WO1996026008A1 - Recipient a echantillons - Google Patents

Recipient a echantillons Download PDF

Info

Publication number
WO1996026008A1
WO1996026008A1 PCT/JP1995/000273 JP9500273W WO9626008A1 WO 1996026008 A1 WO1996026008 A1 WO 1996026008A1 JP 9500273 W JP9500273 W JP 9500273W WO 9626008 A1 WO9626008 A1 WO 9626008A1
Authority
WO
WIPO (PCT)
Prior art keywords
sample container
resin
sample
contact
inorganic filler
Prior art date
Application number
PCT/JP1995/000273
Other languages
English (en)
Japanese (ja)
Inventor
Keiichi Katoh
Syuzi Ueda
Original Assignee
Keiichi Katoh
Syuzi Ueda
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP24348594A priority Critical patent/JPH07125739A/ja
Priority claimed from JP24348594A external-priority patent/JPH07125739A/ja
Application filed by Keiichi Katoh, Syuzi Ueda filed Critical Keiichi Katoh
Priority to US08/875,124 priority patent/US6319475B1/en
Priority to PCT/JP1995/000273 priority patent/WO1996026008A1/fr
Publication of WO1996026008A1 publication Critical patent/WO1996026008A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/508—Containers for the purpose of retaining a material to be analysed, e.g. test tubes rigid containers not provided for above
    • B01L3/5085—Containers for the purpose of retaining a material to be analysed, e.g. test tubes rigid containers not provided for above for multiple samples, e.g. microtitration plates
    • B01L3/50851—Containers for the purpose of retaining a material to be analysed, e.g. test tubes rigid containers not provided for above for multiple samples, e.g. microtitration plates specially adapted for heating or cooling samples

Definitions

  • the present invention relates to the construction of a container for holding a sample requiring the application of a thermal process for the fields of medicine, chemistry and biotechnology.
  • sample containers consisted of only a single thick resin layer.Thus, when a temperature process was applied from the outside, heat transfer was extremely poor, and it was possible to efficiently transfer heating and cooling to the sample in the container. could not. In addition, the flexibility of the portion of the outer surface of the sample container that is in contact with the sample container support was not considered, and the heat transfer efficiency from the sample container support to the sample container was poor due to insufficient close contact with the sample container support.
  • the present invention has been made to solve such conventional drawbacks and to efficiently transfer external heating and cooling to a sample to which a temperature process needs to be applied. Disclosure of the invention
  • the present invention employs a technical means of improving heat conduction by adding an inorganic material having a thermal conductivity of 1 OWZ (mK) or more alone in a resin as a filler.
  • the drawbacks of a resin with low thermal conductivity are complemented by a large thermal conductivity L dispersed in the resin and an inorganic filler.
  • the volume content of the inorganic filler is low L, and there is no sufficient effect of improving the thermal conductivity, and at least a volume content of the inorganic filler of 30% is required.
  • the higher the volume content of the inorganic filler the better the thermal conductivity.
  • Increasing the volume content of inorganic fillers is difficult, especially when it exceeds 90%. You.
  • the volume content of the filler can be up to 95% by using the technique that used the spherical inorganic filler particles. Therefore, the volume content of the inorganic filler may be freely selected from the range of 30% to 95% in consideration of the strength, thermal conductivity, cost, shape, and the like.
  • the shape of the filler may be freely selected from particles and whiskers, fibers and foils according to the purpose. If necessary, a plurality of shapes may be combined.
  • Inorganic materials are boron nitride, aluminum oxide, gay carbide, gay nitride, calcium carbonate, magnesium oxide, gay oxide, quartz glass, zirconium oxide, titanium nitride, beryllium oxide, iron oxide.
  • the material may be freely selected from the above materials according to the purpose in consideration of strength, insulation properties, and the like, and a plurality of materials may be combined if necessary.
  • the part in contact with the sample must be made of resin to avoid contact with the inorganic filler. Therefore, this part may be formed by selecting the type of resin according to the properties of the sample and forming a resin-only part.However, if the part consisting of only the resin in contact with the sample is too thin, the resin-only layer may be damaged. Therefore, at least 5 m is required, depending on the resin material, since the sample may come into contact with the inorganic filler. On the other hand, if the thickness is more than a certain value, the thermal resistance of the resin-only part will increase and the heat conduction to the sample will deteriorate, so it is desirable that the thickness be less than 200.
  • the technology adopted is that it consists of only two parts, the rest of which consists of a composite of resin and inorganic filler.
  • the component resin of the portion of the outer surface of the sample container that is in contact with the sample container support is made of a resin that is more flexible than the main component resin of the sample container.
  • the flexible resin deforms on the uneven surface of the surface of the hole of the sample container support where the sample container is inserted, so that it adheres tightly to the sample container from the sample container support rest.
  • the communication is carried out.
  • the deformation mechanism of the flexible resin may be plastic deformation or elastic deformation. In the case of plastic deformation, it is preferable that the tensile strength of the constituent resin at the portion of the outer surface of the sample container that comes into contact with the sample container support be 32 MPa or less.
  • the longitudinal elastic modulus of the component resin in a portion of the outer surface of the sample container that comes into contact with the sample container support is 1.4 GPa or less.
  • the flexible resin may be a gel resin.
  • a resin according to the purpose may be selected from resins having a softening temperature of 100 or less at the portion of the outer surface of the sample container which is in contact with the sample container support. Even when this flexible resin is used, the volume content of the inorganic filler is preferably in the range of 30% or more and 95% or less, and the thickness of 5 m to 300 rn is more effective.
  • the sample can efficiently transmit the temperature process of external heating and cooling to the sample by installing the composite part consisting of resin and inorganic filler with good thermal conductivity.
  • the inorganic filler does not directly contact the sample and does not damage the sample.
  • the constituent resin of the portion of the outer surface of the sample container that is in contact with the sample container support uses a resin that is more flexible than the main component resin of the sample container.
  • FIGS. 1, 4, and 7 are external views of a preferred container according to the present invention.
  • FIGS. 2, 5, and 8 are cross-sectional views of a preferred container according to the present invention.
  • Fig. 6 and Fig. 10 show the container comparison performance test, and
  • Fig. 9 shows a comparative example.
  • FIG. 1 shows the appearance of a preferred container according to the present invention.
  • FIG. 2 is a sectional view taken along line AA of FIG.
  • the sample container has a high thermal conductive part 1 composed of a filler composed of powdered gay carbide and a polypropylene resin, and the filler does not come into direct contact with the sample. Thus, it consists of two parts made of polypropylene resin only.
  • the manufacturing method of this sample container was two-layer blow molding. In other words, the resin is mixed with a volumetric mixing ratio of 0, 20, 30, 50, 70, 80, 90% l / m to 20 m of gay carbide powder as a filler, and is compounded.
  • the high thermal conductivity part 1 was used, the part 2 was made of polypropylene resin only, and the thickness was 30 m.
  • a thermocouple is attached inside each container, and each container is set in a 80 ° C water bath, and the sample container is placed in a water bath of the same condition, that is, 8 ⁇ ' ⁇ .
  • the time required to reach 7 (TC) was measured.
  • TC time required to reach 7
  • the volume mixing ratio of the filler may be freely selected from 30% to 95% in consideration of the strength of the container and the use condition of the container.
  • the particles of the silicon carbide are used as the inorganic filler, but the present invention is not limited to this.
  • the shape of the inorganic filler is not less than 10 W (mK), and the shape of the inorganic filler is not limited to particles, whiskers, fibers and foils. You can choose freely according to your purpose. In this embodiment, only two layers are used, but if necessary, three layers, that is, a relaxation layer may be provided between the first and second layers. By providing this layer, the shear stress of the first and second layers can be reduced.
  • the part 2 that comes into contact with the internal sample is the same polypyrene as the part 1 in the present embodiment, but is not limited to this.
  • the method of manufacturing the part 2 that is in contact with the sample is not limited to the two-color blow molding. —It may be formed by ting.
  • FIG. 4 a gel-like silicon resin layer in which elastic copper powder was dispersed was formed on a portion of the outer surface of the container prepared in the above example, which was in contact with the sample container support, as shown in FIG. .
  • the portion 3 in FIG. 4 is a gel-like silicon resin layer in which elastic copper powder is dispersed.
  • FIG. 5 is a sectional view taken along line AA of FIG. This part is formed by adding copper powder as an inorganic filler to the silicone resin before gelation in a container with a volume blending ratio of 70% of the gay carbide filler prepared in the above example, and uniformly distributing it.
  • the flexible portion may be selected from materials within the scope of the present invention. That is, the component of the outer surface of the sample container that is in contact with the sample container support
  • the tensile strength of the component resin is 32 MPa or less or the longitudinal elastic modulus is 1.4 GPa or less, or the softening temperature is 100 or less
  • Resins according to the purpose may be selected from the above resins.
  • a relaxation layer may be provided between one part of the composite high thermal conductivity part and three parts of the flexible part. By providing this layer, the shear stress of the second and third layers can be reduced.
  • the inorganic filler dispersed in the flexible portion 3 is not limited to copper powder.
  • the shape may be freely selected from inorganic fillers having a power of 10 W / (mK) or more, such as particles, whiskers, fibers and foils, according to the purpose.
  • FIG. 7 shows the appearance of a sample container of another embodiment.
  • FIG. 8 is an A-A cross section of FIG.
  • 7 parts were made of boron nitride particles as an inorganic filler at a volume mixing ratio of 60%, epoxy was used as the resin, 8 parts were polypropylene, and 9 parts were soft PVC in which boron nitride particles were dispersed.
  • the same test as in Example 2 was performed. That is, for comparison, as shown in FIG. 9, a sample container comprising a portion 10 of only epoxy resin and a portion 11 of polypropylene without inorganic filler is prepared.
  • sample containers 13 are set in the anoremi block 12 and the sample Container 13 was pressed from above by rod 14.
  • a thermocouple was attached to the bottom part 15 of the sample support part of the sample container and tested. The result was that the temperature reached 70 "C.
  • the temperature of this example was 1/7 that of the comparative example, which was better. Results were obtained.
  • the present invention is a sample container having high heat conduction and high heat transfer that enables a temperature process for external heating and cooling to be quickly and efficiently transmitted to a sample.
  • the invention is suitable for biotechnology and related fields of chemistry, medicine, and engineering, and opens up new uses and applications.

Landscapes

  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Hematology (AREA)
  • Clinical Laboratory Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Laminated Bodies (AREA)

Abstract

Récipient à échantillons classique qui est fabriqué à partir d'une seule résine. Par conséquent, lorsque ce récipient à échantillons est soumis à un processus thermique, son rendement est très bas. Cette invention décrit un récipient d'échantillons à conductivité et à taux d'échange thermiques élevés. La partie du récipient en contact avec l'échantillon est uniquement en résine, tandis que la partie du récipient qui est en contact avec le support d'échantillon est en un matériau à base de mélange de résine molle et d'une matière de remplissage à haute conductivité thermique. Le récipient est utilisé en biotechnologie, dans les domaines de la chimie, de la médecine et de l'ingénierie, ainsi que dans d'autres domaines de pointe en cours de développement.
PCT/JP1995/000273 1993-09-03 1995-02-24 Recipient a echantillons WO1996026008A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP24348594A JPH07125739A (ja) 1993-09-03 1994-09-01 サンプル容器
US08/875,124 US6319475B1 (en) 1995-02-24 1995-02-24 Sample container
PCT/JP1995/000273 WO1996026008A1 (fr) 1994-09-01 1995-02-24 Recipient a echantillons

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP24348594A JPH07125739A (ja) 1993-09-03 1994-09-01 サンプル容器
PCT/JP1995/000273 WO1996026008A1 (fr) 1994-09-01 1995-02-24 Recipient a echantillons

Publications (1)

Publication Number Publication Date
WO1996026008A1 true WO1996026008A1 (fr) 1996-08-29

Family

ID=26436240

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1995/000273 WO1996026008A1 (fr) 1993-09-03 1995-02-24 Recipient a echantillons

Country Status (1)

Country Link
WO (1) WO1996026008A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1438137A1 (fr) * 2001-09-20 2004-07-21 3-Dimensional Pharmaceuticals, Inc. Plaque de microtitrage conductrice
WO2009030908A2 (fr) * 2007-09-06 2009-03-12 It-Is International Ltd Appareil de régulation thermique pour réactions chimiques et biochimiques

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57174084A (en) * 1981-04-17 1982-10-26 Eisai Co Ltd Container for test
JPS634857A (ja) * 1986-06-24 1988-01-09 Nitsushiyoo:Kk ミニスピツツ
JPH03192129A (ja) * 1989-12-21 1991-08-22 Sumitomo Chem Co Ltd 断熱支持材および容器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57174084A (en) * 1981-04-17 1982-10-26 Eisai Co Ltd Container for test
JPS634857A (ja) * 1986-06-24 1988-01-09 Nitsushiyoo:Kk ミニスピツツ
JPH03192129A (ja) * 1989-12-21 1991-08-22 Sumitomo Chem Co Ltd 断熱支持材および容器

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1438137A1 (fr) * 2001-09-20 2004-07-21 3-Dimensional Pharmaceuticals, Inc. Plaque de microtitrage conductrice
EP1438137A4 (fr) * 2001-09-20 2010-07-07 Johnson & Johnson Pharm Res Plaque de microtitrage conductrice
WO2009030908A2 (fr) * 2007-09-06 2009-03-12 It-Is International Ltd Appareil de régulation thermique pour réactions chimiques et biochimiques
WO2009030908A3 (fr) * 2007-09-06 2009-08-13 It Is Internat Ltd Appareil de régulation thermique pour réactions chimiques et biochimiques
US9492825B2 (en) 2007-09-06 2016-11-15 It-Is International Limited Thermal control apparatus for chemical and biochemical reactions

Similar Documents

Publication Publication Date Title
US5738936A (en) Thermally conductive polytetrafluoroethylene article
KR100677818B1 (ko) 방열 구조체
US6311769B1 (en) Thermal interface materials using thermally conductive fiber and polymer matrix materials
JP2004080040A (ja) 高度に充填されているか又は低度に架橋されている熱伝導性インタフェースパッドを与えるための可とう性表面層フィルム
US20100172101A1 (en) Thermal interface material and method for manufacturing the same
KR20000064867A (ko) 전도성，수지-기재 조성물
JP7053484B2 (ja) 三次元形状熱伝導性成形体、及びその製造方法
JPH06155517A (ja) 熱伝導性複合シートの製造方法
CN107686699A (zh) 导热界面材料和导热界面材料制备方法
Li et al. Compliance-tunable thermal interface materials based on vertically oriented carbon fiber arrays for high-performance thermal management
US20010050836A1 (en) Electrostatic chuck for ion injector
CN108728046A (zh) 一种导热储热复合材料及其制备方法、导热储热散热装置
WO2018078436A1 (fr) Corps moulé thermoconducteur en trois dimensions, et son procédé de fabrication
WO1996026008A1 (fr) Recipient a echantillons
Li et al. An improvement of thermal conductivity of underfill materials for flip-chip packages
CN101807565B (zh) 半导体系统
JPH07125739A (ja) サンプル容器
JPH11307697A (ja) 熱伝導性複合シート
US6319475B1 (en) Sample container
CN106280050B (zh) 一种高导热硅橡胶层状复合材料
JP6735432B1 (ja) 熱伝導性シリコーンゴム組成物とそのシート及びその製造方法
Uppal et al. Precuring Matrix Viscosity Controls Thermal Conductivity of Elastomeric Composites with Compression‐Activated Liquid and Solid Metallic Filler Networks
CN108164753B (zh) 高导热绝缘氧化锌晶须及其制备方法和用途
JP3372487B2 (ja) シリコーンゴム成形体
TWI604037B (zh) Fluororesin sheet and manufacturing method thereof

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): US

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH DE DK ES FR GB GR IE IT LU MC NL PT SE

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 08875124

Country of ref document: US

122 Ep: pct application non-entry in european phase