WO1999001250A1 - Procede de brasage tendre de metaux et metal d'apport pour brasage tendre pour mettre ledit procede en oeuvre - Google Patents

Procede de brasage tendre de metaux et metal d'apport pour brasage tendre pour mettre ledit procede en oeuvre Download PDF

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Publication number
WO1999001250A1
WO1999001250A1 PCT/EP1998/003974 EP9803974W WO9901250A1 WO 1999001250 A1 WO1999001250 A1 WO 1999001250A1 EP 9803974 W EP9803974 W EP 9803974W WO 9901250 A1 WO9901250 A1 WO 9901250A1
Authority
WO
WIPO (PCT)
Prior art keywords
solder
soft solder
soft
reaction component
reaction
Prior art date
Application number
PCT/EP1998/003974
Other languages
German (de)
English (en)
Inventor
Hans-Jürgen Albrecht
Michael Dörr
Wolfgang HÄRTEL
Wolfgang Scheel
Harry Berek
Monika Hannemann
Heino Pachschwöll
Klaus Wittke
Original Assignee
Zentrum für Material- und Umwelttechnik GmbH
Metallwerk Goslar Gmbh & Co. Kg
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zentrum für Material- und Umwelttechnik GmbH, Metallwerk Goslar Gmbh & Co. Kg, Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. filed Critical Zentrum für Material- und Umwelttechnik GmbH
Priority to EP98939558A priority Critical patent/EP0939684A1/fr
Publication of WO1999001250A1 publication Critical patent/WO1999001250A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/34—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0006—Exothermic brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1163—Chemical reaction, e.g. heating solder by exothermic reaction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/121—Metallo-organic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/125—Inorganic compounds, e.g. silver salt
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Definitions

  • the invention relates to a method according to the preamble of patent claim 1 and a soft solder according to the preamble of patent claim 19.
  • Dispersion and / or reaction solders have also become known in which solidification of the solder joint is to be achieved by introducing dispersoids.
  • Metal oxides, intermetallic phases and non-metals are preferably used as dispersoids.
  • a solder is known from WO 94/27777 which is based on the use of a solder paste with the metallic partners SnBi on the one hand and Ag or Au on the other. All known solutions either provide known soft solder alloys with their temperature strengths recognized as inadequate, or significantly higher process temperatures have to be used to produce the soldered connection.
  • the working temperatures during the soldering process are normally about 50 ° K above these melting temperatures, so that in the known reflow processes peak temperatures are between 230 ° C and 260 ° C, to which the entire assembly on which the soldering takes place is fully exposed is.
  • peak temperatures are between 230 ° C and 260 ° C, to which the entire assembly on which the soldering takes place is fully exposed is.
  • peak temperatures are between 230 ° C and 260 ° C, to which the entire assembly on which the soldering takes place is fully exposed is.
  • lower temperatures are often classified as critical for the electronic components. There are therefore no possibilities for using higher melting solders.
  • the aim of the invention is to provide a method and a soft solder of the type mentioned, with which an increased Soft solders having melting temperature can be used without corresponding heating of the soldering point from the outside.
  • reaction component A particularly preferred introduction of the reaction component into the soft solder is defined by claim 4 or 22.
  • the reaction component should preferably be a metal or an alloy.
  • An advantageous practical development of this embodiment can be found in claim 6 or 24, the quantitative ratios advantageously being selected according to claim 7 or 25.
  • reaction component can also be an organic or inorganic metal salt.
  • a metal-free reagent can also be used as the reaction component.
  • reaction component reacts exothermically with part of the soft solder.
  • the cascade effect according to the invention is based on the fact that the increased temperature caused by the first reaction causes the reaction of further components of the solder, which in turn releases exothermic energy. This effect can already be range for low-melting solders.
  • the use of this cascade effect in particular makes it possible to further reduce the triggering temperature when the soldering point has increased temperature resistance.
  • reaction component additionally fulfills the function of a flux or flux component for the soft solder used.
  • a practical implementation of this embodiment can be found in claims 16 or 34.
  • the metal components of the components to be joined can also participate in the exothermic reaction.
  • the idea of the invention is that the highest temperature required for the actual soldering process only arises directly at the components to be joined, but the surroundings of these components are largely spared from overheating.
  • the soft solders according to the invention ensure a higher temperature resistance of the soldered connections within the assemblies produced therewith.
  • a major advantage of the solders according to the invention is that the solderings can be produced using the customary methods and processes of the previous soft soldering technique.
  • the invention is primarily reaction solders in which, in addition to the known reaction processes, exothermic reactions be initiated.
  • a local temperature increase occurs in the solder joint during the soldering process.
  • further metallurgical effects can be achieved with the previously usual process parameters of soft soldering technology, ie essentially with the known temperature-time functions, which lead to solder connections that can be subjected to much higher loads.
  • reaction component The reactions with the reaction component are possible with the metallic components directly involved in the alloying process. In addition or instead of this, additives can also be used which are not involved in the alloy formation.
  • An essential idea of the invention is based on the fact that cascade effects can be built up as a result.
  • components can be installed which react exothermically as organic or inorganic compounds, which then triggers further reactions.
  • So-called starting eutectics can also be formed by introducing further metals, which trigger and accelerate the reactions through their wetting effects. The components of these starting eutectics have to undergo an irreversible reaction to the other components of the solder during the joining process.
  • the decisive factor for the quality of the solder joints is not only the melting temperature of the solder, but also the homologous temperature factor Th, which is defined as follows: T E (K)
  • TE is the operating temperature, which e.g. Can be 150 ° C.
  • Ts is the melting temperature of the soft solder.
  • Th factor of 0.92 is derived for the usual eutectic SnPb solder at an operating temperature of 150 ° C.
  • the Th factor can be reduced to 0.84. This results in a significantly improved temperature stability of the solder joint.
  • the soft solders previously used can neither be used in their original form nor in the expansion as dispersion or composite solders.
  • the basic matrix SnPb, SnPbAg or SnAg with the corresponding melting temperatures and the resulting homologous temperatures is decisive for their mechanical properties when used at elevated temperatures.
  • An embodiment according to the invention for such reaction solders consists in that Pd is added to a reaction with the Sn contained therein in the manufacturing process of a solder paste. During the soldering process, Pd forms intermetallic phases with Sn releasing exothermic energy. This makes it possible, for example, to reliably melt an SnCu eutectic at normal reflow temperatures.
  • Another example provides for components which are not or only partially involved in the formation of the alloy to be formed as metal-organic or metal-inorganic additives in order to form the exothermic reaction. Suitable for this for example Cu (II) acetylacetonate or corresponding Fe compounds.
  • the reactants can be used in powder form for the production of solder paste.
  • Another shape is also possible, for example as a wire and / or fiber composite.
  • a press bond for the production of preforms or other shaped pieces is also possible.
  • Another example provides for the composite to be produced by galvanic and / or chemical application.
  • Very fine Pd powder is added to the alloy powder SnCu3 and homogenized. Then binder, flux and metal powder are mixed to a solder paste of the following composition: Sn95Cu3Pd2 (data in mass%). The metal content of the paste is between 80 and 90%.
  • Suitable metal salts with an exothermic reaction are copper (II) acetylacetonate, which reacts exothermically at approx. 247 ° C and / or cobalt (II) acetylacetonate, which shows usable reactions at approx. 235 ° C.
  • Example 3 For example, an addition of up to 30% n-nonane to the binder is suitable as the organic component.
  • Lead is added to the soft solder SnCu3Pd2 as the first reaction component (0.7%). This reduces the start of melting to approx. 215 ° C and the exothermic reaction with Pd begins. By further adding SnAg3.5 with a melting temperature of 221 ° C, the exothermic reaction can be increased by providing metallic Sn and the solder can be melted reliably.
  • a reagent that can be a flux or flux component at the same time is n-nonane.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention concerne un procédé de brasage tendre de métaux en un point de brasage, selon lequel un métal d'apport liquide de brasage tendre est mis en contact par chauffage au point de brasage, avec la pièce métallique à assembler, puis est refroidi pour produire un assemblage par brasage. Cette invention se caractérise en ce qu'il est prévu au point de brasage au moins un constituant de réaction qui réagit de manière exothermique avec au moins un autre constituant lorsque la température parvient à un degré de déclenchement, de manière à provoquer localement, au point de brasage, une élévation de la température de brasage.
PCT/EP1998/003974 1997-07-01 1998-06-29 Procede de brasage tendre de metaux et metal d'apport pour brasage tendre pour mettre ledit procede en oeuvre WO1999001250A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP98939558A EP0939684A1 (fr) 1997-07-01 1998-06-29 Procede de brasage tendre de metaux et metal d'apport pour brasage tendre pour mettre ledit procede en oeuvre

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19728014A DE19728014A1 (de) 1997-07-01 1997-07-01 Verfahren zum Weichlöten von Metallen und Weichlot zur Ausführung dieses Verfahrens
DE19728014.5 1997-07-01

Publications (1)

Publication Number Publication Date
WO1999001250A1 true WO1999001250A1 (fr) 1999-01-14

Family

ID=7834274

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP1998/003974 WO1999001250A1 (fr) 1997-07-01 1998-06-29 Procede de brasage tendre de metaux et metal d'apport pour brasage tendre pour mettre ledit procede en oeuvre

Country Status (3)

Country Link
EP (1) EP0939684A1 (fr)
DE (1) DE19728014A1 (fr)
WO (1) WO1999001250A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012502798A (ja) * 2008-09-15 2012-02-02 シーメンス アクティエンゲゼルシャフト 反応性充填剤を有するはんだ材料、当該はんだ材料を有する担体要素又は部品、ならびに融剤の利用
DE102015205820A1 (de) * 2015-03-31 2016-10-06 KLEB- UND GIEßHARZTECHNIK DR. LUDECK GMBH Heizelement für die SMD-Montage, elektronische Baugruppe mit einem solchen Heizelement und Verfahren zum Erzeugen einer elektronischen Baugruppe

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005310956A (ja) 2004-04-20 2005-11-04 Denso Corp 半導体装置の製造方法
DE102011083931A1 (de) 2011-09-30 2013-04-04 Robert Bosch Gmbh Schichtverbund aus einem elektronischen Substrat und einer Schichtanordnung umfassend ein Reaktionslot

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3808670A (en) * 1972-05-24 1974-05-07 Isotopes Inc Exothermic bonding of thermoelectric couples
US4274483A (en) * 1979-08-01 1981-06-23 Modine Manufacturing Company Reaction bonding of ferrous metals
JPS61111765A (ja) * 1984-11-02 1986-05-29 Matsushita Electric Ind Co Ltd 物品の接合方法とそのためのハンダ材料
JPH04190995A (ja) * 1990-11-21 1992-07-09 Hitachi Ltd 自溶性はんだ材料及び電子回路基板
US5381944A (en) * 1993-11-04 1995-01-17 The Regents Of The University Of California Low temperature reactive bonding
JPH07136795A (ja) * 1993-11-16 1995-05-30 Showa Denko Kk はんだペースト

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2019443B (en) * 1977-11-03 1982-05-12 Sergeant C Hypophosphite soft solder flux
JPH10146690A (ja) * 1996-11-14 1998-06-02 Senju Metal Ind Co Ltd チップ部品のはんだ付け用ソルダペースト

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3808670A (en) * 1972-05-24 1974-05-07 Isotopes Inc Exothermic bonding of thermoelectric couples
US4274483A (en) * 1979-08-01 1981-06-23 Modine Manufacturing Company Reaction bonding of ferrous metals
JPS61111765A (ja) * 1984-11-02 1986-05-29 Matsushita Electric Ind Co Ltd 物品の接合方法とそのためのハンダ材料
JPH04190995A (ja) * 1990-11-21 1992-07-09 Hitachi Ltd 自溶性はんだ材料及び電子回路基板
US5381944A (en) * 1993-11-04 1995-01-17 The Regents Of The University Of California Low temperature reactive bonding
JPH07136795A (ja) * 1993-11-16 1995-05-30 Showa Denko Kk はんだペースト

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 010, no. 299 (M - 524) 11 October 1986 (1986-10-11) *
PATENT ABSTRACTS OF JAPAN vol. 016, no. 515 (M - 1329) 23 October 1992 (1992-10-23) *
PATENT ABSTRACTS OF JAPAN vol. 095, no. 008 29 September 1995 (1995-09-29) *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012502798A (ja) * 2008-09-15 2012-02-02 シーメンス アクティエンゲゼルシャフト 反応性充填剤を有するはんだ材料、当該はんだ材料を有する担体要素又は部品、ならびに融剤の利用
DE102015205820A1 (de) * 2015-03-31 2016-10-06 KLEB- UND GIEßHARZTECHNIK DR. LUDECK GMBH Heizelement für die SMD-Montage, elektronische Baugruppe mit einem solchen Heizelement und Verfahren zum Erzeugen einer elektronischen Baugruppe
US9986648B2 (en) 2015-03-31 2018-05-29 Siemens Aktiengesellschaft Heating element for SMD mounting

Also Published As

Publication number Publication date
EP0939684A1 (fr) 1999-09-08
DE19728014A1 (de) 1999-01-07

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