WO1997019466A1 - Procede et appareil de formation de bosses de soudage sur un substrat - Google Patents

Procede et appareil de formation de bosses de soudage sur un substrat Download PDF

Info

Publication number
WO1997019466A1
WO1997019466A1 PCT/US1996/018734 US9618734W WO9719466A1 WO 1997019466 A1 WO1997019466 A1 WO 1997019466A1 US 9618734 W US9618734 W US 9618734W WO 9719466 A1 WO9719466 A1 WO 9719466A1
Authority
WO
WIPO (PCT)
Prior art keywords
solder
substrate
sheet
die
preforms
Prior art date
Application number
PCT/US1996/018734
Other languages
English (en)
Inventor
Angelo Gulino
Thomas W. Edwards
Original Assignee
Fry's Metals, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fry's Metals, Inc. filed Critical Fry's Metals, Inc.
Publication of WO1997019466A1 publication Critical patent/WO1997019466A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/033—Punching metal foil, e.g. solder foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0405—Solder foil, tape or wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste

Definitions

  • This invention relates generally to methods and apparatuses for forming and attaching spherical solder elements on a substrate, and more particularly to a method and apparatus for depositing non-spherical solder preforms onto pads ofthe substrate, and forming the non- spherical solder preforms into spherical solder bumps.
  • solder bumps In attempting to attach solder "bumps", as referred to in Altman et al., a thick layer of solder resist material is applied to a printed circuit board substrate wherein some of the solder resist material is selectively removed to provide wells over metallized pads which are fixedly attached to the substrate. Next, solder paste is applied to the substrate in the wells and the excess is removed by a squeegee. The solder bumps are then placed within the wells over the metallized pads and reflowed (e.g., heated) for positively bonding the solder bump to the pad. After bonding the solder bumps to the pads ofthe substrate, the excess solder resist material is then removed from the substrate.
  • solder paste is applied to the substrate in the wells and the excess is removed by a squeegee.
  • the solder bumps are then placed within the wells over the metallized pads and reflowed (e.g., heated) for positively bonding the solder bump to the pad. After bonding the solder bump
  • This method of attaching the solder contacts to the substrate is particularly representative of several of the known methods in that it is extremely time consuming to perform since the wells surrounding each metallized pad must be fabricated and removed from the substrate.
  • the instant invention provides an improved method for forming spherical solder bumps on solder pads of a substrate comprising the steps of positioning a sheet of solder material over the substrate, stamping the sheet in such a manner that a plurality of non-spherical solder preforms are removed from the sheet, depositing the stamped solder preforms on the pads of the substrate, and heating the non-spherical solder preforms to a reflow temperature wherein the non- spherical solder preforms automatically reflow into a generally spherical configuration due to surface tension forces ofthe solder.
  • an apparatus comprising means for advancing a sheet of solder material over the substrate, and a die positioned between the sheet of solder material and the substrate.
  • the die has a plurality of openings formed therein which correspond to and are in registry with the solder pads ofthe substrate.
  • a plurality of punch elements are provided for punching solder preforms from the sheet through the openings ofthe die. The arrangement is such that the punch elements extend into the openings of the die for punching solder preforms from the sheet wherein the solder preforms are disposed upon the pads of the substrate.
  • the provision of a simple method of forming a spherical solder bump on a solder pad the provision of such a method wherein a non-spherical solder preform is transformed into a spherical solder bump by heating of the non-spherical solder preform; the provision of an improved method for depositing solder preforms onto pads of a substrate; the provision of such a method which is simple to follow and easy to preform; the provision of such a method wherein a relatively flat, disc-shaped solder preform is deposited onto a pad of the substrate and then heated to transform the solder preform into a substantially spherical solder bump; the provision of such a method which incorporates easy to use equipment; and the provision of such a method which produces high- quality results.
  • Fig. 1 is a perspective view of a sheet of solder foil displaced over a substrate having metallized pads;
  • Fig. 2 is a partial cross section schematic view of an apparatus used for coining the foil onto the substrate
  • Fig. 3 is a side elevational view of a solder preform disposed on the substrate prior to its being soldered to the metallized pad of the substrate;
  • Fig. 4 is side elevational view of the solder preform illustrated in Fig. 3 after it is soldered to the metallized pad of the substrate.
  • a sheet of solder material disposed over a printed circuit board substrate, generally indicated at 12, which has a plurality of metallized solder pads 14 attached to the body 16 ofthe substrate 12 in a grid pattern.
  • the sheet of solder material 10 has a plurality of preforms 18 coined by a suitable stamping operation for enabling the easy removal of solder preforms 18 from the sheet 10.
  • the sheet 10 is preferably fabricated from suitable solder material, such as a tin-lead composition and is very thin (otherwise referred to as a foil).
  • the sheet of solder material 10 is preferably part of a roll 20 of solder material (see Fig. 2) which is readily available from any number of commercial sources.
  • the method of the present invention is directed to depositing the solder preforms 1 taken from the sheet of solder material 10 on the metallized solder pads 14 of the substrate 12.
  • This method is achieved by an apparatus, generally indicated at 22, which is illustrated in Fig. 2 of the drawings.
  • the apparatus 22 comprises a die, generally indicated at 24, positioned between the sheet of solder material 10 and the substrate 12.
  • the die 24 has a body portion 26 having a plurality of bored openings 28 formed therein which correspond to and are in registry with the metallized solder pads 14 of the substrate 12.
  • the die 24 is suitably supported by a housing (not shown), the construction of which can be readily developed by anyone skilled in the art.
  • a plurality of punch elements, each indicated at 30, are provided above the sheet of solder material 10 and are suitably attached to a support 32 for punching the solder preforms 1 from the sheet 10 through the openings 28 ofthe die 24.
  • the sheet of solder material 10 can be preformed as illustrated in Fig. 1 or can be untreated and still fall within the scope ofthe present invention.
  • one advantage to preforming the sheet 10 is that it is easier for the punch elements 30 to separate the solder preforms 18 from the sheet 10 than if the sheet 10 is not preformed.
  • the punch elements 30 are also arranged so that the correspond to and are in registry with the openings 28 in the die 24 and the metallized solder pads 14 of the substrate 12. The arrangement is such that the punch elements 30 extend into the openings 28 of the die 24 for punching the preforms 18 from the sheet 10.
  • solder preforms 18 After being separated from the sheet 10 by the punch elements 30, the solder preforms 18 travel through the openings 28 ofthe die 24 and are deposited on the metallized solder pads 14 of the substrate 12.
  • each pad 14 has a layer of solder flux material (not shown) disposed thereon to initially hold the solder preforms 18 to the metallized pads 14 and to facilitate bonding. It is an important aspect ofthe present invention that the punch elements 30, openings 28 ofthe die 24 and the metallized solder pads 14 of the substrate 12 be in registry so that the solder preforms 18 are accurately deposited on the metallized solder pads 14.
  • a first reel 34 For advancing the sheet of solder material 10 over the substrate 12, a first reel 34 is provided which has the roll 20 of wound solder material in sheet form thereon.
  • a second, take- up reel 36 is attached to the free end of the roll 20 of wound sheet of solder material which is wound on the first reel 34.
  • the take-up reel 36 can be driven by any suitable drive mechanism (not shown) for advancing unstamped portions of the sheet 10 over the substrate 12.
  • the take-up reel 36 is rotated by the drive mechanism so as to advance a fresh sheet of material for either another section of the printed circuit board substrate, or another printed circuit board substrate.
  • Suitable means can also be provided for moving the substrate 12 or multiple substrates to the position where they are located below the die.
  • the method of the present invention is achieved by positioning the sheet of solder material 10 over the substrate 12, stamping or punching the sheet 10 with the punch elements 30 in such a manner that a plurality of solder preforms 18 are removed from the sheet 10, and depositing via openings 28 in the die 24 the stamped or removed solder preforms 18 on the metallized solder pads 14 of the substrate 12.
  • the apparatus 22 of the present invention performs the method in a relatively uncomplicated and efficient manner. After the solder preforms 18 are deposited on the metallized pads 14 having a layer of solder flux thereon, the substrate 12 is heated for fixedly attaching the solder preforms 18 to the pads 14 of the substrate 12.
  • solder preforms 18 upon being subjected to heat, transform into a substantially spherical solder bump 38 (see Fig. 4). More specifically, it has been found that the surface tension ofthe solder material (e.g., 63 percent tin and 37 percent lead in a preferred embodiment) when in a liquified state transforms the relatively flat disc-shaped preform 18 as seen in Fig. 3 into a substantially spherically-shaped "bump" 38 configuration illustrated in Fig. 4. This spherical shape is especially suited for contacts which are often attached (as by soldering) to wire leads.
  • solder material e.g., 63 percent tin and 37 percent lead in a preferred embodiment
  • solder bumps rely on the preforming of spherical solder balls. Such spherical solder balls are quite difficult to manufacture and add significant costs to present BGA circuit packages.
  • the method and apparatus 22 ofthe present invention are especially suited for effectively and efficiently depositing solder preforms 18 onto a printed circuit board substrate 12. There are no extraneous steps which need to be performed, such as providing and removing a layer of solder resist material to the substrate as disclosed in the patent to Altman et al.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Un procédé de formation de bosses de soudage sur des plages de soudage (14) d'un substrat (16) comprend les étapes consistant à positionner une plaque de matière de soudage (10) sur le substrat, à estamper la plaque de manière à enlever une pluralité de préformes de soudage non-spheriques (18) de la plaque, à déposer des préformes de soudage estampées sur les plages (14) du substrat et à chauffer les éléments de soudage à une température de refusion où les éléments de soudage sont transformés en une bosse de soudage de forme générale sphérique. Le procédé précité est mis en application à l'aide d'un appareil présentant une matrice (24) positionnée entre la plaque de matière de soudage (10) et le substrat (16). Dans la matrice sont formées une pluralité d'ouvertures (28) correspondant aux plages de soudage du substrat, et se trouvant allignées avec celles-ci. On a prévu une pluralité d'éléments de découpage (30) destinés à découper les préformes de soudage dans la plaque, à travers les ouvertures de ladite matrice. L'agencem ent est tel que les éléments de découpage s'étendent jusque dans les ouvertures de la matrice afin de découper des préformes de soudage (18) dans ladite plaque, dans laquelle les préformes de soudage sont disposées sur les plages du substrat.
PCT/US1996/018734 1995-11-22 1996-11-22 Procede et appareil de formation de bosses de soudage sur un substrat WO1997019466A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US56207495A 1995-11-22 1995-11-22
US08/562,074 1995-11-22

Publications (1)

Publication Number Publication Date
WO1997019466A1 true WO1997019466A1 (fr) 1997-05-29

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1996/018734 WO1997019466A1 (fr) 1995-11-22 1996-11-22 Procede et appareil de formation de bosses de soudage sur un substrat

Country Status (1)

Country Link
WO (1) WO1997019466A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2322234A (en) * 1997-02-13 1998-08-19 Nec Corp Method of mounting an optical device and mounting therefor
SG93181A1 (en) * 1996-12-13 2002-12-17 Texas Instruments Inc Systems and method for coupling conductive pellets to a component of an integrated circuit
EP1443548A2 (fr) * 2002-12-31 2004-08-04 Texas Instruments Incorporated Colonne composite en metal pour le montage d'un composant semiconducteur
US7550852B2 (en) 2002-12-31 2009-06-23 Texas Instruments Incorporated Composite metal column for mounting semiconductor device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03181192A (ja) * 1989-12-11 1991-08-07 Fujitsu Ltd 配線基板への予備はんだの形成方法
US5184767A (en) * 1991-12-31 1993-02-09 Compaq Computer Corporation Non-wicking solder preform
EP0573146A1 (fr) * 1992-06-05 1993-12-08 International Business Machines Corporation Application de soudure à pas fins
US5275970A (en) * 1990-10-17 1994-01-04 Nec Corporation Method of forming bonding bumps by punching a metal ribbon
JPH0645740A (ja) * 1992-04-22 1994-02-18 Nec Corp 半田接続方法
JPH06283536A (ja) * 1993-03-30 1994-10-07 Nec Corp 半田バンプ実装基板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03181192A (ja) * 1989-12-11 1991-08-07 Fujitsu Ltd 配線基板への予備はんだの形成方法
US5275970A (en) * 1990-10-17 1994-01-04 Nec Corporation Method of forming bonding bumps by punching a metal ribbon
US5184767A (en) * 1991-12-31 1993-02-09 Compaq Computer Corporation Non-wicking solder preform
JPH0645740A (ja) * 1992-04-22 1994-02-18 Nec Corp 半田接続方法
EP0573146A1 (fr) * 1992-06-05 1993-12-08 International Business Machines Corporation Application de soudure à pas fins
JPH06283536A (ja) * 1993-03-30 1994-10-07 Nec Corp 半田バンプ実装基板

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
"LOW MELT SOLDER PREFORM FOR CHIP ATTACH", RESEARCH DISCLOSURE, no. 331, 1 November 1991 (1991-11-01), EMSWORTH, GB, pages 872, XP000271522 *
PATENT ABSTRACTS OF JAPAN vol. 015, no. 434 (E - 1129) 6 November 1991 (1991-11-06) *
PATENT ABSTRACTS OF JAPAN vol. 018, no. 270 (E - 1552) 23 May 1994 (1994-05-23) *
PATENT ABSTRACTS OF JAPAN vol. 95, no. 1 28 February 1995 (1995-02-28) *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG93181A1 (en) * 1996-12-13 2002-12-17 Texas Instruments Inc Systems and method for coupling conductive pellets to a component of an integrated circuit
GB2322234A (en) * 1997-02-13 1998-08-19 Nec Corp Method of mounting an optical device and mounting therefor
EP1443548A2 (fr) * 2002-12-31 2004-08-04 Texas Instruments Incorporated Colonne composite en metal pour le montage d'un composant semiconducteur
EP1443548A3 (fr) * 2002-12-31 2004-08-18 Texas Instruments Incorporated Colonne composite en metal pour le montage d'un composant semiconducteur
US7125789B2 (en) 2002-12-31 2006-10-24 Texas Instruments Incorporated Composite metal column for mounting semiconductor device
US7550852B2 (en) 2002-12-31 2009-06-23 Texas Instruments Incorporated Composite metal column for mounting semiconductor device

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