WO2000052459A1 - Procede et dispositif d'essai non destructif de materiaux - Google Patents

Procede et dispositif d'essai non destructif de materiaux Download PDF

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Publication number
WO2000052459A1
WO2000052459A1 PCT/DE2000/000480 DE0000480W WO0052459A1 WO 2000052459 A1 WO2000052459 A1 WO 2000052459A1 DE 0000480 W DE0000480 W DE 0000480W WO 0052459 A1 WO0052459 A1 WO 0052459A1
Authority
WO
WIPO (PCT)
Prior art keywords
component
eddy current
ultrasound
probe
ultrasonic
Prior art date
Application number
PCT/DE2000/000480
Other languages
German (de)
English (en)
Inventor
Dieter Pöpperl
Rainer Gebhardt
Kerstin Gemmer-Berkbilek
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO2000052459A1 publication Critical patent/WO2000052459A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/72—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables
    • G01N27/82—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws
    • G01N27/90—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws using eddy currents
    • G01N27/9006—Details, e.g. in the structure or functioning of sensors

Definitions

  • the invention is in the field of non-destructive measurement and testing technology.
  • the invention relates to a device for non-destructive material testing of a component, with
  • an ultrasound test head that can be acoustically coupled to the component, comprising an ultrasound transducer
  • the invention also relates to a method for non-destructive material testing of a component, in which ultrasound is coupled into the component and eddy current is generated in the component by means of an eddy current probe.
  • the invention relates to a method for non-destructive material testing of a component, in which the component is coupled in by means of an ultrasound transducer, and eddy current is generated in the component.
  • a flexible coil for eddy current testing is known from EP 0 228 117 A2, which is attached to a flexible substrate.
  • the coil is attached to versatile surface Customizable. For example, it can be produced photolithographically.
  • Corresponding test manipulators for eddy current and ultrasound testing are known for example from DE 196 41 888 AI and from German utility model DE 297 00 027.6 U.
  • these known test manipulators require a coupling or support surface that is large in comparison to an Emzel test head, in particular if an ultrasonic transducer used to decouple ultrasound and an eddy current probe used to generate eddy current are accommodated in a common test head or in a common housing and e.g. are also rigidly connected.
  • the manipulators disclosed in the cited documents are not suitable for testing on strongly curved surfaces.
  • the known combined ultrasonic and eddy current test devices are also particularly voluminous compared to an Emzelprufem ⁇ chtung, so that they can not be used for testing difficult accessible test areas on the component or only with great effort.
  • the invention is therefore based on the object of specifying a device and a method for the non-destructive material testing of a component, with which even more difficult to access test areas can be checked very precisely, and which can also be used on more curved surfaces of the component.
  • the ultrasonic transducer is designed as a piezoelectric transducer
  • the eddy current probe is arranged with respect to the ultrasonic transducer in such a way that when the ultrasonic transducer is coupled to the component it comes to rest at least partially between a side of the ultrasonic transducer facing the component and the component or at least partially on the side of the ultrasonic transducer facing away from the component.
  • the invention is based on the following unexpected results:
  • the device can advantageously be constructed in a particularly space-saving manner.
  • the eddy current probe and the ultrasonic test head are accommodated, for example, in a common housing and in particular are rigidly connected to one another. There can also be several eddy current probes and / or ultrasonic probes.
  • the side facing the component and the side of the ultrasonic transducer facing away from the component are in particular the flat sides of the ultrasonic transducer.
  • the ultrasound test head includes, for example, a lead wedge and / or an adaptation layer.
  • the eddy current probe is arranged with respect to the ultrasound transducer in such a way that when the ultrasound transducer is coupled to the component it comes to lie at least partially between a coupling surface of the ultrasound probe and the component.
  • the ultrasonic transducer is arranged on an upper wedge surface of the leading wedge.
  • the lower wedge surface of the lead wedge is acoustically coupled to the component, ie it forms the coupling surface.
  • the eddy current probe then lies between the lower wedge surface and the component.
  • the eddy current probe can, however, also be arranged between the upper wedge surface of the lead wedge and the, in particular lower, side of the ultrasonic transducer facing the component.
  • the ultrasound transducer is, for example, a group emitter designed as an array.
  • the eddy current probe preferably comprises a probe coil arrangement.
  • windings * of a coil of the probe coil arrangement are arranged, for example, in one plane and / or have a spiral shape.
  • the probe coil arrangement is preferably a photolithographically produced arrangement of conductor tracks.
  • the height of the conductor tracks is less than 0.1 mm or less than 0.02 mm.
  • the probe coil arrangement comprises, for example, at least two coils.
  • the eddy current probe has a film in or on which the probe coil arrangement is arranged.
  • the film has a thickness of less than 0.5 mm or less than 0.02 mm.
  • the film is preferably made of flexible material.
  • the ultrasonic test heads i.e. in particular the ultrasonic wand and the eddy current probe can be operated at different frequencies. This has the advantage that the ultrasonic test head and the eddy current probe do not influence one another, in particular when the distance is small and in particular when accommodated in a common housing.
  • the frequencies preferably differ from one another by at least a factor of 2.
  • the eddy current probe is operated at an eddy current frequency whose even multiples (harmonics) do not match a resonance frequency of the ultrasound transducer or an even multiple thereof.
  • the ultrasonic test head and the eddy current probe can be operated alternately.
  • Mutual influencing for example by electromagnetic induction or mechanical vibrations, can also be reliably excluded by performing the ultrasound test and the eddy current test in such a timed manner in phase opposition.
  • the process-related object is achieved in relation to the first embodiment according to the invention mentioned at the outset in that the eddy current probe is at least partially exposed to ultrasound.
  • the object is achieved in that the ultrasound transducer is designed as a piezoelectric transducer and is at least partially penetrated by an alternating magnetic field that generates the eddy current.
  • the two methods can preferably be carried out with the device according to the invention.
  • the advantages mentioned with regard to the device apply analogously to the methods.
  • an eddy current frequency that is different from the ultrasound frequency is preferably set.
  • the ultrasound frequency and the eddy current frequency differ from one another by at least a factor of 2.
  • ultrasound can alternately be coupled in and eddy current can be generated.
  • FIGS. 1 to 6 Three exemplary embodiments of a device according to the invention are explained in more detail with reference to FIGS. 1 to 6.
  • the figures also serve to explain the method according to the invention. It shows:
  • FIG. 1 shows a first embodiment of a device according to the invention in a longitudinal section (“vertical section *) along the line I-I of FIG. 2,
  • FIG. 2 shows the device of FIG. 1 in a plan view of a section along the line II-II of FIG. 1,
  • FIG. 3 shows a second embodiment of a device according to the invention in a longitudinal section
  • 4 shows a third embodiment of a device according to the invention in a longitudinal section (“vertical section *) along the line IV-IV of FIG. 5,
  • FIGS. 5 shows a plan view of the device of FIGS.
  • FIG. 6 shows a cross-sectional view through the device of FIG. 4 along the line VI-VI.
  • FIG. 1 shows in a vertical section a component 1 which is subjected to a non-destructive material test.
  • an ultrasonic test head 10 is acoustically coupled to the surface 2 of the component 1, which includes an ultrasonic transducer 10-1 for coupling ultrasound 12 into the component 1.
  • the ultrasonic transducer 10-1 has a smooth cut, plane-parallel piezoelectric body and electrodes (not explicitly shown).
  • the side 14 of the ultrasonic transducer 10-1 facing the component 1 forms a coupling surface 10-2 with which the ultrasonic test probe 10 is coupled to the component 1 — indirectly in the example shown.
  • An eddy current probe 30 is arranged between the coupling surface 10-2 and the surface 2 of the component 1.
  • This consists among other things of a film 30-1 made of temperature-resistant and flexible material M and with a thickness D of less than 0.1 mm.
  • the material M is, for example, polyamide.
  • a probe coil arrangement 30-2 is arranged on the film 30-1 and is designed as a photolithographically produced conductor track 30-3 with a height H of less than 0.1 mm.
  • the height H of the conductor track 30-3 is drawn in a greatly exaggerated manner in FIG. 1 for better illustration.
  • the ultrasound 12 generated by the ultrasound transducer 10-1 penetrates the eddy current probe 30 below it before it penetrates into the component 1.
  • the area of the surface 2 of the component 1 located under the ultrasonic transducer 10-1 serves both as an acoustic coupling surface and also for the penetration of an electromagnetic field (not shown) generated by the eddy current probe 30, which leads to the generation of the desired eddy current in the component 1.
  • Figure 2 shows the device of Figure 1 in a plan view with the ultrasonic transducer 10-1 removed (section along the line II-II). It can be seen from this that the conductor track 30-3 of the probe coil arrangement 30-2 forms a spiral or helical and planar coil.
  • the conductor track 30-3 is contacted with a contact wire 33 at a first coil end 30-4 located at the edge of the film 30-1. It winds with a decreasing radius from turn to turn to a second coil end 30-5 located approximately in the middle of the film 30-1, from which a further contact wire 32 extends, which goes up through a bore 10-3 (see FIG. 1 ) is supplied to a control unit that is not explicitly shown.
  • the eddy current probe 30 is arranged on a side 35 facing away from component 1, ie on the upper side, of the ultrasonic transducer 10-1.
  • the device of the second embodiment follows the electromagnetic coupling of the eddy current probe 30 to the component 1 through the ultrasonic transducer 10-1. This means that the largest proportion of the magnetic field lines generated by the probe coil arrangement 30-2 penetrates the ultrasonic probe 10.
  • the ultrasound transducers 10 of FIGS. 1 to 3 are prepared for vertical insonification in pulse-echo operation.
  • FIG. 4 shows a further exemplary embodiment in which the ultrasound test head 10 and the eddy current probe 30 are arranged in a common housing 10-4 and are firmly connected to one another therein.
  • the ultrasonic transducer 10-1 is enclosed on the side 35 facing away from the component 1 by a damping body 10-5 made of cork. With the side 14 facing the component, the ultrasound transducer 10-1 is coupled via a matching layer 10-6 ( ⁇ / 4 layer) to a leading wedge 10-7 made of plexiglass and penetrated by the coupled ultrasound 12.
  • FIGS. 5 and 6 show the device shown in FIG. 4 in a vertical section in a plan view of the ultrasonic test head (FIG. 5) with the housing 10-4 unlocked and the damping body 10-5 removed or in a horizontal section (FIG. 6) along the Line VI-VI of the
  • the leading wedge 10-7 is divided into two wedges by an acoustic separating layer 10-8 made of cork.
  • the ultrasound transducer 10-1 is also designed in several parts in this embodiment. It consists of an ultrasonic transmitter 10-1T, which is acoustically coupled to one of the partial wedges, and an ultrasonic receiver 10-1R, which is acoustically coupled to the other partial wedge. Due to this configuration of the leading wedge 10-7 and the ultrasonic transducer 10-1, the illustrated ultrasonic probe 10 is particularly suitable for a transmit / receive operation.
  • the probe coil arrangement 30-2 in the third exemplary embodiment comprises a first coil 30-2A and a second coil 30-2B, which can be operated, for example, in a differential circuit (not shown).
  • the ultrasonic transmitter 10-1T is coupled to the component 1
  • the first coil 30-2A comes to lie between the latter and the component 1.
  • the second coil 30-2B then lies under the ultrasound receiver 10-1R.
  • the conductor tracks 30-3 of the largely planar probe coil arrangement 30-2 of the eddy current probe 30 are contacted via contact wires 32, 33, 44, 45.
  • the contact wires 32, 44 which originate from the coil ends not located at the edge of the film 30-1, are guided via horizontally running grooves 10-9, 10-10 to the vertical bore 10-3, which passes through the separating layer 10-8 runs above, and through which these contact wires 32, 44 are guided to the outside.
  • the grooves 10-9, 10-10 are milled on the underside of the leading wedge 10-7.
  • the turns of the coils 30-2A, 30-2B are essentially rectangular in shape with the width and length of the rectangle decreasing from turn to turn.
  • the conductor tracks 30-3 of the probe coil arrangement 30-2 in contrast to FIGS. 1 and 3 — are not shown at an excessive height, so that they cannot be seen there.
  • the probe coil arrangement 30-2 is arranged between the film 30-1 and the lead wedge 10-7. In order to protect the film 30-1 from abrasion and dirt, it is covered with a protective layer 30-6 which lies directly on the surface 2 of the component 1.
  • the eddy current probe 30, in particular the film 30-1 with the probe coil arrangement 30-2, could also be arranged between the ultrasonic transducer 10-1 and the leading wedge 10-7. It could also be attached to the side 35 of the ultrasonic transducer 10-1 facing away from the component 1.
  • the ultrasonic transducer 10-1 is operated at an ultrasonic frequency in the range from 1 MHz to 15 MHz, for example at 2 MHz.
  • the eddy current probe 30 is electrically excited with an eddy current frequency from the interval of 50 kHz and 900 kHz, for example 600 kHz.
  • three or more coils can be provided in any arrangement.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)

Abstract

L'invention concerne un dispositif d'essai non destructif de matériaux pour un composant (1), qui comprend aussi bien un transducteur ultrasonore piézo-électrique (10-1) qu'une sonde à courants de Foucault (30). Cette sonde à courants de Foucault (30) est disposée par rapport au transducteur ultrasonore (10-1) de manière à se trouver, lorsque le transducteur ultrasonore (10-1) est couplé sur le composant (1), entre un côté (14) du transducteur ultrasonore (10-1), qui fait face au composant (1) et ledit composant (1). La sonde à courants de Foucault (30) peut également se trouver sur le côté (35) du transducteur ultrasonore (10-1), qui fait face au composant (1). L'invention concerne en outre des procédés permettant de conduire des essais non destructifs de matériaux sur un composant (1), selon lesquels il est prévu aussi bien d'injecter des ultrasons (12) dans le composant (1), que des courants de Foucault dans ledit composant (1). Il est prévu qu'une sonde à courants de Foucault (30) soit examinée par ultrasons (12) ou qu'un transducteur ultrasonore (10-1) soit traversé par un champ alternatif magnétique produisant des courants de Foucault.
PCT/DE2000/000480 1999-03-04 2000-02-21 Procede et dispositif d'essai non destructif de materiaux WO2000052459A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE1999109528 DE19909528A1 (de) 1999-03-04 1999-03-04 Vorrichtung und Verfahren zur zerstörungsfreien Werkstoffprüfung
DE19909528.0 1999-03-04

Publications (1)

Publication Number Publication Date
WO2000052459A1 true WO2000052459A1 (fr) 2000-09-08

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WO (1) WO2000052459A1 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016108744A1 (de) 2016-05-11 2017-11-16 NDT Global Corporate Ltd. Ireland Vorrichtung zur Untersuchung einer Rohrwand oder eines sonstigen Werkstücks

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3530525A1 (de) * 1985-08-27 1987-03-12 Foerster Inst Dr Friedrich Vorrichtung zur zerstoerungsfreien werkstoffpruefung
EP0887642A1 (fr) * 1997-06-23 1998-12-30 General Electric Company Sonde combinant un transducteur ultrasonique flexible avec un capteur de courants de Foucault flexible

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2652085A1 (de) * 1976-11-16 1978-05-18 Hoesch Werke Ag Vorrichtung zur zerstoerungsfreien werkstoffpruefung
EP0228177A3 (fr) * 1985-11-19 1988-11-02 Electric Power Research Institute, Inc Bobine flexible de courant tourbillonnaire et disposition de bobines d'essais non destructif
US5811682A (en) * 1995-12-13 1998-09-22 Ebara Corporation Electromagnetic acoustic transducer EMAT and inspection system with EMAR
JP3377395B2 (ja) * 1997-03-21 2003-02-17 株式会社荏原製作所 焦点型電磁超音波トランスデューサ及び電磁超音波探傷方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3530525A1 (de) * 1985-08-27 1987-03-12 Foerster Inst Dr Friedrich Vorrichtung zur zerstoerungsfreien werkstoffpruefung
EP0887642A1 (fr) * 1997-06-23 1998-12-30 General Electric Company Sonde combinant un transducteur ultrasonique flexible avec un capteur de courants de Foucault flexible

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DIBELIUS G ET AL: "ZERSOERUNGSFREIE MESSUNG DER KORROSIONSEINWIRKUNG AUF HOCHTEMPERATURSCHUTZSCHICHTEN - ABSCHLUSSBERICHT DES VGB-FORSCHUNGSPROJEKTES NR. 54", VGB KRAFTWERKSTECHNIK,DE,VGB KRAFTWERKSTECHNIK GMBH. ESSEN, vol. 70, 1990, pages 762 - 768, XP000885075, ISSN: 0372-5715 *

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