WO1996016796A1 - Contact electrique comportant une surface particulaire - Google Patents

Contact electrique comportant une surface particulaire Download PDF

Info

Publication number
WO1996016796A1
WO1996016796A1 PCT/US1995/016044 US9516044W WO9616796A1 WO 1996016796 A1 WO1996016796 A1 WO 1996016796A1 US 9516044 W US9516044 W US 9516044W WO 9616796 A1 WO9616796 A1 WO 9616796A1
Authority
WO
WIPO (PCT)
Prior art keywords
contact
electrical contact
conductive
particles
conductive particles
Prior art date
Application number
PCT/US1995/016044
Other languages
English (en)
Other versions
WO1996016796B1 (fr
Inventor
David R. Crotzer
Gregory E. Dean
Original Assignee
Augat Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Augat Inc. filed Critical Augat Inc.
Publication of WO1996016796A1 publication Critical patent/WO1996016796A1/fr
Publication of WO1996016796B1 publication Critical patent/WO1996016796B1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/06—Contacts characterised by the shape or structure of the contact-making surface, e.g. grooved
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/60—Auxiliary means structurally associated with the switch for cleaning or lubricating contact-making surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/023—Hard particles, i.e. particles in conductive adhesive at least partly penetrating an electrode
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1168—Graft-polymerization
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1344—Spraying small metal particles or droplets of molten metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S439/00—Electrical connectors
    • Y10S439/931—Conductive coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Definitions

  • This invention relates to electrical contacts for providing electrical interconnection between conductive surfaces.
  • the present invention comprises an electrical contact having solid homogenous conductive particles on the contact surface.
  • the particles are of greater hardness than that of the contact material to deform the contact material and cause breakage or fracture of the oxide or other contaminating layer, or to penetrate the contaminating layer.
  • the particles are applied to the contact surface by a technique which results in the particles being intimately bonded to the contact surface, usually as a layer of particles.
  • a preferable technique for such particle application is hypervelocity oxygen fuel spraying (HVOF) or plasma spraying, by which the particles are embedded on the contact surfaces to provide a substantially permanent interparticle bond between the applied particles and the contact material.
  • HVOF hypervelocity oxygen fuel spraying
  • plasma spraying by which the particles are embedded on the contact surfaces to provide a substantially permanent interparticle bond between the applied particles and the contact material.
  • the contact surface on which the particle layer is provided can be the outer surface of a single layer or multi ⁇ layer electrical contact structure.
  • the contact surface can alternatively be the outer surface of a plated or other contact layer which is itself provided on a supporting structure.
  • the contact surface can be, for example, on a contact pad or contact area of an integrated circuit or other electronic device or package, circuit board or other type of electrical device such as a switch, keypad and the like.
  • the contact surface may also be on a resilient substrate or element such as shown in co-pending application, Serial No. 08/294,370, filed August 23, 1994 (AUG-C-549XX) .
  • the particles can also be provided on the conductive surface of an electrical shield, ground plane or gasket.
  • the solid homogenous conductive particles can be composed of noble metals such as gold, silver, platinum and palladium, other metals such as copper, nickel and iron, or conductive compounds such as tungsten carbide or chromium carbide.
  • a metal filler, such as cobalt, copper or silver can be added to the carbide to increase the conductivity.
  • the particle sizes can range from about 200 microinches to about 1 microinch or less.
  • the particle size should be greater than the thickness of the oxide or other contaminating coating in order to engage the underlying contact surface.
  • the oxide thickness can vary considerably, and can typically be in the range of about 100 Angstroms to about 1 mil.
  • the hardness of the particles typically is in the range of about 100-7000 on the Knoop scale. Particles of different sizes can be employed together and applied randomly to the contact surface.
  • the particles may be in a continuous layer or in a non-continuous layer on a contact surface.
  • the mating contact surface which engages the particulate surface can itself be a similar particulate surface or a non- particle covered contact surface.
  • the conductive particles can be applied to a conductive as well as a non-conductive substrate.
  • the particles can serve as the only conductive layer, or the conductive particles can be provided on an intermediate conductive plating or other layer which itself is on the non-conductive substrate.
  • FIG. 1 illustrates an annular ring embodying the invention for contacting an inserted terminal pin
  • Fig. 2 illustrates a board-to-board connector with contacts embodying the invention
  • Fig. 2a is a partial elevation view of an alternative contact structure for the connector of Fig. 2;
  • FIG. 3 shows an edge card connector having contact areas according to the invention
  • Figs. 4a through 4d show respective views of a terminal pin interconnect embodying the invention
  • Fig. 5 illustrates a test probe having a resilient contact tip embodying the invention
  • Figs. 6a and 6b illustrate a resilient interconnect embodying the invention
  • Figs. 7a through 7c illustrate electrical switch devices having contact areas according to the invention.
  • annular ring 30 which is connected to one or more circuit traces 32 of a printed circuit board 34.
  • the ring is aligned around a hole through the circuit board and into which a lead 35 of an electrical or electronic device is inserted.
  • the ring is composed of a resilient core of material such as silicon rubber having a flexible conductive coating or layer on the surfaces of the ring.
  • the opening through the annular ring is slightly smaller than the diameter of the electrical lead or pin to be inserted therethrough such that compressive force is provided between the inserted lead and surrounding ring to maintain the lead in position.
  • the flexible conductive layer is provided preferably by a chemical grafting technique by which metallization is provided on the surfaces of the ring.
  • the conductive coating can also be applied by techniques such as dipping, ink jet printing, roller coating, screen printing, or spray coating, which techniques are themselves known in the art.
  • a particulate layer is provided over the conductive layer of the ring or at least over the contact portions of the conductive layer, in this case the circumferential wall 36 of the ring.
  • the particulate layer is composed of conductive and homogeneous hard particles which are of greater hardness than the hardness of the mating content surface or surfaces.
  • the particles are carborundum having a metal such as copper or silver disposed therein.
  • a hardness typically in the range of about 100-7000 on the Knoop scale is suitable.
  • the particles are plasma injected onto the conductive coating.
  • the conductive coating is sufficiently flexible and resilient to not impede the resilience of the core material.
  • the ring can compress when in contact with a mating electrical lead and expand when out of mating contact without peeling or cracking of the conductive coating on the surface of the ring.
  • the resilient interconnect ring can be fabricated by molding the core material in the desired shape.
  • a metallization is applied to the ring surfaces preferably by chemical grafting, and the particulate layer is then applied to the surface of the metallization layer. Copper or other metal may optionally be electroless plated onto the metallization layer prior to application of the particulate layer.
  • FIG. 2 shows a right angle board to board connector which includes a connector body 80 formed of a suitable dielectric material such as FR-4, Teflon (PTFE) or phenolic, having on a first face 82 a plurality of conductive contact areas 84 arranged in an intended pattern, and electrically connected via conductive traces 86 to corresponding contact areas 88 provided on an orthogonal face 90 of the body.
  • the contact areas 84 are mated to corresponding contact areas of printed circuit board 100
  • contact areas 88 are mated to corresponding contact areas of printed circuit board 102.
  • the interconnection assembly of the two circuit boards and connector body is maintained by a suitable mechanism (not shown) and which per se is known in the connector field.
  • the contact areas 84 and 88 have a particulate layer provided on the contact surfaces thereof.
  • the surfaces of the body on which the contact areas 84 and 88 are formed may have raised pedestal areas, and which may have a resilient layer on which the conductive contact layer is provided.
  • Fig. 2a there is shown a portion of one of the surfaces of the connector body 80 having raised pedestals 81.
  • a resilient layer 83 is provided on the outer surfaces of the pedestals, and over which a conductive layer 85 is provided having the particles embedded thereon in accordance with the invention.
  • the connector body 80 may itself be of a resilient or elastomeric material which is compressed during engagement of the contact areas with the associated circuit boards to provided contact pressure.
  • an edge card connector which comprises a body 110 of elastomeric material having a plurality of raised ridges 112 onto each of which a conductor 114 is provided.
  • the conductors extend down respective sides of the body, as illustrated and through openings in the bottom portion of the body and thence along the bottom surface of the body.
  • the particulate layer is provided on at least the contact portions 115 of the conductors 114.
  • a circuit board or circuit card having contact areas corresponding to the contact areas of the connector is inserted, into the connector body for engagement with the respective contact portions 115 of the connector.
  • the illustrated edge card connector has contacts on opposite sides to engage opposite rows of contact areas of a double sided circuit board or card. It will be recognized that single sided connectors can also be provided to engage and make contact with single sided circuit cards.
  • Various other connector configurations are also contemplated to accommodate various electrical and electronic interconnect applications and configurations.
  • FIGs. 4a through 4d Another embodiment is illustrated in Figs. 4a through 4d wherein the conductive particulate coatings are provided within openings of a female socket or interconnect.
  • the interconnect body 120 has a plurality of holes 122 therethrough each of which has a conductive surface with particulate coating 124 for electrical contact of corresponding electrical pins 126 of a mating connector 128.
  • Each of the conductive surfaces of the interconnect openings terminate on the back surface in an annular contact area 130 for mating with appropriate circuit board or other interconnections.
  • Each of the connector openings can have an outwardly flared entry section 132 which is also has a conductive coating.
  • the particulate coating can also be provided on the contact surfaces of areas 130.
  • an electrical test probe having a probe body 140 with an elastomeric spherical probe tip 142 secured at one end.
  • the tip is an elastomeric ball having a conductive surface with particulate coating.
  • the probe body has a conductive surface or may be of conductive material such as metal. The probe body is retained within a suitable fixture to position the tip over the contact area and to compress the tip against the contact area for electrical engagement therewith.
  • the elastomeric spheres with conductive particulate surfaces can also be embodied in an interconnection device as shown in Figs. 6a and 6b.
  • the spheres 150 are retained within a suitable housing (not shown) which is interposed between a printed circuit board 152 having conductive pads 154, and an electronic device 156 also having conductive pads 158.
  • the device is forced toward the printed circuit board against the biasing of the elastomeric spheres and the pad areas of the device and circuit board are interconnected by the interposed conductive spheres.
  • the device is maintained in contact engagement with the circuit board by a suitable socket mechanism (not shown) .
  • the invention can also be usefully employed in the fabrication of electrical switches, such as shown in Figs. 7a through 7c.
  • one or more conductive particulate contact areas 159 is applied to the switch actuator 161.
  • a pushbutton switch is shown in Fig. 7a in which a conductive particulate contact area 159 is provided on the actuator. Upon manual depression of the actuator, the contact area engages the confronting contact areas 163 of the switch terminals.
  • a slide switch is shown in Fig. 7b in which the slidable actuator 165 includes particulate contact areas 167 on respective ends.
  • a toggle switch is depicted in Fig. 7c in which the toggle mechanism 170 includes particulate contact areas 172.
  • the switch terminals 174 of the switch terminals can also have the particulate layer mateable with the particulate layer of the actuator.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

Contact électrique (84) dont la surface de contact (84) contient des particules conductrices pleines et homogènes. Ces particules sont plus dures que celles du matériau de contact (84) et peuvent ainsi former celui-ci et casser la couche d'oxyde ou autre couche contaminante, ou alors pénétrer une couche contaminante. Les particules sont appliquées sur la surface de contact (84) au moyen d'une technique grâce à laquelle elles se lient intimement à cette surface, généralement sous forme d'une couche de particules. Une technique privilégiée pour l'application des particules est la projection d'oxygène liquide à très grande vitesse (HVOF) ou la projection plasma, qui incruste les particules sur les surfaces de contact (84) pour produire un lien interparticulaire sensiblement permanent entre les particules appliquées et la matériau de contact (84).
PCT/US1995/016044 1994-12-02 1995-11-30 Contact electrique comportant une surface particulaire WO1996016796A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/349,042 US5527591A (en) 1994-12-02 1994-12-02 Electrical contact having a particulate surface
US08/349,042 1994-12-02

Publications (2)

Publication Number Publication Date
WO1996016796A1 true WO1996016796A1 (fr) 1996-06-06
WO1996016796B1 WO1996016796B1 (fr) 1996-08-01

Family

ID=23370666

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1995/016044 WO1996016796A1 (fr) 1994-12-02 1995-11-30 Contact electrique comportant une surface particulaire

Country Status (3)

Country Link
US (1) US5527591A (fr)
TW (1) TW312891B (fr)
WO (1) WO1996016796A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1304196C (zh) * 1996-10-28 2007-03-14 托马斯-贝茨国际公司 层状组合物及其制备方法

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6326704B1 (en) 1995-06-07 2001-12-04 Automotive Technologies International Inc. Vehicle electrical system
US6733036B2 (en) 1995-06-07 2004-05-11 Automotive Technologies International, Inc. Automotive electronic safety network
US6533316B2 (en) 1995-06-07 2003-03-18 Automotive Technologies International, Inc. Automotive electronic safety network
US6648367B2 (en) 1995-06-07 2003-11-18 Automotive Technologies International Inc. Integrated occupant protection system
US6271482B1 (en) 1994-08-23 2001-08-07 Thomas & Betts International, Inc. Conductive elastomer interconnect
US5607882A (en) * 1994-12-20 1997-03-04 Lucent Technologies Inc. Multi-component electronic devices and methods for making them
US9443358B2 (en) 1995-06-07 2016-09-13 Automotive Vehicular Sciences LLC Vehicle software upgrade techniques
US5692050A (en) * 1995-06-15 1997-11-25 Binaura Corporation Method and apparatus for spatially enhancing stereo and monophonic signals
US7744122B2 (en) 1995-12-12 2010-06-29 Automotive Technologies International, Inc. Driver side aspirated airbags
US6072324A (en) 1996-03-19 2000-06-06 Micron Technology, Inc. Method for testing semiconductor packages using oxide penetrating test contacts
CA2245413C (fr) * 1997-09-16 2001-09-18 Thomas & Betts International, Inc. Elastomere electroconducteur a fixer a un substrat elastique
US6019609A (en) * 1998-05-15 2000-02-01 Thomas & Betts International, Inc. Elastomeric shielded connector
US10240935B2 (en) 1998-10-22 2019-03-26 American Vehicular Sciences Llc Vehicle software upgrade techniques
US6165628A (en) 1999-08-30 2000-12-26 General Electric Company Protective coatings for metal-based substrates and related processes
US6590324B1 (en) * 1999-09-07 2003-07-08 Veeco Instruments, Inc. Charged particle beam extraction and formation apparatus
US6200146B1 (en) 2000-02-23 2001-03-13 Itt Manufacturing Enterprises, Inc. Right angle connector
CA2350853A1 (fr) * 2001-06-15 2002-12-15 Groupe Minutia Inc. Methode d'etablissement de la conductivite electrique entre des conducteurs electriques recouverts d'oxyde
DE10223209A1 (de) * 2002-05-24 2003-12-04 Delphi Tech Inc Verfahren zum Verbessern der elektrischen Leitfähigkeit und der Korrosions- und Verschleißfestigkeit einer flexiblen Schaltung
US7825512B2 (en) * 2005-09-12 2010-11-02 Hewlett-Packard Development Company, L.P. Electronic package with compliant electrically-conductive ball interconnect
US9985295B2 (en) * 2005-09-26 2018-05-29 General Electric Company Solid oxide fuel cell structures, and related compositions and processes
BRPI0815902B1 (pt) * 2007-08-24 2020-11-10 Inventio Ag processo para aplicação de um revestimento antiderrapante
KR101339166B1 (ko) * 2012-06-18 2013-12-09 주식회사 아이에스시 관통공이 형성된 도전성 입자를 가지는 검사용 소켓 및 그 제조방법
US9459285B2 (en) * 2013-07-10 2016-10-04 Globalfoundries Inc. Test probe coated with conductive elastomer for testing of backdrilled plated through holes in printed circuit board assembly
US20150093923A1 (en) * 2013-09-27 2015-04-02 Lotes Co., Ltd Terminal
JP6485465B2 (ja) * 2017-01-18 2019-03-20 アンデン株式会社 接点装置及び電磁継電器
CN108241240B (zh) * 2018-02-08 2021-05-14 上海天马微电子有限公司 一种显示面板以及显示装置
US10670653B2 (en) 2018-05-15 2020-06-02 International Business Machines Corporation Integrated circuit tester probe contact liner
US11509080B2 (en) 2020-07-22 2022-11-22 Te Connectivity Solutions Gmbh Electrical connector assembly having hybrid conductive polymer contacts
US11128072B1 (en) 2020-07-22 2021-09-21 TE Connectivity Services Gmbh Electrical connector assembly having variable height contacts
US11509084B2 (en) 2020-07-24 2022-11-22 Te Connectivity Solutions Gmbh Electrical connector assembly having hybrid conductive polymer contacts
US11894629B2 (en) 2021-03-09 2024-02-06 Tyco Electronics Japan G.K. Electrical interconnect with conductive polymer contacts having tips with different shapes and sizes

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5300340A (en) * 1988-02-26 1994-04-05 Minnesota Mining And Manufacturing Company Electrically conductive pressure-sensitive adhesive tape

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5137461A (en) * 1988-06-21 1992-08-11 International Business Machines Corporation Separable electrical connection technology
US5083697A (en) * 1990-02-14 1992-01-28 Difrancesco Louis Particle-enhanced joining of metal surfaces
US5118299A (en) * 1990-05-07 1992-06-02 International Business Machines Corporation Cone electrical contact

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5300340A (en) * 1988-02-26 1994-04-05 Minnesota Mining And Manufacturing Company Electrically conductive pressure-sensitive adhesive tape
US5494730A (en) * 1988-02-26 1996-02-27 Minnesota Mining And Manufacturing Company Electrically conductive pressure-sensitive adhesive tape

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1304196C (zh) * 1996-10-28 2007-03-14 托马斯-贝茨国际公司 层状组合物及其制备方法

Also Published As

Publication number Publication date
US5527591A (en) 1996-06-18
TW312891B (fr) 1997-08-11

Similar Documents

Publication Publication Date Title
US5527591A (en) Electrical contact having a particulate surface
US5600099A (en) Chemically grafted electrical devices
JP4082735B2 (ja) 導電性エラストマーと、これを作る方法
US6524115B1 (en) Compliant interconnect assembly
EP1032079B1 (fr) Elément d'interconnexion en matériau elastomère conducteur
US8499442B2 (en) Process for fabricating a connector
US7726984B2 (en) Compliant interconnect apparatus with laminate interposer structure
US20050164527A1 (en) Method and system for batch forming spring elements in three dimensions
KR100898503B1 (ko) 고주파 인터포저
US6117539A (en) Conductive elastomer for grafting to an elastic substrate
US7063542B2 (en) Compliant electrical probe device incorporating anisotropically conductive elastomer and flexible circuits
US6641406B1 (en) Flexible connector for high density circuit applications
KR200444773Y1 (ko) 실리콘 콘택터
KR100412973B1 (ko) 미립자표면필드를가진전기접촉장치
KR100442022B1 (ko) 화학적으로그래프팅된전기장치
KR101099502B1 (ko) 내마모성이 우수한 도체 접촉부 및 그 도체 접촉부의 제조방법
JP2009193710A (ja) 異方導電性コネクターおよびこの異方導電性コネクターを用いた回路装置の検査装置
KR100441578B1 (ko) 이방도전성 쉬이트 및 커넥터
WO2004093252A2 (fr) Connecteur electrique et son procede de fabrication
JPH06104035A (ja) 電気接続用コネクタ
KR20190125842A (ko) 이방 도전성 시트

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): CA CN JP KP

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH DE DK ES FR GB GR IE IT LU MC NL PT SE

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
CFP Corrected version of a pamphlet front page

Free format text: REVISED ABSTRACT RECEIVED BY THE INTERNATIONAL BUREAU AFTER COMPLETION OF THE TECHNICAL PREPARATIONS FOR INTERNATIONAL PUBLICATION

122 Ep: pct application non-entry in european phase