WO2000074137A1 - Dispositif pour refroidir des elements a semi-conducteur - Google Patents

Dispositif pour refroidir des elements a semi-conducteur Download PDF

Info

Publication number
WO2000074137A1
WO2000074137A1 PCT/DE2000/001570 DE0001570W WO0074137A1 WO 2000074137 A1 WO2000074137 A1 WO 2000074137A1 DE 0001570 W DE0001570 W DE 0001570W WO 0074137 A1 WO0074137 A1 WO 0074137A1
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor component
cooled
heat sink
heat
cooling
Prior art date
Application number
PCT/DE2000/001570
Other languages
German (de)
English (en)
Inventor
Robert Jung
Rainer Kreutzer
Erich Zerbian
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO2000074137A1 publication Critical patent/WO2000074137A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a device for cooling a semiconductor component.
  • Devices for cooling semiconductor components which have a heat sink.
  • This heat sink provided for heat dissipation can be a simple heat sink, a heat sink in the form of a cooling star or a cooling profile.
  • Cooling stars have cooling fins protruding outwards in a star shape.
  • the known cooling profiles are curved cooling plates. By using cooling stars or cooling profiles, the effective cooling surface is increased and thereby an improved heat dissipation of the heat generated in the semiconductor component to the surroundings is achieved.
  • Thermal paste can be used to improve the thermal contact between the semiconductor component and the heat sink.
  • Heat sinks have cooling fins facing away from the semiconductor component to be cooled in order to enlarge the contact area of the heat sink with the surroundings.
  • FIG. 1 An example of a known heat sink is shown in FIG. 1.
  • a heat sink 1 is provided there for dissipating the heat generated in a silicon element 5.
  • the silicon element 5 is connected to a substrate 4 by means of a heat-conducting soldering or adhesive layer 3.
  • the heat sink 1 is attached to the substrate 4 using a heat-conducting solder or adhesive layer 2.
  • the heat sink 1 has a flat contact: - or inner surface 6, which faces the silicon element 5 to be cooled, and an outside 7 facing away from the silicon element to be cooled.
  • the latter is provided with cooling fins protruding vertically outwards, around the contact surface of the heat sink with the surroundings to enlarge and thereby achieve improved heat dissipation.
  • the invention has for its object a device for cooling a
  • the advantages of the invention are that the multi-sided thermal contact between the semiconductor component to be cooled and the heat sink and the resulting increase in surface area result in improved heat dissipation; becomes. This is due to the improved transfer of heat from the semiconductor component to the heat sink, which in turn emits the heat dissipated from the semiconductor component to the environment.
  • FIG. 1 shows a known device for cooling a semiconductor component
  • FIG. 2 shows a device for cooling a semiconductor component according to a first exemplary embodiment for the invention
  • 3 shows a device for cooling a semiconductor component according to a second exemplary embodiment of the invention.
  • FIG. 2 shows a device for cooling a semiconductor component in accordance with a first exemplary embodiment of the invention.
  • the semiconductor component to be cooled has a silicon element 5, which is connected to a substrate 4 via a heat-conducting solder or adhesive layer 3. Due to these components, the semiconductor component has a predetermined external profile.
  • the heat generated in this semiconductor component which is in particular a power semiconductor, is dissipated to the environment via a heat sink 1.
  • This heat sink 1 has an inside 6 facing the semiconductor component to be cooled, which is adapted in a form-fitting manner to the outer profile of the semiconductor component and surrounds it on three sides.
  • a heat-conductive solder or adhesive layer 2 is provided between the heat sink 1 and the semiconductor component. This also surrounds the semiconductor component to be cooled on three sides.
  • the outside 7 of the heat sink 1 is provided with cooling fins protruding outwards, which consequently extend on three sides. This means an increase in the contact area between the heat sink 1 and the surroundings, which further improves compared to the prior art
  • FIG. 3 shows a device for cooling a semiconductor component in accordance with a second exemplary embodiment of the invention.
  • the semiconductor component to be cooled has a silicon element 5, which is connected to a substrate 4 via a heat-conducting solder or adhesive layer 3. Due to these components, the semiconductor component has a predetermined external profile.
  • the heat generated in this semiconductor component which is in particular a power semiconductor, is dissipated to the environment via a heat sink 1.
  • This heat sink 1 has an inside 6 facing the semiconductor component to be cooled, which is adapted in a form-fitting manner to the outer profile of the semiconductor component and surrounds it on four sides. As is apparent from the figure, the heat sink 1 thus has a closed cross-sectional area.
  • the inside 6 of the heat sink 1 is provided with gradations 8 and 9 in order to achieve the above-mentioned form-fitting adaptation to the outer profile of the semiconductor component to be cooled.
  • a heat-conductive solder or adhesive layer 2 is provided between the heat sink and the semiconductor component. This also surrounds the semiconductor component to be cooled on four sides.
  • the outside 7 of the heat sink 1, which surrounds the semiconductor component on four sides, is provided with cooling fins protruding outwards, which consequently extend on four sides.
  • further improved heat dissipation from the semiconductor component to the surroundings is consequently achieved by a further improvement in heat transfer from the semiconductor component to the heat sink and a further improvement in the heat transfer from the heat sink to the surroundings.
  • the semiconductor component to be cooled can also be a silicon carbide chip.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un dispositif permettant de refroidir un élément à semi-conducteur à profil extérieur prédéfini. Ce dispositif comprend un corps de refroidissement comportant une face intérieure faisant face à l'élément à semi-conducteur à refroidir et une face extérieure opposée à l'élément à semi-conducteur à refroidir. La face intérieure du corps de refroidissement est adaptée par liaison de forme au profil extérieur de l'élément à semi-conducteur qu'il renferme en différents côtés.
PCT/DE2000/001570 1999-05-31 2000-05-17 Dispositif pour refroidir des elements a semi-conducteur WO2000074137A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE1999124960 DE19924960A1 (de) 1999-05-31 1999-05-31 Vorrichtung zur Kühlung von Halbleiterbauelementen
DE19924960.1 1999-05-31

Publications (1)

Publication Number Publication Date
WO2000074137A1 true WO2000074137A1 (fr) 2000-12-07

Family

ID=7909803

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2000/001570 WO2000074137A1 (fr) 1999-05-31 2000-05-17 Dispositif pour refroidir des elements a semi-conducteur

Country Status (2)

Country Link
DE (1) DE19924960A1 (fr)
WO (1) WO2000074137A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10244791B4 (de) * 2002-09-26 2009-03-26 Robert Bosch Gmbh Vorrichtung zur Kühlung von elektronischen Bauelementen
DE10321549A1 (de) * 2003-05-14 2004-12-02 Adam Opel Ag Anordnung zum Kühlen eines Thyristors
DE102004015929A1 (de) * 2004-03-31 2005-07-07 Infineon Technologies Ag Elektronisches Bauteil
DE102008026765A1 (de) 2008-04-16 2009-10-22 Rohde & Schwarz Gmbh & Co. Kg Mikrowellen-Baugruppe
DE102019124593A1 (de) * 2019-09-12 2021-03-18 Tdk Electronics Ag Kühlsystem

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62204554A (ja) * 1986-03-05 1987-09-09 Matsushita Electric Ind Co Ltd ハイブリツドｉｃ
JPS62208653A (ja) * 1986-03-07 1987-09-12 Matsushita Electric Ind Co Ltd ハイブリツドｉｃ
DE4326207A1 (de) * 1992-10-06 1994-04-07 Hewlett Packard Co Mechanisch schwimmendes Mehr-Chip-Substrat
WO1994013012A1 (fr) * 1992-11-24 1994-06-09 Asea Brown Boveri Ab Dispositif de refroidissement d'elements en feuille destines a de l'electronique de puissance
US5444304A (en) * 1992-08-24 1995-08-22 Hitachi, Ltd. Semiconductor device having a radiating part

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2931052A1 (de) * 1979-07-31 1981-02-05 Siemens Ag Einrichtung zur waermeuebertragung von einer waermequelle auf ein waermeabfuehrendes mittel

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62204554A (ja) * 1986-03-05 1987-09-09 Matsushita Electric Ind Co Ltd ハイブリツドｉｃ
JPS62208653A (ja) * 1986-03-07 1987-09-12 Matsushita Electric Ind Co Ltd ハイブリツドｉｃ
US5444304A (en) * 1992-08-24 1995-08-22 Hitachi, Ltd. Semiconductor device having a radiating part
DE4326207A1 (de) * 1992-10-06 1994-04-07 Hewlett Packard Co Mechanisch schwimmendes Mehr-Chip-Substrat
WO1994013012A1 (fr) * 1992-11-24 1994-06-09 Asea Brown Boveri Ab Dispositif de refroidissement d'elements en feuille destines a de l'electronique de puissance

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 012, no. 063 (E - 585) 25 February 1988 (1988-02-25) *
PATENT ABSTRACTS OF JAPAN vol. 012, no. 065 (E - 586) 27 February 1988 (1988-02-27) *

Also Published As

Publication number Publication date
DE19924960A1 (de) 2000-12-14

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