DE19733777C2 - Module and method for producing a module and a chip card - Google Patents

Description

The invention relates to module according to the preamble of the patent claims 1. The invention further relates to a method for Production of a module according to the preamble of the patent Proverb 6. The invention further relates to a chip card the preamble of claim 9.

DE 195 00 925 A1 describes a chip card for contactless Data transmission known, on the one hand a chip module with egg integrated circuit and secondly a transmission module with at least one transmission element for data and / or energy transfer between the integrated circuit circuit and an external device. To form the chip in a first step, the transmission module in integrated the card body. In a second step then the chip module in a recess of the Card body inserted and connected to the same. To the e electrical coupling of the chip module to the transmission module become the corresponding contact elements of the chip module on the one hand and the transmission module on the other hand placed. The electrical contact between the corresponding contact elements by means of soldering, by Introducing a conductive adhesive or an elastically deformable  Body made between the contact elements become. These known types of contact are relative to manoeuvrable and subject to severe bending stress Chip card has a limited lifespan.

Furthermore, it is known to produce a contactless Chip card a chip module and a transmission module for one month dul to connect and keep ready as a semi-finished product, the corresponding contact elements from the chip module on the one hand and the transmission module on the other hand by soldering or Introducing a conductive adhesive electrically together are connected. Here are the chip and the transmission module mounted on a common support that is between min at least two layers of the card body is embedded, so that after the layers have been laminated, the chip card is produced is.

A disadvantage of the known connection type of soldering is that due to the high temperature load that from one thermoplastic existing transmission module very is heavily stressed, so that a deformation of the same can kick. Furthermore, the soldering process is relatively complex, as additional soldering agent is applied to the transmission module must be brought.

A disadvantage of the electrically conductive adhesive is that its aging properties decrease as it ages. Further is the thickness of the electrically conductive adhesive in terms of process technology difficult to set to a constant value. The Setting a constant distance between the correspon Denden contact elements is required so that the  Transverse extension of the module in this contact area with the Depth of the intended recess of the card body ü will coincide.

From DE 44 40 721 A1 is a module consisting of two with known to be interconnected flat carrier layers, in which the two carrier layers are facing each other on the one hand, pointed mandrels and correspondence rend on the other hand have recordings. Ver Binding of the two carrier layers will correspond to the mandrels positioned to the recordings, according to Verbie against the same are held clamped in the recordings. A disadvantage of the known module is that a positional the support layers must be in accurate contact with one another.

From EP 0 682 321 A2 is a module consisting of one Chip module with contact elements and a transmission module with Contact elements known, the contact elements material conclusively by means of an electrically conductive adhesive or are connected by soldering.

From DE 44 43 980 C2 is a module with a chip module and known a transmission module, the respective contact elements together using an electrically conductive adhesive who are connected.

DE 196 40 260 A1 describes a module or a chip card knows, in which the transmission module and the chip module thereby can be contacted with each other by a contact element a breakthrough of the other module can be pushed through  subsequently by welding or soldering with the correspondie renden contact element to be connected.

The object of the invention is therefore a module and a method to specify the manufacture of a module, so that a reliable and safe electrical contact between egg nem chip module and another component is guaranteed.

It is also an object of the invention to provide a chip card of this type train that simple and inexpensive manufacture is made possible.

To achieve this object, the invention has the features of Claim 1, claim 6 and patent say 9.

The particular advantage of the chip module according to the invention is in that the contact elements by jamming with corresponding contact elements of another component can be connected. There are no other connection with tel necessary. This will ensure a safe and permanent con clocking created, which is also so elastic can be formed that later external forces acting on them can be included. The jamming is advantageous mation of the contact elements of the chip module with the correspondie renden contact elements of the transmission module a simple and reliable electrical contacting is created. to The contacting also serves as a mechanical connection of the chip module with the transmission module. They are advantageous Contact elements are not exposed to temperature stress. The Connection is made solely by using one  Contact pressure. A module can be easily manufactured as a semi-finished product be produced, which is always a constant training having. This is achieved in particular by the fact that the contact elements themselves the jamming is generated. It are no other additional materials or components required to bring about the electrical contacting. The quality and the formation of the contact will be alone determined by the materials of the contact elements themselves. The contact elements of the chip module are advantageous in each case formed as a crown-shaped cutting contacts, pointed to running serrations of the cutting contact through a carrier layer of the transmission module can be pushed through. By redirection and Press it in the direction of the contact element of the over support module is a flat press fit of the teeth on the Contact elements of the transmission module created.

According to a development of the invention, the contact elements Te of the chip module part of a metallic chip carrier layer. The chip carrier layer can preferably be a sheet metal part be formed, the shape of the contact element can be easily produced using cutting or bending tools can.

According to a development of the invention, the chip module is on one facing away from the contact elements of the transmission module Side connected to the same so that applying a intermediate insulation layer is not required.

The advantage of the chip card according to the invention is that that a defined grandeur of the module is guaranteed, so that the recess of the card body can be adjusted accordingly  is. The fact that the chip carrier layer from the back is pressed against the transfer carrier layer, the Chip in a corresponding recess of the transmission mo engages a module with comparatively ge ringer transverse extension created in the chip area.

Exemplary embodiments of the invention are described below of the drawings explained in more detail.

Show it:

Fig. 1 shows a partial longitudinal section through a module,

Fig. 2 is a plan view of a transmission module,

Fig. 3 is a perspective view of a chip module according to a first embodiment,

Fig. 4 shows a cross section through a contact element according to Fig. 3,

Fig. 5 is a perspective view of a chip module with contact elements according to a second example and Ausfüh

Fig. 6 shows a longitudinal section through a chip card with a module according to the invention.

Fig. 1 shows a module 1, which is composed of a transmission module 2 and a chip module 3. The connection between the transmission module 2 and the chip module 3 takes place in a contacting area thereof.

As can be seen from FIG. 2, the transmission module 2 consists of a transmission carrier layer 4 , on which a transmission element 5 is applied as a structured, in particular etching, printing or laser-structured, coil printed or applied as a wire-wound coil. The transmission element 5 is designed as an antenna and is used for data and / or energy transmission between a chip 6 shown in FIG. 3 and an external device. The transmission element 5, which has a plurality of turns, has flat contact elements 7 at its ends. Alternatively, the contact elements 7 can also be round or raised. To accommodate the chip 6 , the transmission module 2 has a cutout 8 , which is located adjacent to the contacting area formed by the contact elements 7 . The transfer carrier layer 4 consists of a flexible plastic material made of PVC, PC or ABS with a thickness of at least 150 microns, preferably 200 to 300 microns.

As can be seen from FIG. 3, a chip module 3 consists of a thin cuboid-shaped chip carrier layer 10 , which is preferably formed from a metallic material. On the chip carrier layer 10 , the integrated circuit 6 is brought up, the electrical connections are formed by contact elements 11 . The contact elements 11 are designed as crown-shaped cutting contacts 12 with prongs 13 projecting at right angles and running to a point. The contact elements 11 are formed by appropriate cutting and bending tools. The contact elements 11 are separated and insulated from one another by punched-out portions 9 . The chip module 3 can be kept as an intermediate product on a roll.

To establish an electrical and mechanical connection between the chip module 3 and the transmission module 2 , the transmission carrier layer 4 and the chip carrier layer 10 are placed against one another in such a way that the integrated circuit 6 is aligned with the recess 8 and the prongs 13 of the cutting contacts 12 correspond to the contact elements 7 rest on the back of the transfer carrier layer 4 . By From a power exercise in the direction of Kontakelemente 7, the serrations 13 of the contact elements 11 in layers by the transfer carrier 4 and pressed through the corresponding contact elements 7, so that the transfer carrier layer 4 and the chip carrier layer 10 lie against each other surface. Ge by suitable bending tools the teeth are bent 13 and pressed onto the surface of the corresponding contact element. 7 The prongs 13 lie flat on the contact elements 7 , forming a press fit. The press fit is increased in that the thickness of the prongs 13 is substantially greater than the thickness of the contact elements 7 , preferably twice as large as the transverse extent of the contact elements 7 . A permanent clamping connection is created between the contact elements 7 and 11 , a raised area of the module 1 being defined by the thickness of the contact elements 7 and 11 .

Alternatively, the chip carrier layer 10 can have only incisions, in particular cruciform incisions. Which is then brought in correspondence to the contact element 7 in system only at the production of the connection between the chip module 3 and the transmission module 2, the contact element 11 is formed by Auftulpen or pivoting of the teeth formed by the notches 13 from a joint with the chip carrier layer 10 level , In this embodiment, the formation of the cutting contacts 12 takes place only immediately when the chip module 3 is connected to the transmission module 2 . The chip module 3 can thus be kept essentially without protruding contact elements 11 , so that the manufac turing effort is reduced.

According to a further embodiment of the chip module 3 according to FIG. 5, the contact elements are designed as contact lugs 15 . The contact lugs 15 are each arranged corresponding to egg ner corresponding contact surface of the transmission module on egg nem edge 17 of a chip carrier layer 16 . As can be seen from Fig. 5, the contact lugs 15 are triangular. Alternatively, they can also be arched. It is important that the area of the contact elements 15 is so large that a sufficiently large contact area is formed after the same has been bent over and lies flat on the corresponding contact element of the transmission module. A slot 18 separates the contact elements 15 from one another, so that there is no electrical connection between them. By pivoting the contact lugs 15 around an edge of the transmission module, not shown, a clamping electrical and at the same time mechanical connection between the chip carrier layer 16 and the transmission module can be created.

Alternatively, the contact elements of the chip module can also be used by providing marginal incisions in a qua deriform chip carrier layer are formed, so that less  Material expenditure is required. Furthermore, the Kon clock elements by lowering within the chip carrier layer quite protruding contact tabs are formed by ei a corresponding slit of the transmission module layer are pluggable and clamped on contact elements of the transfer supply module.

Alternatively, the formation of at least one contact element are formed by the course of the insulating slot, so that the manufacturing outlay is further reduced can be. The contact elements can thus at any be arranged in place of the chip carrier layer, preferably but in an edge area. They are part of the chip carrier layer formed so that the chip carrier layer a dop function. On the one hand, it serves as a carrier layer for the chip and on the other hand for the formation of contact elements The chip carrier layer is made of an electrically conductive Material formed, preferably from sheet metal.

The modules described above each serve as a semi-finished product for the production of a chip card 19 , as shown in Fig. 6 is Darge. The chip card 19 can be made in the laminating technology ago, with an inner core layer 20 adjoining the transmission carrier layer 4 and the chip carrier layer 10 in each case adjacent. The core layers 20 each have recesses 21 corresponding to the elevations of the transfer carrier layer 4 and the chip carrier layer 10 . On the outside, the core layers 20 each have a cover layer 22 , the outer surfaces of which are preferably provided with an imprint. The core layers 20 and the cover layers 22 can be made of an ABS, PC or PVC material.

Claims (11)

1. Module, in particular for use in chip cards, consisting of a chip module with an integrated circuit and a transmission module with at least one transmission element for data and / or energy transmission between the integrated circuit and an external device or vice versa, the chip module and Transmission module each have contact elements for electrical connection to one another, characterized in that at least one contact element ( 11 ) of the chip module ( 3 ) is in each case in the form of a crown-shaped cutting contact ( 12 ) with projecting prongs ( 13 ), so that it layered through an adjacent carrier ( 4 ) can be pushed through and can then be clamped and electrically conductively connected to the same corresponding contact element ( 7 ). 2. Module according to claim 1, characterized in that the chip module ( 3 ) has a consisting of a metallic material existing chip carrier layer ( 10 ), the contact elements ( 11 ) of the chip module ( 3 ) each being integrally connected to the chip carrier layer ( 10 ) are. 3. Module according to claim 1 or 2, characterized in that the chip carrier layer ( 10 ) consists of a sheet metal material, wherein the contact elements ( 11 ) are separated from one another by punching. 4. module is characterized according to one of claims 1 to 3, terized in that the chip module (3) at a the contact elements (7) of the transmission module (2) side opposite to the transmission module (2) is clampingly connectable. 5. Module according to one of claims 1 to 4, characterized in that the contact elements ( 11 ) on the edge of the chip module ( 3 ) are arranged as projecting contact tabs. 6. A method for producing a module, wherein an integrated circuit and a chip carrier layer having a chip module with at least one transmission element and a transmission carrier layer having a transmission module that serves for data and / or energy transmission between the integrated circuit and an external device , electrically connected, characterized in that in a contacting area of the chip module ( 3 ) at least one contact element ( 11 ) formed with a protruding prongs ( 13 ) as a crown-shaped cutting contact ( 12 ) is pushed through a carrier layer ( 4 ) and then under flat system on the same is bent. 7. The method according to claim 6, characterized in that the integrated circuit ( 6 ) with a metallic chip carrier layer ( 10 ) is connected to form the chip module ( 3 ) and that in the chip carrier layer ( 10 ) projecting contact elements ( 11 ) are embossed , 8. The method according to claim 6 or 7, characterized in that the electrically conductive transmission element ( 5 ) is structured as a coil on a transmission carrier layer ( 4 ). 9. Chip card for contactless data transmission with a chip module having an integrated circuit, with a transmission module having at least one transmission element for data and / or energy transmission between the integrated circuit and an external device, where the chip module and the transmission module each have contact elements for Electrical connection with each other, characterized in that the chip module ( 3 ) and the transmission module ( 2 ) is designed as a module ( 1 ) combined by means of a jamming on the contact elements ( 7 , 11 ) caused by a cutting contact ( 12 ) and that Connect card layers to both sides of the module ( 1 ). 10. Chip card according to claim 9, characterized in that at least on one side of the module ( 1 ) is followed by an inner card layer ( 20 ) with a recess ( 21 ) corresponding to the elevations of the module ( 1 ). 11. Chip card according to claim 9 or 10, characterized in that at least on one side of the module ( 1 ) an inner core layer ( 20 ) and adjacent to this a cover layer ( 22 ) can be applied by lamination.