WO1998014904A1 - Carte a puce sans contact - Google Patents

Carte a puce sans contact Download PDF

Info

Publication number
WO1998014904A1
WO1998014904A1 PCT/DE1997/002120 DE9702120W WO9814904A1 WO 1998014904 A1 WO1998014904 A1 WO 1998014904A1 DE 9702120 W DE9702120 W DE 9702120W WO 9814904 A1 WO9814904 A1 WO 9814904A1
Authority
WO
WIPO (PCT)
Prior art keywords
coil
lead frame
chip card
pads
contacts
Prior art date
Application number
PCT/DE1997/002120
Other languages
German (de)
English (en)
Inventor
Detlef Houdeau
Manfred Fries
Reinhard Fischbach
Josef Kirschbauer
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO1998014904A1 publication Critical patent/WO1998014904A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card

Definitions

  • the invention is based on the finding that a complex construction within a chip card for the components, such as an induction coil for the transmission of information, carrier foil and leadframe, can be substantially simplified by opening both the carrier foil and the coil pad of the induction coil the corresponding lead frame contacts can be routed through.
  • the lead frame contacts are threaded through the corresponding punched openings to the side of the induction coil and connected on this side to a connection pad of the induction coil.
  • FIG. 1 shows a section 10 from a chip card
  • FIG. 2 shows a sectional view corresponding to FIG. 1
  • FIG. 3 shows a sectional view corresponding to FIG. 1
  • FIG. 4 shows a sectional view corresponding to FIG. 5
  • FIG. 5 shows a section 10 from a chip card with a modified arrangement of the coil pads or lead frame contacts 4.
  • a section 10 of a chip card is outlined in FIG. It is indicated that the chip card has a chip module 2, a coil 3, which serves as a transmitting or receiving antenna, a carrier film 8 with a chip module window 9 and coil pads 7.
  • the closed circle of the induction coil 3 leads in a circular or polygonal shape around the chip module 2.
  • Figures 1 and 5 only a section of the electrically conductive tracks of the coil 3 is shown.
  • the coil pads 7 are each the connection elements for contacting the lead frame 1.
  • the lead frame 1 is connected to the chip module 2 in a corresponding manner.
  • openings 5 are made according to the invention. These openings 5 go through both the coil pads 7 and the carrier film 8. Leadframe contacts 4 can thus be guided from below through the openings and connected to the top of the coil pads 7 by means of a welding point 6.
  • FIG. 2 a sectional representation is given again in accordance with section II-II in accordance with FIG. 1.
  • the chip module window 9 which can be produced simultaneously with the openings 5 by means of a stamping process.
  • the openings 5 in the carrier film 8 for the lead frame contacts 4 are punched in this case after the coil has been etched.
  • etching there is no covering of the previously usual underside exposure (blind hole) of the copper foil, which was produced by partially removing the carrier foil 8 according to the prior art. So-called stripping is also omitted.
  • connection of the leadframe Contacts 4 with the coil pads 7 are made by bending the leadframe contacts 4 accordingly during assembly, pushing them through the bores and pressing and welding them onto the contact pads 4 using a suitable tool.
  • the coil contacts 4 can maintain the position as in the previous solution according to the prior art or they can be arranged symmetrically to the module window 9.
  • the advantages of the two variants are the simple positioning of the lead frames or the module above the openings and the form-fitting connection of the carrier film 8 and lead frame 1 (curved lead frame contacts).
  • the welding only provides the electrical connection secure and the mechanical connection or the positioning takes place through the interaction between the opening 5 and the leadframe contact 4.
  • the connection can preferably be produced by thermocompression welding or by means of ultrasound. It is necessary to change the lead frame 1 so that the contacts can be bent in the sketched form.
  • FIG. 3 shows the basic position of a central carrier film 8 with lead frame contacts 4 threaded through and coil pads 7.
  • FIGS. 4 and 5 show the variant in which the connections between the coil pad 7 and the lead frame contact 4 are arranged symmetrically to the chip module window 9.
  • the coil (3) being electrically connected to the lead frame (1) and the chip module (2) via coil pads (7) with lead frame contacts (4) and the connection between the lead frame contacts (4) and those on the opposite side - Lying side of the carrier film (8) located coil pads

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

L'invention concerne une carte à puce sans contact qui contient, en plus d'un module puce (2), une bobine d'induction (3) pour la transmission de données. Un cadre conducteur (1) sert à la liaison électrique entre les deux composants mentionnés. La mise en contact du cadre conducteur (1) et de la bobine d'induction (3) est, si l'on compare avec les solutions correspondant à état de la technique, sensiblement simplifiée. Dans la zone des plages de contact de bobine (7), sont réalisées des traversées (5) qui traversent les plages de contact de bobine (7) et la feuille de support (8), par lesquelles passent, depuis le côté opposé, les contacts de cadre de support (4) qui sont soudés sur le côté supérieur.
PCT/DE1997/002120 1996-09-30 1997-09-18 Carte a puce sans contact WO1998014904A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19640260.3 1996-09-30
DE19640260A DE19640260A1 (de) 1996-09-30 1996-09-30 Kontaktlose Chipkarte

Publications (1)

Publication Number Publication Date
WO1998014904A1 true WO1998014904A1 (fr) 1998-04-09

Family

ID=7807413

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1997/002120 WO1998014904A1 (fr) 1996-09-30 1997-09-18 Carte a puce sans contact

Country Status (2)

Country Link
DE (1) DE19640260A1 (fr)
WO (1) WO1998014904A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19912201A1 (de) * 1999-01-14 2000-08-17 Pav Card Gmbh Verfahren zur Herstellung einer Ident-Anordnung mit drahtloser Signalübertragung, insbesondere Smart-Label, sowie vorfertigbares streifenförmiges Modul für eine Ident-Anordnung, insbesondere Smart-Label
US6972394B2 (en) 2001-04-25 2005-12-06 Muehlbauer Ag Method for connecting microchips to an antenna arranged on a support strip for producing a transponder

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19733777C2 (de) * 1997-07-28 2003-12-18 Microidentt Ges Fuer Identifik Modul und Verfahren zur Herstellung eines Moduls sowie eine Chipkarte
FR2780848A1 (fr) 1998-07-06 2000-01-07 Solaic Sa Antenne a bornes de connexion ajourees pour carte a circuit integre, et carte a circuit integre comprenant une telle antenne
DE69943315D1 (de) * 1998-12-22 2011-05-12 Nxp Bv Datenträger mit chip und gänzlich umhüllten verbindungsmitteln
EP1327226B1 (fr) 2000-10-11 2009-01-14 Nxp B.V. Module ayant un cadre de montage equipe de composants des deux cotes
DE10117994A1 (de) * 2001-04-10 2002-10-24 Orga Kartensysteme Gmbh Trägerfolie für elektronische Bauelemente zur Einlaminierung in Chipkarten
US7124956B2 (en) * 2001-05-17 2006-10-24 Koninklijke Philips Electronics N.V. Product comprising product sub-parts connected to each other by a crimp connection

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0671705A2 (fr) * 1994-02-14 1995-09-13 Gemplus Card International Procédé de fabrication d'une carte sans contact et carte sans contact
DE4431604A1 (de) * 1994-09-05 1996-03-07 Siemens Ag Schaltungsanordnung mit einem Chipkartenmodul und einer damit verbundenen Spule
EP0708414A2 (fr) * 1994-10-22 1996-04-24 MICHALK, Manfred Porteur d'informations sans contact et méthode pour sa fabrication

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07262337A (ja) * 1994-03-23 1995-10-13 Melco:Kk 半導体パッケージの取付構造およびｉｃカード

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0671705A2 (fr) * 1994-02-14 1995-09-13 Gemplus Card International Procédé de fabrication d'une carte sans contact et carte sans contact
DE4431604A1 (de) * 1994-09-05 1996-03-07 Siemens Ag Schaltungsanordnung mit einem Chipkartenmodul und einer damit verbundenen Spule
EP0708414A2 (fr) * 1994-10-22 1996-04-24 MICHALK, Manfred Porteur d'informations sans contact et méthode pour sa fabrication

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19912201A1 (de) * 1999-01-14 2000-08-17 Pav Card Gmbh Verfahren zur Herstellung einer Ident-Anordnung mit drahtloser Signalübertragung, insbesondere Smart-Label, sowie vorfertigbares streifenförmiges Modul für eine Ident-Anordnung, insbesondere Smart-Label
DE19912201C2 (de) * 1999-01-14 2000-12-14 Pav Card Gmbh Verfahren zur Herstellung einer flexiblen Ident-Anordung mit drahtloser Signalübertragung, insbesondere Smart-Label, sowie vorfertigbares streifenförmiges Modul für eine flexible Ident-Anordung, insbesondere Smart-Label
US6972394B2 (en) 2001-04-25 2005-12-06 Muehlbauer Ag Method for connecting microchips to an antenna arranged on a support strip for producing a transponder
USRE41361E1 (en) 2001-04-25 2010-06-01 Muhlbauer Ag Method for connecting microchips to an antenna arranged on a support strip for producing a transponder

Also Published As

Publication number Publication date
DE19640260A1 (de) 1998-04-02

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