Classifications

• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
  • G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
  • G03F7/70958—Optical materials or coatings, e.g. with particular transmittance, reflectance or anti-reflection properties
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
  • C03B19/00—Other methods of shaping glass
  • C03B19/06—Other methods of shaping glass by sintering, e.g. by cold isostatic pressing of powders and subsequent sintering, by hot pressing of powders, by sintering slurries or dispersions not undergoing a liquid phase reaction
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
  • C03B19/00—Other methods of shaping glass
  • C03B19/06—Other methods of shaping glass by sintering, e.g. by cold isostatic pressing of powders and subsequent sintering, by hot pressing of powders, by sintering slurries or dispersions not undergoing a liquid phase reaction
  • C03B19/066—Other methods of shaping glass by sintering, e.g. by cold isostatic pressing of powders and subsequent sintering, by hot pressing of powders, by sintering slurries or dispersions not undergoing a liquid phase reaction for the production of quartz or fused silica articles
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
  • C03B19/00—Other methods of shaping glass
  • C03B19/10—Forming beads
  • C03B19/1005—Forming solid beads
  • C03B19/106—Forming solid beads by chemical vapour deposition; by liquid phase reaction
  • C03B19/1065—Forming solid beads by chemical vapour deposition; by liquid phase reaction by liquid phase reactions, e.g. by means of a gel phase
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
  • C03B19/00—Other methods of shaping glass
  • C03B19/14—Other methods of shaping glass by gas- or vapour- phase reaction processes
  • C03B19/1453—Thermal after-treatment of the shaped article, e.g. dehydrating, consolidating, sintering
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
  • C03B20/00—Processes specially adapted for the production of quartz or fused silica articles, not otherwise provided for
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C1/00—Ingredients generally applicable to manufacture of glasses, glazes, or vitreous enamels
  • C03C1/006—Ingredients generally applicable to manufacture of glasses, glazes, or vitreous enamels to produce glass through wet route
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
  • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
  • C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C3/00—Glass compositions
  • C03C3/04—Glass compositions containing silica
  • C03C3/06—Glass compositions containing silica with more than 90% silica by weight, e.g. quartz
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70058—Mask illumination systems
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70216—Mask projection systems
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
  • C03B2207/00—Glass deposition burners
  • C03B2207/30—For glass precursor of non-standard type, e.g. solid SiH3F
  • C03B2207/32—Non-halide
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C2201/00—Glass compositions
  • C03C2201/02—Pure silica glass, e.g. pure fused quartz
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C2203/00—Production processes
  • C03C2203/50—After-treatment
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10S65/00—Glass manufacturing
  • Y10S65/13—Computer control

Definitions

• the invention relates to stepper lens from fused silica having low compaction under high energy irradiation, particularly adaptable for use in photolithography applications at wavelengths of 193 and 248 nm.
• Fused silica is highly relevant to such applications as windows and mirrors used in outer space, and increasingly, it is becoming relevant to optical elements for deep ultraviolet photolithography.
• fused silica to intense deep ultraviolet radiation of the type utilized in photolithography leads to optical damage which is generally manifested in the form of changes in the optical and physical properties of the glass.
• optical damage observed in fused silica glass is a physical densification or compaction of the exposed regions of the glass. Compaction is generally observed by interferometry where the alteration of the optical phase front is measured through the damaged regions, and is reported as optical path difference, the product of refractive index and path length, in ppm or waves of 633 nm light.
• optical path difference the product of refractive index and path length
• the optical phase front of stepper lens elements for photolithographic applications which utilize deep ultraviolet wavelengths at 193 and 248 nm for high resolution microcircuit fabrication may become altered due to optical modification as a consequence of prolonged exposure.
• the object of the present invention to provide a fused silica stepper lens which is resistant to laser-induced damage, specifically defined as densification.
• the invention relates to a fused silica stepper lens which is resistant to laser-induced compaction.
• the invention relates to stepper lenses made by flame hydrolysis, and sol gel methods.
• fused silica glass for photolithographic applications should be resistant to laser-induced optical damage.
• stepper lenses for photolithographic applications should be resistant to laser-induced absorption and compaction.
• most fused silica stepper lenses available today have shown a tendency to optically deteriorate after prolonged exposure to excimer laser radiation.
• stepper lenses made from fused silica glasses produced by certain processes are more resistant to laser-induced compaction than are lenses made by conventional stepper lens manufacturing methods such as the boule process.
• Structural change in fused silica has at least two ramifications: (1 ) a geometric change in the densified region, which gives rise to a decrease in the optical path length; and (2) an increase in the refractive index of the fused silica caused by an increase in density. These two effects result in a net change (increase) in the optical path length (optical path difference, OPD).
• OPD optical path difference
• density increases caused by high energy irradiation are very small (in the range of about 1 to 50 ppm), so that direct measurements of the absolute density range can be impractical.
• interferometric measurements to characterize relative density changes across fused silica samples, measuring densified (exposed) and undensified (non-exposed) regions of each sample.
• Examples of useful processes include, (1 ) the flame hydrolysis process described in U.S. Patents 5,043,002 and 3,933,454 both of which are sometimes referred to herein as the waveguide process; and (2) the sol-gel method described in U.S. Patent 4,789,389 which is sometimes referred to herein as the sintered process.
• One method of making fused silica lenses which are resistant to laser-induced compaction is by the flame hydrolysis process.
• a coating of flame hydrolysis- produced glass soot is deposited on a starting member to form a soot preform.
• the preform is consolidated to form a dense glass layer which can then be formed into a desired shape.
• the soot preform is subjected to a temperature the consolidation temperature range for a time sufficient to permit the soot particles to fuse and consolidate, thereby forming a dense glass layer which is free from particle boundaries.
• such glass can be made using an improved flame hydrolysis process as described in U.S. 3,933,454.
• the soot preform is heated to a temperature within the consolidation temperature range for a time sufficient to cause the soot particles to fuse and form a dense glass layer.
• the glass is subjected to a stream of a substantially dry chlorine containing atmosphere.
• a vaporous stream of silicon- containing compound is converted, through thermal decomposition with oxidation or flame hydrolysis, to Si0 2 .
• the gas stream is then passed into the flame of a combustion burner to form amorphous particles of fused Si ⁇ 2 which are then deposited onto a support and consolidated to form fused silica.
• the amorphous particles are consolidated in a chlorine-containing environment to purify the glass.
• the deposit of amorphous particles are consolidated in a He/HCI- containing atmosphere to form a transparent glass body.
• silicon-containing compounds for forming fused silica glass are well known in the industry such as disclosed collectively in U.S. Patent No. 3,393,454; 4,789,389; 5,043,002; 5,152,819; and 5, 154,744, all herein incorporated by reference.
• the silicon-containing gaseous feedstock includes compounds that can be oxidized by flame hydrolysis or pyrolysis, to produce transparent, high-purity silica glass articles.
• halide-free, cylcosiloxane compounds are preferred.
• halide-free silicon-containing compounds include cyclosiloxane compounds, preferably, polymethylsiloxane such as hexamethyldisiloxane, polymethylcyclosiloxane, and mixtures of these.
• polymethylsiloxane such as hexamethyldisiloxane, polymethylcyclosiloxane, and mixtures of these.
• particularly useful polymethylcyclosiloxane include, hexamethylcyclotrisiloxane, decamethylcylcopentasiloxane, octa- methylcyclotetrasiloxane and mixtures of these.
• organosilicon materials satisfying the following three criteria can also be used to produce the inventive stepper lens: ( 1 ) an operable organosilicon-R compound (R is an element of the Periodic Table) will have a Si-R bond dissociation energy that is no higher than that of the Si-O pond;
• an operable organosilicon-R compound will exhibit a significant vapor pressure at temperatures below 250° C and a boiling point no higher than 350° C; and, in the interest of safety,
• an operable organosilicon-R compound will, upon pyrolysis and/or hydrolysis, yield decomposition products besides SiO- which are
• organosilicon-oxygen compounds having a basic Si-O-Si structure, in particular linear siioxanes wherein an oxygen atom and a single element or group of elements, such as a methyl group, is bonded to the silicon atom;
• organosilicon-nitrogen compounds having a basic Si-N-Si structure, such as aminosilanes, linear silazanes, and cyclosilazanes, wherein a nitrogen atom and a single element or group of elements are bonded to the silicon atom; and
• siloxasilazanes having a basic Si-N-Si-O-Si structure, wherein a nitrogen atom and an oxygen atom are bonded to the silicon atom.
• halide-free silicon-containing compounds for the method of the invention include octamethyltrisiloxane (an operable linear siloxane), aminosilanes such as tris (trimethylsiiyl) ketenimine, linear silazanes such as nonamethyltrisilazane, cyclosilazanes such octamethylcyclotetrasilazane, and siloxasilazanes such as hexamethyl- cyclotrisiloxazane.
• halide-free, cyclosiloxane compound such as octamethylcyclotetrasiloxane
• OCTS organic chemical formula
• — [SiO(CH3)2J 4 — , is used as the feedstock in the vapor deposition processes such as used in making high purity fused silica for optical waveguide applications.
• phase front distortion ppm
• l 2 N dose of exposure
• fljls the laser intensity
• the reciprocity of the dose parameter allows one to calculate the total exposure dose that a sample will see without regard to the intensity or number of pulses and, using the equation given on the figure, predict the densification. What this means in the practical sense is that the quantity is what is important, not how the sample gets there.
• the peak-to-valley phase front distortion was calculated from birefringence measurements using the conversion reported in Borrelli, Smith, Allan, and Seward, "Densification of fused silica under 193-nm excitation", J. Opt. Soc. Am. B/Vol. 14, No. 7/July 1997, 1606, and Allan, Smith, Borrelli, and Seward, "193-nm excimer-laser-induced densification of fused silica", OPTICS LETTERS/ Vol. 21 , No. 24/ December 15, 1996, 1960, incorporated herein by reference.
• For the standard fused silica glass we used samples of Coming's Code HPFS® fused silica (Corning, New York), which had been optimized for deep ultraviolet transmittance and optical homogeneity.

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• Chemical & Material Sciences (AREA)
• Engineering & Computer Science (AREA)
• Organic Chemistry (AREA)
• Materials Engineering (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Geochemistry & Mineralogy (AREA)
• Life Sciences & Earth Sciences (AREA)
• General Chemical & Material Sciences (AREA)
• Dispersion Chemistry (AREA)
• General Physics & Mathematics (AREA)
• Health & Medical Sciences (AREA)
• Epidemiology (AREA)
• Environmental & Geological Engineering (AREA)
• Public Health (AREA)
• Thermal Sciences (AREA)
• Optics & Photonics (AREA)
• Toxicology (AREA)
• Glass Compositions (AREA)
• Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
• Glass Melting And Manufacturing (AREA)
• Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

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• 1997
  • 1997-08-27 JP JP10511953A patent/JP2001500631A/ja active Pending
  • 1997-08-27 JP JP10511954A patent/JP2000517284A/ja not_active Ceased
  • 1997-08-27 WO PCT/US1997/015233 patent/WO1998008775A1/en not_active Ceased
  • 1997-08-27 DE DE69734675T patent/DE69734675T2/de not_active Expired - Lifetime
  • 1997-08-27 KR KR1019997001649A patent/KR20000035913A/ko not_active Withdrawn
  • 1997-08-27 EP EP97945187A patent/EP0960074B1/en not_active Expired - Lifetime
  • 1997-08-27 EP EP97944297A patent/EP0958255B1/en not_active Revoked
  • 1997-08-27 RU RU99105849/03A patent/RU2175647C2/ru not_active IP Right Cessation
  • 1997-08-27 KR KR1019997001594A patent/KR20000035883A/ko not_active Withdrawn
  • 1997-08-27 WO PCT/US1997/015234 patent/WO1998008776A1/en not_active Ceased
  • 1997-08-27 DE DE69736563T patent/DE69736563T2/de not_active Revoked
• 1999
  • 1999-02-25 US US09/254,113 patent/US6295841B1/en not_active Expired - Fee Related
• 2001
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