WO1996026008A1

WO1996026008A1 - Sample container

Info

Publication number: WO1996026008A1
Application number: PCT/JP1995/000273
Authority: WO
Inventors: Keiichi Katoh; Syuzi Ueda
Original assignee: Keiichi Katoh; Syuzi Ueda
Priority date: 1994-09-01
Filing date: 1995-02-24
Publication date: 1996-08-29

Abstract

A conventional sample container is formed out of a single resin. Therefore, when such a sample container is subjected to a temperature process, the efficiency is very low. The present invention provides a sample container of a high heat conductivity and a high heat transfer rate. The portion of this sample container, in contact with a sample, is formed out of a resin alone, the portion, in contact with the sample support, is made of a material of a mixture of a soft resin, and a filler of a high heat conductivity. The other portions are made of a resin and a filler of a high heat conductivity. The container is suitably used in the biotechnological field, the fields concerning chemistry, medicine and engineering, and other fields possible in future.

Description

Description Sample container Technical field

The present invention relates to the construction of a container for holding a sample requiring the application of a thermal process for the fields of medicine, chemistry and biotechnology. Background art

Conventional sample containers consisted of only a single thick resin layer.Thus, when a temperature process was applied from the outside, heat transfer was extremely poor, and it was possible to efficiently transfer heating and cooling to the sample in the container. could not. In addition, the flexibility of the portion of the outer surface of the sample container that is in contact with the sample container support was not considered, and the heat transfer efficiency from the sample container support to the sample container was poor due to insufficient close contact with the sample container support.

The present invention has been made to solve such conventional drawbacks and to efficiently transfer external heating and cooling to a sample to which a temperature process needs to be applied. Disclosure of the invention

The present invention employs a technical means of improving heat conduction by adding an inorganic material having a thermal conductivity of 1 OWZ (mK) or more alone in a resin as a filler. In other words, the drawbacks of a resin with low thermal conductivity are complemented by a large thermal conductivity L dispersed in the resin and an inorganic filler. The volume content of the inorganic filler is low L, and there is no sufficient effect of improving the thermal conductivity, and at least a volume content of the inorganic filler of 30% is required. The higher the volume content of the inorganic filler, the better the thermal conductivity. Increasing the volume content of inorganic fillers is difficult, especially when it exceeds 90%. You. For example, the volume content of the filler can be up to 95% by using the technique that used the spherical inorganic filler particles. Therefore, the volume content of the inorganic filler may be freely selected from the range of 30% to 95% in consideration of the strength, thermal conductivity, cost, shape, and the like. In addition, the shape of the filler may be freely selected from particles and whiskers, fibers and foils according to the purpose. If necessary, a plurality of shapes may be combined. Inorganic materials are boron nitride, aluminum oxide, gay carbide, gay nitride, calcium carbonate, magnesium oxide, gay oxide, quartz glass, zirconium oxide, titanium nitride, beryllium oxide, iron oxide. , Diamond, gold, silver, copper, aluminum, tungsten, molybdenum, and the like. The material may be freely selected from the above materials according to the purpose in consideration of strength, insulation properties, and the like, and a plurality of materials may be combined if necessary.

Due to the nature of the sample, the part in contact with the sample must be made of resin to avoid contact with the inorganic filler. Therefore, this part may be formed by selecting the type of resin according to the properties of the sample and forming a resin-only part.However, if the part consisting of only the resin in contact with the sample is too thin, the resin-only layer may be damaged. Therefore, at least 5 m is required, depending on the resin material, since the sample may come into contact with the inorganic filler. On the other hand, if the thickness is more than a certain value, the thermal resistance of the resin-only part will increase and the heat conduction to the sample will deteriorate, so it is desirable that the thickness be less than 200. The technology adopted is that it consists of only two parts, the rest of which consists of a composite of resin and inorganic filler.

The component resin of the portion of the outer surface of the sample container that is in contact with the sample container support is made of a resin that is more flexible than the main component resin of the sample container. In other words, the flexible resin deforms on the uneven surface of the surface of the hole of the sample container support where the sample container is inserted, so that it adheres tightly to the sample container from the sample container support rest. The communication is carried out. Here, the deformation mechanism of the flexible resin may be plastic deformation or elastic deformation. In the case of plastic deformation, it is preferable that the tensile strength of the constituent resin at the portion of the outer surface of the sample container that comes into contact with the sample container support be 32 MPa or less. In the case of elastic deformation, it is preferable that the longitudinal elastic modulus of the component resin in a portion of the outer surface of the sample container that comes into contact with the sample container support is 1.4 GPa or less. Alternatively, the flexible resin may be a gel resin. As another method, when the temperature process applied to the sample is performed in the range of 50 to 100 and the following range, the component on the outer surface of the sample container that is in contact with the sample container support rest, even if the softening temperature of the component resin is 50 For example, the constituent resin at the portion in contact with the sample container support is easily deformed by heat because of a temperature process of 50 ° C. or more, and adheres closely. In the field of biotechnology, the range of the applied temperature process is almost 100 ° C or less. Therefore, a resin according to the purpose may be selected from resins having a softening temperature of 100 or less at the portion of the outer surface of the sample container which is in contact with the sample container support. Even when this flexible resin is used, the volume content of the inorganic filler is preferably in the range of 30% or more and 95% or less, and the thickness of 5 m to 300 rn is more effective.

According to the sample container configured as described above, the sample can efficiently transmit the temperature process of external heating and cooling to the sample by installing the composite part consisting of resin and inorganic filler with good thermal conductivity. The inorganic filler does not directly contact the sample and does not damage the sample. In addition, the constituent resin of the portion of the outer surface of the sample container that is in contact with the sample container support uses a resin that is more flexible than the main component resin of the sample container. Brief description of the drawing that enables the container to be in close contact

FIGS. 1, 4, and 7 are external views of a preferred container according to the present invention. FIGS. 2, 5, and 8 are cross-sectional views of a preferred container according to the present invention. Fig. 6 and Fig. 10 show the container comparison performance test, and Fig. 9 shows a comparative example. BEST MODE FOR CARRYING OUT THE INVENTION

The present invention will be described with reference to the accompanying drawings in order to explain the present invention in more detail.

FIG. 1 shows the appearance of a preferred container according to the present invention. FIG. 2 is a sectional view taken along line AA of FIG. As shown in the cross-sectional configuration of Fig. 2, the sample container has a high thermal conductive part 1 composed of a filler composed of powdered gay carbide and a polypropylene resin, and the filler does not come into direct contact with the sample. Thus, it consists of two parts made of polypropylene resin only. The manufacturing method of this sample container was two-layer blow molding. In other words, the resin is mixed with a volumetric mixing ratio of 0, 20, 30, 50, 70, 80, 90% l / m to 20 m of gay carbide powder as a filler, and is compounded. The high thermal conductivity part 1 was used, the part 2 was made of polypropylene resin only, and the thickness was 30 m. A thermocouple is attached inside each container, and each container is set in a 80 ° C water bath, and the sample container is placed in a water bath of the same condition, that is, 8 ο'υ. The time required to reach 7 (TC) was measured. The results are shown in Fig. 3. As can be seen from the figure, when the volumetric mixing ratio of the filler is out of the range of the present invention and less than 30%, the composite high heat conductive part 1 The thermal conductivity is not sufficient, and the higher the volume ratio of the filler, the better the results. If it is high, problems such as deterioration of strength occur. Therefore, the volume mixing ratio of the filler may be freely selected from 30% to 95% in consideration of the strength of the container and the use condition of the container. Here, the particles of the silicon carbide are used as the inorganic filler, but the present invention is not limited to this.The shape of the inorganic filler is not less than 10 W (mK), and the shape of the inorganic filler is not limited to particles, whiskers, fibers and foils. You can choose freely according to your purpose. In this embodiment, only two layers are used, but if necessary, three layers, that is, a relaxation layer may be provided between the first and second layers. By providing this layer, the shear stress of the first and second layers can be reduced. In this embodiment, the part 2 that comes into contact with the internal sample is the same polypyrene as the part 1 in the present embodiment, but is not limited to this. Select the resin material in part 2. The method of manufacturing the part 2 that is in contact with the sample is not limited to the two-color blow molding. —It may be formed by ting.

As shown in FIG. 4, a gel-like silicon resin layer in which elastic copper powder was dispersed was formed on a portion of the outer surface of the container prepared in the above example, which was in contact with the sample container support, as shown in FIG. . Here, the portion 3 in FIG. 4 is a gel-like silicon resin layer in which elastic copper powder is dispersed. FIG. 5 is a sectional view taken along line AA of FIG. This part is formed by adding copper powder as an inorganic filler to the silicone resin before gelation in a container with a volume blending ratio of 70% of the gay carbide filler prepared in the above example, and uniformly distributing it. For this purpose, add a surfactant, dispersant, etc., stir, and apply a solvent whose viscosity is adjusted using a solvent. Then, a gelling process is performed on this portion. In this example, gelation treatment by heat was performed, and then a second test was performed to test the performance of this container.

6 Install a flexible part on the aluminum block 4 of the dry A comparison test was performed by inserting a container that was not installed and a container that was not installed. Each container Arumipuro' click should be set to 8 0 ^D C put weight on the sample container top in order to increase the adhesion of the container and the container supporting portion inserted into the container support portion. Then, the arrival time up to 70 was measured in the same manner as in Example 1. As a result, the container with the flexible part was able to shorten the arrival time by 80% compared to the container without the flexible part. In this embodiment, the flexible portion is provided by coating, but is not limited to this. For example, it may be performed at the same time as molding the container. That is, three-color molding may be performed by a method such as induction. Of course, the flexible portion may be selected from materials within the scope of the present invention. That is, the component of the outer surface of the sample container that is in contact with the sample container support The tensile strength of the component resin is 32 MPa or less or the longitudinal elastic modulus is 1.4 GPa or less, or the softening temperature is 100 or less Resins according to the purpose may be selected from the above resins. In addition, a relaxation layer may be provided between one part of the composite high thermal conductivity part and three parts of the flexible part. By providing this layer, the shear stress of the second and third layers can be reduced. The inorganic filler dispersed in the flexible portion 3 is not limited to copper powder. The shape may be freely selected from inorganic fillers having a power of 10 W / (mK) or more, such as particles, whiskers, fibers and foils, according to the purpose.

FIG. 7 shows the appearance of a sample container of another embodiment. FIG. 8 is an A-A cross section of FIG. Here, 7 parts were made of boron nitride particles as an inorganic filler at a volume mixing ratio of 60%, epoxy was used as the resin, 8 parts were polypropylene, and 9 parts were soft PVC in which boron nitride particles were dispersed. The same test as in Example 2 was performed. That is, for comparison, as shown in FIG. 9, a sample container comprising a portion 10 of only epoxy resin and a portion 11 of polypropylene without inorganic filler is prepared. As shown in Fig. 10, sample containers 13 are set in the anoremi block 12 and the sample Container 13 was pressed from above by rod 14. A thermocouple was attached to the bottom part 15 of the sample support part of the sample container and tested. The result was that the temperature reached 70 "C. The temperature of this example was 1/7 that of the comparative example, which was better. Results were obtained.

Although the present invention has been specifically described based on the embodiments, the present invention is not limited to the above embodiments, and it goes without saying that various modifications can be made without departing from the gist of the present invention. Industrial applicability

INDUSTRIAL APPLICABILITY As described above, the present invention is a sample container having high heat conduction and high heat transfer that enables a temperature process for external heating and cooling to be quickly and efficiently transmitted to a sample. The invention is suitable for biotechnology and related fields of chemistry, medicine, and engineering, and opens up new uses and applications.

Claims

The scope of the claims

1-A sample container having at least one sample holding part, wherein the constituent material is composed of a resin and an inorganic filler.

2. The sample container according to claim 1, wherein the portion in contact with the sample is composed of only a resin, and the remainder has a structure composed of at least two portions composed of a composite of a resin and an inorganic filler. .

3. The sample container according to claim 1, wherein the constituent resin of a portion of the outer surface of the sample container that contacts the sample container support is a resin that is more flexible than the main component resin of the sample container.

4. The resin that is in contact with the sample only, the resin that is in contact with the sample container support on the outer surface of the sample container, and the composite resin-inorganic filler and the resin that is the main component of the sample container A structure in which a stress relaxation layer is provided on at least one of the boundary layers of each portion of the easily deformable resin by a polymer bonding method for preventing destruction due to a difference in expansion coefficient. 4. The sample container according to paragraph 3 and 3.

5. The sample container according to claim 1, wherein the volume content of the inorganic filler is 30% to 95%.

6. The method according to claim 1, wherein the inorganic filler is at least one material selected from the group consisting of a ceramic metal having a thermal conductivity of 1 OW / (mK) or more and a carbon. Sample container.

7. The sample container according to claim 1, wherein the inorganic filler has at least one kind of shape selected from particles and whiskers and fibers and foils.

8. The inorganic fillers are boron nitride, aluminum oxide, gay carbide, silicon nitride, calcium carbonate, magnesium oxide, gay oxide, quartz glass, Claims: The main component is at least one material selected from zirconium oxide, titanium nitride, beryllium oxide, carbon, diamond, gold, silver, copper, aluminum, tungsten, and molybdenum. Sample container according to item 1.

9. The sample container according to claim 2, wherein the thickness of the portion composed of only the resin directly in contact with the sample is 5 m to 200 m / m.

10. The thickness of the part of the outer surface of the sample container where the constituent resin in contact with the sample container support is a resin that is more flexible than the main component resin of the sample container should be 5 / m to 300. 4. The sample container according to claim 3, wherein the sample container is a container.

11. The sample container according to claim 3, wherein a tensile strength of a constituent resin at a portion of the outer surface of the sample container that contacts the sample container support is 32 MPa or less.

12. The sample container according to claim 3, wherein a longitudinal elastic modulus of a constituent resin of a portion of the outer surface of the sample container which is in contact with the sample container support is 1.4 GPa or less.

13. The sample container according to claim 3, wherein a constituent resin of a portion of the outer surface of the sample container that contacts the sample container support is a gel.

14. The sample container according to claim 3, wherein the softening temperature of the constituent resin in a portion of the outer surface of the sample container that contacts the sample container support is 100 or less.