten anodi- siert. Vorzugsweise wird ein als "Harteloxieren" bezeichne¬ tes Gleichstromverfahren eingesetzt, das bei reduzierten Tem¬ peraturen (etwa 0°C) arbeitet und besonders harte und kratz¬ feste Oxidschichten erzeugt, die darüber hinaus eine gute Wärmeleitfähigkeit aufweisen.The AI -Grundplatte 1 is surface-side acidic with dilute sodium hydroxide or mixtures of nitric acid m, river ¬ or chromic acid pickled and then compared with egg ner insoluble electrode an acidic electrolyte Siert anodic m. Preferably, an as is "hard anodising" used denote ¬ tes cocurrent process, the working temperatures at reduced Tem ¬ (about 0 ° C) and particularly hard and scratch generated ¬ solid oxide layers also have good thermal conductivity also.
Nach dem Anodisieren wird die Harte und Abriebsfestigkeit der erzeugten Oxidschicht durch ein Verdichten der Schicht in heißem Wasser, m Dampf oder in Salzlosungen erhöht. Durch diesen Prozeß wird die elektrische Durchschlagsfestigkeit der Schicht erhöht. Nachfolgend wird das Anbringen der Leiterplatte 20 an der Grundplatte 1 beschrieben:After anodizing, the hardness and abrasion resistance of the oxide layer produced is increased by compacting the layer in hot water, steam or in salt solutions. This process increases the dielectric strength of the layer. The attachment of the printed circuit board 20 to the base plate 1 is described below:
Zu diesem Zweck wird ein elektrisch nichtleitender Klebstoff auf Epoxid-, Acryl- oder Phenolbasis entweder auf die eloxierte Oberflächenschicht 8 der Grundplatte 1 oder auf die Unterseite der Leiterplatte 20 (d.h. u.a. auch auf die freiliegenden Leiterbahnen 6) aufgebracht. Der Klebstoff kann I- dentisch mit der Klebstoff-Füllmasse 7 sein, die zum Aufbau der Leiterbahnlage 5 der Leiterplatte 20 verwendet wurde.For this purpose, an electrically non-conductive adhesive based on epoxy, acrylic or phenol is applied either to the anodized surface layer 8 of the base plate 1 or to the underside of the printed circuit board 20 (i.e. also to the exposed conductor tracks 6). The adhesive can be identical with the adhesive filling compound 7 that was used to build up the conductor track layer 5 of the printed circuit board 20.
Nach dem Applizieren des Klebstoffes werden die beiden Komponenten (Grundplatte 1 und Leiterplatte 20) miteinander verklebt.After applying the adhesive, the two components (base plate 1 and printed circuit board 20) are glued together.
Analog zu dem optionalen Anlaufschutz konnte auch der zwischen den Leiterbahnen 6 und der Grundplatte 1 vorgesehene e- lektrisch nichtleitende Klebstoff - sofern keine isolierende Oberflächenschicht 8 vorhanden wäre - keine für die Praxis ausreichende Kurzschlußsicherheit gewahrleisten. Die auf der metallischen Grundplatte 1 erzeugte isolierende Schicht 8 ist daher zwingend erforderlich, um eine wirksame, sichere und langzeitbestandige elektrische Isolation der Leiterbahnen 6 gegenüber dem Grundplattenmetall zu erreichen.Analogous to the optional tarnish protection, the electrically non-conductive adhesive provided between the conductor tracks 6 and the base plate 1 - provided that there was no insulating surface layer 8 - could not guarantee short-circuit protection sufficient in practice. The insulating layer 8 produced on the metallic base plate 1 is therefore imperative in order to achieve effective, safe and long-term electrical insulation of the conductor tracks 6 from the base plate metal.
Fig. 3 zeigt in perspektivischer Ansicht ein zweites Ausfuh- rungsbeispiel der Erfindung, das sich von dem ersten Ausfuh- rungsbeispiel im wesentlichen nur durch die Verwendung eines anderen Leiterplattentyps unterscheidet. Gleiche Teile sind auch hier mit denselben Bezugszeichen bezeichnet.3 shows a perspective view of a second exemplary embodiment of the invention, which differs from the first exemplary embodiment essentially only in the use of a different type of printed circuit board. The same parts are also designated with the same reference numerals here.
Die Leiterplatte ist m Form eines mehrschichtigen Keramik- Substrats 200 ausgebildet, das aus wechselweise angeordneten Keramik-Schichtlagen 204 und Leiterbahnlagen 205 aufgebaut ist. Bodenseitig des Keramik-Substrats 200 ist eine Leiter¬ bahnlage 205 bestehend aus freiliegenden, einzelnen Leiter¬ bahnen 206 vorgesehen. Die Oberseite des Keramik-Substrats 200 kann durch eine Keramik-Schichtlage 204 mit darauf verlaufenden Leiterbahnen 206 realisiert sein. Die auf der 0- berseite des Keramik-Substrats 200 verlaufenden Leiterbahnen 206 kontaktieren elektrische Bauelemente wie beispielsweise ICs 209 oder Dunnfllmwiderstande 210, welche auf das Keramik- Substrat 200 aufgeklebt sind.The printed circuit board is designed in the form of a multilayer ceramic substrate 200, which is constructed from alternately arranged ceramic layer layers 204 and conductor track layers 205. Base side of the ceramic substrate 200 is a printed circuit ¬ web layer 205 consisting of exposed individual conductors ¬ tracks provided 206th The top of the ceramic substrate 200 can be realized by a ceramic layer layer 204 with conductor tracks 206 running thereon. The conductor tracks 206 running on the upper side of the ceramic substrate 200 contact electrical components, such as ICs 209 or thin film resistors 210, which are glued to the ceramic substrate 200.
Die einzelnen Leiterbahnen 206 verschiedener Leiterbahnlagen 205 stehen über elektrische Durchfuhrungen 207 selektiv mit- einander m elektrischem Kontakt.The individual conductor tracks 206 of different conductor track layers 205 are selectively in electrical contact with one another via electrical bushings 207.
Das Keramik-Substrat 200 ist mittels einer dünnen, nicht dargestellten Klebstoffschicht auf die elektrisch isolierende Schicht 8 der metallischen Grundplatte 1 aufgeklebt. Fig. 4 verdeutlicht den Aufbau aus Leiterplatte 200 undThe ceramic substrate 200 is glued onto the electrically insulating layer 8 of the metallic base plate 1 by means of a thin adhesive layer, not shown. Fig. 4 illustrates the structure of circuit board 200 and
Grundplatte 1 anhand einer Schnittdarstellung entlang der Li
Figure imgf000013_0001
Base plate 1 based on a sectional view along the Li
Figure imgf000013_0001
Das Keramik-Substrat 200 wird aus einem keramischen Rohmate- rial (Green Tape) hergestellt, das von einer Rolle abgerollt und m passende Stucke mit gleichen Konturen geschnitten wird. Anschließend werden die Locher für die Durchkontaktie- rungen 207 ausgestanzt und mit einer metallischen Paste gefüllt. Danach wird auf die einzelnen Keramik- Rohmaterialstucke das Leiterbahnbild durch Siebdruck oder ein Photolithographieverfahren aufgebracht. Die einzelnen Stucke werden m der richtigen Reihenfolge aufemandergestapelt und m einem letzten Schritt der Leiterplattenfertigung wird der Mehrlagenstapel gesintert, d.h. bei hohen Temperaturen zu ei- ne keramischen Festkörper verpreßt.The ceramic substrate 200 is produced from a ceramic raw material (green tape), which is rolled off a roll and cut into m matching pieces with the same contours. The holes for the vias 207 are then punched out and filled with a metallic paste. The conductor pattern is then applied to the individual ceramic raw material pieces by screen printing or a photolithography process. The individual pieces are stacked on top of one another in the correct order and in a last step of the printed circuit board production, the multilayer stack is sintered, i.e. pressed to a ceramic solid at high temperatures.
Durch die vorstehend beschriebene Technologie (sogenannte co- fire-Technik) können e nach Sintertemperatur HTCC- oder LTCC-Leiterplatten hergestellt werden.The technology described above (so-called co-fire technology) can be used to produce HTCC or LTCC circuit boards according to the sintering temperature.
Alternativ können zunächst auch die durchkontaktierten Kera- mik-Rohmateπalstucke einzeln gebrannt werden, nachfolgend mit den Leiterbahnen 206 versehen werden, gestapelt werden und spater noch einmal gebrannt oder gesintert werden. Mittels dieser Technologie hergestellte Leiterplatten werden als FC- (fired ceramics-) Leiterplatten bezeichnet und können e- benfalls verwendet werden.Alternatively, the plated-through ceramic raw material pieces can first be fired individually, subsequently are provided with the conductor tracks 206, are stacked and later fired or sintered again. Printed circuit boards manufactured using this technology are referred to as FC (fired ceramics) printed circuit boards and can also be used.
Ein weiterer im Rahmen der Erfindung einsetzbarer Keramik- Leiterplattentyp ist m der Technik als DCB-Substrat oder auch Thermal Clad bekannt.Another type of ceramic circuit board that can be used within the scope of the invention is known in the art as a DCB substrate or also thermal clad.
Bei dem Herstellungsprozeß sämtlicher Keramik- Leiterplattentypen kann im Vergleich zu herkömmlichen Keramik-Leiterplatten eine Rohmateπallage eingespart werden. Demzufolge wird eine deutliche Dickenreduzierung der Leiter- platte 200 und auch des Gesamtaufbaus 1, 8, 200 sowie eine verbesserte Warmeabfuhr von der Keramik-Leiterplatte 200 zu der metallischen Grundplatte 1 hin erreicht.In the manufacturing process of all types of ceramic circuit boards, a raw material layer can be saved in comparison to conventional ceramic circuit boards. As a result, a significant reduction in the thickness of the printed circuit board 200 and also of the overall structure 1, 8, 200 and improved heat dissipation from the ceramic printed circuit board 200 to the metallic base plate 1 are achieved.
Den beschriebenen Ausfuhrungsbeispielen ist gemeinsam, daß die Beschichtungs- und Oberflachenumwandlungsverfahren zur Erzeugung der isolierenden Schicht 8 miteinander kombiniert werden können und daß zusätzlich oder anstelle der bereits genannten Verfahren Pulverbeschichtungsverfahren, Walzenbe- schichtungsverfahren und Schmelztauchverfahren eingesetzt werden können. The exemplary embodiments described have in common that the coating and surface conversion processes for producing the insulating layer 8 can be combined with one another and that, in addition to or instead of the processes already mentioned, powder coating processes, roll coating processes and hot dip processes can be used.

Claims

Patentansprüche claims
1. Verfahren zum Anbringen einer Leiterplatte an einer Grundplatte, mit den Schritten: - Bereitstellen einer Leiterplatte (20, 200) ,1. A method for attaching a printed circuit board to a base plate, comprising the steps: providing a printed circuit board (20, 200),
-- die aus einem Mehrlagensystem bestehend aus mindestens einer Isolationsschichtlage (4, 204) und mindestens einer Leiterbahnlage (5, 205) aufgebaut ist, und -- die an ihrer der Grundplatte (1) zugewandten Oberflache keine Isolationsschichtlage (4, 204) aufweist;- which is constructed from a multi-layer system consisting of at least one insulation layer (4, 204) and at least one interconnect layer (5, 205), and - has no insulation layer (4, 204) on its surface facing the base plate (1);
- sofern die Grundplatte (1) elektrisch leitend ist, Erzeugen einer elektrisch isolierenden Schicht (8) auf der der Leiterplatte (20, 200) zugewandten Oberflache der Grundplatte ( 1 ) ; und - Fixieren der Leiterplatte (20, 200) an der Grundplatte (1).- If the base plate (1) is electrically conductive, generating an electrically insulating layer (8) on the surface of the base plate (1) facing the printed circuit board (20, 200); and - fixing the printed circuit board (20, 200) to the base plate (1).
2. Verfahren nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t, daß der Fixierschritt mittels eines zwischen Leiterplatte (20, 200) und Grundplatte (1) angewendeten, elektrisch nichtleitenden Klebstoffs ausgef hrt wird.2. The method according to claim 1, so that the fixing step is carried out by means of an electrically non-conductive adhesive applied between the printed circuit board (20, 200) and the base plate (1).
3. Verfahren nach einem der Ansprüche 1 oder 2, d a d u r c h g e k e n n z e i c h n e t, daß es sich bei der Leiterplatte um eine flexible Leiterplatte (20) mit einer oder mehreren Isolationsschichtlagen aus Kunststoffolie (4) handelt.3. The method according to any one of claims 1 or 2, so that the circuit board is a flexible circuit board (20) with one or more insulation layer layers made of plastic film (4).
4. Verfahren nach Anspruch 1 oder 2, d a d u r c h g e k e n n z e i c h n e t, daß es sich bei der Leiterplatte um eine Leiterplatte mit einer oder mehreren Isolationsschichtlagen aus einer glasfaserverstärkten Kunststoffplatte handelt.4. The method according to claim 1 or 2, d a d u r c h g e k e n n z e i c h n e t that the printed circuit board is a printed circuit board with one or more insulation layer layers made of a glass fiber reinforced plastic plate.
5. Verfahren nach Anspruch 1 oder 2, d a d u r c h g e k e n n z e i c h n e t, daß es sich bei der Leiterplatte um eine Leiterplatte (200) mit einer oder mehreren Isolationsschichtlagen aus einem Ke- ramikmaterial (204) handelt.5. The method according to claim 1 or 2, characterized in that the printed circuit board is a printed circuit board (200) with one or more insulation layer layers made of a ceramic material (204).
6. Verfahren nach einem der vorhergehenden Ansprüche, d a d u r c h g e k e n n z e i c h n e t, daß die elektrisch isolierende Schicht (8) auf der Oberflache der elektrisch leitenden Grundplatte (1) durch ein Beschichten der Grundplattenoberflache mit einem elektrisch lsolie- renden Material erzeugt wird.6. The method according to any one of the preceding claims, that the electrical insulating layer (8) is produced on the surface of the electrically conductive base plate (1) by coating the base plate surface with an electrically insulating material.
7. Verfahren nach Anspruch 6, d a d u r c h g e k e n n z e i c h n e t, daß die elektrisch isolierende Schicht (8) durch Lackieren und/oder Pulverbeschichten und/oder Walzenbeschichten und/oder Schmelztauchen hergestellt wird.7. The method according to claim 6, that the electrical insulation layer (8) is produced by painting and / or powder coating and / or roller coating and / or hot dipping.
8. Verfahren nach Anspruch 6 oder 7, d a d u r c h g e k e n n z e i c h n e t, daß die elektrisch isolierende Schicht (8) durch Emaillieren hergestellt wird.8. The method according to claim 6 or 7, d a d u r c h g e k e n n z e i c h n e t that the electrically insulating layer (8) is produced by enamelling.
9. Verfahren nach einem der Ansprüche 1 bis 5, d a d u r c h g e k e n n z e i c h n e t, daß die elektrisch isolierende Schicht (8) auf der Oberflache der elektrisch leitenden Grundplatte (1) durch ein strukturelles Umwandeln der Grundplattenoberflache erzeugt wird.9. The method according to any one of claims 1 to 5, so that the electrically insulating layer (8) on the surface of the electrically conductive base plate (1) is generated by a structural conversion of the base plate surface.
10. Verfahren nach Anspruch 9, d a d u r c h g e k e n n z e i c h n e t, daß die elektrisch isolierende Schicht (8) durch eine chemi¬ sche Umwandlung der Grundplattenoberflache, insbesondere durch Eloxieren und/oder Phosphatieren und/oder Chromatieren erzeugt wird.10. The method according to claim 9, characterized in that the electrically insulating layer (8) is generated by a chemical ¬ cal conversion of the base plate surface, in particular by anodizing and / or phosphating and / or chromating.
11. Anordnung aus Grundplatte und auf der Grundplatte angebrachter Leiterplatte, bei der - die Leiterplatte (20, 200) aus einem Mehrlagensystem bestehend aus mindestens einer Isolationsschichtlage (4, 204) und mindestens einer Leiterbahnlage (5, 205) aufgebaut ist und an ihrer der Grundplatte (1) zugewandten Oberflache keine Isolationsschichtlage (4, 204) aufweist,11. Arrangement of base plate and printed circuit board attached to the base plate, in the - The printed circuit board (20, 200) is constructed from a multi-layer system consisting of at least one insulation layer (4, 204) and at least one conductor layer (5, 205) and has no insulation layer (4, 204) on its surface facing the base plate (1) ,
- die Grundplatte (1), sofern sie elektrisch leitend ist, mit einer oberflachenseitig angeordneten, elektrisch isolierenden Schicht (8) versehen ist, und- The base plate (1), if it is electrically conductive, is provided with an electrically insulating layer (8) arranged on the surface, and
- die Leiterplatte (20, 200) an der Grundplatte (1) msbeson- dere mittels eines elektrisch nichtleitenden Klebstoffs fixiert ist.- The printed circuit board (20, 200) is fixed to the base plate (1) in particular by means of an electrically non-conductive adhesive.
12. Anordnung nach Anspruch 11, d a d u r c h g e k e n n z e i c h n e t, daß der Klebstoff auf Acryl-, Epoxid- oder Phenolbasis aufge¬12. The arrangement according to claim 11, d a d u r c h g e k e n n z e i c h n e t that the adhesive auf¬ based on acrylic, epoxy or phenol
13. Anordnung nach Anspruch 11 oder 12, d a d u r c h g e k e n n z e i c h n e t, daß die Grundplatte (1) mit oberflachenseitig angeordneter, elektrisch isolierender Schicht (8) eine eloxierte Aluminiumplatte, eine chromatierte oder phosphatierte Stahl- oder Alu- miniumplatte oder eine emaillierte Stahl- oder Graugußplatte 13. Arrangement according to claim 11 or 12, so that the base plate (1) with an electrically insulating layer (8) arranged on the surface side is an anodized aluminum plate, a chromated or phosphated steel or aluminum plate or an enamelled steel or cast iron plate
PCT/DE2000/001345 1999-05-26 2000-04-28 Main board with printed circuit board mounted thereon WO2000074449A1 (en)

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