WO1997033302A2 - FARBSELEKTIVES Si-DETEKTORARRAY - Google Patents
FARBSELEKTIVES Si-DETEKTORARRAY Download PDFInfo
- Publication number
- WO1997033302A2 WO1997033302A2 PCT/DE1997/000457 DE9700457W WO9733302A2 WO 1997033302 A2 WO1997033302 A2 WO 1997033302A2 DE 9700457 W DE9700457 W DE 9700457W WO 9733302 A2 WO9733302 A2 WO 9733302A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- transistor
- layer
- etching
- array
- components
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 claims abstract description 8
- 238000005530 etching Methods 0.000 claims description 27
- 229910021426 porous silicon Inorganic materials 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 8
- 239000003792 electrolyte Substances 0.000 claims description 5
- 239000003086 colorant Substances 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 2
- 230000000694 effects Effects 0.000 claims 2
- 230000005284 excitation Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 6
- 230000035945 sensitivity Effects 0.000 abstract description 4
- 230000003595 spectral effect Effects 0.000 abstract description 4
- 230000001960 triggered effect Effects 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000002513 implantation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 239000007943 implant Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
- H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
- H01L31/11—Devices sensitive to infrared, visible or ultraviolet radiation characterised by two potential barriers, e.g. bipolar phototransistors
- H01L31/1105—Devices sensitive to infrared, visible or ultraviolet radiation characterised by two potential barriers, e.g. bipolar phototransistors the device being a bipolar phototransistor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/96—Porous semiconductor
Definitions
- the invention relates to a color-selective silicon detector array with individually producible color filters made of porous silicon. Furthermore, the invention relates to a method for its production.
- Porous silicon is very simple and inexpensive to produce by anodic etching of single-crystal silicon in a hydrofluoric acid solution.
- the porosity and microstructure of the porous silicon and thus also the optical refractive index depend, among other things, on the doping of the starting material and the etching current density. Therefore, by changing the etching current density over time or by using a material with a suitable doping profile, it is possible to produce porosity superlattices which are used as optical filters e.g. function as a Bragg reflector or Fabry-Perot filter (M.G. Berger el al., J.Phys. D: Appl. Phys. 27, 1333, (1994)).
- Attaching such a filter to an optical detector changes the spectral sensitivity of the detector.
- an optical detector for example a pn diode
- the use of a large number of detectors with different filters enables, for example, the color recognition or the detection of the Energy spectrum of the incident light, with spatial resolution.
- the aim of the invention is to create a detector array or to provide a production method in which each individual detector is or is provided with an individual filter.
- the object is achieved by an array according to the entirety of the features according to claim 1.
- the object is further achieved by a method according to the entirety of the features according to claim 10. Further expedient or advantageous embodiments or variants can be found in each of these Claims subordinate claims.
- the invention includes a plurality of pnp transistors on an insulating or undoped or n-doped substrate.
- the layer closest to the substrate serves as an emitter
- the n-layer serves as a base
- the p-layer on the surface serves as a collector.
- the individual transistors are electrically isolated from one another by suitable insulation (e.g. mesa etching, insulation implantation or the like).
- An array of cells can advantageously be produced, in which each cell contains pixel detectors for different colors, for example red, green, blue. Except- the array can be controlled for reading out row by row and column by column.
- Fig. 2 Array with two pn photodetectors shown with different filters
- the etching process for producing the porous silicon essentially only the p-collector layer is etched through (completely or partially) if the etching is carried out in the absence of light.
- the negligible porosidization of n-doped material can be used as an etch stop to the base layer.
- the n-layer can also be partially etched.
- the collector current of the pnp transistor with suitable emitter and base voltages is used as the etching current.
- the collector layer is biased over the electrolyte.
- the etching current has to flow from the silicon into the electrolyte. This is exactly the case with the pnp transistor if the upper layer is switched as a collector.
- the desired porosity superlattice is etched into the collector layer of the transistor by suitable modulation of emitter and / or base voltages and currents.
- the transistors When producing a plurality of detector elements, the transistors can be switched on or off or modulated individually or in groups.
- the anodic etching takes place only on the current-carrying collector layers (FIG. 1). To this
- An advantageous electrical connection of the transistors consists in connecting the emitter contacts in columns and the base contacts in rows, or vice versa. By applying suitable voltages to rows and columns, the transistors can be controlled individually or in rows or columns.
- the light passes through the layer system made of porous silicon into the emitter-base pn diode, which is used as a pn detector.
- the electrical signal generated is tapped between the emitter and base contacts (FIG. 2).
- the electrical trical signal of each individual pn diode can be tapped at the corresponding row and column contact.
- the dopants lie in the range between, for example, 1 * 10 1 cm “ 3 and 1 * 10 cm " , the layer thicknesses are, for example, 10 to 100 ⁇ m, so that the layer sequence has a transistor function.
- the layer sequence can be generated with the aid of epitaxy or implantation or diffusion or a combination of the methods mentioned.
- Isolation etching can also be replaced by suitable implants. 5.
- the component array can also be produced in a different order.
- the inventive method combines the advantages of conventional silicon technology with the very inexpensive process for the production of porous silicon. It is possible in a captivatingly simple and inexpensive way to produce a photodetector array with row and columnar control with individual spectral sensitivity for each individual detector. This enables the simple production of an integrated color camera.
- the pnp structure used can be used for the production of a readout logic and an electronic further processing. It is also possible to carry out MOS technology on the substrate.
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Light Receiving Elements (AREA)
- Color Television Image Signal Generators (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/142,295 US6255709B1 (en) | 1996-03-08 | 1997-03-08 | Color-selective SI detector array |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19609073A DE19609073A1 (de) | 1996-03-08 | 1996-03-08 | Farbselektives Si-Detektorarray |
DE19609073.3 | 1996-03-08 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/704,407 Division US6632699B1 (en) | 1996-03-08 | 2000-11-02 | Process for making a color selective Si detector array |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1997033302A2 true WO1997033302A2 (de) | 1997-09-12 |
WO1997033302A3 WO1997033302A3 (de) | 1997-10-30 |
Family
ID=7787675
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE1997/000457 WO1997033302A2 (de) | 1996-03-08 | 1997-03-08 | FARBSELEKTIVES Si-DETEKTORARRAY |
Country Status (3)
Country | Link |
---|---|
US (2) | US6255709B1 (de) |
DE (1) | DE19609073A1 (de) |
WO (1) | WO1997033302A2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10128654B4 (de) * | 2001-06-15 | 2008-04-10 | Forschungszentrum Jülich GmbH | Beidseitig mikrostrukturierter, ortsempfindlicher Detektor |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19609073A1 (de) * | 1996-03-08 | 1997-09-11 | Forschungszentrum Juelich Gmbh | Farbselektives Si-Detektorarray |
DE19837126B4 (de) * | 1998-08-17 | 2004-02-05 | Forschungszentrum Jülich GmbH | Verfahren und Vorrichtung zur elektrischen oder elektrochemischen Manipulation von Proben |
DE19900879A1 (de) * | 1999-01-12 | 2000-08-17 | Forschungszentrum Juelich Gmbh | Optischer Detektor mit einer Filterschicht aus porösem Silizium und Herstellungsverfahren dazu |
DE10018444B4 (de) * | 1999-05-04 | 2006-01-26 | Soft Imaging System Gmbh | Halbleitersystem zur Registrierung von Spektren, Farbsignalen, Farbbildern und dergleichen |
US6518080B2 (en) | 2001-06-19 | 2003-02-11 | Sensors Unlimited, Inc. | Method of fabricating low dark current photodiode arrays |
WO2003067231A1 (en) * | 2002-02-07 | 2003-08-14 | The Regents Of The University Of California | Optically encoded particles |
DE10346362B4 (de) * | 2003-09-30 | 2007-11-29 | Siemens Ag | Verfahren zum Herstellen eines Bauteils unter Trennung vom Herstellungssubstrat |
US8308066B2 (en) * | 2003-12-22 | 2012-11-13 | The Regents Of The University Of California | Method for forming optically encoded thin films and particles with grey scale spectra |
DE102006039073A1 (de) * | 2006-08-09 | 2008-02-14 | Opsolution Gmbh | Vorrichtung zur Untersuchung der spektralen und örtlichen Verteilung einer elektromagnetischen, von einem Gegenstand ausgehenden Strahlung |
US8629986B2 (en) * | 2006-08-09 | 2014-01-14 | Biozoom Technologies, Inc. | Optical filter and method for the production of the same, and device for the examination of electromagnetic radiation |
US10553633B2 (en) * | 2014-05-30 | 2020-02-04 | Klaus Y.J. Hsu | Phototransistor with body-strapped base |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3911269A (en) * | 1971-03-20 | 1975-10-07 | Philips Corp | Circuit arrangement having at least one circuit element which is energised by means of radiation and semiconductor device suitable for use in such a circuit arrangement |
JP3216153B2 (ja) | 1991-07-30 | 2001-10-09 | 株式会社デンソー | 光検出器 |
DE4231310C1 (de) * | 1992-09-18 | 1994-03-24 | Siemens Ag | Verfahren zur Herstellung eines Bauelementes mit porösem Silizium |
DE4319413C2 (de) * | 1993-06-14 | 1999-06-10 | Forschungszentrum Juelich Gmbh | Interferenzfilter oder dielektrischer Spiegel |
JPH07181318A (ja) * | 1993-12-22 | 1995-07-21 | Nippon Steel Corp | 光学フィルター |
JPH07230983A (ja) * | 1994-02-15 | 1995-08-29 | Sony Corp | 多孔質状シリコンの形成方法およびその多孔質状シリコンを用いた光半導体装置 |
US5478757A (en) * | 1994-08-12 | 1995-12-26 | National Science Council | Method for manufacturing photodetector using a porous layer |
DE4444620C1 (de) * | 1994-12-14 | 1996-01-25 | Siemens Ag | Sensor zum Nachweis elektromagnetischer Strahlung und Verfahren zu dessen Herstellung |
DE19609073A1 (de) * | 1996-03-08 | 1997-09-11 | Forschungszentrum Juelich Gmbh | Farbselektives Si-Detektorarray |
US6103546A (en) * | 1998-03-13 | 2000-08-15 | National Science Council | Method to improve the short circuit current of the porous silicon photodetector |
-
1996
- 1996-03-08 DE DE19609073A patent/DE19609073A1/de not_active Withdrawn
-
1997
- 1997-03-08 US US09/142,295 patent/US6255709B1/en not_active Expired - Fee Related
- 1997-03-08 WO PCT/DE1997/000457 patent/WO1997033302A2/de active Application Filing
-
2000
- 2000-11-02 US US09/704,407 patent/US6632699B1/en not_active Expired - Fee Related
Non-Patent Citations (4)
Title |
---|
BERGER ET AL.: "POROSITY SUPERLATTICES: A NEW CLASS OF SI HETEROSTRUCTURES" JOURNAL OF APPLIED PHYSICS., Bd. 27, 1994, NEW YORK US, Seiten 1333-1336, XP000677258 in der Anmeldung erw{hnt * |
FABES B D ET AL: "POROSITY AND COMPOSITION EFFECTS IN SOL-GEL DERIVED INTERFERENCE FILTERS" THIN SOLID FILMS, Bd. 254, Nr. 1/02, 1.Januar 1995, Seiten 175-180, XP000481506 * |
FROHNHOFF S ET AL: "POROUS SILICON SUPERLATTICES" ADVANCED MATERIALS, Bd. 6, Nr. 12, Dezember 1994, Seiten 963-965, XP000480052 * |
KRUGER M ET AL: "Color-sensitive Si-photodiode using porous silicon interference filters" JAPANESE JOURNAL OF APPLIED PHYSICS, PART 2 (LETTERS), 15 JAN. 1997, PUBLICATION OFFICE, JAPANESE JOURNAL APPL. PHYS, JAPAN, Bd. 36, Nr. 1A-B, ISSN 0021-4922, Seiten L24-L26, XP002038000 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10128654B4 (de) * | 2001-06-15 | 2008-04-10 | Forschungszentrum Jülich GmbH | Beidseitig mikrostrukturierter, ortsempfindlicher Detektor |
EP2276073A2 (de) | 2001-06-15 | 2011-01-19 | Forschungszentrum Jülich GmbH | Beidseitig mikrostrukturierter, ortsempfindlicher Detektor |
Also Published As
Publication number | Publication date |
---|---|
WO1997033302A3 (de) | 1997-10-30 |
US6632699B1 (en) | 2003-10-14 |
DE19609073A1 (de) | 1997-09-11 |
US6255709B1 (en) | 2001-07-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3615515C2 (de) | ||
DE69434745T2 (de) | Verfahren zur Herstellung eines Aggregats von Mikro-Nadeln aus Halbleitermaterial und Verfahren zur Herstellung eines Halbleiterbauelements mit einem solchen Aggregat | |
CA1138081A (en) | Multi-spectrum photodiode devices | |
DE69721112T2 (de) | Drei- oder Vier-Band-multispektrale Strukturen mit zwei gleichzeitigen Ausgangssignalen | |
DE69732862T2 (de) | Halbleiteranordnung zur aufnahme von infrarotbildern | |
EP0001586B1 (de) | Integrierte Halbleiteranordnung mit vertikalen NPN- und PNP-Strukturen und Verfahren zur Herstellung | |
WO1997033302A2 (de) | FARBSELEKTIVES Si-DETEKTORARRAY | |
WO1997023897A2 (de) | Optoelektronisches sensor-bauelement | |
DE102019108757B4 (de) | Halbleitervorrichtung und Sensor, enthaltend eine Einzel-Photon Avalanche-Dioden (SPAD)-Struktur | |
DE102010043822B4 (de) | Fotodiode und Fotodiodenfeld sowie Verfahren zu deren Betrieb | |
WO1999012205A9 (de) | Mehrfarbensensor | |
DE102005025937B4 (de) | Lichtempfindliches Bauelement mit erhöhter Blauempfindlichkeit, Verfahren zur Herstellung und Betriebsverfahren | |
DE3637817C2 (de) | ||
DE2313254A1 (de) | Photoelektrisches umsetzungselement fuer farbbildaufnahme- bzw. -abtastroehren und verfahren zu dessen herstellung | |
CN101866932B (zh) | 电压调制型中长波双色量子阱红外探测器及其制作方法 | |
DE102008002231A1 (de) | Monolithisch integrierte Photodetektor-Array-Vorrichtung mit ROIC für Laserradar-Bildsignal und Verfahren zu ihrer Herstellung | |
DE2752704A1 (de) | Infrarotdetektoranordnung | |
DE112014000624T5 (de) | Fotodioden-Anordnung mit einer ladungsabsorbierenden dotierten Zone | |
DE2355626A1 (de) | Verfahren zur herstellung integrierter schaltkreise mit hoher packungsdichte in einem einkristall-substrat | |
WO1998047184A1 (de) | Verfahren zur herstellung einer anordnung und anordnung von in serie bzw. reihe geschalteten einzel-solarzellen | |
WO1998047184A9 (de) | Verfahren zur herstellung einer anordnung und anordnung von in serie bzw. reihe geschalteten einzel-solarzellen | |
EP0638940B1 (de) | Halbleiter-Photodetektor | |
DE19512493A1 (de) | Farbsensoranordnung | |
DE10357135B4 (de) | Fotodetektor mit Transimpendanzverstärker und Auswerteelektronik in monolithischer Integration und Herstellungsverfahren | |
JPS60182764A (ja) | 半導体受光装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): CA JP KR US |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): AT BE CH DE DK ES FI FR GB GR IE IT LU MC NL PT SE |
|
AK | Designated states |
Kind code of ref document: A3 Designated state(s): CA JP KR US |
|
AL | Designated countries for regional patents |
Kind code of ref document: A3 Designated state(s): AT BE CH DE DK ES FI FR GB GR IE IT LU MC NL PT SE |
|
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
WWE | Wipo information: entry into national phase |
Ref document number: 09142295 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: JP Ref document number: 97531355 Format of ref document f/p: F |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
122 | Ep: pct application non-entry in european phase | ||
NENP | Non-entry into the national phase |
Ref country code: CA |