WO1999062644A1 - Dispositif pour appliquer une pate de maniere uniforme - Google Patents

Dispositif pour appliquer une pate de maniere uniforme Download PDF

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Publication number
WO1999062644A1
WO1999062644A1 PCT/JP1998/002513 JP9802513W WO9962644A1 WO 1999062644 A1 WO1999062644 A1 WO 1999062644A1 JP 9802513 W JP9802513 W JP 9802513W WO 9962644 A1 WO9962644 A1 WO 9962644A1
Authority
WO
WIPO (PCT)
Prior art keywords
paste
nozzle
parts
electrode
discharge member
Prior art date
Application number
PCT/JP1998/002513
Other languages
English (en)
Japanese (ja)
Inventor
Akio Harada
Tsuyoshi Nishi
Original Assignee
Daiken Chemical Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daiken Chemical Co., Ltd. filed Critical Daiken Chemical Co., Ltd.
Priority to PCT/JP1998/002513 priority Critical patent/WO1999062644A1/fr
Priority to JP56026099A priority patent/JP3536924B2/ja
Publication of WO1999062644A1 publication Critical patent/WO1999062644A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
    • C23C24/082—Coating starting from inorganic powder by application of heat or pressure and heat without intermediate formation of a liquid in the layer
    • C23C24/085—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
    • C23C24/087—Coating with metal alloys or metal elements only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C7/00—Apparatus specially designed for applying liquid or other fluent material to the inside of hollow work
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
    • C23C10/28—Solid state diffusion of only metal elements or silicon into metallic material surfaces using solids, e.g. powders, pastes
    • C23C10/30—Solid state diffusion of only metal elements or silicon into metallic material surfaces using solids, e.g. powders, pastes using a layer of powder or paste on the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/06—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00 specially designed for treating the inside of hollow bodies
    • B05B13/0645—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00 specially designed for treating the inside of hollow bodies the hollow bodies being rotated during treatment operation

Definitions

  • the present invention relates to an apparatus for applying a metal paste to a desired shape on the inner surface of a component such as an electronic component, and more particularly, to apply a paste containing a noble metal to a uniform thickness to minimize the amount of the noble metal used.
  • the present invention relates to a paste uniform coating apparatus capable of producing an electronic component of good quality by forming an electrode film with a very uniform thickness.
  • This noble metal paste is, for example, a semi-fluid substance having a predetermined viscosity in which an organometallic complex of a noble metal is dispersed in an organic solvent.
  • a desired pattern is formed on a flat electronic component surface by using a screen printing technique. It can be applied to If a noble metal paste is applied and dried, and the electrode part is baked at a predetermined temperature, all organic substances are removed and scattered, and finally only the metal is sintered as a metal film, and metal wiring and A metal electrode is formed.
  • the screen printing technology described above is a very effective technology for applying a metal paste to the surface of a planar electronic component.
  • a large number of electronic components having a curved surface or a cylindrical shape have appeared, and a new technology for forming an electrode or a wiring having a desired shape on the inner surface of the curved surface or the cylindrical component has been demanded.
  • a new technology for forming an electrode or a wiring having a desired shape on the inner surface of the curved surface or the cylindrical component has been demanded.
  • FIG. 1 is a cross-sectional view of a main part of an oxygen sensor for detecting an oxygen concentration in an exhaust gas of an automobile.
  • the cylindrical oxygen sensor 2 is made of ceramic, and has an inner ring-shaped inner electrode 4 made of platinum and a lead portion 6 formed on the inner surface, and an outer electrode (not shown) formed on the outer surface at a tip portion. Is formed.
  • This oxygen sensor is installed in the exhaust pipe, and the oxygen concentration in the exhaust gas is detected by an external electrode, the oxygen concentration in the atmosphere is detected by an internal electrode, and a voltage corresponding to the difference between the internal and external oxygen concentrations is generated. It measures oxygen concentration in exhaust gas.
  • the shape is not limited to a cylindrical shape, and various shapes such as a polygonal cylindrical shape, a conical shape, and a hollow shape are conceivable.
  • External electrodes can be easily immersed in the paste of electronic components—existing printing techniques, but the problem is how to form the internal electrodes.
  • the present inventors have already proposed a paste coating apparatus disclosed in Japanese Patent Application Laid-Open No. Hei 9-97510.
  • FIG. 7 shows a schematic front view of this conventional device. This device has a mounting portion 10 on which a cylindrical electronic component 8 such as an oxygen sensor is mounted, and this mounting portion 10 can be moved up and down.
  • Fig. 8 is an explanatory diagram of the paste application state using this conventional device.
  • a soft member 20 is attached to the end of a nozzle 16 whose tip is sealed, and a discharge penetrating through the soft member 20 and the nozzle 16 is shown.
  • a hole 22 is formed.
  • the feature of this conventional device is that the paste is applied while the shrinkable soft member 20 is pressed against the inner surface 8 a of the electronic component 8.
  • the paste pumping section 18 is pressurized for a predetermined time, a fixed amount of paste is pumped from the dispenser body 14 and the paste flows out of the discharge holes 22.
  • an annular internal electrode 4 having a predetermined width is formed.
  • Part 6 is formed.
  • the first disadvantage of this conventional device is that the soft member 20 is pressed against the inner surface 8 a of the electronic component 8.
  • an electrode having a width of only the width w of the soft member 20 could be formed by the pressure welding method.
  • the application of the pressure welding can reliably apply the internal electrode 4 and the lead portion 6.
  • this pressure welding method causes the thickness of the internal electrode 4 and the lead portion 6 to be uneven in the width direction.
  • the pressure welding method has the effect of increasing the thickness of the paste at the left and right ends in the electrode width direction and reducing the thickness at the center.
  • this drawback also appears in the non-uniform thickness of the lead portion 6 and the increase in the width, which is the greatest weakness of the electrode formation by the pressure welding method.
  • the second drawback arises from the fact that the dispenser body 14 is arranged in the horizontal direction, as can be seen from FIG.
  • the paste pumping section 18 When the paste pumping section 18 is in a pressurized state, the paste filled in the dispenser 14 is pressed to the nozzle side, and does not drop down to the paste pumping section 18 side. Absent.
  • the paste in the dispenser body 14 flows down to the paste pumping section 18 by its own weight. Solidification of the paste in the paste feeding section due to long-term non-use has also caused equipment failure.
  • the soft member is not brought into contact with the surface of the electronic component. Since they are not brought into contact with each other, there is no fear of damaging the electronic components, and not only soft members but also hard members can be used. In other words, there is no need to limit the material of the soft member to the hard member, and the concept will be expressed in the future as a discharge member that includes both.
  • the point of the present invention is how far the ejection member is kept away from the surface of the electronic component. In other words, if the discharge member is moved relative to the surface of the component while discharging the paste into the space, that is, the gap, the discharge speed and the relative speed are adjusted to make the uniformity determined at the space. It is possible to form a thick paste film.
  • the interval between the discharge speed and the relative speed can be determined empirically, it can be determined empirically, and ultimately the point of the present invention is how to make the interval.
  • a paste is a material obtained by dissolving an organometallic complex in an organic solvent at a predetermined viscosity. Even if this wet paste is applied with a certain thickness, the paste is evaporated to evaporate the organic solvent. As a result, its thickness shrinks. In addition, if fired thereafter, organic substances are scattered and removed. Therefore, after a sudden decrease in volume, a film of a simple metal such as platinum may be finally formed. And As a result of intensive studies, the present inventors have calculated that the thickness of a metal film that can function as an electrode of an electronic component is l to 10 / im, preferably 2 to 7 / m. It is intended that this value can be applied not only to the electrode film but also to the semiconductor thick film technology.
  • the thickness of the dried paste was reduced to about 15 by firing, and the thickness of the wet paste was reduced to 50% by drying. Therefore, when the thickness of the metal film was calculated backward, the thickness of the dry paste was 5 to 50 ⁇ , and it was found that the appropriate thickness of the wet paste was 10 to 100 m.
  • the distance between the surface of the ejection member and the surface of the electronic component should be set to 10 to 100 ⁇ . Desirably, it should be set to 20 to 70 im. With such a setting, the electrode film thickness can be formed to 1 to 10 / im, preferably 2 to 7 / im.
  • a nozzle for fixing the ejection member or a vertical position adjustment device capable of vertically moving the electronic component may be provided.
  • a well-known vertical position adjusting device is provided for the entirety of the mounting means for mounting the electronic components and the rotation drive unit thereof ( and a vertical position adjusting device for the entire nozzle whose tip is covered with the discharge member is provided. Or adjust the distance with both vertical position adjustment devices.
  • the means for discharging the paste includes a dispenser body filled with the paste, a nozzle connected to the tip of the body, and a predetermined amount of a nozzle from the dispenser body to the tip of the nozzle.
  • It can be composed of a pasting pumping section that pumps the pump.
  • a means such as a rotating mechanism or a piston mechanism for mechanically feeding the paste by a predetermined amount may be employed.
  • the relative movement device between the component such as an electronic component and the discharge member depends on the shape of the paste applied to the component.
  • the component is a cylindrical component such as the oxygen sensor described above, and an annular internal electrode is applied to the inner surface of the cylinder, it is only necessary to rotationally drive a mounting portion on which the component is mounted. It becomes a relative motion device.
  • the nozzle in order to form a linear lead portion on the inner surface of the cylinder, the nozzle can be freely moved in and out of the cylinder axis direction, and the driving device of the nozzle is a relative movement device.
  • the present invention is not limited to cylindrical electronic components, but is also effective for various shapes such as curved surfaces and conical shapes.
  • a horizontal movement device and a vertical movement device that move the nozzle three-dimensionally are required.
  • the nozzle is moved three-dimensionally while reading the coordinates of the curved surface with a computer. become. in this case ,
  • the horizontal movement device and the vertical movement device become relative movement devices.
  • Such a three-dimensional relative motion device can be easily realized by using computer technology.
  • Fig. 1 is a cross-sectional view of the main part of a cylindrical oxygen sensor that detects the oxygen concentration in the exhaust gas of an automobile.
  • FIG. 2 is a schematic front view of the paste uniform coating apparatus according to the present invention.
  • FIG. 3 is an explanatory view of a paste application state for forming an annular internal electrode by the apparatus of the present invention.
  • FIG. 4 is an explanatory view of a paste application state for forming a linear lead portion by the apparatus of the present invention.
  • FIG. 5 is an end view taken along line AA of FIG.
  • Figure 6 is a cross-sectional view of the main part of a two-stage cylindrical oxygen sensor that detects the oxygen concentration in the exhaust gas.
  • FIG. 7 is a schematic front view of a conventional paste coating apparatus.
  • FIG. 8 is an explanatory view of a paste application state for forming an annular internal electrode by a conventional apparatus.
  • FIG. 9 is an explanatory diagram of a paste application state for forming a linear lead portion by a conventional apparatus.
  • FIG. 2 is a schematic front view of the paste uniform coating apparatus according to the present invention.
  • This device has a mounting portion 10 composed of a chuck or the like on which a cylindrical electronic component 8 such as an oxygen sensor is mounted, a driving portion 12 for rotating the mounting portion 10, and a mounting portion 1.
  • the vertical position adjustment device 13 that moves the 0 and the drive unit 12 up and down together with the dispenser body 14 with the paste filled vertically, the nozzle 16 with the tip horizontally arranged, and the dispenser body It comprises an advance / retreat moving device 17 for horizontally moving the nozzle 14 and the nozzle 16 together in the horizontal direction, and a paste feeding section 18.
  • the display Since the sensor body is arranged almost vertically, the paste filled inside has a tendency to always flow down to the nozzle side by its own weight. However, the pressure is adjusted so that it does not actually flow down to the nozzle side. Therefore, since the paste does not flow backward to the paste pumping section, the paste clogging is improved.
  • FIG. 3 is an explanatory view of a state of a base applied by the apparatus of the present invention.
  • the tip of a nozzle 16 is coated with a discharge member 21, and the discharge member 21 and a discharge hole 2 penetrating the nozzle 16 are provided. 2 is perforated.
  • the feature of the device of the present invention is that the discharge member 21 is separated from the inner surface 8a of the electronic component 8 by a constant distance h.
  • the interval h is set to a suitable value within the range of 10 to 100 ⁇ , preferably 20 to 70; m. This interval is equal to the formed paste film thickness, and this film thickness is directly related to the finally formed electrode film thickness. According to the inventor's research.
  • the thickness of a commercially available metal paste is reduced to about 1/10 by drying and firing, the thickness of the paste is 10 to 100 ⁇ . If there is, the metal film thickness will be reduced to 1 to 10 jum. Therefore, it is important to set the interval h to about 10 times the finally obtained metal film thickness.
  • the paste pressure feeding section 18 When the paste pressure feeding section 18 is driven while maintaining the interval h, an amount of paste corresponding to the operating pressure and the operating time is supplied from the dispenser body 14.
  • the paste is discharged from the discharge hole 22 of the discharge member 21 via the nozzle 16, during which the mounting portion 10 rotates in the direction of arrow a to form the annular internal electrode 4.
  • the paste film thickness of the internal electrode 4 is equal to the interval h.
  • the width w of the discharge member becomes equal to the width of the internal electrode 4, and the electrode width can be designed by the width of the discharge member. That is, the electrode width can be varied by selecting the width of the discharge member.
  • the number of the discharge holes 22 formed in the discharge member 21 can also be changed according to the width.
  • FIG. 4 shows a process of forming the lead portion 6.
  • the reciprocating device 17 retreats, and the discharge member 21 moves horizontally in the direction of the arrow b to the outlet portion 8b of the electronic component 8.
  • the paste feeding section 18 is operated, and the linear lead section 6 is formed.
  • the paste film thickness of the lead portion 6 is also equal to the interval h.
  • FIG. 5 is an end view taken along the line A—A in FIG. 4, in which the thickness of the lead portion 6 is equal to the distance h, and This indicates that is uniformly formed.
  • the width L of the lead portion 6 can be set finely by adjusting the discharge speed and the relative movement speed, and as a result, the amount of paste used can be reduced.
  • the organic solvent evaporates from the wet paste film to form a dry paste film. After baking to remove the organic substance, the paste film changes to a metal film.
  • the oxygen sensor 4 shown in FIG. 1 is formed.
  • FIG. 6 is a cross-sectional view of a main part of a two-stage cylindrical oxygen sensor for detecting oxygen concentration in exhaust gas.
  • This step 6a can be formed by the following steps. While the nozzle 16 is moving backward by the reciprocating device 17, if the mounting portion 10 is moved up by the step by the vertical position adjusting device 13, the step portion 6 a is provided. Lead part 6 is completed.
  • interval is set between the discharge member of a nozzle tip part, and a component surface, and under this condition, a predetermined amount of paste is discharged from a discharge hole.
  • a paste coating having a very uniform thickness can be formed on the component surface.
  • the thickness of the metal film that can be formed after the drying and firing is extremely uniform, and a high-quality electrode film having no unevenness in resistance performance and conductive performance can be formed.
  • noble metals such as platinum are extremely expensive, the use of noble metals can be reduced to the minimum necessary by limiting the thickness of the electrodes, which can contribute to a reduction in the cost of electronic components.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

L'invention concerne un dispositif pour appliquer une pâte de manière uniforme, ledit dispositif appliquant une pâte de métal noble sur les surfaces intérieures de pièces telles que des pièces électroniques, selon une configuration souhaitée. Ce procédé comprend une fixation (10) permettant de fixer des pièces (2, 8) à recouvrir de pâte, une buse (16) pour fournir la pâte, un élément de distribution (21) qui recouvre l'extrémité de la buse (16), des orifices de distribution (22) s'étendant à travers la buse (16) et l'élément de distribution (21), des éléments pour ajuster un espace (h) de 10 à 100 νm entre la surface de l'élément de distribution et la surface de chacune des pièces à recouvrir de pâte, des éléments pour fournir la pâte avec un espace constant, et des éléments pour déplacer les pièces et la buse les unes par rapport aux autres, l'espace étant maintenu constant pendant la fourniture de la pâte. Une quantité prédéterminée de pâte étant délivrée aux pièces avec un espace constant, un film de pâte présentant une épaisseur absolument uniforme peut être formé sur les surfaces des pièces. Il est ainsi possible de former un film d'électrode de bonne qualité, présentant une résistance et une conduction électrique homogènes, et comportant un film métallique d'épaisseur absolument uniforme obtenu après séchage et cuisson. Les métaux nobles tels que le platine étant extrêmement coûteux, la limitation de l'épaisseur des électrodes permet de réduire la quantité de métal noble utilisé et contribue ainsi à réduire le prix à l'unité des pièces électroniques.
PCT/JP1998/002513 1998-06-03 1998-06-03 Dispositif pour appliquer une pate de maniere uniforme WO1999062644A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP1998/002513 WO1999062644A1 (fr) 1998-06-03 1998-06-03 Dispositif pour appliquer une pate de maniere uniforme
JP56026099A JP3536924B2 (ja) 1998-06-03 1998-06-03 ペースト均一塗布装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP1998/002513 WO1999062644A1 (fr) 1998-06-03 1998-06-03 Dispositif pour appliquer une pate de maniere uniforme

Publications (1)

Publication Number Publication Date
WO1999062644A1 true WO1999062644A1 (fr) 1999-12-09

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PCT/JP1998/002513 WO1999062644A1 (fr) 1998-06-03 1998-06-03 Dispositif pour appliquer une pate de maniere uniforme

Country Status (2)

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WO (1) WO1999062644A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6843105B1 (en) 2003-06-30 2005-01-18 Robert Bosch Corporation Contact pin for exhaust gas sensor
GB2414245A (en) * 2004-05-19 2005-11-23 Diffusion Alloys Ltd Metallising internal surfaces
JP2009125625A (ja) * 2007-11-20 2009-06-11 Tokai Rubber Ind Ltd 潤滑剤付きゴムブッシュおよび潤滑剤付きゴムブッシュの製造方法
JP2019197615A (ja) * 2018-05-08 2019-11-14 岡谷電機産業株式会社 放電型サージ吸収素子の製造方法
WO2019215938A1 (fr) * 2018-05-08 2019-11-14 岡谷電機産業株式会社 Élément d'absorption de surtension de type à décharge et procédé de fabrication d'élément d'absorption de surtension de type à décharge
JP2020027749A (ja) * 2018-08-13 2020-02-20 岡谷電機産業株式会社 放電型サージ吸収素子の製造方法
US12025267B1 (en) * 2023-01-17 2024-07-02 Dana Automotive Systems Group, Llc Bore lubrication system

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104759387B (zh) * 2015-01-27 2017-02-22 诺博橡胶制品有限公司 自动滚油装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6179677U (fr) * 1984-10-29 1986-05-27
JPS6253765A (ja) * 1985-09-02 1987-03-09 Matsushita Electric Ind Co Ltd 吐出ノズル
JPH0564762A (ja) * 1991-09-05 1993-03-19 Kubota Corp 管内面の塗装装置
JPH0975810A (ja) * 1995-09-14 1997-03-25 Daiken Kagaku Kogyo Kk ペースト塗布装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6179677U (fr) * 1984-10-29 1986-05-27
JPS6253765A (ja) * 1985-09-02 1987-03-09 Matsushita Electric Ind Co Ltd 吐出ノズル
JPH0564762A (ja) * 1991-09-05 1993-03-19 Kubota Corp 管内面の塗装装置
JPH0975810A (ja) * 1995-09-14 1997-03-25 Daiken Kagaku Kogyo Kk ペースト塗布装置

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6843105B1 (en) 2003-06-30 2005-01-18 Robert Bosch Corporation Contact pin for exhaust gas sensor
GB2414245A (en) * 2004-05-19 2005-11-23 Diffusion Alloys Ltd Metallising internal surfaces
GB2414245B (en) * 2004-05-19 2007-10-10 Diffusion Alloys Ltd Metallising process
JP2009125625A (ja) * 2007-11-20 2009-06-11 Tokai Rubber Ind Ltd 潤滑剤付きゴムブッシュおよび潤滑剤付きゴムブッシュの製造方法
JP4640403B2 (ja) * 2007-11-20 2011-03-02 東海ゴム工業株式会社 潤滑剤付きゴムブッシュの製造方法
JP2019197615A (ja) * 2018-05-08 2019-11-14 岡谷電機産業株式会社 放電型サージ吸収素子の製造方法
WO2019215938A1 (fr) * 2018-05-08 2019-11-14 岡谷電機産業株式会社 Élément d'absorption de surtension de type à décharge et procédé de fabrication d'élément d'absorption de surtension de type à décharge
JP2020027749A (ja) * 2018-08-13 2020-02-20 岡谷電機産業株式会社 放電型サージ吸収素子の製造方法
US12025267B1 (en) * 2023-01-17 2024-07-02 Dana Automotive Systems Group, Llc Bore lubrication system
US20240240751A1 (en) * 2023-01-17 2024-07-18 Dana Automotive Systems Group, Llc Bore lubrication system

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