WO1997006585A1 - Prise femelle de circuit integre pour conducteurs en forme de j - Google Patents

Prise femelle de circuit integre pour conducteurs en forme de j Download PDF

Info

Publication number
WO1997006585A1
WO1997006585A1 PCT/JP1995/001584 JP9501584W WO9706585A1 WO 1997006585 A1 WO1997006585 A1 WO 1997006585A1 JP 9501584 W JP9501584 W JP 9501584W WO 9706585 A1 WO9706585 A1 WO 9706585A1
Authority
WO
WIPO (PCT)
Prior art keywords
contact
socket
portions
contact terminals
pair
Prior art date
Application number
PCT/JP1995/001584
Other languages
English (en)
Japanese (ja)
Inventor
Akihiko Ito
Yoshihito Kobayashi
Original Assignee
Advantest Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corporation filed Critical Advantest Corporation
Priority to DE19581797T priority Critical patent/DE19581797T1/de
Priority to PCT/JP1995/001584 priority patent/WO1997006585A1/fr
Publication of WO1997006585A1 publication Critical patent/WO1997006585A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
    • H05K7/103—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by sliding, e.g. DIP carriers
    • H05K7/1046—J-shaped leads

Definitions

  • the present invention is suitable for IC elements having J-type leads such as SOJ type (Small outline J type lead package) and QFJ (Quad flat J type lead package).
  • the present invention relates to an IC socket for a J-type lead having high contact reliability with the lead of each IC element used in a so-called horizontal transport type handler for transporting the IC horizontally.
  • IC sockets used for semiconductor test equipment
  • handlers are required to have particularly high contact reliability s with the lead of the IC element.
  • a mechanism for transferring an IC element by a horizontal transfer type handler and testing it by a test device is described in, for example, Japanese Patent Application No. Hei 4 3 4 5 639 "Automatic Test Handler One Contact Assembly", and a corresponding US patent application. It is shown in the description of each of the 0th / 800, 056 (January 3, 1991) specifications, particularly with reference to FIGS.
  • Fig. 1 shows an IC socket used for conventional SOJ-type IC devices.
  • One end of each of the contact terminals 15 and 16 is connected to the bottom of the groove 13 and 14 at the bottom of the groove.
  • the contact terminals 17 and 18 are provided to bend and extend upward along the line. These contact terminals 17 and 18 are folded slightly above the upper ends of the contact terminals 15 and 16 so as to be close to each other.
  • the IC element 19 is placed on the mounting table 12, and leads 22, 23 are led out from both sides of the package 21 of the IC element 19, and the leads 22, 23 are respectively connected to each other in a) shape. It is bent inward, and its tip is closely opposed to the bottom surface of the package 21.
  • the outer ends of the curved lower ends 22a and 23b of the leads 22 and 23 are in contact with the upper ends of the contact terminals 15 and 16 and the contact portions 15a and 16a, respectively, and are immediately derived from the respective packages 21 of the leads 22 and 23.
  • the upper bent portions 17a and 18a of the contact terminals 17 and 18 come into contact with the bent corners 22b and 23b from above, respectively, and the IC element 19 is elastically moved by the contact terminals 17 and 18. Between the contact terminals 15 and 16 and the leads 22 and 23 of the contact terminals 15 and 16 to prevent the IC element 19 from floating from the mounting base 12 and to prevent the contact terminals 15, 16 and 17. Good electrical contact is made between 18 and leads 22 and 23.
  • the conventional IC socket 24 suppresses the IC element 19 with the contact terminals 17 and 18, a relatively large force is required to remove the IC element 19 from the IC socket 24.
  • the force for pushing the IC element 19 into the IC socket is relatively large, but the force for taking out the IC element 19 is extremely small. Rubbing of the leads 22, 23 with the contact terminals 15, 16 or 17, 18 breaks the oxide film of the solder of the lead, and the force necessary to obtain good electrical contact, The contact terminals 17 and 18 are rubbed over a long section from immediately after the IC element is mounted to the IC socket until the mounting is completed. Therefore, while the IC element is repeatedly mounted and removed from the IC socket, the solder on the lead transfers and grows on the contact terminals 17 and 18, causing poor contact, leakage and lead bending, that is, the life of the IC socket 24. Is short.
  • Fig. 2 shows a conventional device used as an IC socket for a horizontal transport type handler for a TSOP (thin small outline package) type IC device.
  • the bases 27a, 28b of a pair of contact terminals 27, 28 are arranged on the left and right sides on the upper surface of the insulating body 26, and the terminals 27b, 28b are inserted through the body 26 downward from the lower edge. It is held, and the outer ends of the bases 27a, 28a are folded back to form elastic portions 27c, 28c that are U-shaped together with the bases 27a, 28a. Are bent upward to form contact portions 27d and 28d.
  • a plurality of such contact terminals 27, 28 are arranged in the longitudinal direction of the body 26, that is, in the direction perpendicular to the paper surface.
  • the leads 31, 32 led out from both sides of the package of the TSOP type IC element 29 are bent downward and then bent outward to form contact portions 31a, 32a. .
  • These lead contact portions 31a and 32a are arranged on the upper end surfaces of the contact portions 27d and 28d of the contact terminals 27 and 28, respectively, and are pushed by the lower end of the IC element 29, as shown by the dotted line.
  • elastic portions 27 c, 28 c is the contact portion 29 d is elastically deformed, 28 d and the contact portion 31 a, 32 a and the force? electrically good contact.
  • the surface of the IC leads 17 and 18 is soldered, and an oxide film is often formed on the surface.
  • the leads 22 and 23 are connected to the upper end contact portions 15 a and 16 a of the contact terminals 15 and 16 and the contact terminals 17 and 16. It is inserted while rubbing the upper bent portion 17a, 18a of 18 so-called wiving is performed, whereby the oxide film is peeled off, and the contact terminals 15, 16, 17 and 18 and the IC lead 22 , 23 make good electrical contact with each other.
  • the TS OP IC socket 35 when the conventional TSOP IC socket 35 is used for the J-type IC element 19, the distance between the contact portions 27d and 28d and the curved lower ends 22a and 23a of the IC lead is reduced. Wiving is extremely small, and good electrical contact may not be obtained. From the above points, the TS OP IC socket 35 is not suitable for a J-type lead IC element. Note The amount of Waibingu force? Greater is electrical contact performed well, half the solder IC lead as described above is attached to the contact pin of the IC socket Occurs field transition, becomes the life force s' short of the IC socket by soldering transition.
  • the object of the present invention is to be used for an IC element having a J-type lead, there is no possibility of deforming the J-type lead, and the electric contact between the IC lead and the contact terminal is good and stable. , With a relatively small solder transition, long life, and high reliability
  • Each of the pair of contact terminals has a holding portion held by the body, a semicircular spring portion having one end integrally connected to the holding portion, and being separated from each other by being integrally connected to the other end of the spring portion. And an arm portion extending obliquely upward so as to be large.
  • the ends of the respective arms opposite to the springs protrude inside each other in an elliptical arc shape, and serve as contact portions with the leads of the IC element.
  • the free ends of the pair of contact terminals are structured so as to be in contact with the outer contact portions with respect to the mounted contact portions at the curved lower ends of the leads of the SOJ type IC element.
  • FIG. 1 is a sectional view showing a conventional J-type lead IC socket.
  • FIG. 2 is a sectional view showing a conventional IC socket for a TSOP type IC element.
  • FIG. 3 is a cross-sectional view assuming that the IC socket shown in FIG. 2 is used for an SOJ type IC device.
  • FIG. 4 is a sectional view showing an embodiment of the present invention.
  • FIG. 5 is a plan view in which the IC element is removed from FIG.
  • a pair of slots 42 and 43 are arranged in a longitudinal direction in a body 41 made of an insulating material such as a rectangular parallelepiped polyetherimide, and a plurality of slots 42 and 43 are provided.
  • the same number of leads 22 and 23 of the IC element 19 of the mating J-type lead are formed at the same pitch and the same number.
  • Contact terminals 44 and 45 are held in the body 41 in the slots 42 and 43, respectively.
  • contact Terminals 4 4 and 4 5 have bases 4 4 a and 45 a extending along slots 4 2 and 4 3, respectively, and the bottom of body 4 1 below the lower edge of bases 4 4 a and 45 a.
  • Terminal portions 44b, 45b protruding from the base portions 44a, 45a, and semicircular spring portions 44c, 45c, which are connected at one end to the base portions 44a, 45a, and spring portions 44c, 4 One end is connected to the other end of 5c, and is composed of arms 44d and 45d that are diagonally extended upward so as to increase the interval therebetween.
  • Each of the spring portions 4 4 c and 45 d of the arms 4 4 d and 45 d has a contact portion 4 4 e and 45 e that protrudes in an elliptical arc shape inside each other at ends opposite to the ends. . Also in this example protrudes in the center connecting part 4 4 f, 4 5 £ Ca?
  • the connecting portions 4 4 ⁇ , 4 5 inner mutually f Spring portions 44c and 45c are connected to the side edge, and the spring portions 44c and 45c are provided so as to approach each other.
  • the base 44 a, the terminal 44 b, the connection 44 f, the spring 44 c, the arm 44 d, and the contact 44 e are formed by punching a spring metal plate such as BeCu. It is integrally formed and further plated with gold.
  • a spring metal plate such as BeCu. It is integrally formed and further plated with gold.
  • Each of the slots 4 2 and 4 3 is slightly longer on the bottom side of the body 41, and the bases 44 a and 45 a are press-fitted into the enlarged portion thereof, and the bases 4 4 g and 45 g are used. 4a and 45a are engaged with and held by the body 41.
  • the contact portions 44 e and 44 f protrude from the upper surface of the body 41.
  • the angle of each of the arms 44 d and 45 d with respect to the vertical line is, for example, about 30 degrees, and the length of the arms 44 d and 45 d (from the spring part to the contact between the contact part and the IC lead).
  • the length to the corresponding point) is about 7 mm
  • the radius of each of the springs 44c and 45c is about 1.3 mm
  • the thickness of each part is 0.4 mm.
  • the leads 22 and 23 of the J-type IC element 19 are arranged on the contact parts 44e and 44f of the contact terminals 44 and 45, and the IC element 19 is pushed down and the spring part 44c and 45c are elastically deformed, and the contact portions 44e and 45e are respectively displaced by, for example, about 0.5 mm as shown by the dotted lines.
  • the curved lower end portions 22a and 23a are brought into contact with the contact portions 44e and 45e at the outer portions of the respective portions.
  • the point where the curved lower ends 22a and 23a come into contact with the contact portions 44e and 45e is very close to the mounting contact portions 22c and 23c.
  • the distance between the terminal portions 44b and 45b of the contact terminals 44 and 45 is alternately different in the direction perpendicular to the paper of FIG. 4 in the arrangement direction of the contact terminals 44 and 45.
  • the IC element 19 is mounted on the carrier 51 and moved to the IC socket 47.
  • the carrier 51 is positioned with respect to the IC socket 47, and 1 ( : Leads 22 and 23 are arranged on contact terminals 44 and 45, respectively, and IC element 19 is pushed down by, for example, about 0.5 mm by a pressing element (not shown), and IC leads 22 and 23 are read. Good contact with the contact terminals 44 and 45.
  • the mounting of the IC element 19 to the IC socket 47 is not limited to the case using the carrier 51.
  • the IC element 19 on the tray is picked up by vacuum suction means.
  • the IC socket 47 is provided with a means for positioning the IC element 19, and 1 (leads 22 and 23 correspond to the contact terminals 44 and 45).
  • the IC socket of the present invention is not limited to a horizontal transport type handler, It can also be applied to heavy transport type handler.
  • the IC socket 47 of the present invention is less likely to deform the IC leads 22 and 23.
  • the curved lower ends 22a and 23a are displaced while rubbing the surfaces of the contact portions 44e and 45e, respectively, so that an appropriate amount of wiping is performed. Oxidized surface of the IC leads 22 and 23 Good electrical contact is obtained regardless of the film. Moreover, since the amount of Waibingu size wards solder metastases without significantly occur, resulting s long IC socket force life.
  • the mounting contact portions 22c and 23 there is no danger of scratching 5 'on c, that is, there is no danger of solder being removed at the mounting contact portions 2 2c and 23 c, and when the IC element 19 is mounted, mounting may not be performed well. Absent. However, since the contact occurs in the immediate vicinity of the mounting contact part, the test can be performed under almost the same electrical conditions as during mounting.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

Deux fentes sont pratiquées dans le sens longitudinal du corps d'une prise femelle fait d'un matériau isolant, de telles paires de fentes étant également pratiquées à angle droit par rapport à ce même sens longitudinal. Des bornes de contact sont disposées dans chaque paire de fentes, chaque paire de bornes de contact étant maintenue au niveau de sa base par les corps. Une partie ressort semi-circulaire est reliée par une extrémité à chacune de ces parties base, tandis qu'une extrémité d'une partie bras est reliée à l'autre extrémité de la partie ressort. Chaque paire de parties bras est orientée obliquement vers le haut de sorte que la distance entre elles augmente, les extrémités supérieures des parties bras servant de parties de contact. Les parties de contact entrent en contact avec les surfaces extérieures des conducteurs en forme de J.
PCT/JP1995/001584 1995-08-09 1995-08-09 Prise femelle de circuit integre pour conducteurs en forme de j WO1997006585A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE19581797T DE19581797T1 (de) 1995-08-09 1995-08-09 IC-Fassung für J-Anschlußleiter
PCT/JP1995/001584 WO1997006585A1 (fr) 1995-08-09 1995-08-09 Prise femelle de circuit integre pour conducteurs en forme de j

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP1995/001584 WO1997006585A1 (fr) 1995-08-09 1995-08-09 Prise femelle de circuit integre pour conducteurs en forme de j

Publications (1)

Publication Number Publication Date
WO1997006585A1 true WO1997006585A1 (fr) 1997-02-20

Family

ID=14126169

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1995/001584 WO1997006585A1 (fr) 1995-08-09 1995-08-09 Prise femelle de circuit integre pour conducteurs en forme de j

Country Status (2)

Country Link
DE (1) DE19581797T1 (fr)
WO (1) WO1997006585A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105051994A (zh) 2013-03-15 2015-11-11 矢崎总业株式会社 电子元件的装配构造及电气接线箱

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5880277A (ja) * 1981-11-05 1983-05-14 山一電機工業株式会社 集積回路板用コネクタ
JPH0225184U (fr) * 1988-08-04 1990-02-19
JPH04181172A (ja) * 1990-11-15 1992-06-29 Nec Kyushu Ltd Ｊ型リード半導体装置用ソケット

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5880277A (ja) * 1981-11-05 1983-05-14 山一電機工業株式会社 集積回路板用コネクタ
JPH0225184U (fr) * 1988-08-04 1990-02-19
JPH04181172A (ja) * 1990-11-15 1992-06-29 Nec Kyushu Ltd Ｊ型リード半導体装置用ソケット

Also Published As

Publication number Publication date
DE19581797T1 (de) 1997-11-27

Similar Documents

Publication Publication Date Title
US5073116A (en) Surface mount LCC socket
JP4584548B2 (ja) 低背コネクタ
KR100371660B1 (ko) Ｉｃ 소켓
EP0929129B1 (fr) Connecteur de bord de carte avec une paire de dispositifs de verrouillage
JP3746106B2 (ja) 基板用電気コネクタ
JP3216050B2 (ja) 低背型表面取付電気コネクタ
JPH11233216A (ja) テスト用ｉｃソケット
EP0426349B1 (fr) Socle support de circuit intégré de faible hauteur
KR20020013760A (ko) 전기 커넥터
JP2002025720A (ja) 基板用コネクタ
KR100344050B1 (ko) Ｐｇａ 패키지용의 낮은 형상 전기 커넥터 및 단자
JPS59114776A (ja) 電気接続端子
JP2000323215A (ja) 電気コネクタ
US7402066B2 (en) Low insertion force socket with lead-in mechanism background of the invention
US5942905A (en) Contact arrangement
JPH0225257B2 (fr)
TWM352797U (en) Electrical contact
US6724081B2 (en) Electronic assembly
WO1997006585A1 (fr) Prise femelle de circuit integre pour conducteurs en forme de j
JP2945087B2 (ja) 電気コネクタ
JP2002270320A (ja) 半導体パッケージ用ソケット
TWI328320B (en) Socket for electrical parts
JPS6013183Y2 (ja) 電気コネクタ
JPH0747828Y2 (ja) Ｉｃソケット
JPS6091577A (ja) リードのない平板状回路を接続する装置とコネクタ

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): DE

RET De translation (de og part 6b)

Ref document number: 19581797

Country of ref document: DE

Date of ref document: 19971127

WWE Wipo information: entry into national phase

Ref document number: 19581797

Country of ref document: DE