DE3623093A1 - Method for producing through-connections in printed circuit boards or multilayer printed circuit boards having inorganic or organic/inorganic insulating layers - Google Patents
Method for producing through-connections in printed circuit boards or multilayer printed circuit boards having inorganic or organic/inorganic insulating layersInfo
- Publication number
- DE3623093A1 DE3623093A1 DE19863623093 DE3623093A DE3623093A1 DE 3623093 A1 DE3623093 A1 DE 3623093A1 DE 19863623093 DE19863623093 DE 19863623093 DE 3623093 A DE3623093 A DE 3623093A DE 3623093 A1 DE3623093 A1 DE 3623093A1
- Authority
- DE
- Germany
- Prior art keywords
- insulating layer
- printed circuit
- conductor
- inorganic
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09554—Via connected to metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0207—Partly drilling through substrate until a controlled depth, e.g. with end-point detection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
Abstract
Description
Die Erfindung betrifft ein Verfahren zur Herstellung von Durchverbindungen durch aus anorganischem oder organisch-anorganischem, hartem Werkstoff bestehende Isolierschichten von Leiterplatten oder Mehrschichtstrukturen.The invention relates to a method for producing Through connections from inorganic or organic-inorganic, hard material existing Insulating layers of printed circuit boards or Multilayer structures.
Ein solches Verfahren ist z.B. aus "Thick film seminar" Proceedings 1978, ISHM, Sept. 25-27, Minneapolis, bekannt. Aus einem auf Seite 109 dieser Druckschrift dargestellten Schema geht hervor, daß z.B. zur Herstellung von Durchverbindungen in Multilayern mit keramischen oder glasigen Isolierschichten in den einzelnen Isolierschichten Aussparungen vorgesehen werden, die noch vor dem Einbrand der entsprechenden Isolierschicht mit Metall aufgefüllt werden. Um die gewünschte Konstanz der Abmessungen dieser Durchverbindungen zu erhalten, wird deren Aufbau stufenweise, in mehreren Zyklen durchgeführt, wobei immer abwechselnd Isolationsmaterial und Metall aufgetragen wird und dazwischen Einbrennvorgänge stattfinden. Nachteilig an dem bekannten Verfahren ist neben der hohen Zahl der erforderlichen Prozeßschritte vor allem die Notwendigkeit, die Isolierschicht nach einem die Durchverbindung enthaltenden Layout aufzubringen. Wegen der häufigen Einbrennvorgänge und der damit verbundenen möglichen Oxydation der Metallauflagen ist es erforderlich, in Inertgasatmosphäre zu arbeiten oder aber Edelmetall (Gold) für die Durchverbindungen zu verwenden.Such a method is e.g. from "Thick film seminar" Proceedings 1978, ISHM, Sept. 25-27, Minneapolis, known. From one on page 109 of this publication shown scheme shows that e.g. to Production of through connections in multilayers with ceramic or glassy insulating layers in the recesses are provided for individual insulating layers be that before the appropriate branding Insulation layer to be filled with metal. To the desired constancy of the dimensions of this To get through connections is their construction carried out gradually, in several cycles, always alternating insulation material and metal applied will take place and in between burn-in processes. A disadvantage of the known method, in addition to the high one Number of process steps required, especially the Need to apply the insulating layer after a die Apply layout containing through connection. Because of the frequent burn-in processes and the associated It is possible oxidation of the metal pads required to work in an inert gas atmosphere or else Use precious metal (gold) for the through connections.
Bei emaillierten Leiterplatten, die ebenfalls glasige oder keramische Isolierschichten aufweisen, welche auf einem Metallkern aufgebracht sind, werden Durchverbindungen zur anderen Plattenseite vor Emaillierung des Kernes mit genügend großem Durchmesser gebohrt oder gestanzt und die Seitenwände der Bohrungen zusammen mit den übrigen Flächen des Kerns emailliert und anschließend metallisiert. Soll jedoch der Leiterplattenkern kontaktiert werden, bleibt dem Fachmann heute nur die Möglichkeit, die Kontaktstelle bei der Emaillierung auszusparen. Sie ist dann während des Einbrennvorgangs dem Angriff des Luftsauerstoffs ausgesetzt und oxydiert. Die entstehende Oxidschicht muß später in einem besonderen Arbeitsschritt entfernt werden.For enamelled printed circuit boards, which are also glassy or have ceramic insulating layers, which on a metal core are applied Connections to the other side of the plate Enameling of the core with a sufficiently large diameter drilled or punched and the side walls of the holes enamelled together with the other surfaces of the core and then metallized. However, the The PCB core remains in contact with the specialist today only the possibility to contact the contact point at the Omit enamel. It is then during the Burning in the attack of atmospheric oxygen exposed and oxidized. The resulting oxide layer must can be removed later in a special step.
Der Erfindung liegt die Aufgabe zugrunde, ein Verfahren zur Verfügung zu stellen, mit dessen Hilfe Durchverbindungen durch aus anorganischen oder organisch-anorganischen harten Werkstoffen bestehende Isolierschichten einfacher und wirtschaftlicher hergestellt werden können. The invention has for its object a method to provide, with the help of Through connections from inorganic or existing organic-inorganic hard materials Insulating layers easier and more economical can be produced.
Diese Aufgabe wird für einseitig freiliegende Isolierschichten durch die im kennzeichnenden Teil des Patentanspruchs 1 angegebenen Verfahrensschritte, für zwischen Leiterschichten eingebettete Isolierschichten durch die im kennzeichnenden Teil des Patentanspruchs 2 angegebenen, den im Kennzeichnen des Patentanspruchs 1 angegebenen Verfahrensschritten im wesentlichen entsprechenden Verfahrensschritte gelöst.This task is for unilaterally exposed Insulating layers by the in the characteristic part of the Claim 1 specified process steps for insulating layers embedded between conductor layers by the in the characterizing part of claim 2 specified in the characterizing of claim 1 specified process steps essentially corresponding process steps solved.
Das erfindungsgemäße Verfahren erlaubt es, fertig eingebrannte Isolierschichten nachträglich mit Durchverbindungen zu versehen. Damit entfallen sämtliche Probleme, die mit der Veränderung aufgebrachter Metalloberflächen während des Einbrennens verbunden sind. Anstelle von Edelmetall können die in der Leiterplattentechnik üblichen Metalle, wie z.B. Kupfer zum Aufbau der Durchverbindungen verwendet werden. Die Isolierschichten können vollflächig auf einen Träger aufgetragen werden, ohne daß dabei Löcher für die Durchverbindungen ausgespart bleiben müssen. Die Durchverbindungen selbst sind genau positionierbar und äußerst maßhaltig. Sie können in jeder Form und nahezu jeder Größe hergestellt werden. Irgendwelche Unterbrechungen innerhalb der Durchverbindungen aufgrund schlechter elektrischer Verbindung zwischen verschiedenen, nacheinander abgelagerten Metallauflagen können nicht auftreten.The method according to the invention makes it possible to finish baked insulation layers with To provide through connections. This eliminates all Problems angry with the change Metal surfaces are connected during baking. Instead of precious metal, those in the PCB technology common metals, e.g. copper can be used to set up the interconnections. The Insulating layers can be applied to the entire surface of a support are applied without holes for the Connections must be left out. The Through connections themselves can be positioned exactly extremely true to size. They can be in any shape and almost any size. Any Interruptions within the through connections due to poor electrical connection between various, successively deposited metal supports cannot occur.
Eine Kontaktierung der Kerne von emaillierten Metallkern-Leiterplatten läßt sich mit dem erfindungsgemäßen Verfahren ebenfalls ohne Schwierigkeiten durchführen. Die bisher erforderlichen, beim Emaillierungsverfahren störenden Aussparungen in der Emailschicht können entfallen. Contacting the cores of enamelled Metal core circuit boards can be used with the inventive method also without Perform difficulties. The previously required Recesses in the enamelling process in the Enamel layer can be omitted.
Vorteilhafte Ausgestaltungen des erfindungsgemäßen Verfahrens sind in den Ansprüchen 3 bis 9 beschrieben.Advantageous embodiments of the invention Processes are described in claims 3 to 9.
So ermöglicht die in Anspruch 3 angegebene Ausgestaltung des erfindungsgemäßen Verfahrens dessen Integration in eines der heute bekannten Verfahren zur Leiterplatten- oder Multilayer-Herstellung. Dabei eignet sich eine im Anspruch 4 beschriebene Weiterbildung für Verfahren der Dickschichttechnik, eine in Anspruch 5 beschriebene Weiterbildung dagegen für Verfahren, in denen die Leiterstrukturen der Schaltungsebenen mittels stromloser Metallisierung erzeugt werden.Thus, the configuration specified in claim 3 enables of the method according to the invention its integration in one of the methods known today for PCB or multilayer manufacturing. It is suitable a further training described in claim 4 for A method of thick film technology, one in claim 5 Training described, however, for procedures in which the conductor structures of the circuit levels by means of electroless metallization are generated.
Eine in Anspruch 6 enthaltene Ausgestaltung des Verfahrens nach der Erfindung sieht ein dem Abtrag der Isolierschicht vorgeschaltetes Entfernen einer auf der Isolierschicht aufliegenden Leiterschicht vor. Dies ermöglicht eine bessere Anpassung der Frequenz der Ultraschall-Bohrvorrichtung an den harten Werkstoff der Isolierschicht, und damit eine Reduzierung der Abtragzeit.An embodiment of the contained in claim 6 The method according to the invention provides for the removal of the Insulating layer upstream removal of one on the Insulating layer overlying conductor layer. This allows a better adjustment of the frequency of the Ultrasonic drilling device on the hard material of the Insulating layer, and thus a reduction in the removal time.
Gegenstand der Ansprüche 7 und 8 sind Ausgestaltungen des erfindungsgemäßen Verfahrens für die Anwendung bei mit Metallkernen ausgestalteten Multilayern oder emaillierten Leiterplatten, während Anspruch 9 die Herstellung von Durchverbindungen durch mehrere durch Leiterschichten voneinander getrennte Isolierschichten hindurch unter Anwendung des Verfahrens nach der Erfindung betrifft.The subject of claims 7 and 8 are embodiments of the inventive method for use with Metal cores designed multilayers or enamelled Printed circuit boards, while claim 9 the manufacture of Through connections through several through conductor layers insulating layers separated from one another underneath Application of the method according to the invention relates.
Anhand von Figuren soll das Verfahren nach der Erfindung nun eingehend beschrieben werden. Die Figuren zeigen einzelne Fertigungsstadien von Durchverbindungen: The method according to the invention is intended to be based on figures will now be described in detail. The figures show individual production stages of through connections:
- - in einer einseitig freiliegenden Isolierschicht (Fig. 1a ... d)- in an insulating layer exposed on one side ( Fig. 1a ... d)
- - in einer beidseitig leiterbeschichteten Isolierschicht (Fig. 2a ... d)- in an insulating layer coated on both sides with a conductor ( Fig. 2a ... d)
- - in der Isolierschicht einer Metallkernleiterplatte zum Zweck der Kernkontaktierung (Fig. 3a ... d).- In the insulating layer of a metal core circuit board for the purpose of core contacting ( Fig. 3a ... d).
In Fig. 1a ist schematisch ein Schichtenaufbau dargestellt, wie er z.B. in einem Mehrschichtbauelement (Multilayer) verwendet werden kann. Auf ein Trägermaterial 1, etwa ein Al2O3-Substrat ist eine Leiterschicht 2 und darüber eine keramische oder glasige Isolierschicht 3 aufgebracht. Um elektrische Verbindungen zwischen Leiterstrukturen der Leiterschicht 2 und Leiterstrukturen einer auf die Isolierschicht 3 aufzubringenden weiteren Leiterschicht 4 (Fig. 1d) zu erhalten, müssen in der Isolierschicht 3, Durchverbindungen vorhanden sein. Diese werden, anders als beim Stand der Technik, erst nach Fertigstellung der Isolierschicht erzeugt. In Fig. 1b ist schematisch das Bohrwerkzeug 5 einer Ultraschall-Bohrvorrichtung dargestellt. Mit einer solchen Bohrvorrichtung können auch in sehr harte keramische Isolierschichten die für die Durchverbindungen benötigten Löcher in beliebiger Form (z.B. auch quadratisch oder rechteckig) und in allen in Frage kommenden Tiefen bei hervorragender Maßhaltigkeit gebohrt werden. Bei auf den verwendeten Werkstoff der Isolierschicht abgestimmter Arbeitsfrequenz ist bei den üblicherweise verwendeten Isolierschichtdicken und einer durchschnittlichen Zahl von benötigten Durchverbindungen pro Isolierschicht die Bohrzeit ausreichend kurz, um gegenüber dem bisher verwendeten Verfahren eine erhebliche Zeitersparnis zu bewirken. A layer structure is schematically shown in FIG. 1 a, as can be used, for example, in a multilayer component (multilayer). A conductor layer 2 and a ceramic or glassy insulating layer 3 are applied to a carrier material 1 , for example an Al 2 O 3 substrate. In order to obtain electrical connections between conductor patterns of the conductor layer 2 and a conductor structures to be applied to the insulating layer 3 further conductor layer 4 (Fig. 1D), have in the insulating layer 3, through-connections may be present. In contrast to the prior art, these are only produced after the insulation layer has been completed. In Fig. 1b, the drilling tool 5 is shown an ultrasonic drilling device schematically. With such a drilling device, the holes required for the through connections can be drilled in any shape (for example also square or rectangular) and in all possible depths with excellent dimensional accuracy even in very hard ceramic insulating layers. With the operating frequency matched to the material used for the insulating layer, the drilling time is sufficiently short for the insulating layer thicknesses that are usually used and an average number of through-connections required per insulating layer in order to save considerable time compared to the previously used method.
Fig. 1c zeigt das fertig gebohrte Loch 6, das auf oder geringfügig innerhalb der Leiterschicht 2 als Sackloch endet. Dieses Loch kann nun in bekannter Weise mit Leitpaste ausgefüllt oder stromlos metallisiert werden. Fig. 1c shows the finished drilled hole 6 , which ends on or slightly inside the conductor layer 2 as a blind hole. This hole can now be filled in a known manner with conductive paste or metallized without current.
Fig. 1d zeigt den Endzustand des Schichtenaufbaus, nach Auffüllen des gebohrten Loches mit Leitpaste und anschließendem Einbrennen. In diesem Falle wurde die Leitpaste in einem Arbeitsgang mit dem Auftrag der Leiterstruktur der Leiterschicht 4 in das Bohrloch eingebracht. Es entstand eine durchgehende metallische Verbindung 7. Fig. 1d shows the final state of the layer structure, after filling the drilled hole with conductive paste and then baking. In this case, the conductive paste was introduced into the borehole in one operation with the application of the conductor structure of the conductor layer 4 . A continuous metallic connection 7 was created .
In Fig. 2a bis d ist die Herstellung einer Durchverbindung in einer Isolierschicht mit einer bereits vorhandenen aufliegenden Leiterschicht dargestellt. Auf dem Trägermaterial 1 sind der Reihenfolge nach die Leiterschicht 2, die Isolierschicht 3 und die weitere Leiterschicht 4 aufgebracht. Das Bohrwerkzeug 5 (Fig. 2b) durchdringt, bevor es die Isolierschicht abträgt, die Leiterschicht 4. Das Durchbohren dieser Leiterschicht ist bei den bei Multilayern üblichen Schichtdicken problemlos. Bei großen Schichtdicken kann eine Anpassung der Bohrfrequenz an das Material der Leiterschicht zweckmäßig sein. Das in Fig. 2c dargestellte Bohrloch 6 kann entweder durch Einbringen von Dickschichtpaste mit Leitermaterial ausgefüllt werden oder aber, wie in Fig. 2d dargestellt, durch stromlose Metallisierung der Bohrlochwandung leitfähig gemacht werden. Durch anschließende galvanische Verstärkung der stromlos aufgebrachten Metallschicht wird eine sichere niederohmige metallische Durchverbindung 7 hergestellt. In Fig. 2a to d preparation of a through-connection is shown in an insulating layer with an existing overlying conductor layer. The conductor layer 2 , the insulating layer 3 and the further conductor layer 4 are applied to the carrier material 1 in order. The drilling tool 5 ( FIG. 2 b) penetrates the conductor layer 4 before it removes the insulating layer. Drilling through this conductor layer is no problem with the layer thicknesses customary for multilayers. With large layer thicknesses, an adaptation of the drilling frequency to the material of the conductor layer can be expedient. The borehole 6 shown in FIG. 2c can either be filled with conductive material by introducing thick-film paste or, as shown in FIG. 2d, can be made conductive by electroless metallization of the borehole wall. Subsequent galvanic reinforcement of the electrolessly applied metal layer produces a secure, low-resistance metallic interconnection 7 .
In Fig. 3a ist ein Schnitt durch eine Metallkernleiterplatte wiedergegeben. Ein Metallkern 8 ist beidseitig mit einer isolierenden Keramik- oder Emailschicht 9, 10 umgeben. Auf der Emailschicht können Leiterschichten 11, 12 aufgebracht sein, die durch Durchverbindungen 13 miteinander verbunden sind. Zur Herstellung dieser Durchverbindungen werden hier vor der Beschichtung des Kernes in diesen Löcher gebohrt oder gestanzt. Der Lochdurchmesser muß dabei so groß gewählt werden, daß die Lochwandungen beim Aufbringen der Keramik- oder Emailschicht eine ausreichend dicke und porenfreie Auflage erhalten, und dabei ein Restloch 13 für die nachfolgende Metallisierung erhalten bleibt. Dieses Restloch wird durch Einbringen von Dickschichtpaste oder durch stromloses Metallisieren der Wandungen leitfähig gemacht. Soll bei einer solchen Metallkernleiterplatte der Metallkern kontaktiert werden, etwa um eine Masseverbindung zum Kern herzustellen, so wird gemäß Fig. 3b und 3c die Isolierschicht mittels des Bohrwerkzeuges 14 einer Ultraschall-Bohrvorrichtung abgetragen und so ein bis auf den Kern oder in den Kern führendes Loch 15 erzeugt. Dieses Loch kann, wie vorstehend für die Herstellung von Durchverbindungen in Mehrschichtsubstraten beschrieben, durch Einbringen von Dickschichtpaste oder durch stromlose Metallisierung leitfähig gemacht und so der Kern mit einer auf der Leiterplatte aufgebrachten Leiterschicht verbunden werden. Bei genügend großem Lochdurchmesser oder passend gewählter Form des Loches läßt sich der Kern auch durch Auflöten oder Aufschweißen eines Leiters 16 kontaktieren.In Fig. 3a is a section represented by a metal core printed circuit board. A metal core 8 is surrounded on both sides with an insulating ceramic or enamel layer 9 , 10 . Conductor layers 11 , 12 , which are connected to one another by through-connections 13, can be applied to the enamel layer. To produce these interconnections, holes are drilled or punched in these before coating the core. The hole diameter must be chosen so large that the hole walls receive a sufficiently thick and non-porous coating when the ceramic or enamel layer is applied, and a remaining hole 13 is retained for the subsequent metallization. This residual hole is made conductive by introducing thick-film paste or by electroless plating of the walls. If the metal core can be contacted with such a metal core printed circuit board, such as to produce a ground connection to the core, so Fig invention. 3b and 3c, the insulating layer removed an ultrasonic drilling means of the drilling tool 14, and so a to the core or in the core leading hole 15 generated. As described above for the production of interconnections in multilayer substrates, this hole can be made conductive by introducing thick-film paste or by electroless metallization, and the core can thus be connected to a conductor layer applied to the printed circuit board. If the hole diameter is large enough or the shape of the hole is appropriately selected, the core can also be contacted by soldering or welding a conductor 16 onto it.
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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DE19863623093 DE3623093A1 (en) | 1986-07-09 | 1986-07-09 | Method for producing through-connections in printed circuit boards or multilayer printed circuit boards having inorganic or organic/inorganic insulating layers |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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DE19863623093 DE3623093A1 (en) | 1986-07-09 | 1986-07-09 | Method for producing through-connections in printed circuit boards or multilayer printed circuit boards having inorganic or organic/inorganic insulating layers |
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DE3623093A1 true DE3623093A1 (en) | 1988-01-21 |
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DE19863623093 Withdrawn DE3623093A1 (en) | 1986-07-09 | 1986-07-09 | Method for producing through-connections in printed circuit boards or multilayer printed circuit boards having inorganic or organic/inorganic insulating layers |
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DE3937442A1 (en) * | 1989-11-10 | 1991-05-16 | Nokia Unterhaltungselektronik | METHOD FOR AREA REMOVAL OF LAYERS FROM A SUBSTRATE |
EP1939976A1 (en) * | 2006-12-30 | 2008-07-02 | Rohm and Haas Electronic Materials LLC | Three-dimensional microstructures and methods of formation thereof |
US8542079B2 (en) | 2007-03-20 | 2013-09-24 | Nuvotronics, Llc | Coaxial transmission line microstructure including an enlarged coaxial structure for transitioning to an electrical connector |
US8659371B2 (en) | 2009-03-03 | 2014-02-25 | Bae Systems Information And Electronic Systems Integration Inc. | Three-dimensional matrix structure for defining a coaxial transmission line channel |
US8717124B2 (en) | 2010-01-22 | 2014-05-06 | Nuvotronics, Llc | Thermal management |
US8742874B2 (en) | 2003-03-04 | 2014-06-03 | Nuvotronics, Llc | Coaxial waveguide microstructures having an active device and methods of formation thereof |
US8814601B1 (en) | 2011-06-06 | 2014-08-26 | Nuvotronics, Llc | Batch fabricated microconnectors |
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-
1986
- 1986-07-09 DE DE19863623093 patent/DE3623093A1/en not_active Withdrawn
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