WO1998014904A1 - Contactless chip card - Google Patents

Contactless chip card Download PDF

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Publication number
WO1998014904A1
WO1998014904A1 PCT/DE1997/002120 DE9702120W WO9814904A1 WO 1998014904 A1 WO1998014904 A1 WO 1998014904A1 DE 9702120 W DE9702120 W DE 9702120W WO 9814904 A1 WO9814904 A1 WO 9814904A1
Authority
WO
WIPO (PCT)
Prior art keywords
coil
lead frame
chip card
pads
contacts
Prior art date
Application number
PCT/DE1997/002120
Other languages
German (de)
French (fr)
Inventor
Detlef Houdeau
Manfred Fries
Reinhard Fischbach
Josef Kirschbauer
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO1998014904A1 publication Critical patent/WO1998014904A1/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card

Definitions

  • the invention is based on the finding that a complex construction within a chip card for the components, such as an induction coil for the transmission of information, carrier foil and leadframe, can be substantially simplified by opening both the carrier foil and the coil pad of the induction coil the corresponding lead frame contacts can be routed through.
  • the lead frame contacts are threaded through the corresponding punched openings to the side of the induction coil and connected on this side to a connection pad of the induction coil.
  • FIG. 1 shows a section 10 from a chip card
  • FIG. 2 shows a sectional view corresponding to FIG. 1
  • FIG. 3 shows a sectional view corresponding to FIG. 1
  • FIG. 4 shows a sectional view corresponding to FIG. 5
  • FIG. 5 shows a section 10 from a chip card with a modified arrangement of the coil pads or lead frame contacts 4.
  • a section 10 of a chip card is outlined in FIG. It is indicated that the chip card has a chip module 2, a coil 3, which serves as a transmitting or receiving antenna, a carrier film 8 with a chip module window 9 and coil pads 7.
  • the closed circle of the induction coil 3 leads in a circular or polygonal shape around the chip module 2.
  • Figures 1 and 5 only a section of the electrically conductive tracks of the coil 3 is shown.
  • the coil pads 7 are each the connection elements for contacting the lead frame 1.
  • the lead frame 1 is connected to the chip module 2 in a corresponding manner.
  • openings 5 are made according to the invention. These openings 5 go through both the coil pads 7 and the carrier film 8. Leadframe contacts 4 can thus be guided from below through the openings and connected to the top of the coil pads 7 by means of a welding point 6.
  • FIG. 2 a sectional representation is given again in accordance with section II-II in accordance with FIG. 1.
  • the chip module window 9 which can be produced simultaneously with the openings 5 by means of a stamping process.
  • the openings 5 in the carrier film 8 for the lead frame contacts 4 are punched in this case after the coil has been etched.
  • etching there is no covering of the previously usual underside exposure (blind hole) of the copper foil, which was produced by partially removing the carrier foil 8 according to the prior art. So-called stripping is also omitted.
  • connection of the leadframe Contacts 4 with the coil pads 7 are made by bending the leadframe contacts 4 accordingly during assembly, pushing them through the bores and pressing and welding them onto the contact pads 4 using a suitable tool.
  • the coil contacts 4 can maintain the position as in the previous solution according to the prior art or they can be arranged symmetrically to the module window 9.
  • the advantages of the two variants are the simple positioning of the lead frames or the module above the openings and the form-fitting connection of the carrier film 8 and lead frame 1 (curved lead frame contacts).
  • the welding only provides the electrical connection secure and the mechanical connection or the positioning takes place through the interaction between the opening 5 and the leadframe contact 4.
  • the connection can preferably be produced by thermocompression welding or by means of ultrasound. It is necessary to change the lead frame 1 so that the contacts can be bent in the sketched form.
  • FIG. 3 shows the basic position of a central carrier film 8 with lead frame contacts 4 threaded through and coil pads 7.
  • FIGS. 4 and 5 show the variant in which the connections between the coil pad 7 and the lead frame contact 4 are arranged symmetrically to the chip module window 9.
  • the coil (3) being electrically connected to the lead frame (1) and the chip module (2) via coil pads (7) with lead frame contacts (4) and the connection between the lead frame contacts (4) and those on the opposite side - Lying side of the carrier film (8) located coil pads

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

This invention concerns a contactless chip card containing besides a chip module (2) an induction coil (3) for data transmission. A lead frame (1) serves as the electrical connection for these two components. In contrast to solutions in prior art, the contact between the lead frame (1) and induction coil (3) is much simpler. In the area of the coil pads (7), apertures (5) are made through the coil pads (7) and substrate film (8) through which the lead frame contacts (4) pass and are soldered on the upper surface.

Description

onsspule einer Chipkarte bereitzustellen, mit der die gegenseitige Positionierung und Verbindung vereinfacht und verbessert wird.To provide onsspule a chip card, with the mutual positioning and connection is simplified and improved.
Die Lösung dieser Aufgabe geschieht durch die Merkmale des Anspruchs 1.This object is achieved by the features of claim 1.
Der Erfindung liegt die Erkenntnis zugrunde, daß eine aufwendige Konstruktion innerhalb einer Chipkarte für die Bestand- teile, wie Induktionsspule zur Übertragung von Informationen, Trägerfolie und Leadframe wesentlich vereinfacht werden kann, indem beide, die Trägerfolie und das Spulenpad der Induktionsspule eine Öffnung erhalten, an der entsprechende Leadfra- mekontakte hindurchführbar sind. Dabei sind die Leadframekon- takte durch die entsprechenden gestanzten Durchbbrüche zur Seite der Induktionsspule hindurchgefädelt und auf dieser Seite mit einem Anschlußpad der Induktionsspule verbunden.The invention is based on the finding that a complex construction within a chip card for the components, such as an induction coil for the transmission of information, carrier foil and leadframe, can be substantially simplified by opening both the carrier foil and the coil pad of the induction coil the corresponding lead frame contacts can be routed through. The lead frame contacts are threaded through the corresponding punched openings to the side of the induction coil and connected on this side to a connection pad of the induction coil.
Besondere Vorteile dieser Konstruktion resultieren daraus, daß die Löt- oder Schweißverbindungen zwischen Leadframekontakt und Anschlußpad der Induktionsspule lediglich die elektrische Verbindung sicherzustellen hat. Die Aufgabe der Positionierung wird durch das Zusammenwirken der ausgestanzten Durchbrüche mit den Leadframekontakten dargestellt.Particular advantages of this construction result from the fact that the soldered or welded connections between the leadframe contact and the connection pad of the induction coil only have to ensure the electrical connection. The task of positioning is represented by the interaction of the punched-out openings with the lead frame contacts.
Vorteilhafte Ausgestaltungen sind den Unteransprüchen zu entnehmen .Advantageous configurations can be found in the subclaims.
Im folgenden wird anhand von schematischen Figuren ein Aus- führungsbeispiel beschrieben.An exemplary embodiment is described below with the aid of schematic figures.
Figur 1 zeigt einen Ausschnitt 10 aus einer Chipkarte, Figur 2 zeigt eine Schnittdarstellung entsprechend Figur 1, Figur 3 zeigt eine Schnittdarstellung entsprechend Figur 1, Figur 4 zeigt eine Schnittdarstellung entsprechend der Figur 5, Figur 5 zeigt einen Ausschnitt 10 aus einer Chipkarte mit einer modifizierten Anordnung der Spulenpads bzw. Leadframekon- takte 4.1 shows a section 10 from a chip card, FIG. 2 shows a sectional view corresponding to FIG. 1, FIG. 3 shows a sectional view corresponding to FIG. 1, FIG. 4 shows a sectional view corresponding to FIG. 5, FIG. 5 shows a section 10 from a chip card with a modified arrangement of the coil pads or lead frame contacts 4.
In der Figur 1 ist ein Ausschnitt 10 aus einer Chipkarte umrissen. Dabei ist angedeutet, daß die Chipkarte ein Chipmodul 2, eine Spule 3, die als Sende- oder Empfangsantenne dient, eine Trägerfolie 8 mit einem Chipmodulfenster 9 und Spulenpads 7 aufweist. Der geschlossene Kreis der Induktionsspule 3 führt kreis- oder mehreckförmig um das Chipmodul 2 herum. In den Figuren 1 und 5 ist lediglich ein Ausschnitt aus den elektrisch leitenden Bahnen der Spule 3 dargestellt. Die Spulenpads 7 sind jeweils die Anschlußelemente für die Kontak- tierung mit dem Leadframe 1. Das Leadframe 1 ist in entspre- chender Weise mit dem Chipmodul 2 verbunden. In den Bereichen, in dem eine elektrisch leitende und mechanisch tragende Verbindung zwischen dem Leadframe 1 bzw. Leadframekontakten 4 und der Induktionsspule 3 bzw. Spulenpads 7 vorliegen soll, werden erfindungsgemäß Durchbrüche 5 eingebracht. Diese Durchbrüche 5 gehen sowohl durch die Spulenpads 7 als auch durch die Trägerfolie 8 hindurch. Somit können Leadframekon- takte 4 von unten durch die Durchbrüche hindurchgeführt werden und an der Oberseite der Spulenpads 7 mittels eines Schweißpunktes 6 mit diesen verbunden werden.A section 10 of a chip card is outlined in FIG. It is indicated that the chip card has a chip module 2, a coil 3, which serves as a transmitting or receiving antenna, a carrier film 8 with a chip module window 9 and coil pads 7. The closed circle of the induction coil 3 leads in a circular or polygonal shape around the chip module 2. In Figures 1 and 5, only a section of the electrically conductive tracks of the coil 3 is shown. The coil pads 7 are each the connection elements for contacting the lead frame 1. The lead frame 1 is connected to the chip module 2 in a corresponding manner. In the areas in which there is to be an electrically conductive and mechanically load-bearing connection between the leadframe 1 or leadframe contacts 4 and the induction coil 3 or coil pads 7, openings 5 are made according to the invention. These openings 5 go through both the coil pads 7 and the carrier film 8. Leadframe contacts 4 can thus be guided from below through the openings and connected to the top of the coil pads 7 by means of a welding point 6.
In der Figur 2 wird entsprechend dem Schnitt II-II entsprechend Figur 1 eine Schnittdarstellung wieder gegeben. In dieser Darstellung ist im wesentlichen auf das Chipmodulfensters 9 zu achten, welches gleichzeitig mit den Durchbrüchen 5 mit- tels eines Stanzverfahrens herstellbar ist. Die Durchbrüche 5 in der Trägerfolie 8 für die Leadframekontakte 4 werden in diesem Fall nach dem Ätzen der Spule gestanzt. Hierdurch entfällt bei der Herstellung der Spule (Ätzung) die Abdeckung der bisher üblichen unterseitigen Freilegung (Sackbohrung) der Kupferfolie, die durch partielles Entfernen der Trägerfolie 8 nach dem Stand der Technik angefertigt wurden. Weiterhin entfällt das sog. Strippen. Die Verbindung der Leadframe- kontakte 4 mit den Spulenpads 7 erfolgt dadurch, daß die Leadframekontakte 4 bei der Montage entsprechend gebogen werden, durch die Bohrungen hindurchgesteckt werden und durch geeignetes Werkezeug auf die Kontaktpads 4 gedrückt und ver- schweißt werden. Die Spulenkontakte 4 können die Position wie bei der bisherigen Lösung nach dem Stand äßr Technik beibehalten oder sie können symmetrisch zum Modulfenster 9 angeordnet sein. Die Vorteile der beiden Varianten sind neben der Kosteneinsparung die einfache Positionierung der Leadframes bzw. des Moduls über den Durchbrüchen und die formschlüssige Verbindung von Trägerfolie 8 und Leadframe 1 (gebogene Lead- framekontakte) .Die Schweißung stellt im Gegensatz zur bisherigen Lösung nur die elektrische Verbindung sicher und die mechanische Verbindung bzw. die Positionierung geschieht durch das Zusammenwirken zwischen Durchbruch 5 und Leadframe- kontakt 4. Die Verbindung kann vorzugsweise durch eine Ther- mokompressionsschweißung oder mittels Ultraschall erzeugt sein. Notwendig ist eine Änderung des Leadframes 1, damit die Kontakte in der skizzierten Form gebogen werden können.In FIG. 2, a sectional representation is given again in accordance with section II-II in accordance with FIG. 1. In this illustration, attention should essentially be paid to the chip module window 9, which can be produced simultaneously with the openings 5 by means of a stamping process. The openings 5 in the carrier film 8 for the lead frame contacts 4 are punched in this case after the coil has been etched. As a result, during the manufacture of the coil (etching) there is no covering of the previously usual underside exposure (blind hole) of the copper foil, which was produced by partially removing the carrier foil 8 according to the prior art. So-called stripping is also omitted. The connection of the leadframe Contacts 4 with the coil pads 7 are made by bending the leadframe contacts 4 accordingly during assembly, pushing them through the bores and pressing and welding them onto the contact pads 4 using a suitable tool. The coil contacts 4 can maintain the position as in the previous solution according to the prior art or they can be arranged symmetrically to the module window 9. In addition to the cost savings, the advantages of the two variants are the simple positioning of the lead frames or the module above the openings and the form-fitting connection of the carrier film 8 and lead frame 1 (curved lead frame contacts). In contrast to the previous solution, the welding only provides the electrical connection secure and the mechanical connection or the positioning takes place through the interaction between the opening 5 and the leadframe contact 4. The connection can preferably be produced by thermocompression welding or by means of ultrasound. It is necessary to change the lead frame 1 so that the contacts can be bent in the sketched form.
Figur 3 zeigt die prinzipielle Lage einer mittig liegenden Trägerfolie 8 mit hindurchgefädelten Leadframekontakten 4 und Spulenpads 7.FIG. 3 shows the basic position of a central carrier film 8 with lead frame contacts 4 threaded through and coil pads 7.
Die Figuren 4 und 5 zeigen die Variante, bei der die Verbindungen zwischen Spulenpad 7 und Leadframekontakt 4 symmetrisch zum Chipmodulfenster 9 angeordnet sind. FIGS. 4 and 5 show the variant in which the connections between the coil pad 7 and the lead frame contact 4 are arranged symmetrically to the chip module window 9.
Patentansprücheclaims
1. Kontaktlose Chipkarte mit einem Leadframe (1), einem darauf befestigten und kontaktierten Chipmodul (2), einer Trä- gerfolie (8) und einer darauf ausgebildeten Induktionsspule1. Contactless chip card with a lead frame (1), a chip module (2) fastened and contacted thereon, a carrier film (8) and an induction coil formed thereon
(3) zur Datenübertragung, wobei die Spule (3) über Spulenpads (7) mit Leadframekontakten (4) mit dem Leadframe (1) und dem Chipmodul (2) elektrisch verbunden ist und die Verbindung zwischen Leadframekontakten (4) und den auf der geggenüber- liegenden Seite der Trägerfolie (8) befindlichen Spulenpads(3) for data transmission, the coil (3) being electrically connected to the lead frame (1) and the chip module (2) via coil pads (7) with lead frame contacts (4) and the connection between the lead frame contacts (4) and those on the opposite side - Lying side of the carrier film (8) located coil pads
(7) jeweils mittels eines Durchbruches (5) in der Trägerfolie(7) in each case by means of an opening (5) in the carrier film
(8) und den Spulenpads (7) mit zur Spulenpadseite hindurchgesteckten Leadframekontakten (4) und mit einer diese verbindenden Schweißung oder Lötung ausgeführt ist.(8) and the coil pads (7) with lead frame contacts (4) pushed through to the coil pad side and with a welding or soldering connecting them.
2. Kontaktlose Chipkarte nach Anspruch 1, worin die Kontakt- pads (7) relativ zu einem Chipmodulfenster (9) in der Trägerfolie (8) jeweils gegenüberliegend angeordnet sind.2. Contactless chip card according to claim 1, wherein the contact pads (7) are arranged relative to a chip module window (9) in the carrier film (8) opposite each other.
3. Kontaktlose Chipkarte nach einem der vorhergehenden Ansprüche worin die Induktionsnspule (3) aus einem strukturierten Kupferlaminat besteht.3. Contactless chip card according to one of the preceding claims, wherein the induction coil (3) consists of a structured copper laminate.
4. Kontaktlose Chipkarte nach einem der vorhergehenden An- sprüche worin eine paßgenaue Ausführung der Leadframekontakte4. Contactless chip card according to one of the preceding claims, in which a precisely fitting design of the lead frame contacts
(4) und der Durchbrüche (5) eine relative Positionierung und gegenseitige mechanische Halterung zwischen der Trägerfolie (8) mit der Indukitonsspule (3) einerseits und dem Leadframe (1) mit dem Chipmodul (2) andererseits ermöglicht. (4) and the openings (5) enable relative positioning and mutual mechanical mounting between the carrier film (8) with the induction coil (3) on the one hand and the lead frame (1) with the chip module (2) on the other.

Claims

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Figure imgf000007_0003
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PCT/DE1997/002120 1996-09-30 1997-09-18 Contactless chip card WO1998014904A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19640260.3 1996-09-30
DE19640260A DE19640260A1 (en) 1996-09-30 1996-09-30 Contactless chip card

Publications (1)

Publication Number Publication Date
WO1998014904A1 true WO1998014904A1 (en) 1998-04-09

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Application Number Title Priority Date Filing Date
PCT/DE1997/002120 WO1998014904A1 (en) 1996-09-30 1997-09-18 Contactless chip card

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DE (1) DE19640260A1 (en)
WO (1) WO1998014904A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19912201A1 (en) * 1999-01-14 2000-08-17 Pav Card Gmbh Method for producing a smart label identity device with wireless signal transmission, attaching windings running in a square by vacuum coating process to a foil or flexible insulating material.
US6972394B2 (en) 2001-04-25 2005-12-06 Muehlbauer Ag Method for connecting microchips to an antenna arranged on a support strip for producing a transponder

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19733777C2 (en) * 1997-07-28 2003-12-18 Microidentt Ges Fuer Identifik Module and method for producing a module and a chip card
FR2780848A1 (en) 1998-07-06 2000-01-07 Solaic Sa ANTENNA WITH SLOTTED CONNECTION TERMINALS FOR INTEGRATED CIRCUIT BOARD, AND INTEGRATED CIRCUIT BOARD INCLUDING SUCH ANTENNA
KR100707528B1 (en) 1998-12-22 2007-04-12 코닌클리즈케 필립스 일렉트로닉스 엔.브이. Data carrier with chip and fully enclosed connection means
EP1327226B1 (en) 2000-10-11 2009-01-14 Nxp B.V. Module having a lead frame equipped with components on both sides
DE10117994A1 (en) * 2001-04-10 2002-10-24 Orga Kartensysteme Gmbh Carrier foil for electronic components to be laminated into smart cards, includes inter-joined part surfaces of connection zones made of conductive material
EP1393249A1 (en) * 2001-05-17 2004-03-03 Koninklijke Philips Electronics N.V. Product comprising product sub-parts connected to each other by a crimp connection

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0671705A2 (en) * 1994-02-14 1995-09-13 Gemplus Card International Manufacturing process for a contactless card and contactless card
DE4431604A1 (en) * 1994-09-05 1996-03-07 Siemens Ag Circuit arrangement with a chip card module and an associated coil
EP0708414A2 (en) * 1994-10-22 1996-04-24 MICHALK, Manfred Contactless data carrier and method for fabricating

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07262337A (en) * 1994-03-23 1995-10-13 Melco:Kk Fitting structure for semiconductor package and ic card

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0671705A2 (en) * 1994-02-14 1995-09-13 Gemplus Card International Manufacturing process for a contactless card and contactless card
DE4431604A1 (en) * 1994-09-05 1996-03-07 Siemens Ag Circuit arrangement with a chip card module and an associated coil
EP0708414A2 (en) * 1994-10-22 1996-04-24 MICHALK, Manfred Contactless data carrier and method for fabricating

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19912201A1 (en) * 1999-01-14 2000-08-17 Pav Card Gmbh Method for producing a smart label identity device with wireless signal transmission, attaching windings running in a square by vacuum coating process to a foil or flexible insulating material.
DE19912201C2 (en) * 1999-01-14 2000-12-14 Pav Card Gmbh Method for producing a flexible identification arrangement with wireless signal transmission, in particular a smart label, and a prefabricated strip-shaped module for a flexible identification arrangement, in particular a smart label
US6972394B2 (en) 2001-04-25 2005-12-06 Muehlbauer Ag Method for connecting microchips to an antenna arranged on a support strip for producing a transponder
USRE41361E1 (en) 2001-04-25 2010-06-01 Muhlbauer Ag Method for connecting microchips to an antenna arranged on a support strip for producing a transponder

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