WO2000070687A1 - Led-modul für signaleinrichtungen - Google Patents
Led-modul für signaleinrichtungen Download PDFInfo
- Publication number
- WO2000070687A1 WO2000070687A1 PCT/DE2000/001537 DE0001537W WO0070687A1 WO 2000070687 A1 WO2000070687 A1 WO 2000070687A1 DE 0001537 W DE0001537 W DE 0001537W WO 0070687 A1 WO0070687 A1 WO 0070687A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- led module
- module according
- led
- lenses
- light
- Prior art date
Links
- 230000011664 signaling Effects 0.000 title claims description 14
- 230000003287 optical effect Effects 0.000 claims abstract description 32
- 239000000463 material Substances 0.000 claims description 10
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 6
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 6
- 230000005855 radiation Effects 0.000 claims description 6
- 230000000295 complement effect Effects 0.000 claims description 3
- 238000011144 upstream manufacturing Methods 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 2
- 239000007924 injection Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- 239000003086 colorant Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B61—RAILWAYS
- B61L—GUIDING RAILWAY TRAFFIC; ENSURING THE SAFETY OF RAILWAY TRAFFIC
- B61L5/00—Local operating mechanisms for points or track-mounted scotch-blocks; Visible or audible signals; Local operating mechanisms for visible or audible signals
- B61L5/12—Visible signals
- B61L5/18—Light signals; Mechanisms associated therewith, e.g. blinders
- B61L5/1809—Daylight signals
- B61L5/1836—Daylight signals using light sources of different colours and separate optical systems
-
- E—FIXED CONSTRUCTIONS
- E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
- E01F—ADDITIONAL WORK, SUCH AS EQUIPPING ROADS OR THE CONSTRUCTION OF PLATFORMS, HELICOPTER LANDING STAGES, SIGNS, SNOW FENCES, OR THE LIKE
- E01F9/00—Arrangement of road signs or traffic signals; Arrangements for enforcing caution
- E01F9/50—Road surface markings; Kerbs or road edgings, specially adapted for alerting road users
- E01F9/553—Low discrete bodies, e.g. marking blocks, studs or flexible vehicle-striking members
- E01F9/559—Low discrete bodies, e.g. marking blocks, studs or flexible vehicle-striking members illuminated
-
- E—FIXED CONSTRUCTIONS
- E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
- E01F—ADDITIONAL WORK, SUCH AS EQUIPPING ROADS OR THE CONSTRUCTION OF PLATFORMS, HELICOPTER LANDING STAGES, SIGNS, SNOW FENCES, OR THE LIKE
- E01F9/00—Arrangement of road signs or traffic signals; Arrangements for enforcing caution
- E01F9/50—Road surface markings; Kerbs or road edgings, specially adapted for alerting road users
- E01F9/576—Traffic lines
- E01F9/582—Traffic lines illuminated
-
- E—FIXED CONSTRUCTIONS
- E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
- E01F—ADDITIONAL WORK, SUCH AS EQUIPPING ROADS OR THE CONSTRUCTION OF PLATFORMS, HELICOPTER LANDING STAGES, SIGNS, SNOW FENCES, OR THE LIKE
- E01F9/00—Arrangement of road signs or traffic signals; Arrangements for enforcing caution
- E01F9/50—Road surface markings; Kerbs or road edgings, specially adapted for alerting road users
- E01F9/576—Traffic lines
- E01F9/594—Traffic lines movable for reuse at different locations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/007—Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/04—Refractors for light sources of lens shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B61—RAILWAYS
- B61L—GUIDING RAILWAY TRAFFIC; ENSURING THE SAFETY OF RAILWAY TRAFFIC
- B61L2207/00—Features of light signals
- B61L2207/02—Features of light signals using light-emitting diodes [LEDs]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2111/00—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00
- F21W2111/02—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00 for roads, paths or the like
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2111/00—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00
- F21W2111/06—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00 for aircraft runways or the like
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the invention relates to an LED module, which can be used in particular in signal devices with a very small beam angle.
- Conventional railway signaling technology usually uses a strong light source with small dimensions such as the filament of an incandescent lamp, placed in the focus of an optical lens and projected into infinity at the level of the driver. Due to the high luminance of the light source, there is a very high light intensity with a very small beam angle, so that the signal can still be clearly recognized even from a great distance (> 3 km).
- incandescent lamps have a limited lifespan, the failure of the incandescent lamp used for a railway signal device always being associated with a total failure of the entire signal device.
- the light bulbs in the railway signaling devices must be replaced at regular intervals. These time intervals are much shorter than the average life of the lamp, so that the replacements involve a considerable amount of material and time.
- incandescent lamps which have a second incandescent filament are used in the railway signaling devices. This second filament is switched on if the first filament fails.
- the second filament is not optimally arranged in the focus of the lens, the light intensity of the path signal drops to approx. 12% in the event of an error. Therefore, a repair must be carried out immediately in this case.
- LEDs semiconductor light-emitting diodes
- optics are required which are suitable for bundling the light emitted by the individual LEDs in such a way that it also is perceived at a relatively large distance as an extensive and brightly shining light source.
- a system consisting of an LED arrangement with only one lens is not suitable since the beam angle cannot be reduced below a physically determined limit value.
- An LED module is known from US-A-5404282, in which a number of LEDs are fixedly mounted between two parallel, electrically conductive rods. According to FIG. 3 of this document, the LEDs used therein are each cast with their electrical leads in a transparent plastic such as epoxy resin.
- a lens can be produced by providing the light exit surface of this synthetic resin block with a bump, ie a section that is curved outwards.
- each unit consisting of an LED and a lens must be manufactured individually in this way. This type of production is too complex for the production of a matrix from several LEDs with associated lenses.
- the failure of the LED means that the lens can no longer be used, making this arrangement very inflexible. It is therefore the object of the present invention to provide an LED module, in particular for use in signaling devices or lighting devices, which can be manufactured and constructed as simply as possible and can be used as flexibly as possible.
- the invention describes an LED module with a regular arrangement of LEDs, which are mounted on a circuit board and are each provided with a light-bundling optical device, wherein an optical support plate is also provided, which the light-bundling optical devices in one of the LED Arrangement corresponding regular arrangement contains.
- the light-bundling optical devices are formed by lenses.
- the optics carrier plate contains an arrangement of depressions corresponding to the LED arrangement, into which the lenses can be inserted as individually manufactured components.
- the lenses are each constructed in such a way that they have a square-shaped main body with an outwardly curved light exit surface and a base which is tapered in cross-section with respect to the main body and corresponds to the recess of the optics carrier plate.
- elevations are arranged in the optics carrier plate instead of the depressions, onto which the lenses can be attached.
- a particular advantage of this embodiment is that the module can be easily and quickly adapted to different areas of application and the parameters specified thereby.
- the lenses are integrally formed in the optics carrier plate.
- the optical carrier plate must consist of a material that is transparent to the emission wavelength of the LEDs.
- the light-bundling optical devices are formed by optical channels which are integrated in the optics carrier plate and which have inclined or curved, reflecting inner walls.
- a further light-bundling optical device in particular a lens, is arranged directly on each LED component, which is thus connected upstream of the respective light-bundling optical device of the optics carrier plate.
- the optics carrier plate and / or the lenses contain polymethyl methacrylate (PMMA). Regardless of the choice of the material of the optics carrier plate and the lenses, it is also desirable if the optics carrier plate and / or the lenses - optionally as a one-piece part - are made by injection molding.
- PMMA polymethyl methacrylate
- An LED which is preferably used for the LED module according to the invention is, for example, in the article "SIEMENS SMT-TOPLED for surface mounting" by F. Möllmer and G. Waitl in the magazine Siemens Components 29 (1991), issue 4, p. 147 in connection described with picture 1.
- This form of LED is extremely compact and allows a large number of LEDs to be arranged on the circuit board.
- the LED module according to the invention is particularly suitable for installation in signaling devices such as railway signaling devices or control signal devices or embedded in the floor lighting equipment of any kind used for other purposes.
- Fig.l is a side or cross-sectional view of a first embodiment of an LED module according to the invention.
- FIG. 2A shows a side view of a lens used in an LED module according to FIG. 1; and FIG. 2B shows a view of the lens from the side of the light exit surface;
- FIG 3 shows a side or cross-sectional view of a second embodiment of an LED module according to the invention.
- a first embodiment of an LED module according to the invention with a circuit board 1 and an optics carrier plate 2 is shown in a side view in FIG.
- a plurality of LEDs 10 are shown on the circuit board 1 in the arrangement of a matrix.
- the arrangement can also be formed by a single row of LEDs.
- a metal core board is preferably used as the board 1 in order to improve the heat dissipation from the LEDs, as a result of which the luminous efficacy of the LEDs can be improved.
- the LEDs are preferably mounted on the circuit board 1 using surface mounting technology SMT (Surface-Mount Technology).
- SIEMENS SMT-TOPLED can be used as LED 10.
- the circuitry structure of the LEDs 10 can be such that several separate, independent circuits are arranged. This ensures a high level of reliability for the module.
- the LEDs 10 can be arranged in two independent circuits, each with 15 parallel strands, two LEDs 10 being connected in series in each individual strand.
- the optics carrier plate 2 containing the lens arrangement is orderly .
- the circuit board 1 and the optics carrier plate 2 can be rigidly connected to one another in a suitable manner so that their relative position to one another remains constant.
- the circuit board 1 and the optics carrier plate 2 are preferably connected to one another via a snap-in plug connection.
- the optics carrier plate 20 contains a plurality of lenses 20, which are individually assigned to the LEDs 10.
- An optics carrier plate 20 can be used, in whose surface on the light exit side the lenses 20 are shaped, for example, as elevations, so that the lenses 20 are integrally connected to the optics carrier plate 2.
- an arrangement as in FIG. 1 is preferred, in which the lenses 20 are manufactured as individual components and can be inserted into the optics carrier plate 2 by means of a snap-in plug connection.
- the optics carrier plate 2 is shaped in the manner of a type case with a number of depressions 25 which are in the same matrix-like arrangement as the LEDs 10. These depressions 25 have, for example, a circular cross section.
- each LED component 10 Immediately on each LED component 10 is a further light-bundling optical device 11, in particular a lens, which is thus connected upstream of the respective light-bundling optical device 20, 30 of the optics carrier plate 2 in the direction of radiation of the LED component 10.
- a single lens 20 is shown in a side view (A) and a view from the side of the light exit surface (B).
- the lens 20 accordingly consists of a square-shaped main body 21 and a base 22 connected to it on the side opposite the side of the light exit surface, which is tapered in cross-section with respect to the main body 21.
- the base 22 is complementary to the recess 25 of the optics support plate 2, so that in the inserted
- the surface of the main body 21 projecting at the boundary of the base 22 to the main body 21 rests on the optics carrier plate 2. Furthermore, the cross section of the main body 21 is dimensioned such that the main bodies 21 of the lenses 20 are in contact with one another without gaps in the inserted state. lying there.
- the exemplary embodiment according to the invention thus has the advantage that the module appears as a homogeneously illuminated surface when viewed from a distance of a few meters.
- the complementarity of the optical support plate 2 and the lenses 20 can also be carried out in reverse, in which case instead of the recesses 25 corresponding elevations are formed in the optical support plate 2 and the individual lenses 20 are provided with corresponding complementary recesses.
- the main body 21 has on the light exit surface an outwardly curved surface 21a, through which the actual lens is formed.
- the curved surface 21a can be shaped such that the active surface of the LED 10 lies in the focal point of the lens 20.
- the side walls of the main body 21 and / or the base 22 can be shaped as reflectors to increase the luminous efficiency.
- Polymethyl methacrylate (PMMA) with a refractive index of 1.5 is particularly suitable as the material for the optics carrier plate 2 and the lenses 20. But others can too
- Plastics are used, the shape of the lens, i.e. the shape of the curved surface 21a must be changed.
- An injection moldable material is preferably used for series production with large quantities.
- FIG. 1 A second embodiment of an LED module according to the invention is shown in a side view in FIG.
- a circuit board 1 with a regular arrangement of LEDs 10 applied thereon is used.
- the optics carrier plate 2 as light-bundling optical devices, has a regular arrangement of optical channels 30 corresponding to the LED arrangement, which channels are formed in the optics carrier plate 2 and have reflecting side walls.
- the side walls are inclined in such a way that the channel cross section increases in the direction of light propagation.
- a curved course can also be provided.
- the channels 30 are preferably formed as bores through the optics carrier plate 2, which are either continuous or extend at least over part of the cross section of the optics carrier plate 2.
- the channels 30 consist of a material with a relatively high refractive index, as in the case of a refractive index-guided glass fiber, while the material of the optics carrier plate 2 surrounding the channels 30 has a relatively low refractive index, so that this is due to the Interface light is reflected there by total reflection.
- the change in the refractive index can be gradual or gradual.
- Additional lenses can be provided in the LED module of the second exemplary embodiment (FIG. 3). These can be placed on the channels 30 on one side of the optics carrier plate 2. If the channels 30 are formed by bores, the additional lenses can also be inserted into these bores as in the first exemplary embodiment.
- the LED module according to the invention has the advantage that it appears as a homogeneously illuminated surface when viewed from a distance of a few meters.
- the module according to the invention can be used particularly advantageously in the case of railway signaling devices. However, it can also be used for other signaling devices, such as guidance signal devices embedded in the ground, which are used to illuminate paths, streets, squares, tunnels, take-off and landing trains or the like.
- the flat design of the LED module according to the invention has a particularly advantageous effect in such applications.
- traffic lights or spotlights such as spotlights, or other such lighting objects as can be used for effect lighting, for example in discotheques.
- the emission wavelength of the LED is arbitrary.
- multi-colored signals can also be generated by using LEDs of different colors.
- a white light LED can also be used to imitate the optical properties of a conventional rail signal device as far as possible.
- an LED with the shortest possible wavelength such as GaN in the blue spectral range, must be used, to which a suitable converter material for producing shorter wavelengths is then applied, so that the optical impression of a white light source results from the mixing of the wavelengths.
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Architecture (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Mechanical Engineering (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP00943604.9A EP1179219B1 (de) | 1999-05-14 | 2000-05-15 | Led-modul für signaleinrichtungen |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19922361A DE19922361C2 (de) | 1999-05-14 | 1999-05-14 | LED-Modul für Anzeigeeinrichtungen |
DE19922361.0 | 1999-05-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000070687A1 true WO2000070687A1 (de) | 2000-11-23 |
Family
ID=7908146
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2000/001537 WO2000070687A1 (de) | 1999-05-14 | 2000-05-15 | Led-modul für signaleinrichtungen |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1179219B1 (de) |
CN (1) | CN1193437C (de) |
DE (1) | DE19922361C2 (de) |
WO (1) | WO2000070687A1 (de) |
Cited By (13)
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US6714348B2 (en) * | 2001-11-14 | 2004-03-30 | Ken-A-Vision Manufacturing Co., Inc. | Cordless microscope |
WO2004032235A2 (de) * | 2002-09-30 | 2004-04-15 | Siemens Aktiengesellschaft | Einrichtung zur erzeugung eines gebündelten lichtstromes |
US6987613B2 (en) | 2001-03-30 | 2006-01-17 | Lumileds Lighting U.S., Llc | Forming an optical element on the surface of a light emitting device for improved light extraction |
US7009213B2 (en) | 2003-07-31 | 2006-03-07 | Lumileds Lighting U.S., Llc | Light emitting devices with improved light extraction efficiency |
US7053419B1 (en) | 2000-09-12 | 2006-05-30 | Lumileds Lighting U.S., Llc | Light emitting diodes with improved light extraction efficiency |
US7064355B2 (en) | 2000-09-12 | 2006-06-20 | Lumileds Lighting U.S., Llc | Light emitting diodes with improved light extraction efficiency |
AT414165B (de) * | 2001-10-09 | 2006-09-15 | Gifas Electric Ges M B H | Leuchte |
US7279345B2 (en) | 2000-09-12 | 2007-10-09 | Philips Lumileds Lighting Company, Llc | Method of forming light emitting devices with improved light extraction efficiency |
US7419839B2 (en) | 2004-11-12 | 2008-09-02 | Philips Lumileds Lighting Company, Llc | Bonding an optical element to a light emitting device |
US7902566B2 (en) | 2004-11-12 | 2011-03-08 | Koninklijke Philips Electronics N.V. | Color control by alteration of wavelength converting element |
CN102330906A (zh) * | 2011-10-10 | 2012-01-25 | 无锡华兆泓光电科技有限公司 | 一种采用微透镜阵列的大功率集成led灯体结构 |
CN103388779A (zh) * | 2013-07-12 | 2013-11-13 | 哈尔滨固泰电子有限责任公司 | 室内led灯具及配光方法 |
US9470372B2 (en) | 2008-11-26 | 2016-10-18 | Deloren E. Anderson | High intensity replaceable light emitting diode module and array |
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Publication number | Priority date | Publication date | Assignee | Title |
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DE20018865U1 (de) | 2000-11-07 | 2001-02-01 | Kegelbahntechnik Dortmund GmbH, 44357 Dortmund | Lichtsystem |
EP1227458A3 (de) | 2001-01-11 | 2004-12-22 | Dr. techn. Josef Zelisko, Fabrik für Elektrotechnik und Maschinenbau Gesellschaft m.b.H. | Anzeige- und/oder Signalsiervorrichtung |
PL3722533T3 (pl) * | 2003-04-21 | 2023-03-06 | Signify North America Corporation | Sposoby i systemy oświetlenia płytowego |
DE10349266B4 (de) | 2003-10-20 | 2015-06-18 | Trützschler GmbH & Co Kommanditgesellschaft | Verwendung einer Vorrichtung zur optischen Signalanzeige, bei der mindestens zwei Lichtquellen als Leuchtdioden (LED) vorhanden sind |
DE10355878B3 (de) * | 2003-11-25 | 2005-08-25 | Siemens Ag | Lichtsignal |
DE102005019375A1 (de) * | 2005-02-28 | 2006-09-07 | Osram Opto Semiconductors Gmbh | LED-Array |
DE102006009694A1 (de) * | 2006-03-02 | 2007-09-20 | Paul Heinrich Neuhorst | Leuchte |
CN101162076B (zh) * | 2006-10-11 | 2010-12-01 | 宁波安迪光电科技有限公司 | 圆形led投光灯 |
CN101162075B (zh) * | 2006-10-11 | 2011-07-06 | 宁波安迪光电科技有限公司 | 条形led投光灯 |
PL215189B1 (pl) * | 2008-12-11 | 2013-11-29 | Inst Badawczy Drog I Mostow | Modulowy uklad optyczny tablicy swietlnej |
CN102364549A (zh) * | 2011-11-01 | 2012-02-29 | 苏州晶雷光电照明科技有限公司 | 一种防雷led交通灯 |
CN104503006B (zh) * | 2014-12-01 | 2016-03-09 | 杭州照相机械研究所 | 透镜及具有该透镜的调光系统 |
DE102015121697A1 (de) * | 2015-12-14 | 2017-06-14 | Hella Kgaa Hueck & Co. | Beleuchtungsvorrichtung für Fahrzeuge |
PL415364A1 (pl) | 2015-12-17 | 2017-06-19 | Instytut Optyki Stosowanej Im. Prof. Maksymiliana Pluty | Układ optyczny do rozsyłu światła z pojedynczego piksela tablicy znaków drogowych o zmiennej treści |
PL231325B1 (pl) | 2015-12-17 | 2019-02-28 | Inst Optyki Stosowanej Im Prof Maksymiliana Pluty | Układ optyczny do pojedynczego piksela tablicy znaków drogowych o zmiennej treści |
DE102019121881A1 (de) * | 2019-08-14 | 2021-02-18 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches bauelement und verfahren zur herstellung eines optoelektronischen bauelements |
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EP0303741A1 (de) | 1987-08-12 | 1989-02-22 | Shen-Yuan Chen | Schnell herstellbare lichtemittierende Diodenanzeigevorrichtung und Herstellungsverfahren |
JPS6486573A (en) * | 1987-07-17 | 1989-03-31 | Oshima Denki Co | Light emitting device |
EP0400176A1 (de) * | 1989-05-31 | 1990-12-05 | Siemens Aktiengesellschaft | Oberflächenmontierbares Opto-Bauelement |
DE19623881A1 (de) | 1996-06-05 | 1997-12-11 | Hertz Inst Heinrich | Elektrolumineszenzdisplay |
WO1997050132A1 (de) | 1996-06-26 | 1997-12-31 | Siemens Aktiengesellschaft | Lichtabstrahlendes halbleiterbauelement mit lumineszenzkonversionselement |
GB2329011A (en) * | 1997-09-04 | 1999-03-10 | Howells Railway Products Limit | Light comprising a plurality of LEDs |
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US5404282A (en) * | 1993-09-17 | 1995-04-04 | Hewlett-Packard Company | Multiple light emitting diode module |
TW408497B (en) * | 1997-11-25 | 2000-10-11 | Matsushita Electric Works Ltd | LED illuminating apparatus |
-
1999
- 1999-05-14 DE DE19922361A patent/DE19922361C2/de not_active Revoked
-
2000
- 2000-05-15 WO PCT/DE2000/001537 patent/WO2000070687A1/de active Application Filing
- 2000-05-15 CN CNB00807500XA patent/CN1193437C/zh not_active Expired - Fee Related
- 2000-05-15 EP EP00943604.9A patent/EP1179219B1/de not_active Expired - Lifetime
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JPS6486573A (en) * | 1987-07-17 | 1989-03-31 | Oshima Denki Co | Light emitting device |
EP0303741A1 (de) | 1987-08-12 | 1989-02-22 | Shen-Yuan Chen | Schnell herstellbare lichtemittierende Diodenanzeigevorrichtung und Herstellungsverfahren |
EP0400176A1 (de) * | 1989-05-31 | 1990-12-05 | Siemens Aktiengesellschaft | Oberflächenmontierbares Opto-Bauelement |
DE19623881A1 (de) | 1996-06-05 | 1997-12-11 | Hertz Inst Heinrich | Elektrolumineszenzdisplay |
WO1997050132A1 (de) | 1996-06-26 | 1997-12-31 | Siemens Aktiengesellschaft | Lichtabstrahlendes halbleiterbauelement mit lumineszenzkonversionselement |
GB2329011A (en) * | 1997-09-04 | 1999-03-10 | Howells Railway Products Limit | Light comprising a plurality of LEDs |
Non-Patent Citations (1)
Title |
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PATENT ABSTRACTS OF JAPAN vol. 013, no. 317 (E - 789) 19 July 1989 (1989-07-19) * |
Cited By (29)
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US8486725B2 (en) | 2004-11-12 | 2013-07-16 | Philips Lumileds Lighting Company, Llc | Color control by alteration of wavelenght converting element |
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US7419839B2 (en) | 2004-11-12 | 2008-09-02 | Philips Lumileds Lighting Company, Llc | Bonding an optical element to a light emitting device |
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US11178744B2 (en) | 2008-11-26 | 2021-11-16 | Yjb Led, Inc. | High intensity replaceable light emitting diode module and array |
US11924943B2 (en) | 2008-11-26 | 2024-03-05 | Yjb Led, Inc. | High intensity replaceable light emitting diode module and array |
CN102330906A (zh) * | 2011-10-10 | 2012-01-25 | 无锡华兆泓光电科技有限公司 | 一种采用微透镜阵列的大功率集成led灯体结构 |
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Also Published As
Publication number | Publication date |
---|---|
DE19922361A1 (de) | 2000-11-30 |
EP1179219A1 (de) | 2002-02-13 |
CN1350704A (zh) | 2002-05-22 |
DE19922361C2 (de) | 2003-05-28 |
CN1193437C (zh) | 2005-03-16 |
EP1179219B1 (de) | 2016-05-11 |
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