SG93181A1 - Systems and method for coupling conductive pellets to a component of an integrated circuit - Google Patents
Systems and method for coupling conductive pellets to a component of an integrated circuitInfo
- Publication number
- SG93181A1 SG93181A1 SG9704418A SG1997004418A SG93181A1 SG 93181 A1 SG93181 A1 SG 93181A1 SG 9704418 A SG9704418 A SG 9704418A SG 1997004418 A SG1997004418 A SG 1997004418A SG 93181 A1 SG93181 A1 SG 93181A1
- Authority
- SG
- Singapore
- Prior art keywords
- systems
- component
- integrated circuit
- coupling conductive
- conductive pellets
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45014—Ribbon connectors, e.g. rectangular cross-section
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Punching Or Piercing (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US3316096P | 1996-12-13 | 1996-12-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG93181A1 true SG93181A1 (en) | 2002-12-17 |
Family
ID=21868865
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG9704418A SG93181A1 (en) | 1996-12-13 | 1997-12-12 | Systems and method for coupling conductive pellets to a component of an integrated circuit |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPH10214854A (en) |
KR (1) | KR19980064090A (en) |
SG (1) | SG93181A1 (en) |
TW (1) | TW382797B (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03181192A (en) * | 1989-12-11 | 1991-08-07 | Fujitsu Ltd | Formation of preliminary solder to wiring substrate |
JPH0964089A (en) * | 1995-08-28 | 1997-03-07 | Mitsubishi Electric Corp | Device for forming bump |
WO1997019466A1 (en) * | 1995-11-22 | 1997-05-29 | Fry's Metals, Inc. | Method and apparatus for forming solder bumps on a substrate |
-
1997
- 1997-12-12 KR KR1019970068211A patent/KR19980064090A/en not_active Application Discontinuation
- 1997-12-12 SG SG9704418A patent/SG93181A1/en unknown
- 1997-12-15 JP JP9343538A patent/JPH10214854A/en active Pending
-
1998
- 1998-03-05 TW TW086118735A patent/TW382797B/en not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03181192A (en) * | 1989-12-11 | 1991-08-07 | Fujitsu Ltd | Formation of preliminary solder to wiring substrate |
JPH0964089A (en) * | 1995-08-28 | 1997-03-07 | Mitsubishi Electric Corp | Device for forming bump |
WO1997019466A1 (en) * | 1995-11-22 | 1997-05-29 | Fry's Metals, Inc. | Method and apparatus for forming solder bumps on a substrate |
Also Published As
Publication number | Publication date |
---|---|
TW382797B (en) | 2000-02-21 |
KR19980064090A (en) | 1998-10-07 |
JPH10214854A (en) | 1998-08-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AU2372697A (en) | High-density mounting method and structure for electronic circuit board | |
GB2300502B (en) | An electronic circuit for and a method of decoding a signal | |
SG52954A1 (en) | Method for protecting electronic circuit components and assemblies using a metallized flexible enclosure | |
EP0701298A3 (en) | Low inductance surface-mount connectors for interconnecting circuit devices and method for using same | |
HK1025211A1 (en) | A method and a device for shielding of electronic components on a circuit board. | |
SG99854A1 (en) | Method for enhancing the signal carrying capability of an electrical connector | |
SG44314A1 (en) | Printed circuit board and method of connecting electronic parts | |
SG52759A1 (en) | Method and circuit arrangement for special signal transmission | |
EP0702456A3 (en) | Power-consumption reduction circuit and method | |
GB2293926B (en) | Connector for electronic circuit tester | |
GB2311661B (en) | Electronic circuit unit and method of mounting the same | |
GB9622961D0 (en) | Electronic circuit for determination of distances between reference and data points | |
AU129872S (en) | A connecting device for peripheral equipment of an electronic computer | |
SG78280A1 (en) | Circuit board mounted electrical connector assembly and method of using same | |
GB9524022D0 (en) | Method of operating an electronic circuit | |
SG93181A1 (en) | Systems and method for coupling conductive pellets to a component of an integrated circuit | |
AU1793399A (en) | Electronic circuit and manufacturing method for electronic circuit | |
AU5501798A (en) | Method and device for connecting electrical components to circuit boards | |
GB2297654B (en) | A circuit board assembly and a method of manufacturing such an assembly | |
AU1325197A (en) | Shielding of electronic components embedded in plastics directly on circuit board | |
AU6417298A (en) | Method for the transfer of energy to an electronic circuit implanted in a livingbody and a device for such method | |
AU5140898A (en) | Components for electrical and electronic circuits | |
AU5501898A (en) | Method and device for connecting electrical components to printed circuit boards | |
ZA963988B (en) | A connective medium and a process for connecting electrical devices to circuit boards | |
GB2311673B (en) | Clocked electronic circuit |