WO1997008737A3 - Schaltungsanordnung mit einer hybridschaltung - Google Patents

Schaltungsanordnung mit einer hybridschaltung Download PDF

Info

Publication number
WO1997008737A3
WO1997008737A3 PCT/DE1996/001596 DE9601596W WO9708737A3 WO 1997008737 A3 WO1997008737 A3 WO 1997008737A3 DE 9601596 W DE9601596 W DE 9601596W WO 9708737 A3 WO9708737 A3 WO 9708737A3
Authority
WO
WIPO (PCT)
Prior art keywords
circuit
hybrid
arrangement including
ceramic substrates
mounted components
Prior art date
Application number
PCT/DE1996/001596
Other languages
English (en)
French (fr)
Other versions
WO1997008737A2 (de
Inventor
Jens Grieswald
Original Assignee
Siemens Ag
Jens Grieswald
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag, Jens Grieswald filed Critical Siemens Ag
Publication of WO1997008737A2 publication Critical patent/WO1997008737A2/de
Publication of WO1997008737A3 publication Critical patent/WO1997008737A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

Die Erfindung bezieht sich auf eine Schaltungsanordnung mit einer Hybridschaltung, die auf einem Keramik-Substrat eine Schichtschaltung und oberflächenmontierbare Bauelemente aufweist. Um eine solche Schaltungsanordnung möglichst klein und kostengünstig herstellen zu können, weist erfindungsgemäß die Hybridschaltung ein weiteres Keramik-Substrat (2) auf, und die Schichtschaltung und die oberflächenmontierbaren Bauelemente (22 bis 25) sind vorzugsweise auf beide Keramik-Substrate (1, 2) verteilt angeordnet. Dabei liegen Teile (5, 6) der Schichtschaltung auf verschiedenen Teilbereichen (16; 17', 18') jeweils einer Seite (3, 4) der Keramik-Substrate (1, 2) und die oberflächenmontierbaren Bauelemente (22 bis 25) auf der jeweils anderen Seite (20, 21) der Keramik-Substrate (1, 2). Die Keramik-Substrate (1, 2) sind mit ihren jeweils einen Seiten (3, 4) zusammengeklebt.
PCT/DE1996/001596 1995-08-24 1996-08-22 Schaltungsanordnung mit einer hybridschaltung WO1997008737A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE1995132653 DE19532653C1 (de) 1995-08-24 1995-08-24 Schaltungsanordnung mit einer Hybridschaltung
DE19532653.9 1995-08-24

Publications (2)

Publication Number Publication Date
WO1997008737A2 WO1997008737A2 (de) 1997-03-06
WO1997008737A3 true WO1997008737A3 (de) 1997-04-10

Family

ID=7771250

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1996/001596 WO1997008737A2 (de) 1995-08-24 1996-08-22 Schaltungsanordnung mit einer hybridschaltung

Country Status (2)

Country Link
DE (1) DE19532653C1 (de)
WO (1) WO1997008737A2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10203827C2 (de) * 2002-01-31 2003-12-18 P21 Power For The 21St Century Leiterplattenanordnung sowie elektrisches Bauteil
DE102009040914A1 (de) * 2009-09-10 2011-03-31 Conti Temic Microelectronic Gmbh Leiterplattenverbund und Leiterplattensystem

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8428437U1 (de) * 1984-09-27 1986-01-30 Robert Bosch Gmbh, 7000 Stuttgart Schaltungshybrid für elektronische Schaltungen
JPH01173777A (ja) * 1987-12-28 1989-07-10 Matsushita Electric Ind Co Ltd 積層型集積回路モジュール
JPH01226192A (ja) * 1988-03-07 1989-09-08 Matsushita Electric Ind Co Ltd 混成集積回路装置
JPH02105595A (ja) * 1988-10-14 1990-04-18 Nec Corp 混成集積回路
JPH02114697A (ja) * 1988-10-25 1990-04-26 Matsushita Electric Ind Co Ltd 混成集積回路装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8428437U1 (de) * 1984-09-27 1986-01-30 Robert Bosch Gmbh, 7000 Stuttgart Schaltungshybrid für elektronische Schaltungen
JPH01173777A (ja) * 1987-12-28 1989-07-10 Matsushita Electric Ind Co Ltd 積層型集積回路モジュール
JPH01226192A (ja) * 1988-03-07 1989-09-08 Matsushita Electric Ind Co Ltd 混成集積回路装置
JPH02105595A (ja) * 1988-10-14 1990-04-18 Nec Corp 混成集積回路
JPH02114697A (ja) * 1988-10-25 1990-04-26 Matsushita Electric Ind Co Ltd 混成集積回路装置

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 13, no. 445 (E - 829) 6 October 1989 (1989-10-06) *
PATENT ABSTRACTS OF JAPAN vol. 13, no. 548 (E - 856) 7 December 1989 (1989-12-07) *
PATENT ABSTRACTS OF JAPAN vol. 14, no. 320 (E - 0950) 10 July 1990 (1990-07-10) *
PATENT ABSTRACTS OF JAPAN vol. 14, no. 338 (E - 0954) 20 July 1990 (1990-07-20) *

Also Published As

Publication number Publication date
WO1997008737A2 (de) 1997-03-06
DE19532653C1 (de) 1997-01-30

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