DE19581797T1 - IC-Fassung für J-Anschlußleiter - Google Patents

IC-Fassung für J-Anschlußleiter

Info

Publication number
DE19581797T1
DE19581797T1 DE19581797T DE19581797T DE19581797T1 DE 19581797 T1 DE19581797 T1 DE 19581797T1 DE 19581797 T DE19581797 T DE 19581797T DE 19581797 T DE19581797 T DE 19581797T DE 19581797 T1 DE19581797 T1 DE 19581797T1
Authority
DE
Germany
Prior art keywords
socket
connection conductor
conductor
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19581797T
Other languages
English (en)
Inventor
Akihiko Ito
Yoshihito Kobayashi
Takashi Kusano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of DE19581797T1 publication Critical patent/DE19581797T1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/10Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1015Plug-in assemblages of components, e.g. IC sockets having exterior leads
    • H05K7/103Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by sliding, e.g. DIP carriers
    • H05K7/1046J-shaped leads

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
DE19581797T 1995-08-09 1995-08-09 IC-Fassung für J-Anschlußleiter Withdrawn DE19581797T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP1995/001584 WO1997006585A1 (fr) 1995-08-09 1995-08-09 Prise femelle de circuit integre pour conducteurs en forme de j

Publications (1)

Publication Number Publication Date
DE19581797T1 true DE19581797T1 (de) 1997-11-27

Family

ID=14126169

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19581797T Withdrawn DE19581797T1 (de) 1995-08-09 1995-08-09 IC-Fassung für J-Anschlußleiter

Country Status (2)

Country Link
DE (1) DE19581797T1 (de)
WO (1) WO1997006585A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112014001375B4 (de) 2013-03-15 2023-10-12 Yazaki Corporation Elektronische Baugruppenstruktur und elektrische Anschlussbox

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5848992B2 (ja) * 1981-11-05 1983-11-01 山一電機工業株式会社 集積回路板用コネクタ
JPH0225184U (de) * 1988-08-04 1990-02-19
JP2735378B2 (ja) * 1990-11-15 1998-04-02 九州日本電気 株式会社 J型リード半導体装置用ソケット

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112014001375B4 (de) 2013-03-15 2023-10-12 Yazaki Corporation Elektronische Baugruppenstruktur und elektrische Anschlussbox

Also Published As

Publication number Publication date
WO1997006585A1 (fr) 1997-02-20

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8181 Inventor (new situation)

Free format text: ITO, AKIHIKO, SAITAMA, JP KOBAYASHI, YOSHIHITO, SAITAMA, JP

8139 Disposal/non-payment of the annual fee