WO1998026413A1 - Dispositif pour coller des substrats ou des disques compacts formes de deux parties - Google Patents

Dispositif pour coller des substrats ou des disques compacts formes de deux parties Download PDF

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Publication number
WO1998026413A1
WO1998026413A1 PCT/EP1997/006934 EP9706934W WO9826413A1 WO 1998026413 A1 WO1998026413 A1 WO 1998026413A1 EP 9706934 W EP9706934 W EP 9706934W WO 9826413 A1 WO9826413 A1 WO 9826413A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
adhesive
parts
substrate part
receiving
Prior art date
Application number
PCT/EP1997/006934
Other languages
German (de)
English (en)
Inventor
Eggo Sichmann
Reinhard Gerigk
Stefan Kempf
Original Assignee
Singulus Technologies Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Singulus Technologies Ag filed Critical Singulus Technologies Ag
Publication of WO1998026413A1 publication Critical patent/WO1998026413A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/45—Joining of substantially the whole surface of the articles
    • B29C66/452—Joining of substantially the whole surface of the articles the article having a disc form, e.g. making CDs or DVDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/816—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the mounting of the pressing elements, e.g. of the welding jaws or clamps
    • B29C66/8161—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the mounting of the pressing elements, e.g. of the welding jaws or clamps said pressing elements being supported or backed-up by springs or by resilient material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/82—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
    • B29C66/822—Transmission mechanisms
    • B29C66/8221—Scissor or lever mechanisms, i.e. involving a pivot point
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/82—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
    • B29C66/826—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined
    • B29C66/8266—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined using fluid pressure directly acting on the parts to be joined
    • B29C66/82661—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined using fluid pressure directly acting on the parts to be joined by means of vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8324—Joining or pressing tools pivoting around one axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7841—Holding or clamping means for handling purposes
    • B29C65/7847—Holding or clamping means for handling purposes using vacuum to hold at least one of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00—Carriers for sound or information
    • B29L2017/001—Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
    • B29L2017/003—Records or discs
    • B29L2017/005—CD''s, DVD''s
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/06—Angles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2429/00—Carriers for sound or information
    • B32B2429/02—Records or discs

Definitions

  • a device for gluing compact sound plates made up of two parts or halves, which are formed from two halves and joined together by means of an adhesive is already generally known.
  • the adhesive is introduced between the two halves, the two halves are then placed one on top of the other so that the adhesive can slowly flow outwards due to the adhesive effect.
  • Such assembly is very complex and time consuming, so that it is not suitable for mass production.
  • EP-A-0 624 870 describes a device for producing optical disks, such as CDs, from two substrate parts bonded to one another.
  • a lower substrate part is placed on a carrier and adhesive is applied there; then a second substrate part is placed obliquely at one edge on the lower substrate part, the two substrate parts being centered relative to one another via their corresponding center holes by a centering rod.
  • Lowering the upper substrate part onto the lower substrate part is achieved by reducing the angle of inclination between these substrate parts, a drive being provided to support the free side of the upper substrate part.
  • the angle of inclination between the two substrate parts is reduced, the upper substrate part being supported on the left edge of the lower substrate part during the entire lowering process. This results in a very uneven distribution of the adhesive, since the angle between the upper and the lower substrate part are different for the different areas of the adhesive application.
  • EP-A-0 744 739 a method for gluing two CD substrate parts is known, in which the adhesive is applied to a lower substrate part, then the upper substrate part is placed in parallel and finally both are set in rotary motion for spinning off the adhesive. The adhesive is sucked off from the center hole of the two substrate parts in order to support the distribution of the adhesive in the area of the center hole.
  • This EP-A-0 744 739 does not describe in detail how the upper substrate part is placed on the lower substrate part provided with adhesive.
  • the object of the invention is to reduce the cycle time for bonding compact sound disks formed from parts and to improve the distribution of the adhesive between the substrate parts.
  • the invention is based on the basic idea of first depositing the lower substrate part on a rotatable substrate carrier, applying the adhesive on the free side of this substrate part, for example in a ring, and then placing the second substrate part on the first substrate part provided with adhesive with the aid of a pivotable carrying device .
  • the second substrate part is held essentially centrally on the pivotable support device and, after swiveling sufficiently, is released onto the lower substrate part provided with the adhesive.
  • the geometry of the placement of the upper substrate part on the lower substrate part can be changed to optimize the placement in each case.
  • the pivot axis of the support arm lies both in the plane of the upper side of the lower substrate part and in the plane of the surface of the second substrate part facing the first substrate part, that is to say these two planes intersect in the pivot axis of the support arm, this becomes due to the lateral distance Pivot axis relative to the two substrate parts, the upper substrate part is brought into contact with the lower substrate part essentially without touching it until it touches the adhesive ring. After release by the carrier device, the upper substrate part is initially placed on the adhesive ring in a slightly oblique position relative to the lower substrate part on the latter. The two parts of the substrate are then aligned parallel to one another by the acting forces (gravitational and adhesive forces).
  • the upper substrate part can be aligned parallel to the lower substrate part by completely pivoting the support device and then be released.
  • the upper substrate part can pivot on the side of the support arm when pivoting the support arm lower substrate part placed on its edge and then released.
  • the object is achieved in particular in that at least part of the substrate or the compact
  • a record or CD can be swiveled and / or placed against the other part of the CD in a position inclined with respect to the second part of the CD, and the adhesive can be introduced onto one half or between the two parts of the substrate by means of the feed device and then the first part of the CD can be deposited onto the second part by means of the carrying device. Due to the advantageous design of the device for gluing two disc halves of a CD, the cycle time for grouting or gluing can be significantly reduced. With the device according to the invention, the lower half of the CD can first be placed on a substrate plate, so that the upper half of the compact record can then be tilted towards the lower CD by means of the carrying device until both touch.
  • the adhesive can be applied to the lower substrate and the lower part rotated in a simple manner via an additional device, so that the adhesive is distributed in the form of an elongated sausage on the surface of the lower part of the substrate.
  • the upper part of the CD can be swiveled gradually towards the lower part, the inclined position ensuring that no air bubbles are trapped between the two halves, which would lead to a reduction in the quality of the CD or would render it unusable.
  • the carrying device lowers the upper part until it assumes a parallel position with respect to the lower part.
  • the device for gluing the two parts is assigned a vacuum device or that at least part of this device is accommodated in an evacuable housing.
  • the carrying device can now let go of the upper part, so that it lowers itself onto the lower part of the CD due to its own weight. Due to the fact that the upper part rests on the lower part, the adhesive flows in connection with the adhesive forces into the outer edge area of the CD. The flow of the adhesive in the outer edge area is additionally supported by the rotation of the CD.
  • it can be equipped with a vacuum device which sucks the adhesive into the edge area and at the same time also removes gas from the space between the two halves.
  • the vacuum device or its suction device is brought up to the center and / or the outer area of the CD and consists of at least one chamber or recess provided in a receiving part for supporting the CD and one with the same connected suction line is formed, to which a pump or vacuum pump is connected.
  • a chamber or a recess in the receiving part of the CD the space between the two halves of the CD in the interior of the CD can now be sucked off and thus the adhesive can flow easily into this space, so that a even distribution of the adhesive over the entire surface of the two halves of the CD.
  • the measures described achieve a great uniformity of the thickness of the adhesive on the entire surface and thus a layer thickness of the adhesive of approx. 40 ⁇ + / - 10% is guaranteed.
  • the receiving part prefferably be designed as a receiving mandrel which can be inserted into a central bore in the CD and has one or more recesses provided on the outer circumference, which correspond to the space provided in the CD for receiving of the adhesive are connected.
  • a central annular space is formed between the two parts of the CD, which is delimited on its inner circumference by the receiving part or a further annular space and on its outer circumference by the outer annular space, the height of which is smaller is the height of the central annular space and that in the area of the inner circumference and / or in the area of the outer circumference of the two parts of the CD which are connected to one another, a suction device or suction line can be connected directly or indirectly.
  • FIG. 1 shows a schematic representation of the entire device for bonding substrates or compact disks (CD),
  • FIG. 2 shows another representation of the device for gluing two halves of a CD, the upper part already being lowered onto the lower part of the CD,
  • FIG. 3 shows a schematic illustration of the halves of the CD aligned parallel to one another with the adhesive introduced into the intermediate space
  • FIG. 4 shows a partial view of a CD with the two differently sized annular spaces without coupling element or flange
  • FIG. 5 the arbor on which the lower part of the CD is placed, with the associated coupling
  • FIG. 6 shows a sectional illustration of the holding mandrel with the groove-shaped depressions which can be operatively connected to the interspace of the CD in order to be able to suck off gas or the air mixture from the interspace between the CD's.
  • FIG. 1 the entire device for gluing two parts 2 ′, 2 ′′ of a substrate 2 or a compact sound record or CD is denoted by 1 in FIG. 1, to which an adhesive head 49 belongs, which is shown in more detail in FIGS. 1 to 4 is illustrated.
  • the adhesive head 49 is connected to a drive motor 3 via a shaft 54.
  • the adhesive head 49 has a guide device 18 with a substrate carrier 40.
  • a liquid or the adhesive 5 passes through a feed device 6, as can be seen from the device according to FIGS. 1, 3 and 4 described in more detail below, and an associated nozzle 7 onto the substrate 2 or between the two parts 2 '. "2" of the substrate or the CD 2, while the substrate 2 or only the lower part 2 "is set in rotation by the motor 3.
  • the speed of the substrate 2 is approximately 1 sec n.
  • the adhesive 5 flows radially outwards as a result of the centrifugal force on the surface of the lower half 2 ′ 1 of the substrate 2 and reaches the annular channel 57 via the edge of the substrate and the guide device 18. Additional excess adhesive particles are removed from the surface of the substrate 2 hurled.
  • the device 1 consists of the receiving part or mandrel 34, which on its outer circumference has numerous depressions 35 which extend in the longitudinal direction of the receiving mandrel and which are oriented such that they enter an intermediate space 39, 39 *. flow out.
  • the intermediate space 39, 39 ' is illustrated as an annular space in FIG. 4 and is formed by the underside or the upper side of two halves 2', 2 "of the CD 2 placed on top of one another.
  • the height of the annular space 39, 39 ' is somewhat closed Larger space or annular space 45 for receiving the adhesive 5.
  • the annular space 39 extends between the outer edge of the CD 2 and the interior or a slightly smaller annular space 46 in height. For gluing the CD, it is not necessary that the annular space 46 is completely filled with adhesive 5 during the suction process via the suction line 36.
  • the annular space 45 or 46 is only intended to ensure that the annular space 39 extends over the entire surface Before the interior space 39 is completely filled with adhesive, the adhesive can also be degassed during the filling process so that it is free of bubbles.
  • the inner annular space 39 ' is connected via a suction line 36 and 36' to a pump or vacuum pump 37, so that when the two halves 2 ', 2' '(see FIG. 1, position I, II, in) are joined together, the Adhesive can additionally be sucked inward into the annular space 39 ', the air mixture also being sucked off via the suction line 36, 36' at the same time and the adhesive 5, as mentioned, also being degassed. H. Air inclusions in the adhesive 5 or in the annular space 39 can be prevented.
  • the bore 38 in the center 33 of the two halves 2 ', 2 is dimensioned so that the mandrel 34 fits exactly into the bore 38 and thus seals the annular space 39' vacuum-tight, so that no air from the outside into the room 39, 39 "can penetrate. Only the air mixture is sucked out of this space, and at the same time, as already described, the adhesive 5 partly flows into this space 45 (FIG. 4).
  • the rotary movement of the CD 2 brings the adhesive 5 into the outer edge region of the annular space 39, so that the entire inner surface of the CD 2 in the annular space 39, 39 'is evenly covered with the adhesive.
  • the device 1 has a carrying device or a swivel arm 30, which is connected directly or indirectly to a stepper motor 41.
  • a stepper motor 41 can the support arm or the support device 30 pivot from an inclined position according to position I in FIG. 1 into a position II and then into an approximately horizontal position III according to FIG.
  • the carrying device 30 can be arranged to be pivotable vertically and also horizontally. This makes it possible for the carrying device 30 to grasp part or the upper part 2 'of a delivery station (not shown in the drawing) by means of gripper arms 4 which are arranged on the carrying device 30.
  • the grippers are pivotally mounted and grip the inner edge of the bore 38 and in this way hold the part 2 'on the support arm 30.
  • suction elements can also be provided which take up one half 2' of the CD 2 on the surface.
  • the support arm 30 is pivoted downward via the motor 41, as already mentioned.
  • the motor 41 can be designed as a stepper motor, so that a very exact pivoting of the support arm 30 is possible.
  • the two planes of the two substrate parts 2 ′ and 2 ′′ intersect in the pivot axis 41 of the support arm 30.
  • the upper substrate part 2 ′ first touches the adhesive 5 when the lower substrate part 2 ′′ is approached ; in this phase immediately before the upper substrate part is released by the carrying device 30, the upper substrate part 2 'is slightly inclined with respect to the lower substrate part 2 ", as is the case with positions II and III for the two substrate parts 2' and 2" in FIG. 1 is shown. Thereafter, the carrying device releases the upper substrate part 2 ′, which then lies parallel to the lower substrate part 2 ′′ due to the gravitational and adhesive forces acting on it and approaches it while it is moving at the same time the adhesive is distributed in the radial direction.
  • FIG. 1 shows an alternative position of the upper substrate part 2 'when approaching the lower substrate part 2 "in FIG. 1; in this case, when the support arm 30 is pivoted, the outer edge of the upper substrate part 2' comes first to the outer edge of the lower substrate part 2 "to the system (see position II ').
  • the mandrel 34 is drive-connected via a form-locking element or a coupling 53 to a shaft 54 which is drive-connected directly or indirectly to the drive motor 3.
  • the holding mandrel 34 acts against a spring 50 which is accommodated in a cylindrical housing 51.
  • the lower collar 52 of the holding mandrel 34 is pressed against the underside of a flange 8 of the substrate plate or substrate carrier 40 and thus establishes a frictional connection between the holding mandrel 34 and the substrate plate 40, so that the substrate plate and that the substrate 2 deposited substrate 2 can be set in rotation.
  • the substrate plate 40 shown only in FIG. 1 can be detachably connected to the flange 8 by means of screw bolts.
  • the space 39, 39 ' is evacuated via the vacuum pump 37.
  • the pump 37 is arranged outside the entire device.
  • the device 1 with the substrate plate 40, the support device 30 and of course the CD 2 can be accommodated in a chamber or in a vacuum housing 32, indicated schematically and in broken lines, which can be evacuated by means of the pump 37, thereby also ensuring that the adhesive is evenly distributed in the space 30 or 39 'of the CD 2 and air bubbles escape from the adhesive 5.
  • the vacuum housing 32, the suction line 36 and the pump 37 form a vacuum device 31.
  • the space of the depression 35 is evacuated via a suction line 43 and a transverse bore 44 which connects the suction lines 43 and 35.
  • the holding mandrel shown in FIG. 6 has only two depressions 35. However, numerous elongated depressions can be provided on the outer circumference of the holding mandrel 34, each of which is arranged in such a way that when the CD is deposited, the depressions 35 open exactly into the intermediate space 39 'or 46, so that it is ensured that only the gas or Air mixture is sucked out of the room 39 '.
  • the individual depressions or slot-like depressions 35 in the holding mandrel 34 are connected to the suction line 36 and 36 '.
  • the height of the annular space 39 ' is greater than the height of the intermediate space or annular space 45 of the CD. This is to ensure that part of the adhesive 5 flows into the annular space 45 and the gas-air mixture can be easily extracted from the annular space 45 (suction force component Pvl).
  • ACCORDING ß F igur 1 only the lower T art 2 'example' of the CD 2 driven by the motor 3, while t he o b ere P art 2 ', as long as it is held by the gripper arms 4, turning test connected to the support arm 30 is.
  • the lower part 2 ′′ of the CD 2 is placed on the substrate plate 40 according to FIG. 1. Thereafter, the upper part 2 'of the CD is brought into an inclined position II via a support arm or a carrying device 30 and thereby contacts the outer edge area of the part 2''of the CD 2 which has already been placed on the substrate plate 40.
  • Adhesive 5 can now be introduced into the intermediate space 39 or 39 'by means of a feed device 6 and a nozzle 7. Depending on the feeding device, it is also possible that the adhesive 5 is first applied to the lower half 2 ′′ and then the upper half 2 ′ of the CD is pivoted into position II. For this purpose, the adhesive is applied in accordance with FIGS.
  • the lower part 2 * 'of the CD can be moved by means of the substrate plate 40 and the mandrel 34 are driven.
  • the support arm 30 is also lowered further, so that the entire surface of the upper part 2 'now gradually contacts the adhesive arranged in a ring on the lower part 2''(cf. FIG. 3 or position II in FIG. 1).
  • the upper part 2 ' is parallel to the lower part 2' 1 . Due to the adhesive forces, the adhesive 5 now flows into the outer region of the joined parts 2 'and 2''and fills the annular space 39 according to FIG. 4.
  • the annular space 39 is evacuated via the suction line 36, 36 ', so that an additional force component Pv2 is generated, which causes the adhesive 5 to easily penetrate into the annular space 39 while avoiding air pockets.
  • This procedure ensures that a uniform adhesive thickness is achieved on the entire surface in the order of 40 ⁇ +/- 2 ⁇ . Furthermore, this method prevents air bubbles from being trapped in the adhesive 5.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Quality & Reliability (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Optical Record Carriers (AREA)

Abstract

L'invention concerne un dispositif pour coller des substrats en forme de disques ou non, ou des disques compacts (2), constitués de deux parties (2',2') ou deux moitiés, pouvant être posés sur un porte-substrat (40) et entraînés par un système d'entraînement (3) ou animés d'un mouvement de rotation. La substance ou la colle (5) à appliquer, peut être appliquée au moyen d'une unité d'acheminement (6) sur la surface du substrat (2) ou d'une moitié (2') de ce dernier. Au moins une partie (2') du substrat (2) ou le disque compact (2) peut basculer et/ou venir en contact contre l'autre partie (2') du disque compact, dans une position inclinée par rapport à la deuxième partie (2') du disque compact, au moyen d'un système de transport (30). La colle peut être appliquée au moyen de l'unité d'acheminement (6) sur la partie (2') ou entre les deux parties (2',2') du substrat (2), puis la première partie (2') du disque peut être déposée au moyen du système de transport (30) sur la deuxième partie (2').
PCT/EP1997/006934 1996-12-11 1997-12-11 Dispositif pour coller des substrats ou des disques compacts formes de deux parties WO1998026413A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19651423.1 1996-12-11
DE19651423A DE19651423C2 (de) 1996-12-11 1996-12-11 Vorrichtung und Verfahren zum Verkleben von zwei Substratteilen zu einem Substrat, insbesondere zu einem optischen Datenträger (CD)

Publications (1)

Publication Number Publication Date
WO1998026413A1 true WO1998026413A1 (fr) 1998-06-18

Family

ID=7814323

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PCT/EP1997/006934 WO1998026413A1 (fr) 1996-12-11 1997-12-11 Dispositif pour coller des substrats ou des disques compacts formes de deux parties

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DE (1) DE19651423C2 (fr)
WO (1) WO1998026413A1 (fr)

Families Citing this family (6)

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Publication number Priority date Publication date Assignee Title
WO1999024239A1 (fr) * 1997-11-12 1999-05-20 First Light Technology, Inc. Systeme et procede pour repartir une resine appliquee entre un substrat superieur et un substrat inferieur
US6214412B1 (en) 1998-05-19 2001-04-10 First Light Technologies, Inc. System and method for distributing a resin disposed between a top substrate and a bottom substrate
DE10241163B4 (de) * 2002-09-05 2006-05-18 Singulus Technologies Ag Vorrichtung und Verfahren zum Herstellen von optischen Datenträgern insbesondere durch Verkleben von Rohlingen mittels UV-härtbaren Klebern
DE10260773B4 (de) * 2002-12-23 2005-02-03 Singulus Technologies Ag Vorrichtung zur Ausgabe eines Fluids
CN100548638C (zh) 2003-08-22 2009-10-14 辛古勒斯技术股份公司 碟形基片的粘接方法及实现这种方法的设备
DE102021117163A1 (de) * 2021-07-02 2023-01-05 Scheugenpflug Gmbh Ausbring-Vorrichtung mit einem Gas-Sensor sowie Verfahren für ihren Betrieb

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JPH03157835A (ja) * 1989-11-16 1991-07-05 Japan Steel Works Ltd:The 光ディスク部品の接着装置
EP0624870A2 (fr) * 1989-03-27 1994-11-17 Mitsubishi Denki Kabushiki Kaisha Appareil pour la fabrication de disques optiques
EP0744739A1 (fr) * 1995-05-20 1996-11-27 Kitano Engineering Co., Ltd. Méthode de fabrication d'un disque optique et plate-forme pour la mise en oeuvre

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
EP0624870A2 (fr) * 1989-03-27 1994-11-17 Mitsubishi Denki Kabushiki Kaisha Appareil pour la fabrication de disques optiques
JPH03157835A (ja) * 1989-11-16 1991-07-05 Japan Steel Works Ltd:The 光ディスク部品の接着装置
EP0744739A1 (fr) * 1995-05-20 1996-11-27 Kitano Engineering Co., Ltd. Méthode de fabrication d'un disque optique et plate-forme pour la mise en oeuvre

Non-Patent Citations (1)

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Title
PATENT ABSTRACTS OF JAPAN vol. 015, no. 395 (P - 1260) 7 October 1991 (1991-10-07) *

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DE19651423C2 (de) 1999-11-25
DE19651423A1 (de) 1998-06-25

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