WO1999016924A1 - Appareil de plaquage ionique - Google Patents

Appareil de plaquage ionique

Info

Publication number
WO1999016924A1
WO1999016924A1 PCT/JP1997/003436 JP9703436W WO9916924A1 WO 1999016924 A1 WO1999016924 A1 WO 1999016924A1 JP 9703436 W JP9703436 W JP 9703436W WO 9916924 A1 WO9916924 A1 WO 9916924A1
Authority
WO
WIPO (PCT)
Prior art keywords
plasma
permanent magnet
ion plating
plating apparatus
annular permanent
Prior art date
Application number
PCT/JP1997/003436
Other languages
English (en)
Japanese (ja)
Inventor
Toshiyuki Sakemi
Masaru Tanaka
Original Assignee
Sumitomo Heavy Industries, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP6861796A priority Critical patent/JP2946404B2/ja
Application filed by Sumitomo Heavy Industries, Ltd. filed Critical Sumitomo Heavy Industries, Ltd.
Priority to PCT/JP1997/003436 priority patent/WO1999016924A1/fr
Priority to US09/269,737 priority patent/US6160350A/en
Publication of WO1999016924A1 publication Critical patent/WO1999016924A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J27/00—Ion beam tubes
    • H01J27/02—Ion sources; Ion guns
    • H01J27/16—Ion sources; Ion guns using high-frequency excitation, e.g. microwave excitation
    • H01J27/18—Ion sources; Ion guns using high-frequency excitation, e.g. microwave excitation with an applied axial magnetic field
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating

Definitions

  • the present invention relates to an ion plating device provided with a plurality of plasma guns.
  • an ion plating apparatus using a pressure gradient plasma gun can form a high-quality film on a substrate. Since the plasma beam generated by the plasma gun is twisted, the thickness of the film formed on the substrate is not uniform. Therefore, the present inventors have proposed an ion plating apparatus in which an annular permanent magnet is provided around a hearth acting as an anode to reduce the twist of a plasma beam.
  • the pressure gradient type plasma gun 101 has a cathode 102, a first intermediate electrode 103, and a second intermediate electrode 104.
  • the first intermediate electrode 103 incorporates an annular permanent magnet
  • the second intermediate electrode 104 incorporates an electromagnet coil.
  • a steering coil 105 is provided around the plasma gun 101.
  • a substrate 107 to be processed is arranged in the upper part of the vacuum vessel 106.
  • a hearth 108 serving as an anode is provided in a lower portion of the vacuum vessel 106.
  • an annular permanent magnet 109 is provided.
  • the magnetic poles of the plasma gun 101, the steering coil 105, and the annular permanent magnet 109 will be described with reference to FIG.
  • the electromagnet coil built in the second intermediate electrode 104 the side from which the line of magnetic force emerges from the center of the coil is called the N pole.
  • the second intermediate electrode 104 side of the first intermediate electrode 103 is referred to as “S pole”, and the second intermediate electrode 104 and the first intermediate electrode 103 side of the steering coil 105 are connected to each other. "S pole”.
  • the upper side of the permanent magnet 109 is the "S pole”. Such a type is called an S type.
  • the first intermediate electrode 103, the second intermediate electrode 104, the steering coil 1 The type in which each of the magnetic poles of the magnetic poles 5 and 10 and the magnetic poles of the permanent magnets 10 are exactly the same as the above-mentioned S type is called the N type.
  • the twist of the plasma beam is smaller than that of a conventional ion plating apparatus having no annular permanent magnet 109.
  • the plasma beam is deviated from the center of the plasma gun 101 to the left in the figure as shown in FIG.
  • the plasma beam is shifted to the right. This is due to the phenomenon peculiar to plasma that torsional deformation appears in the plasma column when an electric current is applied to the plasma column in a magnetic field.
  • Japanese Patent Application Laid-Open No. 63-47332 discloses an ion plating apparatus in which a plurality of plasma guns are arranged side by side in one vacuum vessel.
  • a plurality of lines of magnetic force such as a plasma gun and a steering coil interfere with each other.
  • the plasma beam is greatly twisted as compared to an ion plating apparatus provided with one plasma gun.
  • an object of the present invention is to provide an ion plating apparatus that can reduce the twist of a plurality of plasma beams even when a plurality of plasma guns are arranged side by side.
  • a plurality of plasma guns having magnet means are provided in a vacuum vessel, a steering coil is provided in each of the plurality of plasma guns, and a plurality of plasma guns are provided in the vacuum vessel. Therefore, several hearths are provided.
  • An annular permanent magnet is provided around each of the plurality of hearths. The directions of the magnetic poles of the two magnet means, the directions of the magnetic poles of the two steering coils, and the directions of the magnetic poles of the two annular permanent magnets in two adjacent plasma guns are opposite to each other. Oriented.
  • FIG. 1 is a longitudinal sectional view of a conventional ion plating apparatus in which an annular permanent magnet is provided around a hearth.
  • FIG. 2 is a cross-sectional view taken along line AA ′ of FIG.
  • FIG. 3 is a view for explaining the relationship among the plasma gun, the steering coil, and the magnetic poles of the ring-shaped permanent magnet on the housing side of the apparatus shown in FIG.
  • FIG. 4 is a cross-sectional view of the ion plating apparatus according to the present invention.
  • FIG. 5 is a cross-sectional view taken along line BB ′ of FIG.
  • FIG. 6 is a cross-sectional view taken along line CC ′ of FIG.
  • FIG. 7 is a diagram showing an example of a combination of the annular permanent magnet and the electromagnet coil shown in FIG.
  • FIGS. 1 and 2 An ion plating apparatus according to a preferred embodiment of the present invention will be described with reference to FIGS.
  • This ion plating apparatus is suitable for forming a film by attaching evaporated particles to a substrate.
  • a case where two plasma guns 1A and 1B are provided in a vacuum vessel 11 will be described.
  • a pressure gradient type plasma gun 1B is mounted on a cylindrical portion 12b provided on a side wall of the vacuum vessel 11.
  • the plasma gun 1B includes a glass tube 15b one end of which is closed by a cathode 14b. In the glass tube 15b, L a B.
  • a cylinder 18b made of molybdenum Mo containing a disk 16b made of a material and a pipe 17b made of tantalum Ta is fixed to the cathode 14b.
  • the pipe 17b is for introducing a carrier gas 18 made of an inert gas such as argon Ar or helium He into the plasma gun 1B.
  • first and second intermediate electrodes 19 b. 20 b are concentrically arranged. ing.
  • An annular permanent magnet 21 b for converging the plasma beam is built in the first intermediate electrode (first dalide) 19 b.
  • An electromagnet coil 22b for converging the plasma beam is also built in the second intermediate electrode 2Ob (second grid).
  • the electromagnetic coil 22b is supplied with power from a power source 23b.
  • a steering coil 24 b for guiding a plasma beam into the vacuum container 11 is provided.
  • the steering coil 24b is excited by the power supply 25b.
  • a variable voltage type main power supply 28 b Power is connected.
  • the main hearth 3 Ob has a concave portion into which the plasma beam from the plasma gun IB is incident, and stores an evaporating substance such as an ITO (indium oxide) tablet.
  • Both the main hearth 30b and the auxiliary hearth 31b are made of a conductive material having good thermal conductivity, for example, copper.
  • the auxiliary hearth 31b is attached to the main hearth 30b via an insulator.
  • the main hearth 3 Ob and the auxiliary hearth 3 lb are connected via a resistor 48 b.
  • the main hearth 30b is connected to the positive side of the main power supply 28b. Therefore, the main hearth 30b constitutes an anode for sucking the plasma beam generated from the plasma gun 1B.
  • An annular permanent magnet 35b and an electromagnet coil 36b are accommodated in the auxiliary hearth 31b.
  • the electromagnetic coil 36 b is supplied with power from the hearth coil power supply 38 b.
  • the direction of the center-side magnetic field in the excited electromagnet coil 36b is configured to be the same as the center-side magnetic field generated by the annular permanent magnet 35b.
  • the hearth coil power supply 38 b is a variable voltage power supply, and the current supplied to the electromagnet coil 36 b can be changed by changing the voltage.
  • a substrate holder 42 for holding a substrate 41 on which evaporating particles are deposited is provided above the main hearth 30b.
  • the substrate holder 42 is provided with a heater 43.
  • the heater 43 is supplied with power from a heater power supply 44.
  • the substrate holder 42 is supported electrically insulated from the vacuum vessel 11.
  • a bias power supply 45 is connected between the vacuum vessel 11 and the substrate holder 42. As a result, the substrate holder 42 is biased to a negative potential with respect to the vacuum vessel 11 connected to the zero potential.
  • the auxiliary hearth 31b is connected to the positive side of the main power supply 28b via the switching switch 46b. Has been continued.
  • a drooping resistor 29b and an auxiliary discharge power supply 47b are connected in parallel with the main power supply 28b via a switch S1b.
  • a discharge force is generated between the cathode of the plasma gun 1B and the main hearth 30b in the vacuum vessel 11, thereby generating a plasma beam (not shown).
  • This plasma beam is guided by the magnetic field determined by the steering coil 24b and the annular permanent magnet 35b in the auxiliary hearth 31b, and reaches the main heart 30b.
  • the evaporating substance contained in the main hearth 30b is heated and evaporated by the plasma beam.
  • the evaporated particles are ionized by the plasma beam, adhere to the surface of the substrate 41 to which the negative voltage is applied, and a film is formed on the substrate 41.
  • the substrate 41 is a common member to be processed by the two plasma guns 1A and 1B
  • the substrate holder 42, the heater 43, the heater power supply 44, and the bias power supply 45 also have two plasma guns 1A. , IB, and the configuration of the plasma gun 1A side is the same as that of the plasma gun 1B.
  • the plasma gun shown in Fig. 3 (the first and second intermediate electrodes 103 and 104 and the magnetic poles of the permanent magnet 109 are arranged as described in Fig. 3) is the S type. Then, the type in which the magnetic poles of the first and second intermediate electrodes 103, 104 and the permanent magnet 109 are opposite to the S type is the N type.
  • the present invention is characterized in that an S-type plasma gun and an N-type plasma gun are arranged side by side.
  • auxiliary hearths 3 l a and 3 1 b may be provided with only annular permanent magnets.
  • the plasma gun 1A alone, as described in Fig. 2 once protrudes from the left side in the figure due to the twist of the plasma beam before entering the hearth, and The light enters the hearth 108 from directly above. For this reason, if the plasma gun and Haas with the same magnetic pole direction are applied twice, the plasmas will inflate to the left in the figure and then enter Haas.
  • an S-type plasma gun 1A is arranged on the right side of the figure, and an N-type plasma gun 1B is arranged on the left side of the figure to reverse the direction of the magnetic poles.
  • the plasma becomes symmetrical.
  • the plasma guns 1A and IB are arranged as shown in Fig. 5, the two plasma beams once approach each other and spread so that they are centered with each other, and then the hearths 30a and 30 Incident at b.
  • high-density plasma can be generated also in a region between the two plasma beams, and ion plating using high-density plasma over a wide area becomes edible.
  • the plasma density between plasma beams can be changed depending on the position of the S-type and N-type plasmas.
  • a permanent magnet or iron core is provided inside or outside the vacuum vessel to reduce the plasma density. You can also control it.
  • the auxiliary hearth 3la and 31b can be separated.
  • the magnetic poles of the permanent magnets 10 are arranged such that the upper magnetic poles of the permanent magnets 10 of the auxiliary hearths 31a and 31b are opposite to the magnetic poles opposite to the upper magnetic poles.
  • the electromagnet coil 36b is mounted on the annular permanent magnet 35b with the N pole facing upward. They are arranged one above the other. As shown in FIG. 7 (b), the electromagnet coil 36b may be placed on the ring magnet 35b with the south pole facing upward. In this case, the current flowing through the electromagnet coil 36b is reversed from that in Fig. 7 (a).
  • the electromagnet coil 36b may be disposed so as to overlap the lower side of the annular permanent magnet 35b with the N pole facing upward. Further, as shown in FIG. 7 (d), the electromagnet coil 36 b may be arranged so as to overlap the lower side of the annular permanent magnet 35 b with the S pole facing upward. In these cases, as described above, the direction of the magnetic field on the center side of the excited electromagnet coil 36b is the same as the magnetic field on the center side generated by the annular permanent magnet 35b. A current is flowing so as to be oriented.
  • the interference force of the magnetic force lines generated from each of them is ⁇ And the twisting of the plasma beam is reduced. Therefore, it is possible to provide an ion plating apparatus that can perform ion plating using high-density plasma over a wide area.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Combustion & Propulsion (AREA)
  • Plasma Technology (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

Dans cette invention, des foyers auxiliaires (31a et 31b), dans lesquels sont incorporés des aimants permanents annulaires, sont placés autour de foyers (30a et 30b) disposés dans une chambre sous vide d'air (11). Les orientations des pôles des aimants permanents annulaires (21a et 21b) placés sur deux canons à plasma adjacents (1A et 1B), les bobines électromagnétiques (22a et 22b), les bobines de direction (24a et 24b) et les deux aimants annulaires incorporés dans les deux foyers auxiliaires, sont opposées entre elles de façon alternée.
PCT/JP1997/003436 1996-03-25 1997-09-26 Appareil de plaquage ionique WO1999016924A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP6861796A JP2946404B2 (ja) 1996-03-25 1996-03-25 イオンプレーティング装置
PCT/JP1997/003436 WO1999016924A1 (fr) 1996-03-25 1997-09-26 Appareil de plaquage ionique
US09/269,737 US6160350A (en) 1996-03-25 1997-09-26 Ion plating apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6861796A JP2946404B2 (ja) 1996-03-25 1996-03-25 イオンプレーティング装置
PCT/JP1997/003436 WO1999016924A1 (fr) 1996-03-25 1997-09-26 Appareil de plaquage ionique

Publications (1)

Publication Number Publication Date
WO1999016924A1 true WO1999016924A1 (fr) 1999-04-08

Family

ID=26409821

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1997/003436 WO1999016924A1 (fr) 1996-03-25 1997-09-26 Appareil de plaquage ionique

Country Status (2)

Country Link
JP (1) JP2946404B2 (fr)
WO (1) WO1999016924A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012199017A (ja) * 2011-03-18 2012-10-18 Stanley Electric Co Ltd 圧力勾配型プラズマ発生装置およびそれを用いた成膜装置
JP5989601B2 (ja) * 2013-05-29 2016-09-07 住友重機械工業株式会社 プラズマ蒸発装置
JP6013279B2 (ja) * 2013-06-13 2016-10-25 住友重機械工業株式会社 成膜装置
JP6342291B2 (ja) * 2014-10-16 2018-06-13 住友重機械工業株式会社 成膜装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0580555B2 (fr) * 1986-08-15 1993-11-09 Tobi Co Ltd
JPH06340967A (ja) * 1993-06-02 1994-12-13 Asahi Glass Co Ltd 蒸着装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0580555B2 (fr) * 1986-08-15 1993-11-09 Tobi Co Ltd
JPH06340967A (ja) * 1993-06-02 1994-12-13 Asahi Glass Co Ltd 蒸着装置

Also Published As

Publication number Publication date
JPH09256147A (ja) 1997-09-30
JP2946404B2 (ja) 1999-09-06

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