WO1997013630A1 - Procede de fabrication de stratifies par compression - Google Patents
Procede de fabrication de stratifies par compression Download PDFInfo
- Publication number
- WO1997013630A1 WO1997013630A1 PCT/EP1996/004103 EP9604103W WO9713630A1 WO 1997013630 A1 WO1997013630 A1 WO 1997013630A1 EP 9604103 W EP9604103 W EP 9604103W WO 9713630 A1 WO9713630 A1 WO 9713630A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- binder
- thermosetting
- resin
- carrier material
- laminate
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B15/00—Pretreatment of the material to be shaped, not covered by groups B29B7/00 - B29B13/00
- B29B15/08—Pretreatment of the material to be shaped, not covered by groups B29B7/00 - B29B13/00 of reinforcements or fillers
- B29B15/10—Coating or impregnating independently of the moulding or shaping step
- B29B15/105—Coating or impregnating independently of the moulding or shaping step of reinforcement of definite length with a matrix in solid form, e.g. powder, fibre or sheet form
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
- B29C70/28—Shaping operations therefor
- B29C70/40—Shaping or impregnating by compression not applied
- B29C70/50—Shaping or impregnating by compression not applied for producing articles of indefinite length, e.g. prepregs, sheet moulding compounds [SMC] or cross moulding compounds [XMC]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2061/00—Use of condensation polymers of aldehydes or ketones or derivatives thereof, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
Definitions
- the invention relates to a method for the solvent-free production of laminated materials and components containing them.
- flat carrier materials are impregnated or coated with thermosetting resin and optionally hardener, dried and pre-hardened and these so-called prepregs into equal pieces cut, stacked, and between the steel sheets or in forms ⁇ ter heating un pressed.
- thermosetting resin (s) hardens and the individual layers are firmly connected to one another and, if appropriate, to further internal structural parts.
- the production of the prepregs in the melt application process has the disadvantages that the resin has to be kept in the melt for a long time. This increases the viscosity and increases the risk of air inclusions and, as a result, the lack of laminate properties. In addition, there is no guarantee that the resin will get between all the filaments.
- thermosetting binder Layers produced, if necessary after cutting, are placed on top of one another and pressed together in a manner known per se at temperatures above the melting and curing temperature of the thermosetting binder, provided the amount of thermosetting binder is in the range from 20 to 80% by weight. is preferably in the range of 35-55% by weight of the sprinkled flat carrier material.
- laminated materials such as laminates, carrier plates or base plates for printed circuit boards can be manufactured as well as lightweight components in which structural parts such as e.g. Honeycomb or foam cores are pressed in.
- Paper can be used as a flat carrier material, as can fabric or nonwoven made of synthetic or natural textile fibers, but also made of glass, carbon, boron, silicon, silicon carbide or aramid fibers or mixtures of individual types of fibers with one another.
- thermosetting binders are known per se, thermosetting prepolymers (resins) or prepolymer-hardener mixtures. It is preferred to use latent prepolymer-hardener mixtures, which may additionally contain catalysts, which carry out the hardening reaction while supplying different types of energy, such as e.g. Catalyze heat, microwaves, UV or electron beam energy.
- the application process can be set in a targeted manner by heating the resins or, if appropriate, also the flat carrier material by means of radiators on the surface.
- the binders must be meltable, i.e. their melting or softening point must be below the curing temperature.
- thermosets or thermoset / hardener mixtures known per se from the previously known processes for the production of laminates, in particular self-hardening phenolic resins, non-hardening phenolic resin / hardener mixtures (Novolak / Hexa), epoxy resin hardeners Mixtures or epoxy resin novolak mixtures, but also bismaleimides, polyesters, cyanate esters, benzoxazines and their mixtures and mixtures thereof with phenolic and / or epoxy resins.
- fillers and / or additives can be added to the binders.
- these are chalk, kaolins, mica and other silicates, silicon dioxide, in particular highly disperse silica, heavy spar, lithopone, but also pigments and carbon black and titanium dioxide and in particular up to 20% by weight of thermoplastic resins or polymers.
- binders or binder mixtures provided with fillers and / or additives are in the form of free-flowing powder or granules and are prepared in a manner known per se, for example by sprinkling, spreading or spraying, for example by means of airless spraying or by application directly from a Spray drying process, uniformly in the required amount on at least one side of a flat carrier material distributed applied, the carrier material can be cut before or after the application of the binder.
- several layers of the carrier material and, if appropriate, structural parts are stacked on top of one another in a manner known per se and pressed between steel sheets or in molds with heating to a temperature above the curing temperature of the prepolymer.
- Glass fabric with a weight per unit area of 296 g / m 2 is irradiated with an IR radiator and in each case sprinkled with a ground phenol resol (particle size ⁇ 200 ⁇ m) at the irradiated point, so that the sprinkled fabric has a resin content of 40 * Has 3% by weight.
- Eight fabric layers produced in this way are superimposed and pressed to 135 ° C within 25 min to a 2 mm thick laminate.
- Example 1 glass fabrics are sprinkled with a Novolak-Hexa mixture (10% Hexa) and pressed into a 2 mm thick laminate.
- the prepreg thus produced has a resin content of 40 * 3% and a volatile content of 5%.
- Novolak-hexa mixture according to Example 2 is used. The results obtained when testing the laminate can be found in the list.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Laminated Bodies (AREA)
Abstract
L'invention a pour objet un procédé de fabrication de stratifiés par compression de plusieurs couches d'un matériau support plan et de résine thermodurcissable, à des températures supérieures à la température de durcissement de la résine thermodurcissable, procédé selon lequel on répand sur au moins une surface du matériau support plan, 20 à 80 % en poids, par rapport au matériau support recouvert, d'un liant thermodurcissable solide en poudre ou granulé. Plusieurs couches ainsi produites sont appliquées les unes sur les autres et comprimées mutuellement à des températures supérieures à la température de fusion et de durcissement du liant thermoplastique.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19537449.5 | 1995-10-07 | ||
DE19537449A DE19537449A1 (de) | 1995-10-07 | 1995-10-07 | Verfahren zur Herstellung von Schichtpreßstoffen |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1997013630A1 true WO1997013630A1 (fr) | 1997-04-17 |
Family
ID=7774316
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP1996/004103 WO1997013630A1 (fr) | 1995-10-07 | 1996-09-19 | Procede de fabrication de stratifies par compression |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE19537449A1 (fr) |
WO (1) | WO1997013630A1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10156956A1 (de) * | 2001-11-20 | 2003-06-05 | Hw Ind Gmbh & Co Kg | Verfahren zur Herstellung von Bauplatten, insbesondere Fußbodenplatten |
US10040917B2 (en) | 2015-11-14 | 2018-08-07 | Leichtbau-Zentrum Sachsen Gmbh | 1C system, products to be manufactured from the system, and a method for manufacturing semifinished, fiber-reinforced products and components with the 1C system |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT316116B (de) * | 1969-06-27 | 1974-06-25 | Stolllack Ag | Verfahren zur Herstellung eines Schichtkörpers |
JPS5731936A (en) * | 1980-08-04 | 1982-02-20 | Mitsubishi Electric Corp | Preparation molded product of molding compound for epoxy resin sheet |
JPS59159832A (ja) * | 1983-03-01 | 1984-09-10 | Nitto Electric Ind Co Ltd | プリプレグ |
EP0363794A2 (fr) * | 1988-10-14 | 1990-04-18 | Kurt Held | Procédé et appareil pour fabriquer en continu des laminates |
EP0416474A2 (fr) * | 1989-09-05 | 1991-03-13 | BASF Aktiengesellschaft | Procédé pour imprègner un renforcement de fibres tissées avec de la poudre |
WO1992015404A1 (fr) * | 1991-03-01 | 1992-09-17 | S.L. Electrostatic Technology, Inc. | Procede de depot de poudre pour revetement electrostatique, en vue de produire des stratifies pour plaquettes a circuits imprimes et similaires |
FR2678543A1 (fr) * | 1991-07-04 | 1993-01-08 | Rossignol Sa | Procede pour la realisation d'une structure moulee complexe, et notamment d'un ski et ski obtenu par la mise en óoeuvre de ce procede. |
US5308565A (en) * | 1993-02-05 | 1994-05-03 | General Electric Company | Method of preparing modified polyphenylene oxide resin systems for electrical laminates having improved solderability and solvent resistance |
-
1995
- 1995-10-07 DE DE19537449A patent/DE19537449A1/de not_active Withdrawn
-
1996
- 1996-09-19 WO PCT/EP1996/004103 patent/WO1997013630A1/fr active Application Filing
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT316116B (de) * | 1969-06-27 | 1974-06-25 | Stolllack Ag | Verfahren zur Herstellung eines Schichtkörpers |
JPS5731936A (en) * | 1980-08-04 | 1982-02-20 | Mitsubishi Electric Corp | Preparation molded product of molding compound for epoxy resin sheet |
JPS59159832A (ja) * | 1983-03-01 | 1984-09-10 | Nitto Electric Ind Co Ltd | プリプレグ |
EP0363794A2 (fr) * | 1988-10-14 | 1990-04-18 | Kurt Held | Procédé et appareil pour fabriquer en continu des laminates |
EP0416474A2 (fr) * | 1989-09-05 | 1991-03-13 | BASF Aktiengesellschaft | Procédé pour imprègner un renforcement de fibres tissées avec de la poudre |
WO1992015404A1 (fr) * | 1991-03-01 | 1992-09-17 | S.L. Electrostatic Technology, Inc. | Procede de depot de poudre pour revetement electrostatique, en vue de produire des stratifies pour plaquettes a circuits imprimes et similaires |
FR2678543A1 (fr) * | 1991-07-04 | 1993-01-08 | Rossignol Sa | Procede pour la realisation d'une structure moulee complexe, et notamment d'un ski et ski obtenu par la mise en óoeuvre de ce procede. |
US5308565A (en) * | 1993-02-05 | 1994-05-03 | General Electric Company | Method of preparing modified polyphenylene oxide resin systems for electrical laminates having improved solderability and solvent resistance |
Non-Patent Citations (2)
Title |
---|
DATABASE WPI Week 8442, Derwent World Patents Index; AN 84-260749, XP002022659 * |
PATENT ABSTRACTS OF JAPAN vol. 6, no. 102 (C - 107) 11 June 1982 (1982-06-11) * |
Also Published As
Publication number | Publication date |
---|---|
DE19537449A1 (de) | 1997-04-10 |
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