WO1999012749A1

WO1999012749A1 - Ic card and method of manufacturing the same

Info

Publication number: WO1999012749A1
Application number: PCT/JP1997/003192
Authority: WO
Inventors: Kimiaki Ando; Takehiro Ohkawa; Yousuke Chojamori; Nobuyuki Arasawa; Kazutaka Tsuji; Mitsuo Usami
Original assignee: Hitachi, Ltd.
Priority date: 1997-09-10
Filing date: 1997-09-10
Publication date: 1999-03-18

Abstract

An IC card (1) in which function elements composed of chips of a transmission/reception antenna (18), a control unit (15) having a memory and a communication unit (16) are arranged at one longer side of the card to thereby leave a blank space at the other longer side so as to arrange a column for the name of the card owner that can be embossed. At one side in the longitudinal direction of the control unit (15), there are arranged test terminal units (19a and 19) for testing the circuit wiring in the IC card (1) to thereby reduce the breakage of the card and facilitate the test at the manufacture. Further provided is a method of manufacturing the IC card (1).

Description

Specification

Ic card and its manufacturing method

The present invention relates to an IC card having a built-in IC such as a processor and a method of manufacturing the same. In particular, the present invention relates to reception of power and transmission of information signals by electromagnetic wave or magnetic coupling with a non-contact external device. The present invention relates to an IC card that performs transmission and reception in a non-contact manner and a method for manufacturing the same. Background art

In recent years, IC cards incorporating ICs such as processors have attracted attention as storage media such as electronic management private cards. Conventional IC cards mainly use a contact point to transmit information to a leader terminal, a leader-no-writer. However, recently, the development of non-contact IC cards and lidar lighters with low contact failure and high reliability has been promoted.

There are two types of non-contact IC cards: contact type, proximity type, and remote type, depending on the communication distance.Recently, with regard to the contact type IC card, the international standard that defines coil position, shape, electrical characteristics, etc. The standard ISO 10536 has been established, and IC cards and readers / writers based on this standard are being developed.

According to the international standard, when information is transmitted between an IC card and a reader / writer, the position of the antenna for transmission and reception is specified to be about 2 mm. Since these IC cards are carried in a wallet, commuter pass, or the like, damage to the IC card due to bending or the like is a major issue. In order to solve these problems, Japanese Patent Application Laid-Open No. 8-3161641 solves the problems by filling a capacitor, a print coil, and a thin integrated circuit with an adhesive between upper and lower cover sheets. ing.

However, according to the prior art, although the damage due to the bending of the IC card can be greatly reduced, for example, as pointed out in Japanese Patent Publication No. 52-229260, the maximum bending of the integrated circuit is required. It cannot solve all the problems of damage to integrated circuits when placed in the center of an IC card where stress is generated. In particular, in recent years, IC cards having a light weight and a flexible structure have been developed. Therefore, the problem of the bending stress is important.

In Japanese Patent Publication No. 52-292600, the above problem is solved by providing an integrated circuit at a corner of a force.

In addition, non-contact IC cards without contact terminals are subjected to various printing processes on the surface, so when performing sampling inspections during manufacturing or inspections when a failure occurs, the internal There is a problem that inspection is difficult due to invisible wiring. Particularly, in the case of an IC card in which portability is important, if the connection is largely exposed to the outside, a problem remains in reliability.

On the other hand, the cards currently used in banks, etc., require that a magnetic tape be provided on one long side of the force and that the magnetic tape be used to make the IV / report of each vehicle £ 1 :. Collation of personal identification numbers and the like. Cards equipped with these magnetic stripes are based on the printing of the name of the issuing company, and are based on magnetic stripes distributed in Japan and distributed in Europe and the United States. Some magnetic stripes are provided on the back side. This In addition, cards with magnetic stripes are embossed so that the card issuing company and card owner can be identified from the appearance, and the contents can be pressed into a purchase slip and the contents copied. There are provided a card owner and member number, a card owner's sign field, a card usage precautionary explanation field, and the like.

It is hoped that the non-contact IC card to be developed in the future will be designed to be used in combination with the current magnetic stripe and the embossed card with a name identification field.

An object of the present invention is to provide an IC force capable of being used in combination with a discrimination type card by magnetic stripe embossing or the like to facilitate production inspection and a method of producing the same. Disclosure of the invention

An IC card according to a first aspect of the present invention is a transmission / reception antenna for transmitting power and transmitting an information signal to an external device on one long side of a substantially rectangular force main body by electromagnetic coupling. A control unit having a memory for storing information, and a magnetic stripe for storing information, wherein the transmission / reception antenna is disposed at the center in the longitudinal direction of the card body, and the control unit is The magnetic stripe is arranged on one side in the longitudinal direction of the card body, the magnetic stripe is arranged along the longitudinal direction, and the circuit wiring in the IC card is inspected on one side in the longitudinal direction where the control unit is arranged. Make sure to provide a test terminal section.

As a result, the main functional elements of the transmission / reception antenna, the control unit, and the magnetic stripe are immersed on one long side of the IC card, and the other long side is the other functional element. For example, IC power composed of uneven characters A field for the name of the owner of the card (embossing). However, since the control section is provided at a distance from the center of the IC card, the problem of the maximum bending stress at the center of the IC force can be reduced. Further, by providing a test terminal section near the control section, the wiring can be minimized.

Further, the IC card according to the second invention is characterized in that the card main body is constituted by a thin laminate in which a substrate sheet and a single sheet are provided between a pair of cover sheets, The transmitting / receiving antenna, a control unit including the memory, and the magnetic stripe are arranged on one long side of the card body, and the transmitting / receiving antenna is provided at a center in a longitudinal direction of the substrate sheet, The control unit is provided on one side of the substrate sheet in the longitudinal direction, the magnetic stripe is provided on the surface of the cover sheet along the longitudinal direction of the cover sheet, and the spacer sheet is provided on the surface of the cover sheet. An opening for absorbing the protrusion of the control section is formed, and a test terminal section for inspecting circuit wiring in the IC card is provided on one side in the longitudinal direction where the control section is arranged.

Thus, in addition to the functions and effects of the first invention, the main function elements provided inside the IC card, such as the transmitting / receiving antenna and the control unit, are provided on the substrate sheet, thereby facilitating the manufacturing. . Moreover, by providing a spacer that absorbs the unevenness of the main functional element, the IC force can be easily made uniform.

Also, in the IC force according to a third aspect of the present invention, the force body comprises ^{one or} more flexures, and the transmitting / receiving antenna and the memory are provided on one long side of the card body. And an ilfi communication unit for transmitting power and transmitting an information signal via the transmission / reception antenna. An owner column indicating the owner of the force is provided on the other long side of the card body, the transmission / reception antenna is provided at the center of the board sheet in the longitudinal direction, and the control unit and the communication unit are An opening for absorbing the protrusion of the control unit is formed in the spacer sheet on one side in the longitudinal direction of the substrate sheet, and an IC is provided on one side in the longitudinal direction where the control unit is disposed. Provide a test terminal to inspect the circuit wiring in the force.

As a result, the internal mechanism is concentrated on one long side of the IC card, the owner column is set on the other long side, and the test terminal is included on one side of the IC card. Since the circuits are centrally arranged, it can be used in combination with an IC card of the identification method by embossing, and a non-contact IC card that is easy to manufacture and inspect is provided.

An IC card according to a fourth aspect of the present invention further includes, in addition to the configuration of the second aspect, a communication unit for transmitting power and transmitting an information signal via the transmission / reception antenna near the control unit. Further, the control unit and the communication unit are provided on the other long side of the card body and on one side in the longitudinal direction of the board sheet provided with the control unit. And an opening for absorbing the protrusion of the capacitor is formed, so that it is distributed to both long sides of the IC force and is shifted to one side in the longer direction and communicates with the control unit. Since the unit and the capacitor are arranged, it is possible to provide another functional element, for example, a name field of an IC force owner composed of uneven characters on the long side opposite to the transmitting / receiving antenna. . Moreover, since the control section is provided away from the center of the IC card, the maximum bending stress at the center of the IC card can be reduced by 1 mm. In addition, an effect similar to that of the second invention can be obtained. In the case of the present invention, by providing the test terminal portion apart from the end of the substrate sheet, the terminal is not exposed, so that corrosion from the terminal and malfunction can be prevented. In this case, by forming an opening at a position corresponding to the test terminal on the single sheet, the thickness of the upper part of the test terminal can be reduced, and therefore, in the inspection after manufacturing, The test needle can be easily pierced into the force sheet to bring the test needle into contact with the test terminal.

Further, in the case of the invention, the control unit, the communication unit, and the capacitor are arranged such that X1 is inward from an end of a short side in a longitudinal direction of the card body and an end of a long side adjacent to the short side. Y1 is provided on the inside, and the center of the long side is provided from the center position between the opposing long sides, leaving the size of Y2 on the end side of the long side, and the X1 is 5 mm to 8 mm By setting Y1 from 5 mm to 8 mm> Y2 from 7 mm to 10 mm, the bending stress of the IC card can be reduced.

Further, in the case of the above invention, the main function of the transmitting / receiving antenna, the control unit, and the magnetic stripe is provided by providing a card owner column indicated by uneven characters on the other long side of the substantially rectangular card body. It can be used with a magnetic stripe card without affecting the elements.

Further, the method for manufacturing an IC card according to the fifth invention is characterized in that the transmission of power and the transmission of information signals are performed by electromagnetic coupling between one long side of the substantially rectangular force main body and an external device. 1 送受信? A control unit having a memory for storing information and a magnetic stripe for storing information are arranged, and a circuit in an IC force is disposed on one side in the longitudinal direction where the control unit is disposed. In a method of manufacturing an IC card provided with a test terminal for detecting a wiring, (1) Step of cutting each sheet

A step of cutting a pair of cover sheets, a board sheet, and a spacer sheet constituting a substantially rectangular card body into a predetermined size.

(2) Substrate sheet manufacturing process

The transmitting / receiving antenna arranged at the center in the longitudinal direction of the board sheet, the test terminal section arranged on one side in the longitudinal direction of the board sheet, and the test terminal section are arranged. A wiring pattern on which the control unit is attached on one side in the longitudinal direction, and a wiring connecting the transmitting / receiving antenna, the test terminal unit, and the wiring pattern are printed, and the control unit is placed at a predetermined position with a conductive adhesive. Install

(3) Process of manufacturing spacer sheet

An opening is formed at a predetermined position of the spacer sheet to absorb the protrusion of the control unit.

(4) Card assembly process

—Between the pair of cover sheets, the board sheet and the space sheet are positioned so that the control unit and the opening are fitted to each other, and are filled with an adhesive to cover the pair of cover sheets. Between the board and the board sheet

(5) Magnetic stripe application process

An IC force is manufactured in a step of attaching the magnetic stripe along the longitudinal direction of the cover sheet with an adhesive.

As a result, the manufacturing processes that require high accuracy are integrated into the manufacturing process of the substrate sheet, and the stacked structure of a plurality of sheets reduces the cost by dispersing the manufacturing process. It can be improved.

Further, the method for manufacturing an IC card according to the sixth aspect of the present invention On the longer side, the control unit including the transmission / reception antenna, the control unit including a memory, and a communication unit configured to transmit power and transmit an information signal via the transmission / reception antenna. In an IC card manufacturing method in which the test terminal is disposed on one side in the longitudinal direction,

(1) a step of cutting each sheet, (2) a step of manufacturing a substrate sheet, (3) a step of manufacturing a single sheet, and (4) a step of manufacturing a card body. At each step of the assembling process, the communication section is attached, and the opening for absorbing the thickness of the communication section is formed and assembled. After that, (5) the transmission / reception antenna is arranged as a step of printing the owner column. In the process of printing an owner field to indicate the name of the card owner on the outer surface on the long side opposite to the long side of the IC card

Manufacture IC cards.

As a result, an IC card manufacturing method which can be used in combination with an identification type card by embossing and which can be easily manufactured and inspected is provided. The method for manufacturing an IC card according to a seventh aspect of the present invention, in addition to the configuration of the fifth aspect, further comprises: arranging the communication unit on one long side of the force body; In a method of manufacturing an IC card in which a capacitor is arranged on the other long side of the IC card,

(1) a step of cutting each sheet;

(2) Substrate sheet manufacturing process

The transmitting / receiving antenna arranged at the center in the longitudinal direction of the board sheet; a self-test terminal before being arranged on one side in the longitudinal direction of the board sheet; and the test terminal section A wiring pattern on one side in the longitudinal direction where the control unit, the communication unit, and the capacitor are mounted; and a wiring connecting the transmitting / receiving antenna, the test terminal unit, and the wiring pattern. Print a line and attach the control unit, communication unit and capacitor in place with conductive adhesive

(3) Process of manufacturing spacer sheet

An opening is formed at a predetermined position of the spacer to absorb protrusions of the control unit, the communication unit, and the capacitor.

(4) Card assembly process

—Between the pair of cover sheets, the board sheet and the space sheet are positioned so that the control unit, the communication unit, and the capacitor fit in the opening, and the adhesive is filled. The above-mentioned board sheet and the spacer sheet are attached between a pair of cover sheets.

(5) The IC card is manufactured in the step of attaching the magnetic stripe.

In this way, the manufacturing steps of the control unit, the communication unit, and the capacitor, including the plurality of circuit boards, which require high accuracy are integrated into the manufacturing process of the board sheet, and the stacked structure of the plurality of sheets is further integrated. By doing so, it is possible to reduce costs and improve accuracy due to decentralized manufacturing.

Further, in the case of the method of manufacturing an IC card, (2) in the step of manufacturing the substrate sheet, the test terminal portion is printed at a position separated from the end of the substrate sheet; By forming an opening at a position corresponding to the test terminal section in the process of manufacturing a test sheet, a non-contact IC card capable of preventing corrosion and malfunction from the test terminal section can be manufactured. It can be manufactured without increasing.

In the case of the method for manufacturing an IC card, (1) in the step of cutting each sheet, a board sheet is formed large on the longitudinal direction side of the IC card on which a test terminal portion can be printed; (2) In the step of manufacturing the board sheet, the end of the substrate sheet is formed such that the test end is large. (4) Remove the connection near the position to be the end of the IC force before the card body assembling process, and (5) Remove the substrate sheet before the magnetic stripe attaching process. By cutting the large part of the IC card into the prescribed size of the IC card, various test terminal parts are provided at the time of manufacturing to facilitate inspection, and then unnecessary test terminal parts after manufacturing are easily removed. Since it can be removed, it is possible to provide an IC card that can prevent corrosion or malfunction from the test terminal portion.

Further, in the case of the method for manufacturing an IC card, (4) after the step of assembling the card main body, the card is written in concave and convex characters by embossing on the other long side of the substantially rectangular card main body. An IC card that can be used together with a magnetic strip type card without affecting the transmitting / receiving antenna, the control unit, and the main functional elements of the magnetic strip Can be provided. BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a development view of the non-contact IC card according to the present invention, FIG. 2 is an external view of the non-contact IC card according to the present invention, and FIG. 3 is a non-contact IC card according to the present invention. Block diagram showing the relationship between the card and peripheral devices, FIG. 4 is a detailed block diagram of the non-contact IC card according to the present invention, FIG. 5 is a schematic layout diagram of the non-contact IC card according to the present invention, FIG. 6 is a wiring diagram of a non-contact IC card according to the present invention, FIG. 7 is a sectional view of a non-contact IC card according to the present invention, and FIGS. 8 to 12 are diagrams of the present invention. FIG. 10 is a wiring diagram of another embodiment of the non-contact IC force. BEST MODE FOR CARRYING OUT THE INVENTION

The present invention will be described in more detail with reference to the accompanying drawings. First, a schematic structure and main features of a non-contact IC card according to an embodiment of the present invention will be described with reference to FIG. Fig. 1 is a development view of a non-contact IC card.

In FIG. 1, a non-contact IC card is indicated generally by the reference numeral 1, and includes an integrated circuit and the like built in a card body 2 in which a plurality of thin flexible sheets are stacked. By providing a magnetic stripe 3 and an owner column 5 on the surface of the main body 2, it is possible to use the magnetic strip method in addition to the non-contact force method. The IC card 1 includes a card body 2, a transmission / reception antenna 18 built in the card body 2, a plurality of chips such as a control unit 15, a communication unit 16, and a power supply unit 1. It is composed of a magnetic stripe 3 provided on the surface of the card body 2 and the like.

The card body 2 has a laminated structure in which a base sheet 13 and a space sheet 14 are sandwiched between a pair of cover sheets 11 and 12.

The board sheet 13 is a sheet material for mounting a circuit device E or the like built in the IC card 1, and has one long side 2 a side (the upper side of the figure) of the force guide body 2. A circuit pattern 24 connected to the transmitting / receiving antenna 18 is printed on the transmitting / receiving antenna 18 and one end 2 d 侧 (right end in the drawing) of the IC card 1 in the longitudinal direction. The communication section 16 and the power supply section 17 are separately mounted on both long sides 2 a and 2 b of the circuit pattern 24.

Further, the circuit sheet in the IC card 1 is detected on the board sheet 13. Test terminal sections 19 a and 19 b composed of a plurality of terminals are provided near the control section 15 and the power supply section 17.

Here, the substrate sheet 13 in FIG. 1 is shown transparently on the back surface of the substrate sheet 13 for convenience of explanation. Actually, a circuit pattern 24 is printed on the back surface of the board sheet 13, and a control unit 15, a communication unit 16, and a power supply unit 17 are mounted at predetermined positions. The transmission and reception antenna 18 is printed on both front and rear sides to increase the number of turns of the antenna.

The spacer 14 absorbs the convex shape of the plurality of chips (control unit 15, communication unit 16, power supply unit 1) attached to the IC card 1. The thickness of the IC card 1 is made uniform, and an opening is provided at a position corresponding to the chip in order to adjust the thickness of the chip attached to the back surface of the substrate sheet 13 in the drawing. 20, 21 and 22 are formed. Similarly, openings 23a and 23b are formed at positions corresponding to the test terminals 19a and 19b.

The pair of cover sheets 11 and 12 protect the board sheet 13 and the spacer sheet 14 and print on the outer surface to cover various IC cards 1. To provide. In addition, the magnetic stripe 3 is provided at one end of the long side 2a of the cover sheet 11 adjacent to the substrate sheet 13 in this embodiment, for example, An owner column 5 is provided on the long side 2b side opposite to the good side 2a. The owner column 5 is arranged so as to leave a blank portion 9 on one end 2 d side in the longitudinal direction of the IC force 1.

As described above, according to the non-contact 1C card 1 according to the present embodiment, the transmitting / receiving antenna 18 and the magnetic antenna 18 are biased to one good side 2a side of the IC card 1. The control unit 15, the communication unit 16 and the power supply unit 17 are arranged with stripes 3 and distributed to both long sides 2a and 2b, and offset to one side 2d in the longitudinal direction. Since it is arranged, it is possible to provide another functional element, for example, the owner column 5 of the IC card 1 composed of uneven characters on the long side 2 b side opposite to the transmitting / receiving antenna 18. In addition, a magnetic stripe 3 or an embossing identification method can be adopted, so that it can be easily used in combination with another card.

In addition, since the chip including the control unit 15, the communication unit 16, and the power supply unit 17 is arranged away from the center of the IC card 1, the chip due to the maximum bending stress generated at the center of the IC card 1 is used. Since chip breakage can be reduced, portability can be improved. Further, by providing the test terminal portions 19a and 19b near the chip, the wiring of the circuit pattern 24 can be minimized, and the inspection can be easily performed. Further, the transmitting and receiving antenna 18 and the circuit pattern 24 are printed on the board sheet 13 and the chip is attached, and a pair of powerful sheets 11 and 12 are connected to each other. Since it is structured to be stacked together with the gate 14, the manufacturing becomes easy. Moreover, by providing the spacer sheet 14 for absorbing the unevenness of the main functional element, the IC force 1 can be easily made to have a uniform thickness.

Hereinafter, the IC card 1 according to the present invention will be described in detail with reference to FIG. 1 to FIG.

First, the outer shape of a non-contact IC card will be described with reference to FIG. Fig. 2 is an external view of a non-contact IC card. Fig. 2 (a) is a meta diagram, and Fig. 2 (b) is a wall diagram.

The IC card 1 of this embodiment has a length of about 0.25 mm. It has a thickness similar to that of various kinds of pread cards, and its appearance is a substantially rectangular shape with the size used in cache cards and various pread cards.

In FIG. 2 (a), the surface of the IC card 1 has a magnetic drive 3 for storing information on one long side 2a side of the force main body 2, for example, " There is a card issuer column 4 where the issuing company of IC card 1 such as `` force card '' is described, and it is transferred from the force issuer to the other long side 2b side. In addition, there is provided an owner column 5 in which the name of the owner who owns the IC card 1 is indicated by a member number and a name, such as “0101 666 999999 Taro Yamada”.

The owner column 5 may be embossed so that the owner's name and member number are protruded on the front side, or may be printed with a name or the like, or a printed seal may be attached. .

On the other hand, the back side of the IC card 1 shown in FIG. 2 (b) is a caution explanation column (1) 6, in which a caution on using the card is shown at the position of the back side of the magnetic stripe 3. A card owner's sign field 7 is provided at the back of the card issuer's field 4, and a caution explanation field (2) 8 is provided at the position of the back of the owner's field 5. In this embodiment, the caution explanation column is divided into two for the sake of convenience, but the caution explanation column may be provided on the entire back surface, and the sign column 7 may be provided at the predetermined position.

Here, in the IC card 1 according to the present embodiment, a chip is formed on one end 2d side in the longitudinal direction of the IC card 1 shown in the left end of FIG. 2 (b). For this reason, by providing the owner column 5 offset so as to form a blank portion 9 on the right side, it is possible to eliminate breakage of the IC card 1 at the time of embossing or to break the chip due to pressure during printing. ¾ reduced by ¹ 11 You. For the same reason, when the sign is performed by signing the sign column 7 by writing the sign signboard 7a at the left end and providing a substantial sign column 7b to the right. In addition, damage to the tip caused by pen pressure is reduced.

As described above, according to the IC card 1 according to the present embodiment, the magnetic stripe 18, the owner column 5, and the sign column 7 are provided while having the function of the non-contact IC card 1. This enables not only non-contact usage, but also usage similar to that of a force with a magnetic stripe currently in circulation.

Next, with reference to FIGS. 3 and 4, a system configuration employing the non-contact IC card according to the present embodiment and a circuit configuration of the non-contact IC card will be described. FIG. 3 is a block diagram showing the relationship between the non-contact IC card according to the present invention and peripheral devices, and FIG. 4 is a detailed block diagram of the non-contact IC card according to the present invention.

In FIG. 3, a non-contact IC card 1 according to this embodiment includes a transmitting / receiving antenna 18 provided inside and a transmitting / receiving antenna 240 provided in an external device such as a reader Z writer 200. Power and signal transmission and reception between

The IC card 1 includes a power supply circuit 110 composed of a power supply circuit section 111 and a capacitor section 112, a transmission / reception control circuit 120, a CPU 130, and a memory 140. A pair of transmitting and receiving antennas 18 are ft'i.

On the other hand, the reader Z writer 2 includes a power transmission circuit 210, a reader / writer control circuit 220, a modulation / demodulation circuit 230, and a transmission / reception antenna 240. The reader Z writer 200 is connected to a higher-level controller 300, for example, a personal computer, via a signal line, and based on an operation instruction of the higher-level controller 300, the higher-level controller 300 is connected. The information signal and power of 300 are transmitted to the IC card 1. The reader Z writer control circuit 220 generates a 4.91 MHz clock (which is also a carrier signal for power supply), and modulates the signal from the upper controller 300 into a modulation demodulation circuit 230. To 90-degree phase two-phase PSK modulation specified in IS010536, and to convert the 90-degree phase PSK modulation signal (digital signal) into a sine wave signal and amplify it to IC card 1 The data (downstream data) is generated and the transmission / reception antenna 240 is driven to transmit the radio wave (electromagnetic wave) to the IC force 1 side.

Also, data (upward data) from the IC card 1 to the reader Z writer 200 is received by the transmission / reception antenna 240, and the modulation and demodulation circuit 230 amplifies and extracts necessary waveforms. It performs digital signal conversion and PSK demodulation, demodulates and reproduces data (uplink data), and transmits the signal to the upper controller 300.

On the other hand, the IC force 1 receives the above signal by the transmission / reception antenna 18 and generates a DC voltage by the power supply circuit 110, and simultaneously demodulates the downlink data by the transmission / reception control circuit 120. Modulates uplink data. The demodulated signal writes data to the memory 140 via the CPU 130, and conversely, the upstream data read from the memory 140 transmits the data to the CPU 140 and the transmission / reception control circuit 1. Drive the transmission / reception antenna 18 via 20 and set it to the reader / writer 200 side? It propagates in waves (magnetic waves).

In addition, the IC card 1 according to the present embodiment is composed of a CPU 130 and a memory. 140 constitutes a chip of the control unit 15 shown in FIG. 1, the transmission / reception control circuit 120 and the power supply circuit unit 111 constitute a chip of the communication unit 16, and the capacitor unit 1 1 2 constitutes the power supply 17 chip. The detailed circuit of the IC card 1 will be further described with reference to FIG.

In FIG. 4, first, the CPU 13 0 constituting the control unit 15 includes the VCC terminal 13 1, the DI 0 1 terminal 13 2, the DI 0 2 terminal 13 3, and the CLK terminal 13 4 RST terminal 135 and GND terminal 135. In this embodiment, in order to inspect the operation state of the CPU 13 0, at least the VCC pin 13 1, DI 01 pin 13 2, DI 02 pin 13 3, and CLK pin 13 4 And RST terminal 13 5 and GND terminal 13 6 or a signal line is drawn from the other terminal connected to the same terminal and connected to each terminal of the test terminal section 19 a and 19 b. . In addition, the test terminal sections 19a and 19b are connected to input / output terminals (shown by 〇 in the drawing) of signal lines provided on the chip of the communication section 16 shown in FIG. A test terminal may be provided to enable more detailed inspection.

Now, the IC card 1 can obtain power and a signal by the transmission / reception antenna 18 electromagnetically coupled to the transmission / reception antenna 240 of the reader / writer 200. The signal guided to the communication section 16 is connected to the VCC terminal 13 1 of the CPU 13 via the power supply circuit section 11. In the power supply circuit section 111, the rectifier circuit 113 generates DC E pressure, the limiter 114 limits the _f pressure, and reduces power stains. In step 5, the DC power supply is stabilized at a predetermined voltage. In the power supply circuit section 111, a smoothing capacitor (1) 112a is provided between the rectifier circuit 113 and the limiter 114 to make the current flow. In addition, a smoothing capacitor (2) 112b is provided between the VCC pin 13 1 and the chip of the communication section 16 to smooth current and reduce voltage drop due to load fluctuation. ing.

The current stabilized by the constant voltage circuit 115 is also connected to the power-on RES circuit 116. Power-on RES circuit 1 16 A PWE R RES—N signal that initializes the circuit of IC card 1 by detecting the on state is output, and this signal is input to the timing generation circuit 127. Upon receiving the signal, the timing generation circuit 127 outputs an INIT-N signal to inform the downstream data demodulation circuit 124 of the initial value of the signal in accordance with the timing conforming to IS010536, and outputs the RST-N signal. A signal is output to the RST pin 135 of the CPU 130, and IC force 1 is initialized.

The signal guided to the communication unit 16 is connected to the DI 0 2 terminal 13 2, the CLK terminal 13 4, and the RST terminal 13 5 of the CPU 130 via the transmission / reception control circuit 120. You. In the transmission / reception control circuit 120, the reception signal branched from the transmission / reception antenna 18 is converted into a digital signal by the binarization circuit 122 from the clamp circuit 121, and the downstream data demodulation circuit 1 is converted by the digital signal. Perform processing such as demodulation in 24 and connect to DI01 terminal of CPU130. The clock generated by the clock generation circuit 123 is generated based on the digital signal, and the demodulated signal is obtained by sampling the digital signal at the rising edge of the clock signal. The clock of the clock generation circuit 123 is branched, connected to the timing generation circuit 127, and connected to the CLK pin 134 of the CPU 130 and the RST pin 135.

On the other hand, the output signal output from the CPU 130 through the DI 02 terminal The signal (uplink data) is modulated via an uplink data modulation circuit 125, and is driven and output so as to apply a load to a transmission / reception antenna 18 via a drive circuit 126 and a resonance capacitor 128. You.

Next, the printing position and the arrangement position of each part of the non-contact IC card 1 according to the present embodiment will be described with reference to FIGS. FIG. 5 is a schematic layout diagram of the non-contact IC card according to the present invention, and FIG. 6 is a wiring diagram of the non-contact IC card according to the present invention.

In FIG. 5, the IC card 1 according to the present embodiment specifies a range of a chip placement surface 30 on which the respective chips of the control unit 15, the communication unit 16, and the power supply unit 17 are placed. Thus, when the IC card 1 is bent, breakage of the chip due to the bending stress is reduced.

That is, since the IC card 1 is formed to be very thin, there is a high possibility that the IC card 1 is bent in use. As shown in the figure (b), this bending stress is susceptible to a force (arrow) pinching from both sides. In this case, the IC card 1 receives the maximum bending stress at its center Y0.

In addition, since the IC card 1 is carried in a wallet, a commuter pass, or the like, the area around the IC card 1 protruding from the wallet or the like is used.

(Corners and edges) are also subject to bending stress. Therefore, in the IC card 1 according to the present embodiment, the chip arrangement surface 30 is set by providing a gap between the center and the periphery of the IC card 1.

Specifically, the chip placement surface 30a, the second chip placement surface 30b, the third chip placement surface 30b, and the third chip placement surface 30b are located on all sides (four; ί) of the IC chip 1. c, the fourth chip physics 30 d is set. Its size is the force — the short side 2c in the direction of the hand of the body 2 and X1 inward from the end of the 2d. JP 0

20 From the center position between the short sides 2c and 2d, X2 is at the end side of the short sides 2c and 2d, Y1 is at the inside from the ends of the long sides 2a and 2b, and the long is Four chip arrangement surfaces 30 (30a to 30) formed leaving a size of Y2 from the center position between the sides 2a and 2b and the end sides of the long sides 2a and 2b. d) is set. In the present embodiment, the length X of the long sides 2a and 2b of the IC card 1 is about 86 mm, the length Y of the short sides 2c and 2d is about 54 mm. The thickness is 0.2 The thickness is set to about 5 mm, and based on experimental verification of a force of this magnitude, X 1 is 5 to 8 mm, X 2 is 24 to 26 mm, and By setting the range of Y1 from 5 mm to 8 mm and §Y2 from / mm to 10 mm, the IC card 1 is hard to be damaged even under bending stress. are doing.

Further, since the four chip arrangement surfaces 30 are arranged apart from each other, it is desirable to arrange the chips as much as possible at one place in consideration of wiring and the like. For example, when the first chip arrangement surface 30a at the upper left of the drawing is used as a reference, it is desirable to centrally arrange the chips on the first chip arrangement surface 30a. When the chips cannot be arranged on the first arrangement surface 30a, the wiring is provided by dispersing the chips on the second arrangement surface 30b closest to the first arrangement surface 30a. The length can be reduced to make the arrangement less susceptible to stress. Similarly, if it cannot be arranged on the second arrangement surface 30b, the third arrangement surface 30c and then the fourth arrangement surface 30d are arranged in that order.

In this embodiment, as shown in FIG. 6, the control section 15 and the communication section 16 are arranged on the first chip arrangement 30a, and the power supply section 17 is arranged on the chip arrangement surface of 笫 2. 3 0 b Here, when the circuit is distributed over a plurality of chips as in the present embodiment, the exchange of signals between chips is performed at high speed. Those that need to be performed at the same time are placed on the same chip placement surface, and chips that do not require much higher speed are placed on other chip placement surfaces. In the present embodiment, the control unit 15 and the communication unit 16 that require high-speed signal exchange are provided on the first chip arrangement surface 30a, and the second chip arrangement surface 30b has a very high speed. A power supply section 17 consisting of multiple capacitors that does not require reliability is arranged. In this embodiment, the smoothing capacitor (1) 112a, the smoothing capacitor (2) 112b, and the resonance capacitor 128 shown in FIG. 4 are provided.

In the present embodiment, the transmitting and receiving antennas are utilized by utilizing the dead space between the first chip arrangement surface 30a and the third chip arrangement surface 30c set on both sides in the longitudinal direction of the IC card 1. 18 are provided. The transmitting / receiving antenna 18 is provided with a pair of antennas 18a and 18b having a phase of 90 degrees on both sides of the center in the longitudinal direction according to the standard of IS010536.

By providing the transmitting / receiving antenna 18 close to the first chip arrangement surface 30a, the wiring between the transmitting / receiving antenna 18 and the control unit 15 and the communication unit 16 can be shortened. Further, according to this arrangement, a blank space 5a in which no functional element is arranged can be formed on the long side 2b opposite to the transmitting / receiving antenna 18. In the present embodiment, the owner column 5 is provided in the blank space 5a, and the member number and name of the ordinary owner are printed. Moreover, since the owner column 5 is not provided with the functional elements such as the transmitting / receiving antenna 18 and the chip or the circuit panel 24, a convex character greatly affecting the internal metaphor is provided. Embossing can also be performed.

Further, in this embodiment, when the magnetic stripe 3 is provided, the magnetic stripe 3 is provided on the long side 2a side of the transmitting / receiving antenna 18 side. this child Thus, even if the owner column 5 having been embossed as described above is provided, the function is not hindered.

In addition, as shown in FIG. 5 or FIG. 6, in the present embodiment, the test terminal portions 19a and 19b are connected to the chip arrangement surface 30 and the long side 2a, 2b or the short side. It is provided in the area (gap) formed between 2c and 2d. With this arrangement, the dead space in the IC card 1 can be effectively used, and the test terminal section can be used for inspection.

Since 19a and 19b can be provided at the end of the card, it is easy to connect the test terminals (not shown) connected to the test terminals 19a and 19b. it can.

Further, in FIG. 5, in the IC card 1 according to the present embodiment, an unused placement surface among the plurality of chip placement surfaces 30 can be another placement area. For example, in the embodiment shown in FIG. 6, the owner column 5 is enlarged by using the fourth chip arrangement surface 30 d having the lowest frequency of use as the arrangement surface of the owner column 5. The visibility and handling of names etc. are improved. Similarly, if the above-mentioned chips are arranged only on the first chip arrangement surface 30a, the second chip arrangement surface 30b can be used as the arrangement surface of the owner column 5. Visibility and handleability can be improved.

Next, the test terminal sections 19a and 19b will be further described based on FIG. 7 and with reference to FIG. In FIG. 7, (a) is a cross-sectional view of the test terminal section 19b and the control section 15 of the IC card 1, and (b) is a drawing of the inspection terminal 25 in the (a) figure. In a state where both terminals are connected by piercing the terminal.

As described above, in the IC force 1 of this embodiment, the test end f 邰 19 a, 19b are provided between the chip arrangement surface 30 or the chip arrangement surface 30 and the peripheral edge of the IC card 1, and each test terminal is divided into one or more groups. ing.

In the embodiment shown in FIG. 6, a connection between the communication unit 16 and the control unit 15 is provided between the control unit 15 arranged on the first chip arrangement surface 30a and the long side 2a. The relevant test terminal section, for example, the test terminal section 19b composed of the DI01 terminal 132, DI02 terminal 1333, etc. terminals described in FIG. They are concentrated in the area corresponding to 3b. In addition, a test terminal related to the connection with the power supply unit 1 電源 between the power supply unit 17 arranged on the second chip arrangement surface 30b and the short side 2d, for example, a test terminal related to the power supply circuit 110 These terminals are concentrated in the area corresponding to the opening 23a indicated by the dotted line.

The test terminals 19a and 19b will be further described with reference to the cross-sectional view of FIG. In FIG. 7, a wiring pattern 24, test terminal portions 19a and 19b, and a transmitting / receiving antenna 18 (not shown) are printed on a board sheet 13, and a control portion 15 (a communication portion 16 and a power supply portion) are printed. 17) is attached with conductive adhesive.

Then, a space sheet 14 provided with the openings 21, 23 b and the like is provided on one surface side of the plate sheet 13 on which a chip such as the control unit 15 is arranged, and the plurality of | The openings 21 and 23b are aligned with the corresponding communication section 16 and test terminal section 19b, and glued together, and then the board sheet 13 and spacer sheet 14 are attached. Adhered with glue so as to sandwich it. As described above, according to this structure, the thick control section 15 and communication section 16 are integrated by the spacer sheet 13 so that the card body 2 has a uniform thickness. Can be. On the other hand, the test terminal portions 19a and 19b are provided in a space filled with an adhesive formed between the substrate sheet 13 and the force sheet 12. For this reason, in the destructive inspection as shown in Fig. 7 (b), the connection between the inspection terminal 25 and the test terminal 19a is made without penetrating the spacer sheet 14 Since the inspection terminal 25 may be penetrated through the cover sheet 14, inspection can be performed easily.

Here, the IC card 1 of the present embodiment is designed on the assumption that the circuit board is inspected by the two methods. One is a non-destructive inspection that is performed before the above-mentioned spreadsheet 14 is attached, and is applied to the test terminals 19a and 19b in the state of the board sheet 13 shown in FIG. Inspection is performed by connecting inspection terminals 25 (not shown). The other is a destructive inspection to investigate the cause of a problem in the operating state when assembled as IC card 1. In this destructive inspection, as shown in (a) of FIG. 7, the inspection terminal is pierced from the cover sheet 12 side, and the inspection terminal 25 is connected to the test terminal portion 19a. carry out.

According to the structure shown in FIG. 7, in the nondestructive inspection before assembling, the test terminals 19a and 19b are concentrated and exposed in the vicinity of the chip placement surface 30 and are inspected. Can be improved. On the other hand, after the IC card 1 is assembled, the test terminal portions 19a and 19b are sealed in the card body 2 so that the test terminal portions 19a and 19b are closed. Corrosion of the terminal that occurs when the terminal is exposed from the part, and electrical damage that is transmitted from the exposed terminal can be eliminated. Furthermore, in the destructive inspection after manufacturing, the connection between the inspection terminal 25 and the test ends 19a and 19b can be easily achieved.

Next, referring to FIG. 1, the non-contact IC force 1 according to the present embodiment 1 The outline of the manufacturing method of the above will be described. In FIG. 1, in this embodiment, an IC card 1 is manufactured by the following steps.

(1) Cutting each sheet

First, a pair of cover sheets 11 and 12, a board sheet 13 and a spacer sheet 14 constituting the substantially rectangular card body 2 are cut into a predetermined size. In this embodiment, the four sheets constituting the IC card main body 2 are formed of a PET (polyethylene terephthalate) sheet material. In addition, as the sheet material, use an insulating material, such as a general plastic film sheet such as polycarbonate film, polyethylene film, or polyimide film, or a material such as glass fiber reinforced plastic sheet. However, in this embodiment, the PET film, which is preferable in terms of mechanical strength and cost, is employed.

(2) Substrate sheet manufacturing process

The transmitting / receiving antenna 18 arranged at the center of the board sheet 13 in the longitudinal direction, and the test terminal sections 19a, 19 arranged at one side of the board sheet 13 in the longitudinal direction. b, and a wiring pattern 24 to which the control unit 15, the transmission / reception 16 and the power supply unit 17 are attached is printed on one side in the longitudinal direction where the test terminal units 19a and 19b are arranged. In this printing, for example, an electropaste such as a silver paste is applied and dried by silk screen printing. Then, the respective chips of the control section 15, the communication section 16 and the power supply section 17 are attached to a predetermined position ft of the wiring pattern 24 with a conductive adhesive.

(3) Process of manufacturing spacer sheet

Openings 20, 21, 22 for absorbing protrusions of the control unit 15, the duplexer 16, and the power supply unit 17 are formed at predetermined positions of the spacer sheet 14. To achieve. Openings 23a and 23b are formed at positions corresponding to the test terminal portions 19a and 19b. This step may be performed simultaneously with the step (1).

(4) Card assembly process

The board sheet 13 and the space sheet 14 are fitted so that the control section 15, the communication section 16 and the power supply section 1 fit into the openings 20, 21 and 22. Then, the conductive sheet is filled with the conductive adhesive, and the substrate sheet 13 and the spacer sheet 14 are bonded between the pair of cover sheets 11 and 12. As the conductive adhesive, one obtained by mixing conductive particles such as silver particles and copper particles with a polyester-based, phenol-based, or epoxy-based resin is used.

(5) Magnetic stripe attaching process

Various prints are made on the surface of the cover sheets 11 and 12, and the magnetic stripe 3 is attached with an adhesive along the longitudinal direction of the IC force c.When the IC card 1 is issued, The name and member number of the member transferred from the issuing company of the IC card 1 are attached to the owner column 5 by embossing, printing, or using a sticker.

As described above, according to the present embodiment, the manufacturing process of the control unit 15, the communication unit 16, and the power supply unit 17, including a plurality of chips, is required to manufacture the substrate sheet 13. By reducing the process, and further forming a plurality of sheets with an eyebrow structure, it is possible to reduce costs and improve ίβ ^ by dispersing manufacturing.

In this embodiment, the test terminals 19a and 19b are printed at a position away from the end of the sheet sheet 13 and the test terminals 14a and 14b described above are printed.端子 Η 、 9 2 3 By forming a and 23b, IC force 1 that can prevent corrosion and malfunction of test terminal 19a and 19b can be manufactured without increasing the number of manufacturing processes. be able to.

Next, another embodiment regarding the arrangement of the chip and the circuit pattern 24 and the test terminal portion 19 provided inside the IC card 1 will be described with reference to FIGS. 8 to 12. I do. 8 to 12 are wiring diagrams of another embodiment of the non-contact IC card according to the present invention.

First, FIG. 8 shows that the test terminals 19a and 19b separated into two in the above embodiment are centrally arranged at one place, thereby facilitating the inspection. In this figure, in this embodiment, test terminals 19 are arranged in a line along the short side 2d in the gap between the power supply section 17 and the short side 2d. The other parts have the same configuration as the embodiment shown in FIG.

In the embodiment shown in FIG. 9, a board sheet 13 is formed larger than a predetermined size, a test terminal portion 19a is printed on the large formed portion 13a, and after the inspection before assembly is completed, After cutting off the portion 13 a provided with the test terminal portion 19, the hatched circuit pattern 24 a near the end of the IC card 1 is removed, and after assembling the IC card 1. This is intended to prevent the erroneous operation or the like from the test terminal portion 19a which may occur.

In the drawing, in this embodiment, one of the two test terminal portions 19a and 19b provided in one of the test terminal portions 19a and 19b is connected to the IC terminal similarly to the embodiment in FIG. It is provided apart from the end 2 a of the lead 1, and the other test terminal 19 a is provided at the part to be dropped before assembly. According to this structure, the test terminals used only for inspection before assembly are placed in front of the test terminals. A test terminal, which is provided at a and is also used for inspection after assembly, can be provided at the test terminal portion 19b. Of course, the test terminal portion 19b may be formed like the test terminal portion 19a.

The IC card 1 having the structure of the test terminal portion 19a is manufactured by modifying the following method in the method of manufacturing the IC card 1 described with reference to FIG.

First, in the step (1) of cutting each sheet, the substrate sheet 13 is formed large on the longitudinal direction side of the IC card 1 on which the test terminal portion 19a is printed. ), In the step of manufacturing the substrate sheet 13, the test terminal portion 19 b is printed on the portion 13 a (the short side 2 d side) of the substrate sheet 13 formed largely. Prior to the step (4) of assembling the card body, the hatched wiring pattern 24 a near the end of the IC card 1 is removed. For example, as a removing method, the circuit pattern 24 printed on the silver paste is wiped off with a solvent or the like. After that, the large portion 13a of the substrate sheet 13 is cut into a predetermined size of the IC force 1 before the magnetic stripe attaching step (5). As described above, in this manufacturing method, various test terminal portions 19a are provided at the time of manufacturing to facilitate inspection, and thereafter, unnecessary test terminal portions 19a after manufacturing can be easily removed. You.

Further, since the upper portion of the test terminal portion 19a can be covered with the spacer sheet 14 in the same manner as the other portions, the opening portion 19b is formed on the spacer sheet 14 By forming, it is possible to reduce ill distortion.

FIGS. 10 and 11 show the case where the chip is placed on the first chip placement surface 30a. It shows an embodiment in which the components are centrally arranged. According to this embodiment,

The space on the long side 2 b side facing the long side 2 a provided with the chip placement surface 30 a can be a blank space 5 a, and a wiring pattern is provided near the chip placement surface 30 a. Since 24 can be consolidated, the connection can be shortened.

In FIG. 10, in this embodiment, the control unit 15, the communication unit 16, and the respective chips of the power supply unit 17 for miniaturizing each capacitor are arranged on the first chip arrangement surface 30 a, Test terminal portions 19a and 19b are provided between the first chip arrangement surface 30a, the long side 2a and the short side 2d. Further, in the embodiment shown in FIG. 11, the power saving of the communication section 16 and the smoothing capacitors (1) 112a and the smoothing capacitors (2) 112 The function of the power supply unit 17 is provided in the chip of the communication unit 16 by reducing the size of the resonance capacitor 128. For this reason, in this embodiment, the two chips of the communication unit 16 having the function of the power supply unit 17 and the control unit 15 are arranged on the first chip arrangement surface 30a, and the first chip arrangement The test terminal 19 is concentrated between the surface 30a and the short side 2d.

The embodiment shown in FIG. 12 is an embodiment having the same structure as that of FIG. 8 as a result, but the manufacturing method is different. In this embodiment, the opening 23c of the test terminal 19 is cut out in a U-shape on the short side 2d side, and a part where the opening 23c is released at the time of assembly is separately formed. The member 23 may be filled with 3d. In this case, the method may be combined with the method of removing the circuit pattern 23 described with reference to FIG. 9 ₍ note that the example in which a plurality of chips shown in FIG. 1 to FIG. Similar effects can be obtained with one chip c Further, in the above-described embodiment, the magnetic stripe 3 is provided on the front surface of the IC card 1, that is, on one surface provided with the card issuer column 4, but the magnetic stripe 3 is provided on the back surface side, The issuer column 4 may be large.

Further, in this embodiment, the owner column 5 may be provided in the blank space 5a on the long side 2b side opposite to the transmitting / receiving antenna 18 so that, for example, the card issuer column 4 is provided on the entire surface. And the owner column 5 may be provided at a predetermined position on the back surface.

Although the magnetic stripe 3 is provided in the above embodiment, the magnetic stripe 3 may not be provided if the magnetic stripe 3 is not used. In other words, in this IC card 1, at least its appearance includes a force issuer column 4 indicating the issuer of IC card 1, and an ownership indicating the current owner to whom IC card 1 was transferred. It is only necessary to provide the user column 5.

Further, in the above embodiment, the contactless IC card provided with the transmission / reception antenna 18 was used. However, a contact type IC card not provided with the transmission / reception antenna 18 may be used. In this case, by providing one or a plurality of chips or a contact point with the reader Z writer on the chip arrangement surface 30, the same effect as in the above embodiment can be obtained.

Further, in the method for manufacturing an IC card, (1) a step of cutting each sheet is provided first, but (2) a step of manufacturing a substrate sheet may be performed first. For example, if a large sheet is printed corresponding to a plurality of IC forces and then cut into a predetermined size, large S production is easy. This method can be similarly performed in the manufacturing process of the phosphor sheet 14. Industrial applicability

INDUSTRIAL APPLICABILITY The present invention is suitable for various electronic currency systems, various credit card systems, ticket systems, ID card systems, and other various systems in which user authentication is performed using an IC card.

Claims

The scope of the claims

1. On one long side of the substantially rectangular card body, a transmission / reception antenna that transmits power and transmits information signals by electromagnetic coupling with an external device, and a memory that stores information And a magnetic strip for storing information,

The transmission / reception antenna is arranged at the center in the longitudinal direction of the force main body, and the control unit is arranged on one side in the longitudinal direction of the card main body,

Disposing the magnetic stripe along a longitudinal direction;

An IC card characterized in that a test terminal for inspecting circuit wiring in the IC card is provided on one side in the longitudinal direction where the control unit is arranged.

2. A substantially rectangular card body is composed of a thin laminate in which a board sheet and a spacer sheet are provided between a pair of cover sheets, and one long side of the card body is provided. On the side, a transmission / reception antenna for transmitting power and transmitting an information signal by electromagnetic coupling with an external device, a control unit having a memory for storing information, and a control unit for storing information. Place a magnetic stripe,

The transmitting and receiving antenna is provided at a center in a longitudinal direction of the substrate sheet, and the control unit is provided on one side of the substrate sheet in a longitudinal direction,

Providing the magnetic stripe on a surface of the cover sheet along a longitudinal direction of the cover sheet;

The spacer sheet is formed with 113 ports for absorbing the protrusion of the control unit,

Further, a test terminal unit for inspecting a circuit wiring in the Ic card is provided on one side in the longitudinal direction where the control unit is provided. IC card.

3. The substantially rectangular force main body is composed of a thin laminated body provided with a board sheet and spacer sheet between a pair of cover sheets,

A transmission / reception antenna for transmitting power and transmitting an information signal by electromagnetic coupling to an external device on one long side of the card body, and a control unit including a memory for storing information. A communication unit for transmitting power and transmitting an information signal via the transmission / reception antenna; and, on the other long side of the card body, an owner column for indicating a card owner. Provided,

The transmitting / receiving antenna is provided at the center in the longitudinal direction of the substrate sheet, the control unit and the communication unit are provided on one side in the longitudinal direction of the substrate sheet, and the spacer sheet absorbs the protrusion of the control unit. Openings are formed,

Further, a test terminal for inspecting a circuit wiring in the IC card is provided on one side in the longitudinal direction where the control unit is disposed.

4. The substantially rectangular card body is composed of a thin laminate in which a board sheet and a spacer sheet are provided between a pair of cover sheets,

A transmission / reception antenna for transmitting power and transmitting an information signal by electromagnetic coupling to an external device on one long side of the card body, and a control unit including a memory for storing information. A communication unit for transmitting electric power and transmitting an information signal via the transmission / reception antenna, and a magnetic stripe for storing an ecology report;

A capacitor is provided on the other long side of the force body,

The transmitting and receiving antenna is provided at a center of a longitudinal direction of the substrate sheet, The control unit and the communication unit are provided on one side in the longitudinal direction of the substrate sheet, and the magnetic stripe is provided on the surface of the cover sheet along the longitudinal direction of the cover sheet;

Providing the capacitor on one side in the longitudinal direction of the substrate sheet provided with the control unit;

The spacer sheet is formed with an opening for absorbing the protrusion of the control unit, the communication unit, and the capacitor,

5. In any one of claims 1 to 4,

The IC card according to claim 1, wherein the test terminal is provided apart from an end of the substrate sheet.

6. In the IC card according to the item 5,

An IC card, wherein an opening is formed at a position of the spacer sheet corresponding to the test terminal.

7. In the IC card according to any one of claims 1 to 4,

The control unit is located at X1 inside the end of the short side in the longitudinal direction of the force body, Y1 inside the end of the long side adjacent to the short side, and at the center position between the opposed long sides. Is provided in a central region formed leaving the size of Y2 on the end side of the long side from

X1 is 5 mm force, 8 mm, nij, Y1 is 5 mm to 8 mm, and [HJ is 2 mm, 7 mm to 10 mm.

8. In the IC card according to the item 4,

The control unit, the communication unit, and the capacitor are X1, inward from the end of the short side in the longitudinal direction of the card body, Y1, inward from the end of the long side adjacent to the short side, and the opposing length. It is provided in a central region formed leaving a size of Y2 from the center position between the sides to the end of the long side, wherein X1 is 5 mm, 8 mm, and Y1 is 5 mm. An IC card characterized in that the diameter is 8 mm, and Y2 is 7 mm to 10 mm.

9. In the IC card according to any one of claims 1, 2, and 4,

An IC card characterized in that a card holder column is provided on the other long side of the substantially rectangular card body.

10. The IC card according to any one of claims 3 and 9, wherein

The IC card, wherein the card owner column is indicated by uneven characters.

1 1. A transmitting / receiving antenna that transmits power and transmits information signals by electromagnetic coupling to an external device on one long side of the substantially rectangular force main body, and for storing information. And a magnetic strip for storing information,

A method for manufacturing an IC force comprising the following steps in which test terminals for inspecting circuit wiring in an IC card are arranged on one side in the longitudinal direction where the control unit is arranged.

(1) Step of turning on / off each sheet

It is not possible to cut a pair of cover sheets, a board sheet, and a spacer sheet constituting a substantially rectangular card body into a predetermined size. (2) Substrate sheet manufacturing process

The transmitting / receiving antenna arranged at the center in the longitudinal direction of the board sheet, the test terminal section arranged on one side of the board sheet in the longitudinal direction, and the test terminal section are arranged. A wiring pattern on which the control unit is attached on one side in the longitudinal direction, and a wiring connecting the transmitting / receiving antenna, the test terminal unit, and the wiring pattern are printed, and the control unit is placed at a predetermined position with a conductive adhesive. Install

(3) Process of manufacturing spacer sheet

(4) Card assembly process

Between the pair of cover sheets, the substrate sheet and the space sheet are positioned so that the control unit and the opening are fitted to each other, and the gap is filled with an adhesive to cover the pair of cover sheets. Between the board sheet and the space sheet

(5) Magnetic stripe attaching process

The magnetic stripe is attached along the longitudinal direction of the cover sheet with an adhesive.

1 2. On one long side of the substantially rectangular card body, a transmission / reception antenna for transmitting power and transmitting information signals by electromagnetic coupling with an external device i, and for storing information A control unit having a memory of the type described above, and a communication unit for transmitting power and transmitting an information signal via the transmitting and receiving antenna,

Ι] IC The following steps, in which a test terminal section for detecting the circuit wiring in the Ic card is arranged on one side in the longitudinal direction where the control section is arranged, Manufacturing method

(1) Cutting each sheet

A step of cutting a pair of cover sheets, a board sheet, and a space sheet constituting a substantially rectangular card body into a predetermined size.

(2) Substrate sheet manufacturing process

A transmitting / receiving antenna disposed at a longitudinal center of the substrate sheet; a test terminal disposed at one side in the longitudinal direction of the substrate sheet; and a longitudinal terminal disposed at the test terminal. A wiring pattern on which the control unit is mounted on one side in the direction, and a wiring connecting the transmission / reception antenna, the test terminal unit, and the wiring pattern, are printed, and the control unit and the communication unit are conductively bonded at predetermined positions. Attach with material

(3) Process for manufacturing steel sheets

An opening is formed at a predetermined position on the spacer to absorb a protrusion of the control unit and the communication unit.

(4) Card assembly process

Between the pair of cover sheets, the board sheet and the space sheet are positioned so that the control section and the communication section and the opening are fitted to each other, and the gap is filled with the adhesive. Attach the board sheet and the spacer sheet between the cover sheets

(5) Process of printing the owner column

An owner field for writing the name of the card owner is printed on the outer surface on the long side opposite to the fear side of the IC force where the transmitting / receiving antenna is arranged.

1 3. On one long side of the substantially rectangular card holiday, transmission and reception for transmitting power and transmitting information signals by electromagnetic coupling with external devices. A control unit having a communication antenna, a memory for storing information, a communication unit for transmitting power and transmitting an information signal via the transmission / reception antenna, and a magnetic stripe for storing information. And a capacitor on the other long side of the card body,

A method for manufacturing an IC force comprising the following steps in which a test terminal for inspecting a circuit wiring in an IC card is arranged on one side in the longitudinal direction where the control unit is arranged.

(1) Cutting each sheet

A step of cutting a pair of cover sheets, a board sheet, and a spacer sheet that form a substantially rectangular force main body into a predetermined size.

(2) Substrate sheet manufacturing process

The transmitting and receiving antenna arranged at the center in the longitudinal direction of the board sheet; the test terminal section arranged on one side of the board sheet in the longitudinal direction; and the longitudinal direction where the test terminal section is arranged. On one side, a wiring pattern on which the control unit, the communication unit, and the capacitor are attached, and a wiring connecting the transmission / reception antenna, the test terminal unit, and the wiring pattern are printed, and the control unit, the communication unit, and the capacitor are connected to each other in a predetermined manner. Attach in place with conductive adhesive

(3) Process of manufacturing spacer sheet

An opening is formed at a predetermined position of the spacer sheet to absorb protrusions of the control unit, the communication unit, and the capacitor.

(4) Card assembly process

—In the case of a pair of cover sheets, the board sheet and the front seat sheet are positioned so that the openings fit together with the control section, and the contacts are filled. Between the pair of cover sheets, the board sheet Attach sseat

(5) Magnetic stripe attaching process

The magnetic stripe is attached with an adhesive along the longitudinal direction of the force sheet.

14. The method for producing an IC card according to any one of claims 11 to 13, wherein

In the above (2) step of manufacturing a substrate sheet, the test terminal portion is printed at a position away from the end of the substrate sheet, and in the above (3) step of manufacturing a spacer sheet, the test terminal section is printed. An IC card manufacturing method, characterized by forming an opening at a position corresponding to a terminal.

15. The method for producing an I C force source according to any one of claims 11 to 13,

In the above (1) step of cutting each sheet, a test sheet is formed to be large on the longitudinal direction side of an IC card on which a test terminal portion can be printed, and in the above (2) step of manufacturing a substrate sheet, the test sheet is formed. A printed circuit board terminal is printed on the end of the large-sized board sheet, and before the step (4) of assembling the force body, the connection near the position to be the end of the IC card is formed. And removing the large portion of the substrate sheet into a predetermined size of the IC card after the step (4) of assembling the card body.

16. The method for manufacturing an I C force according to any one of claims 11 to 13 of the claims,

(4) After the main card assembling step, a force owner field is formed on the other long side of the substantially rectangular card body by embossing, which is indicated by embossed characters. IC manufacturing method-