WO1998045804A1 - Carte a puce a assemblage rive - Google Patents

Carte a puce a assemblage rive Download PDF

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Publication number
WO1998045804A1
WO1998045804A1 PCT/EP1998/001974 EP9801974W WO9845804A1 WO 1998045804 A1 WO1998045804 A1 WO 1998045804A1 EP 9801974 W EP9801974 W EP 9801974W WO 9845804 A1 WO9845804 A1 WO 9845804A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic device
rivets
rivet
carrier substrate
contact surface
Prior art date
Application number
PCT/EP1998/001974
Other languages
German (de)
English (en)
Inventor
Edgar Schneider
Original Assignee
Telbus Gesellschaft Für Elektronische Kommunikations-Systeme Mbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telbus Gesellschaft Für Elektronische Kommunikations-Systeme Mbh filed Critical Telbus Gesellschaft Für Elektronische Kommunikations-Systeme Mbh
Priority to AU74292/98A priority Critical patent/AU7429298A/en
Publication of WO1998045804A1 publication Critical patent/WO1998045804A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/072—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising a plurality of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/61—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/06—Riveted connections

Definitions

  • the invention relates to an electronic device, in particular a chip card according to the preamble of claim 1 and a method for mechanical and electrical connection of micromodules according to claim 7.
  • contactless chip cards that is to say chip cards in which an inductive method for transmitting energy and data is used
  • a coil which acts as a transmitting and receiving antenna for transmitting of electrical energy as well as information.
  • the micromodule with the antenna film is electrically connected to the micromodule with the semiconductor circuits via a soldered, welded or conductive adhesive connection. In practice, it has been found that these connection points represent weak points in the case of bending loads and lead to system failures.
  • An electronic device and in particular a chip card are provided, in which two electronic micromodules, each containing electronic components arranged on a flexible carrier substrate, are connected at contact points by means of riveted connections.
  • the rivet or rivet connection consists of an electrically conductive material and thus provides both an electrical and a mechanical connection of the micromodules. It has been found that the rivet connection counteracts possible corrosion due to its elastic behavior at the contact points due to frictional effects at the connection points under mechanical loads, such as, in particular, bending loads on the chip card, and ensures low contact resistance between the electrical conductors to be connected.
  • the rivets are hollow rivets that are bent over at the ends and thus provide an optimal connection.
  • the advantageous embodiment of the invention according to claim 4 ensures that the maximum permissible height of chip cards is not exceeded.
  • the mechanical connection between the rivet and the carrier substrate and thus the mechanical connection between the two carrier substrates is improved.
  • the method according to the invention allows two or more micromodules, that is to say flat carrier substrates, to be connected to one another both electrically and mechanically.
  • the rivet receiving holes can be created before or after the substrates to be riveted are positioned one on top of the other.
  • FIG. 1 shows a schematic representation of a first carrier substrate or micromodule of an electronic chip card with the semiconductor circuits
  • FIG. 2 shows a schematic illustration of a second carrier substrate or micromodule in the form of an antenna film for a contactless chip card
  • FIG. 3 shows a sectional view of the two carrier substrates according to FIGS. 1 and 2 connected by a riveted connection.
  • first flexible carrier substrate 2 with at least one semiconductor circuit and other electronic components 4, which are connected to two first electronic contact points 6 via electrical conductor tracks (not shown).
  • 2 schematically shows a second carrier substrate 8 with an antenna winding 10 and two second electrical contact points 12.
  • the first and second contact points 6 and 12 are arranged geometrically on the respective carrier substrate 2 and 8, respectively, in such a way that they are suitable Assignment of the two carrier substrates 2 and 8 according to the dashed line 13 in Fig. 2 lie on top of each other in pairs.
  • the two substrates 2 and 8 are fixed in this position and the two contact points 6 and 12 lying one above the other are provided with rivet receiving holes 14 by means of a bore.
  • 3 shows the state in which the hollow rivet 16 has expanded but has not yet been pressed into the substrates 2 and 8.
  • the contact points 6 and 12 are pressed together by the rivet connection 16. Due to the widening of the ends of the rivet 16, this electrical and mechanical rivet connection acts like a spring when subjected to bending loads and thus ensures permanent and reliable electrical contact between the contact points 6 and 12.
  • Hollow rivets are particularly suitable for the riveted joint according to the invention, since their ends can be z. B. expand by a conically shaped spike without that • this would lead to large upsets of the rivet in the area of the contact points 6, 12. If the substrates are pressed together sufficiently during riveting, solid rivets can also be used. Reference list
  • first flexible carrier substrate semiconductor circuits, electronic components, first electrical contact points, second carrier substrate, antenna winding, second electrical contact points, dashed line, position of the carrier substrates 2 and rivet receiving holes on one another

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

L'invention concerne un appareil électronique, notamment une carte à puce comportant au moins deux micromodules (2, 8) interconnectés électriquement. Ces micromodules électroniques au moins au nombre de deux, lesquels comportent respectivement des composants électroniques (4, 10) disposés sur un substrat porteur souple, sont interconnectés au niveau de points de contact au moyen d'assemblages rivés. En l'occurence, il est important que le rivet ou l'assemblage rivé (16) soit constitué d'un matériau électroconducteur et établisse ainsi une liaison à la fois électrique et mécanique des micromodules.
PCT/EP1998/001974 1997-04-04 1998-04-03 Carte a puce a assemblage rive WO1998045804A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU74292/98A AU7429298A (en) 1997-04-04 1998-04-03 Chip card with a riveted joint

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE29706016.3 1997-04-04
DE29706016U DE29706016U1 (de) 1997-04-04 1997-04-04 Elektronisches Gerät, insbesondere Chipkarte mit Nietverbindung

Publications (1)

Publication Number Publication Date
WO1998045804A1 true WO1998045804A1 (fr) 1998-10-15

Family

ID=8038465

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP1998/001974 WO1998045804A1 (fr) 1997-04-04 1998-04-03 Carte a puce a assemblage rive

Country Status (3)

Country Link
AU (1) AU7429298A (fr)
DE (1) DE29706016U1 (fr)
WO (1) WO1998045804A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999005643A2 (fr) * 1997-07-28 1999-02-04 Wendisch Karl Heinz Module puce, module et procede pour la production d'un module, et carte a puce
WO2002077918A2 (fr) * 2001-03-22 2002-10-03 Intec Holding Gmbh Procede de production d'une carte a puce sans contact et carte a puce ainsi produite

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10146870B4 (de) * 2001-09-24 2013-03-28 Morpho Cards Gmbh Chipkarte und Verfahren zur Herstellung einer elektrischen Verbindung zwischen Bauelementen einer derartigen Chipkarte

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0671705A2 (fr) * 1994-02-14 1995-09-13 Gemplus Card International Procédé de fabrication d'une carte sans contact et carte sans contact
DE4440721A1 (de) * 1994-11-15 1996-05-23 Datacolor Druck Und Fullservic Trägerelement für IC-Baustein
WO1997005570A1 (fr) * 1995-08-01 1997-02-13 Austria Card Plastikkarten Und Ausweissysteme Gesellschaft Mbh Support de donnees sous forme de carte pour applications sans contact, comportant un composant et un systeme de transmission pour applications sans contact, procede permettant de produire un support de donnees sous forme de carte de ce type et module approprie
WO1998006063A1 (fr) * 1996-08-02 1998-02-12 Solaic Carte a circuit integre a connexion mixte

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2706467A1 (de) * 1977-02-16 1978-08-17 Hartmann & Braun Ag Elektrisch leitendes verbindungselement
GB2014368B (en) * 1978-02-11 1982-10-06 Nkf Groep Bv Flexible printed-circuit board
FR2541828B1 (fr) * 1983-02-28 1985-09-13 Inf Milit Spatiale Aeronaut Dispositif de connexion electrique entre deux cartes de circuits imprimes et procede de connexion de deux cartes de circuits imprimes a l'aide d'un tel dispositif
DE3624852A1 (de) * 1986-01-10 1987-07-16 Orga Druck Gmbh Elektronische daten- und/oder programmtraeger und verfahren zu seiner herstellung
GB8808212D0 (en) * 1988-04-08 1988-05-11 Syrinx Innovations Forming mechanical & electrical connections printed circuit board
DE4416697A1 (de) * 1994-05-11 1995-11-16 Giesecke & Devrient Gmbh Datenträger mit integriertem Schaltkreis
JPH08128424A (ja) * 1994-10-31 1996-05-21 Fujitsu Denso Ltd プリント板取付用リベット
JPH08213068A (ja) * 1995-02-09 1996-08-20 Fujikura Ltd フレキシブルプリント基板とテープ電線との接続方法
GB2306805A (en) * 1995-10-30 1997-05-07 Whitaker Corp Conductive rivet electrical termination

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0671705A2 (fr) * 1994-02-14 1995-09-13 Gemplus Card International Procédé de fabrication d'une carte sans contact et carte sans contact
DE4440721A1 (de) * 1994-11-15 1996-05-23 Datacolor Druck Und Fullservic Trägerelement für IC-Baustein
WO1997005570A1 (fr) * 1995-08-01 1997-02-13 Austria Card Plastikkarten Und Ausweissysteme Gesellschaft Mbh Support de donnees sous forme de carte pour applications sans contact, comportant un composant et un systeme de transmission pour applications sans contact, procede permettant de produire un support de donnees sous forme de carte de ce type et module approprie
WO1998006063A1 (fr) * 1996-08-02 1998-02-12 Solaic Carte a circuit integre a connexion mixte

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999005643A2 (fr) * 1997-07-28 1999-02-04 Wendisch Karl Heinz Module puce, module et procede pour la production d'un module, et carte a puce
WO1999005643A3 (fr) * 1997-07-28 1999-04-08 Wendisch Karl Heinz Module puce, module et procede pour la production d'un module, et carte a puce
WO2002077918A2 (fr) * 2001-03-22 2002-10-03 Intec Holding Gmbh Procede de production d'une carte a puce sans contact et carte a puce ainsi produite
WO2002077918A3 (fr) * 2001-03-22 2002-11-14 Intec Holding Gmbh Procede de production d'une carte a puce sans contact et carte a puce ainsi produite

Also Published As

Publication number Publication date
DE29706016U1 (de) 1998-08-06
AU7429298A (en) 1998-10-30

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