DE19733777A1 - Chip module, module and method for producing a module and chip card - Google Patents

Abstract

The invention concerns a module, in particular designed to be used in chip cards, consisting of a chip module including an integrated switching circuit and a transmission module comprising at least a transmitting element for data and/or energy transmission between the integrated switching circuit and an external appliance or vice-versa. The chip module and the transmission module each have contact elements used for their mutual electrical connection, the chip module (3) contact elements (11) and the transmission module (2) contact elements (7) being assembled by blocking the mutually corresponding contact elements (7, 11).

Description

The invention relates to a chip module, a module and a Process for producing a module and a chip card according to the preamble of claim 1, the patent claim 4, claim 11 or claim 14.

DE 195 00 925 A1 describes a chip card for contactless Sen data transmission known, on the one hand, a chip module with an integrated circuit and the other one Transmission module with at least one transmission element for data and / or energy transfer between the inte circuit and an external device. For The formation of the chip card is the first step Transmission module integrated in the card body. In one second step is then the chip module in a ge for it created recess of the card body used and with  connected to it. For electrical coupling of the chip module will correspond to the transmission module the contact elements of the chip module on the one hand and the over support module on the other hand put together. It can the electrical contact between the correspond the contact elements by means of soldering, by insertion a conductive adhesive or an elastically deformable ren body between the contact elements who made the. These known types of contacting are relative manoeuvrable and subject to strong bending stress the chip card has a limited lifespan.

Furthermore, it is known to produce a contactless a chip module and a transmission module to connect a module and keep it ready as a semi-finished product, the corresponding contact elements from the chip module on the one hand and the transmission module on the other by soldering or introducing a conductive adhesive are trically connected. The chip and the transmission module on a common carrier that brings between at least two layers of cards body is embedded so that after lamination of the Layers the chip card is made.

A disadvantage of the known connection type of soldering is that due to the high temperature load that from one existing thermoplastic transmission module is very heavily used, so that a deformation of the same ben can occur. Furthermore, the soldering process is relative complex, because additional soldering agent on the transfer supply module must be applied.

A disadvantage of the electrically conductive adhesive is that in as a result of aging, its conductivity decreases.  

Furthermore, the thickness of the electrically conductive adhesive is pro technically difficult to set to a constant value can be. The setting of a constant distance between the corresponding contact elements, however required so that the transverse extension of the module in the contact area with the depth of the intended area Recess of the card body matches.

The object of the invention is therefore a chip module, a Mo dul and a method of manufacturing a module ben, so that a reliable and safe electrical con Clocking between a chip module and another building part is guaranteed.

It is also an object of the invention to provide a chip card of this type train that a simple and inexpensive manuf is enabled.

To achieve this object, the invention has the features of claim 1, claim 4, the patent claim 11 and claim 14.

The particular advantage of the chip module according to the invention be is that the contact elements alone by jamming mung with corresponding contact elements of another Component can be connected. There are no others Lanyards necessary. This will make it a safe one and permanent contact created beyond that can be so elastic that later on it external forces can be absorbed.

The particular advantage of the module according to the invention is in that by jamming the contact elements of the  Chip module with the corresponding contact elements of the Transmission module a simple and reliable electrical contact is created. In addition, the Contact for mechanical connection of the chip module with the transmission module. The contact elements are advantageous elements not exposed to temperature stress. The Ver binding takes place solely by using a contact pressure.

A module can be easily manufactured as a semi-finished product be that always has a constant training. This is achieved in particular by the fact that the Kon clock elements even the deadlock is generated. There are no other additional materials or components required to bring about the electrical contacting ren. The quality and the formation of the contact is al be through the materials of the contact elements themselves Right.

According to a development of the invention, the chip module protruding contact lugs in a contact area, the after installation of the chip module on the transmission module in Direction of the contact elements of the transmission module vice versa steers and be pressed on the same. This will create a secure clamping connection created.

According to a particular embodiment of the invention the contact elements of the chip module each as a crown ge cutting contacts formed, with tapered Zac the cutting contact through a carrier layer of the over support module can be pushed through. By redirection and on push the same towards the contact element of the over support module is a flat press fit of the prongs the contact elements of the transmission module created.  

According to a further development of the invention, the contacts are elements of the chip module part of a metallic chip carrier layer. Preferably, the chip carrier layer can be as Sheet metal part may be formed, the shape of the con clock elements simply by cutting or bending tools can be manufactured.

According to a development of the invention, the chip module abge on one of the contact elements of the transmission module turned side connected to the same, so that the application an intermediate insulation layer is not required is.

The advantage of the chip card according to the invention is that that ensures a defined grandeur of the module is, so that the recess of the card body accordingly is customizable. The fact that the chip carrier layer of the Back can be pressed against the transfer carrier layer is, the chip in a corresponding recess the transmission module layer intervenes, a module with comparatively low transverse extent in the chip area create.

Exemplary embodiments of the invention are described below hand of the drawings explained in more detail.

Show it:

Fig. 1 shows a partial longitudinal section through a module,

Fig. 2 is a plan view of a transmission module,

Fig. 3 is a perspective view of a chip module according to a first embodiment,

Fig. 4 shows a cross section through a contact element ge Mäss Fig. 3,

Fig. 5 is a perspective view of a chip module with contact elements according to a second exemplary embodiment and

Fig. 6 shows a longitudinal section through a chip card with a module according to the invention.

Fig. 1 shows a module 1, which is composed of a transmission module 2 and a chip module 3. The connection between the transmission module 2 and the chip module 3 takes place in a contacting area thereof.

As can be seen from FIG. 2, the transmission module 2 consists of a transmission carrier layer 4 , on which a transmission element 5 is brought up as a structured, in particular etched technical, printing technology or laser-structured, coil printed or applied as a wire-wound coil. The transmission element 5 is designed as an antenna and is used for data and / or energy transmission between a chip 6 shown in FIG. 3 and an external device. The multi-turn transmission element 5 has at its ends flat contacts elements 7 . Alternatively, the contact elements 7 can also be round or raised. For receiving the chip 6 , the transmission module 2 has a recess 8 which is located adjacent to the contacting area formed by the contact elements 7 . The transfer carrier layer 4 consists of a flexible plastic material made of PVC, PC or ABS with a thickness of at least 150 microns, preferably 200 to 300 microns.

As can be seen from FIG. 3, a chip module 3 consists of a thin cuboid-shaped chip carrier layer 10 , which is preferably formed from a metallic material before. On the chip carrier layer 10 , the integrated circuit 6 is applied, the electrical connections of which are formed by contact elements 11 . The contact elements 11 are designed as crown-shaped cutting contacts 12 with prongs 13 protruding at right angles and tapering. The formation of the contact elements 11 is carried out by appropriate cutting and bending tools. By punching 9 , the contact elements 11 are separated and iso liert. The chip module 3 can be kept as an intermediate product on a roll.

To produce an electrical and mechanical connec tion between the chip module 3 and the transmission module 2 , the transfer carrier layer 4 and the chip carrier layer 10 are put together so that the integrated circuit 6 is aligned with the recess 8 and the prongs 13 of the cutting contacts 12 corresponding to the contact elements 7 rest on the back of the transfer carrier layer 4 . By exerting a force in the direction of the contact elements 7, the prongs are forced through 13 of the contact elements 11 by the transfer carrier layer 4 or by the korre spondierenden contact elements 7, so that the transfer carrier layer 4 and the chip carrier layer 10 lie against each other surface. The prongs 13 are bent over by suitable bending tools and pressed onto the surface of the corresponding contact element 7 . The prongs 13 lie on plan to form a press fit on the contact elements 7 . The press fit is increased in that the thickness of the prongs 13 is substantially greater than the thickness of the contact elements 7 , preferably twice as large as the transverse extent of the contact elements 7 . There is provided a life-like clamping connection between the contact elements 7 and 11, wherein forming a ELEMENTS by the thickness of the contacts 7 and 11 predetermined loftiness of the module 1 is ge.

Alternatively, the chip carrier layer 10 can have only one cuts, in particular cruciform cuts. Only during the establishment of the connection between the chip module 3 and the transmission module 2 is the contact element 11 formed by tipping or pivoting the zac formed by the incisions 13 from a plane common to the chip carrier layer 10 , which then corresponds to the contact element 7 in Plant is brought. In this embodiment, the formation of the cutting contacts 12 thus only takes place immediately when the chip module 3 is connected to the transmission module 2 . The chip module 3 can thus be kept essentially without protruding contact elements 11 , so that the manufacturing outlay is reduced.

According to a further embodiment of the chip module 3 according to FIG. 5, the contact elements are formed as contact lugs 15 . The contact lugs 15 are each corresponding to a corresponding contact surface of the transmission module at an edge 17 of a chip carrier layer 16 . As can be seen from Fig. 5, the contact lugs 15 are triangular. Alternatively, they can also have an arcuate shape. It is important that the area of the contact elements 15 is so large that, after the same has been bent, a sufficiently large contact area is formed which lies flat on the corresponding contact element of the transmission module.

A slot 18 separates the contact elements 15 from one another so that there is no electrical connection between them. By pivoting the contact lugs 15 around an edge of the transmission module, not shown, a clamping electrical and at the same time mechanical connection between the chip carrier layer 16 and the transmission module can be created.

Alternatively, the contact elements of the chip module can also be used by the provision of incisions in the edge cuboidal chip carrier layer are formed so that we less material is required. Could continue the contact elements also through inside the chip carrier layer perpendicular contact tabs are formed, by a corresponding slit of transmission module layer are pluggable and clamped on contact elements of the transmission module.

Alternatively, the formation of at least one contact element ment formed by the course of the insulating slot be, so that the manufacturing cost continues can be reduced. The contact elements can therefore arranged anywhere in the chip carrier layer be, but preferably in an edge area. You are as Part of the chip carrier layer formed so that the chip carrier a dual function. It serves for one as a carrier layer for the chip and the other for Training of contact elements. The chip carrier layer is  formed from an electrically conductive material, preferably wise from sheet metal.

The modules described above each serve as semi-finished products for the production of a chip card 19 , as shown in FIG. 6. The chip card 19 can be produced in the laminating technology, with an inner core layer 20 adjoining the transfer carrier layer 4 and the chip carrier layer 10 . The core layers 20 each have recesses 21 corresponding to the elevations of the transfer carrier layer 4 and the chip carrier layer 10 . On the outside, the core layers 20 each have a cover layer 22 , the outer surfaces of which are preferably provided with an imprint. The core layers 20 and the cover layers 22 can consist of an ABS, PC or PVC material.

Claims (16)

1. Chip module, in particular for use in chip cards, with an integrated circuit and with Kontaktele elements for electrical connection with contact elements of an electrical component, characterized in that the contact elements ( 11 ) of the chip module ( 3 ) are formed such that the contact elements ( 11 ) are connected to each other with the corresponding contact elements ( 7 ) of the transmission module ( 2 ) by jamming. 2. Chip module according to claim 1, characterized in that the contact elements ( 11 ) are each designed to be bendable such that they rest on the corresponding contact elements ( 7 ) of the component ( 2 ) to form a contact force. 3. Chip module according to claim 1 or 2, characterized in that. that a chip carrier layer ( 10 ) of the chip module ( 3 ) has only slots or incisions to form contact lugs ( 13 ), such that a cutting contact ( 12 ) can be formed after bending the contact lugs ( 13 ) from the plane of the chip carrier layer ( 10 ). 4. Module, in particular for use in chip cards, consisting of a chip module with an integrated circuit and a transmission module with at least one transmission element for data and / or energy transmission between the integrated circuit and an external device or vice versa, wherein the chip module and the transmission module each have contact elements for electrical connection to one another, characterized in that the contact elements ( 11 ) of the chip module ( 3 ) on the one hand and the contact elements ( 7 ) of the transmission module ( 2 ) on the other hand by jamming the corresponding contact elements ( 7 , 11 ) are connected to each other. 5. Module according to claim 4, characterized in that the contact elements ( 11 ) of the chip module ( 3 ) each have at least one protruding contact nose ( 15 ) which automatically clamps in a contacting position on the corresponding contact element ( 7 ) of the transmission module ( 2nd ) is present. 6. Module according to claim 4 or 5, characterized in that the contact elements ( 11 ) of the chip module ( 3 ) each have a crown-shaped cutting contact ( 12 ) with teeth ( 13 ), such that the cutting contact ( 12 ) by egg ne transfer carrier layer ( 4 ) can be pressed and after the prongs ( 13 ) have been placed under flat contact with the contact element ( 7 ) of the transmission module ( 2 ) it is connected in a clamping and electrically conductive manner. 7. Module according to any one of claims 4 to 6, characterized in that the chip module ( 3 ) has a chip carrier layer ( 10 ) consisting of a metallic material, the contact elements ( 11 ) of the chip module ( 3 ) in each case in one piece with the Chip carrier layer ( 10 ) are connected. 8. Module according to one of claims 4 to 7, characterized in that the chip carrier layer ( 10 ) consists of a sheet metal material, wherein the contact elements ( 11 ) are separated from one another by a punched-out. 9. Module according to one of claims 4 to 8, characterized in that the chip module ( 3 ) on one of the contact elements ( 7 ) of the transmission module ( 2 ) facing away from the transmission module ( 2 ) can be connected by clamping. 10. Module according to one of claims 4 to 9, characterized in that the contact elements ( 11 ) on the edge of the chip module ( 3 ) are arranged as projecting contact tabs. 11. A method for producing a module, wherein an integrated circuit having a chip module with at least one transmission element having a transmission module that is used for data and / or energy transmission between the integrated circuit and an external device is electrically connected, characterized in that that in a contacting area of a chip module ( 3 ) at least part of a contact element ( 11 ) is pivoted such that it comes to a contact element ( 7 ) of the transmission module ( 2 ) in a clamping manner. 12. The method according to claim 11, characterized in that the integrated circuit ( 6 ) with a metallic chip carrier layer ( 10 ) is connected to form the chip module ( 3 ) and that in the chip carrier layer ( 10 ) from standing contact elements ( 11 ) are embossed. 13. The method according to claim 11 or 12, characterized in that the electrically conductive transmission element ( 5 ) as a coil on a transmission carrier layer ( 4 ) is structured. 14. Chip card for contactless data transmission with an integrated circuit chip module, having at least one transmission element, the transmission module for data and / or energy transmission between the integrated circuit and an external device, wherein the chip module and the transmission module each have contact elements for Electrical connection to one another, characterized in that the chip module ( 3 ) and the transmission module ( 2 ) is designed as a module ( 1 ) combined by jamming on the contact elements ( 7 , 11 ) and that on both sides of the module ( 1 ) Connect card layers to. 15. Chip card according to claim 14, characterized in that at least on one side of the module ( 1 ) in an inner card layer ( 20 ) with a to the elevations of the module ( 1 ) corresponding recess ( 21 ) closes. 16. Chip card according to claim 14 or 15, characterized in that at least on one side of the module ( 1 ) an inner core layer ( 20 ) and adjacent to this a cover layer ( 22 ) can be applied by lamination.