WO1999051071A1 - Circuit hybride apte aux cms - Google Patents

Circuit hybride apte aux cms Download PDF

Info

Publication number
WO1999051071A1
WO1999051071A1 PCT/DE1999/000842 DE9900842W WO9951071A1 WO 1999051071 A1 WO1999051071 A1 WO 1999051071A1 DE 9900842 W DE9900842 W DE 9900842W WO 9951071 A1 WO9951071 A1 WO 9951071A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit
hybrid circuit
hybrid
smd
solder
Prior art date
Application number
PCT/DE1999/000842
Other languages
German (de)
English (en)
Inventor
Karl Rehnelt
Frank Templin
Klaus HEIMGÄRTNER
Original Assignee
Tyco Electronics Logistics Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Logistics Ag filed Critical Tyco Electronics Logistics Ag
Publication of WO1999051071A1 publication Critical patent/WO1999051071A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09172—Notches between edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Definitions

  • the invention relates to a hybrid circuit with a plate-shaped ceramic circuit carrier which can be mounted vertically on a mother board and on which a number of connection pads (solder pads) for contacting the circuit with connections of the mother board are provided near a lower edge.
  • Hybrid or layer circuits are electronic subassemblies in which planar conductor track structures and passive components, in particular resistors, are applied to a ceramic substrate by means of special layer technologies, these planar structures being interconnected or connected to further components, for example ICs or relays, on the common ceramic substrate. be hybridized.
  • These other components are usually surface mountable, i. H. in the known SMD (surface mounted devices) technology, they are placed on connection pads on the hybrid circuit and soldered there, mostly by reflow soldering.
  • the hybrid circuit as a whole should in turn be SMD-capable.
  • hybrid circuits are today mostly soldered into printed circuit boards as single-in-line sub-assemblies. In order to take advantage of the space given in the third dimension, they are therefore mounted perpendicular to the printed circuit board or to the mother board with only one row of connections.
  • Single-in-line hybrid modules have so far only been 2 assembly connected to the motherboard and are now almost the last component not available in SMD technology.
  • the present invention is based on the object of specifying an SMD-capable single-in-line hybrid circuit.
  • connection areas each extend down to the lower edge and form an SMD connection for direct soldering to contact points on the motherboard.
  • a circuit carrier 1 of a hybrid circuit is shown schematically, which is already firmly soldered to the contact points 5 of a circuit board 3 by means of a plurality of solder pads 2.
  • the invention is particularly suitable for the vertical surface mounting of relatively small, for example 5-8 mm high hybrid circuits.
  • connection pads 2 in each case to have a recess which passes through the circuit carrier 1 and extends from the lower end face of the circuit carrier 1 upward into the respective connection surface 2 to be provided, which forms a solder depot.
  • the three-dimensional depot space thus formed provides so much solder that a very durable and mechanically stable solder joint is made possible.
  • the hybrid circuit for example on a side surface of the circuit board 3 gers 1, at any time with at least one anti-tip element, for example a bracket.
  • the circuits according to the invention are used in the solder paste printing on the printed circuit board 3.
  • the solder applied to the contact points 5 of the printed circuit board 3 pulls up onto the solder pads 2 of the circuit carrier 1.
  • the solder paste is prevented from running.
  • connection pads 2 can be implemented on one side on the circuit carrier 1, or also on opposite sides, whereby either two separate connections are possible, or the opposite solder point only serves as additional stabilization. Above the solder points, the via holes known per se can additionally be provided in the solder pad 2.
  • the additional provision of solder, e.g. due to the solder depot described, in the solder pads 2 is advantageous in the reflow soldering processes that are usually common today, but also in a conventional one

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

L'invention concerne un circuit hybride comprenant un substrat de circuit (1) céramique en forme plaque pouvant être monté perpendiculairement sur une platine mère (3). Ce substrat de circuit (1) présente, près d'un bord inférieur, une rangée de plages de contact (2) destinée à la connexion du circuit avec les points de contact (5) de la platine mère (3). Les plages de contact (2) affleurent systématiquement le bord inférieur et constituent un contact CMS pour le brasage direct avec les points de contact (5) de la platine mère (3).
PCT/DE1999/000842 1998-03-31 1999-03-22 Circuit hybride apte aux cms WO1999051071A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19814408 1998-03-31
DE19814408.3 1998-03-31

Publications (1)

Publication Number Publication Date
WO1999051071A1 true WO1999051071A1 (fr) 1999-10-07

Family

ID=7863119

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1999/000842 WO1999051071A1 (fr) 1998-03-31 1999-03-22 Circuit hybride apte aux cms

Country Status (1)

Country Link
WO (1) WO1999051071A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1624736A2 (fr) * 2004-08-04 2006-02-08 Siemens Aktiengesellschaft La méthode pour former un contact électrique entre des cartes imprimées qui sont arrangées dans une configuration 'T'ou 'L'

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2453537A1 (de) * 1974-11-12 1976-05-13 Gerhard Mueller Schaltungseinheit, die aus zwei oder mehr gedruckten schaltungen mittels eines oder mehreren verbindungselementen zusammengesetzt ist
EP0040379A1 (fr) * 1980-05-19 1981-11-25 General Electric Company Sous-assemblage à plaquettes à circuits imprimés pour un circuit à film épais hybride
DE4135007A1 (de) * 1990-10-25 1992-05-14 Cts Corp Bauelemente fuer oberflaechenmontage
JPH0548232A (ja) * 1991-08-07 1993-02-26 Mitsubishi Electric Corp 組合せプリント配線板
JPH05327161A (ja) * 1992-05-22 1993-12-10 Fujitsu Ltd 電子回路モジュール
JPH0677644A (ja) * 1992-08-27 1994-03-18 Fujitsu Ltd 三次元構造電子部品の端子部形成方法
JPH0823163A (ja) * 1994-07-06 1996-01-23 Tanaka Kikinzoku Kogyo Kk 基板の実装方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2453537A1 (de) * 1974-11-12 1976-05-13 Gerhard Mueller Schaltungseinheit, die aus zwei oder mehr gedruckten schaltungen mittels eines oder mehreren verbindungselementen zusammengesetzt ist
EP0040379A1 (fr) * 1980-05-19 1981-11-25 General Electric Company Sous-assemblage à plaquettes à circuits imprimés pour un circuit à film épais hybride
DE4135007A1 (de) * 1990-10-25 1992-05-14 Cts Corp Bauelemente fuer oberflaechenmontage
JPH0548232A (ja) * 1991-08-07 1993-02-26 Mitsubishi Electric Corp 組合せプリント配線板
JPH05327161A (ja) * 1992-05-22 1993-12-10 Fujitsu Ltd 電子回路モジュール
JPH0677644A (ja) * 1992-08-27 1994-03-18 Fujitsu Ltd 三次元構造電子部品の端子部形成方法
JPH0823163A (ja) * 1994-07-06 1996-01-23 Tanaka Kikinzoku Kogyo Kk 基板の実装方法

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 17, no. 344 (E - 1390) 29 June 1993 (1993-06-29) *
PATENT ABSTRACTS OF JAPAN vol. 18, no. 144 (E - 1521) 10 March 1994 (1994-03-10) *
PATENT ABSTRACTS OF JAPAN vol. 18, no. 326 (E - 1565) 21 June 1994 (1994-06-21) *
PATENT ABSTRACTS OF JAPAN vol. 96, no. 5 31 May 1996 (1996-05-31) *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1624736A2 (fr) * 2004-08-04 2006-02-08 Siemens Aktiengesellschaft La méthode pour former un contact électrique entre des cartes imprimées qui sont arrangées dans une configuration 'T'ou 'L'
DE102004038305A1 (de) * 2004-08-04 2006-03-30 Siemens Ag Verfahren zur Herstellung einer elektrisch leitenden Verbindung bei einer T-förmigen oder L-förmigen Leiterplattenkonfiguration
EP1624736A3 (fr) * 2004-08-04 2006-09-13 Siemens Aktiengesellschaft La méthode pour former un contact électrique entre des cartes imprimées qui sont arrangées dans une configuration 'T'ou 'L'

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