WO2000060662A1 - Procede de fabrication d'un dispositif destine a raccorder electriquement un composant semi-conducteur et une surface de montage, et dispositif associe - Google Patents

Procede de fabrication d'un dispositif destine a raccorder electriquement un composant semi-conducteur et une surface de montage, et dispositif associe Download PDF

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Publication number
WO2000060662A1
WO2000060662A1 PCT/DE2000/000666 DE0000666W WO0060662A1 WO 2000060662 A1 WO2000060662 A1 WO 2000060662A1 DE 0000666 W DE0000666 W DE 0000666W WO 0060662 A1 WO0060662 A1 WO 0060662A1
Authority
WO
WIPO (PCT)
Prior art keywords
contact
surface section
hole
section
side wall
Prior art date
Application number
PCT/DE2000/000666
Other languages
German (de)
English (en)
Inventor
Jochen Heinen
Original Assignee
Infineon Technologies Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag filed Critical Infineon Technologies Ag
Publication of WO2000060662A1 publication Critical patent/WO2000060662A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09154—Bevelled, chamferred or tapered edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10174—Diode
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to a method for producing a device for connecting at least one electrical contact of a semiconductor component, in particular a semiconductor diode, to an electrical contact on a mounting surface, and to such a device.
  • each component must be connectable laterally on a mounting surface.
  • a device for connecting an electrical contact of a semiconductor component to an electrical contact on a mounting surface which has, for example, a cuboid body made of essentially electrically insulating material.
  • An electrical contact to be connected to the contact of the component is arranged on a surface section of the body and an electrical contact to be connected to the contact of the mounting surface is arranged on a surface section remote from this surface section.
  • An electrical conductor connects the contacts arranged on the two surface sections to one another via a side surface section of the body which connects the two surface sections.
  • a semiconductor component usually has two or more electrical contacts, each of which has an electrical contact. electrical contact on a mounting surface.
  • one electrical contact of the body to be connected to this contact is arranged on the one surface section per contact of the component, which is provided by an electrical conductor via a side surface section of the body, each with one arranged on the other surface section and with one each Contact on the mounting surface is connected to the body's electrical contact.
  • the object of the invention is to provide a method for producing a device for connecting at least one electrical contact of a semiconductor component, in particular a semiconductor diode, to an electrical contact on a mounting surface, which is simple and suitable for producing such devices in large numbers.
  • a through hole is created in the body that connects the two surface sections to one another.
  • the electrical contacts of the body applied to the two surface sections are connected to one another by means of an electrical conductor via at least one wall section of an inner side wall of the through hole.
  • the connecting electrical conductor is preferably applied to the inner side wall of the through hole, preferably so that it covers the entire inner side wall.
  • the through hole can be easily by etching the
  • the through hole is preferably produced by etching the body with an etching agent which acts in such an anisotropic manner that the through hole produced is delimited by four adjoining trapezoidal inner side wall sections which together define a truncated pyramid.
  • a known anisotropically etchable material is silicon, for example, which can be used very well for the body as a material in the present invention.
  • the inner side wall sections of the through hole defining the truncated pyramid are arranged obliquely at an angle to a surface section of the body in such a way that they are visible when viewed from above on this surface section. This offers the advantage that the electrical contact on this surface section and at least part of the connecting conductor can be produced very easily at the same time in such a way that this contact is connected to the conductor.
  • this contact and this conductor can be produced by simultaneous vapor deposition or sputtering of the surface section and a visible side wall section of the through hole with metal.
  • the entire inner side wall of the through hole, which consists of all side wall sections, can be metal-coated without additional measures.
  • the contact on the other surface section can advantageously be produced in such a way that this contact is connected to the electrical conductor.
  • the other surface section vapor-coated or sputtered with metal, it only being necessary to ensure that the metal layer applied in this way and a metal layer already applied to the inner side wall of the through hole come into contact with one another, for example simply by growing together.
  • the method for simultaneously making an electrical contact on a surface section and the connecting conductor is not restricted to truncated pyramid-shaped through holes, but can in principle be used with any through hole.
  • the body is severed in the direction from one surface section to the other surface section.
  • a larger body for example a wafer made of silicon or another semiconductor material, in which a multiplicity of through-holes have been produced
  • a wafer made of silicon or another semiconductor material in which a multiplicity of through-holes have been produced
  • the semiconductor components which are to be electrically connected to mounting surfaces via individual devices, can be connected to the associated contacts of this body even before the larger body is separated to separate the devices on this body, so that a large number of contacts are already made after the severed body Components are available, each of which can be directly electrically connected to a mounting surface. Additional work steps after severing the body into the individual devices or contactable components are advantageously not required.
  • an electrical conductor covers the entire inner side wall of a through hole, and the body is severed in such a way that this through hole is also severed at least once, two or more conductors can advantageously be produced from an electrical conductor, each of which connects two contacts of a single device to one another .
  • the invention generally provides a novel device for connecting at least one electrical contact of a semiconductor component to an electrical contact on a mounting surface, which has: a body made of essentially electrically insulating material with
  • an electrical conductor which connects the electrical contacts applied to the two surface sections of the body to one another via at least one side wall section of an inner side wall of the through hole.
  • the electrical conductor is preferably attached to an inner side wall of the through hole.
  • the through hole is delimited by four adjoining trapezoidal side wall sections, which together define a truncated pyramid.
  • the invention also provides a novel device for connecting at least one electrical contact of a semiconductor component to an electrical contact on a mounting surface, which has: a body made of essentially electrically insulating material with
  • a substantially trapezoidal side surface section which connects the two surface sections (12) to one another and is arranged obliquely at an angle both to a surface section and to each of these edge edges between two mutually perpendicular edge edges of each surface section, and
  • An advantageous application of the invention lies, for example, in semiconductor components in the form of light-emitting diodes.
  • FIG. 1 shows a plan view of a surface section of an exemplary embodiment of a device according to the invention
  • FIG. 2 shows the view of the lower side of the example in FIG. 1, as well as a semiconductor component arranged above the example and a mounting surface arranged below the example, and
  • FIG. 3 shows a plan view of a cut-out surface section of a larger body, in which through holes are formed and from which the example according to FIG. 1 can be cut out.
  • the exemplary embodiment of the device according to the invention shown in FIGS. 1 and 2 serves to connect a semiconductor component, for example having two electrical contacts, to electrical contacts on a mounting surface such that each contact of the component is connected to one contact of the mounting surface.
  • the example has a body 1 made of essentially electrically insulating material, for example semi-insulating silicon, and two surface sections 11 and 12 facing away from one another, of which only the surface section 11 can be seen in FIG. 1 and is shown in plan view.
  • the two flat surface sections 11 and 12, for example, are arranged parallel to the drawing plane in FIG. 1, extend horizontally and vertically and to the drawing plane in FIG. 2, and are essentially of four side surfaces perpendicular to one another and to the drawing plane of FIG. 1 13, 14, 15 and 16 of the body 1 surrounded and limited.
  • FIG. 2 shows the horizontal side surface 16 lying at the bottom in FIG. 1 in a top view.
  • Each side surface 13, 14, 15 and 16 defines with the one surface section 11 four edge edges 113, 114, 115 and 116 of the body 1 which run at an angle to one another. Similarly, each side surface 13, 14, 15 and 16 defines the other
  • Surface section 12 four edge edges of body 1 which run at an angle to one another, of which only the edges 123, 125 and 126 defined by side surfaces 13, 15 and 16 can be seen in FIGS. 1 and 2.
  • Two separate electrical contacts 111 and 112 are arranged on the surface section 11, each of which is to be connected to one of the two contacts 21 and 22 of the component 2 seen in FIG. 2 above the section 11.
  • the contact 111 of the body 1 is to be connected to the contact 21 of the component 2 and the contact 112 of the body 1 is to be connected to the contact 22 of the component 2.
  • two separate electrical contacts 121 and 122 Arranged on the other surface section 12 facing away from the surface section 11 are two separate electrical contacts 121 and 122, each of which is to be connected to one of the two contacts 31 and 32 on the mounting surface 3 shown in FIG. 2 under section 12.
  • the body 1 has, for example, two substantially trapezoidal side surface sections, each of which connects the two surface sections 11 and 12 to one another and between two of the angled edge edges of each surface section 11 and 12 both at an angle to each surface section 11 and 12 as well as to each of these marginal edges is arranged.
  • a trapezoidal side surface section in FIG. 1 is at the top left between the edge edges 113 and 114 which run at an angle of, for example, 90 ° to one another and delimit the surface section 11 of the body 1, and between the edge sections 113 and 114 parallel to these edge edges and the other surface section 12 of the body 1 boundary edges arranged, of which only the edge 123 (see Figure 2), but not the other is visible.
  • the other trapezoidal side surface section is in the
  • FIG. 2 shows a certain lateral edge edge, designated 103 and 102, of the side surface section arranged at the bottom right in FIG. 1.
  • the two side surface sections themselves cannot otherwise be seen in FIGS. 1 and 2 because they are each covered with an electrical conductor 19, for example a metal layer, one of which covers the trapezoidal side surface section arranged at the top left and the contacts 111 and 121 are electrically connected to one another connects and the other the right covered trapezoidal side surface portion below and electrically connects the contacts 112 and 122.
  • FIG. 3 shows a plan view of, for example, a flat surface section 11 ⁇ of a body 1 which is significantly larger than the body 1 according to FIGS. 1 and 2, which is only shown in detail and from which several bodies 1 according to FIGS. 1 and 2 can be separated.
  • the larger body 1 has a ⁇ of the past, for example, in the drawing plane of figure 3 the surface portion 11 facing away from and not visible in the figure 3 the other surface portion, wherein a distance between the one surface portion 11 ⁇ and said other surface portion t the distance ( see Figure 2) between the surface section 11 and other surface section 12 each of the larger body 1 ⁇ isolated body 1 according to Figures 1 and 2 determined.
  • the separation is carried out, for example, by severing the larger body 1 x perpendicular to the surface section 11 ⁇ along straight lines 51 and 52 running parallel to the surface section 11, which intersect and enclose quadrilaterals between them.
  • Each quadrilateral bordered by four sections of lines 51 and 52 defines a body 1 to be separated according to FIGS. 1 and 2, these sections simultaneously defining both the surface section 11 of this body 1 and seen in FIGS. 1 and 2 Edge 113,
  • edge edges of which only the edges 123, 125 and 126 are visible in FIGS. 1 and 2.
  • the lines 51 run horizontally and are cut vertically by the lines 52, as a result of which these lines 51 and 52 enclose rectangles, especially squares 150, each of which defines a body 1 according to FIGS. 1 and 2.
  • the square 150 shown is surrounded by sections 511 and 512 of adjacent horizontal lines 51 and sections 521 and 522 of adjacent vertical lines 52.
  • edge edges 113, 114, 115 and 116 which delimit the surface section 11 of the body 1 according to FIGS. 1 and 2, in this square 150 shown completely, for example the section 511 of the line 51 defines the edge edge 113, the section 521 of the line 52 the edge 114, the section 512 of the line 51 the edge 115 and the section 522 of the line 52 the edge 116.
  • the larger ⁇ body 1 consists for example of a silicon wafer having a crystal orientation such that, for example, the surface portion 11 of this body can be l x v etched anisotropically.
  • the surface portion 11 with an unillustrated ⁇ etching mask is covered, for example, having openings such that diagonally countertransference lying corners of each square 150 defined by lines 51 to 52 or generally quadrilaterals in each case in the center of such an opening, at these corners during rectangular anisotropic etching even rectangular or square holes in the surface section 11x , which are perpendicular to it Extend surface section 11 x in the direction of the other surface section of the larger body 1 x truncated pyramid-shaped in depth.
  • a through hole 100 which extends continuously from one surface section 11 ⁇ to the other surface section of the larger body 1, has formed at each of these corners, which has a square hole opening 110 with four opening sides 101 in one surface section 11 and a relative one in the other surface section to this hole opening 110 has other smaller square hole openings 120 with four opening sides 102 and an inner side wall 130 connecting the two hole openings 110 and 120.
  • each through hole 100 has four at an angle to each other and obliquely to a surface portion 11 x and other surface portion of the larger body 1 ⁇ standing trapezoidal side wall portions 131 on each of which each have an opening side 101 of the hole opening 110 in a surface portion 11 and each have a Connects opening side 102 of the hole opening 120 in the other surface section of the larger body l x .
  • These two opening sides 101 and 102 form the mutually parallel sides of the trapezoidal shape, the opening side 102 being shorter than the opening side 101.
  • Each trapezoidal side wall section 131 abut along each line 103 connecting a corner of the hole opening 110 and a corner of the hole opening 120.
  • Each trapezoidal side wall section 131 is characterized by two such lines 103 borders, which form the two mutually oblique sides of the trapezoidal shape.
  • such a through hole 100 is formed at the upper left corner and at the lower right corner of this square 150, respectively.
  • Each of these two through holes 100 each has an opening side 101 of the square hole opening 110 of the one surface section 11 ⁇ lying in square 150, which extends obliquely at an angle of 45 ° to each of the two lines 51 and 52 and connects these two lines 51 and 52 to one another , and an opening side 102 of the square hole opening 120 of the other surface section which is also located in square 150 and which is parallel to this opening side 101.
  • a trapezoidal side wall section 131 which is arranged obliquely to the lines 51 and 52 and obliquely at an angle both to the one surface section 11 and to another surface section. If the larger body 1 ⁇ is cut along the lines 51 and 52 vertically to the surface section 11 ⁇ , a separate body is created for each square 150, which has a trapezoidal side wall section 131 on diagonally opposite corners of the square 150, which is oblique to the edges of this body and is arranged obliquely at an angle to surface portions of this body facing away from one another.
  • the central square 150 shown in FIG. 3 results in the body 1 shown in FIGS. 1 and 2 without contacts 111, 112, 121 and 122 and the conductor 19 in which the left upper trapezoidal side surface section in FIG the trapezoidal side wall section 131 in the upper left corner of the square 150 and the lower right trapezoidal side surface section in FIG. 1 is formed by the trapezoidal side wall section 131 in the lower right corner of the square 150.
  • the opening side 101 of the trapezoidal side wall section 131 in the upper left corner of the square 150 forms between the two mutually perpendicular edge edges 113 and 114 of the surface section 11 of this body 1, at an angle of 45 ° to these edges 113 and 114 and these two edges 113 and 114 connecting edge of surface section 11.
  • the opening side 102 of the trapezoidal side wall section 131 in the upper left corner of the square 150 forms between the edge 123 and the non-visible edge edge of the other surface section 12 of this body 1, which runs obliquely at an angle of 45 ° to these edges and these two edges interconnecting edge of the other surface section 12.
  • the opening side 101 of the trapezoidal side wall section 131 in the lower right corner of the square 150 forms between the two mutually perpendicular edge edges 115 and 116 of the surface section 11 of this body 1, and these two edges extend obliquely at an angle of 45 ° to these edges 115 and 116 115 and 116 connecting edge of surface section 11.
  • the opening side 102 of the trapezoidal side wall section 131 in the lower right corner of the square 150 forms one between the two mutually perpendicular edge edges 125 and 126 of the other surface section 12 of this body 1, which extends at an angle of 45 ° to these edges 125 and 126 and these two Edges 125 and 126 connecting edge of the other surface section 12.
  • the surface section 11 of the body 1 according to FIG. 1 is surrounded and delimited in a clockwise direction by the edge edges 113, 101, 114, 115, 101 and 116.
  • the other surface section 12 of this body 1 is surrounded and bounded in a clockwise direction by the edge edges 123 and 102, the invisible, unmarked edge edge and the edge edges 115, 101 and 116.
  • the contacts 111, 112, 121 and 122 and the conductor 19 can be applied before or even the separation of the bodies.
  • two separate contacts 111 and 112 are generated in each square 150 on the surface section 11 ⁇ of the larger body 1, one of which adjoins a trapezoidal side wall section 131 and the other borders another trapezoidal side wall section 131 of this square 150.
  • two separate contacts 111 and 112 are produced in each square 150, one of which adjoins a trapezoidal side wall section 131 and the other another trapezoidal side wall portion 131 of this square 150 borders
  • a contact-connecting electrical conductor 19 is applied to each of the two side wall sections 131 of each square 150.
  • Head 19 of several different individual bodies advantageously arise simultaneously.
  • the coating of the inner side wall 130 of each transit hole 100 may advantageously be carried out v on the surface portion 11 simultaneously with the formation of contacts 111 and 112, for example, in a single process step in which, using a mask, the contacts 111 and 112 and at the same time the metal layer are produced on the inner side wall 130 of a through hole 100 by vapor deposition or sputtering on of metal.
  • the separation can also be carried out in such a way that isolated bodies are formed which have entire through holes, for example holes 100 according to FIG. 3, through which electrical conductors connect the contacts on mutually facing surface sections of the separated bodies.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)

Abstract

Procédé qui consiste à pratiquer dans un corps (1) constitué d'une matière électriquement isolante un trou traversant (100) qui relie deux zones superficielles (11, 12) opposées dudit corps. Un conducteur électrique (19) relie par l'intermédiaire d'au moins une zone (131) de la paroi latérale du trou traversant un contact électrique (111) destiné à être raccordé au composant (2) et placé sur une zone (11) superficielle et un contact électrique (121) destiné à être raccordé à la surface (3) de montage et placé sur l'autre zone superficielle (12). La présente invention concerne également de nouveaux dispositifs réalisés selon ce procédé.
PCT/DE2000/000666 1999-03-31 2000-03-02 Procede de fabrication d'un dispositif destine a raccorder electriquement un composant semi-conducteur et une surface de montage, et dispositif associe WO2000060662A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19914717 1999-03-31
DE19914717.5 1999-03-31

Publications (1)

Publication Number Publication Date
WO2000060662A1 true WO2000060662A1 (fr) 2000-10-12

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PCT/DE2000/000666 WO2000060662A1 (fr) 1999-03-31 2000-03-02 Procede de fabrication d'un dispositif destine a raccorder electriquement un composant semi-conducteur et une surface de montage, et dispositif associe

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007041155A2 (fr) * 2005-09-30 2007-04-12 Intel Corporation Boitiers de micro-electronique a plusieurs conducteurs traversant une ouverture pratiquee dans un substrat support
EP3837714A4 (fr) * 2018-08-17 2022-05-11 Jabil Inc. Appareil, système et procédé de fourniture d'une interconnexion inclinée pour fabrication de semi-conducteur

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3374533A (en) * 1965-05-26 1968-03-26 Sprague Electric Co Semiconductor mounting and assembly method
US4074342A (en) * 1974-12-20 1978-02-14 International Business Machines Corporation Electrical package for lsi devices and assembly process therefor
WO1996013062A1 (fr) * 1994-10-19 1996-05-02 Ceram Incorporated Dispositif et procede de fabrication d'empilements de series de plaquettes
US5621193A (en) * 1995-05-23 1997-04-15 Northrop Grumman Corporation Ceramic edge connect process

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3374533A (en) * 1965-05-26 1968-03-26 Sprague Electric Co Semiconductor mounting and assembly method
US4074342A (en) * 1974-12-20 1978-02-14 International Business Machines Corporation Electrical package for lsi devices and assembly process therefor
WO1996013062A1 (fr) * 1994-10-19 1996-05-02 Ceram Incorporated Dispositif et procede de fabrication d'empilements de series de plaquettes
US5621193A (en) * 1995-05-23 1997-04-15 Northrop Grumman Corporation Ceramic edge connect process

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007041155A2 (fr) * 2005-09-30 2007-04-12 Intel Corporation Boitiers de micro-electronique a plusieurs conducteurs traversant une ouverture pratiquee dans un substrat support
WO2007041155A3 (fr) * 2005-09-30 2007-12-13 Intel Corp Boitiers de micro-electronique a plusieurs conducteurs traversant une ouverture pratiquee dans un substrat support
US7358615B2 (en) 2005-09-30 2008-04-15 Intel Corporation Microelectronic package having multiple conductive paths through an opening in a support substrate
EP3837714A4 (fr) * 2018-08-17 2022-05-11 Jabil Inc. Appareil, système et procédé de fourniture d'une interconnexion inclinée pour fabrication de semi-conducteur

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