WO1996009158A1 - Foiled ud-prepreg and pwb laminate prepared therefrom - Google Patents
Foiled ud-prepreg and pwb laminate prepared therefrom Download PDFInfo
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- WO1996009158A1 WO1996009158A1 PCT/EP1995/003652 EP9503652W WO9609158A1 WO 1996009158 A1 WO1996009158 A1 WO 1996009158A1 EP 9503652 W EP9503652 W EP 9503652W WO 9609158 A1 WO9609158 A1 WO 9609158A1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
- B29C70/28—Shaping operations therefor
- B29C70/40—Shaping or impregnating by compression not applied
- B29C70/50—Shaping or impregnating by compression not applied for producing articles of indefinite length, e.g. prepregs, sheet moulding compounds [SMC] or cross moulding compounds [XMC]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
- B29C70/06—Fibrous reinforcements only
- B29C70/08—Fibrous reinforcements only comprising combinations of different forms of fibrous reinforcements incorporated in matrix material, forming one or more layers, and with or without non-reinforced layers
- B29C70/088—Fibrous reinforcements only comprising combinations of different forms of fibrous reinforcements incorporated in matrix material, forming one or more layers, and with or without non-reinforced layers and with one or more layers of non-plastics material or non-specified material, e.g. supports
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/095—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyurethanes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/08—Impregnating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/024—Woven fabric
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/12—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer characterised by the relative arrangement of fibres or filaments of different layers, e.g. the fibres or filaments being parallel or perpendicular to each other
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
- B29K2105/08—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts of continuous length, e.g. cords, rovings, mats, fabrics, strands or yarns
- B29K2105/10—Cords, strands or rovings, e.g. oriented cords, strands or rovings
- B29K2105/101—Oriented
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
- B29K2105/08—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts of continuous length, e.g. cords, rovings, mats, fabrics, strands or yarns
- B29K2105/10—Cords, strands or rovings, e.g. oriented cords, strands or rovings
- B29K2105/101—Oriented
- B29K2105/108—Oriented arranged in parallel planes and crossing at substantial angles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/24—Condition, form or state of moulded material or of the material to be shaped crosslinked or vulcanised
- B29K2105/243—Partially cured
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/25—Solid
- B29K2105/253—Preform
- B29K2105/256—Sheets, plates, blanks or films
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/02—Synthetic macromolecular fibres
- B32B2262/0276—Polyester fibres
- B32B2262/0284—Polyethylene terephthalate [PET] or polybutylene terephthalate [PBT]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/514—Oriented
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2363/00—Epoxy resins
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0287—Unidirectional or parallel fibers
Definitions
- the present invention pertains to a basic material for making a PWB laminate comprising at least one layer of parallel, unidirectionally oriented (UD) reinforcing fibres impregnated with not yet fully consolidated matrix resin, i.e., a UD prepreg layer.
- the invention also pertains to laminates for use in printed wire boards (PWBs) prepared from such a UD prepreg layer.
- a UD prepreg material for making PWBs is known from US 4,814,945.
- This disclosure relates to a PWB laminate comprising a matrix resin reinforced with parallel aramid fibres.
- the laminate is built up from layers of unidirectional aramid tape stacked one on top of the other in crosswise fashion.
- the aramid tape is formed by arranging a single layer of parallel aramid fibres to form fibre strips, coating the fibre strips with resin, and heating them to a semi-cured or "B"-stage.
- a problem easily incurred when making UD crossply laminates is disorientation of the UD layers. Retaining proper orientation is necessary for obtaining a laminate having sufficient flatness, which is a property of particular importance to a PWB laminate. Particularly if a still flowable matrix resin is used, e.g., B-stage material, there is a substantial risk of disorientation occurring since, on account of the flow which occurs during lamination, the tension, and hence the orientation of the UD layers, cannot be adequately controlled.
- a still flowable matrix resin e.g., B-stage material
- UD-reinforced crossply composite laminates on the basis of prepreg.
- prepreg usually woven glass-fabric prepreg
- resin systems and lamination technology of proven viability in this field.
- the customary prepregs are less prone to disorientation problems.
- UD-crossply laminates are pre-eminently suitable as PWB substrate. Of course, this holds only if these laminates can be manufactured by means of a method that enables retaining proper orientation.
- a problem associated with the orientation of UD fibres is addressed in DE 3542295. It pertains to photographic shutter materials on the basis of a substrate layer of oriented fibres contained in a matrix resin. It is disclosed that by applying a layer of a heat-shrinkable synthetic foil onto the substrate layer, positional deviations of the parallel fibres during shaping under pressure may be suppressed. The use of a heat-shrinkable foil will cause the UD prepreg to slightly bend in the fibre direction. While this may be desirable in the case of a shutter material, in a PWB laminate it should be avoided entirely.
- JP-Hei-4-329,132 teaches a hybrid prepreg article for use therein.
- the hybrid prepreg comprises two different kinds of parallel fibres, essentially thick ones having a diameter of from 30 to 500 ⁇ m and thin ones of 5 to 30 ⁇ m, and a metal layer of 5-100 ⁇ m thickness.
- any reinforcing fibres be filaments having a diameter below 30 ⁇ m, and preferably of from 3 to 15 ⁇ m, since thicker fibres are prohibitive for suitable drilling of holes and for obtaining a desirable surface flatness. It is particularly with thin prepregs, having thin reinforcing fibers, that handling problems occur.
- JP-Hei-6-008,240 teaches structural composites, the outermost layer of which has been covered with a metal or metal-compound film. While the core of the composite can be reinforced with parallel, unidirectional yarns, the outer layers are reinforced with glass cloth.
- the disclosure is directed to shaped, round articles such as golf club shafts or antennas.
- Japanese Patent Application Laid-Open No. 201699/1985 discloses a heat-bondable electric shielding material which comprises a metal foil, a heat-bondable resin layer formed thereon, and a multiplicity of parallel reinforcing wires fixed to the resin layer.
- the conductive wires which have a diameter of from 0.03 to 0.5 mm, are spaced apart 10 to 15 cm. It is disclosed that if the metal foil is to be prevented from wrinkling, the shielding material should be wound up together with a cushioning material, e.g. a polyurethane foam sheet.
- EP 0372 505 It essentially discloses a fibre-reinforced thermoplastic laminate.
- the fibre reinforcement can be in any form.
- the thermoplastic laminate is provided with a metal foil when in the molten state. It generally is a high temperature thermoplastic, which is solid at room temperature.
- the disclosed laminate is not the type of basic material for making PWBs that the invention is aiming at, as it serves as a PWB laminate itself.
- the laminate manufactured according to EP 372 505 is a laminate having the final properties of a PWB substrate.
- the invention essentially aims at UD prepregs which can be used to make PWBs, but are not suitable as PWB laminates in themselves.
- the invention now seeks to provide a UD prepreg layer that allows further handling and processing without incurring problems such as indicated above, and is of a type essentially suitable for making a PWB laminate. Furthermore, the invention seeks to provide a UD prepreg layer in which it is possible to employ a thermally curable resin as the not yet fully consolidated resin without suffering from the additional problems associated therewith. To this end the invention provides a basic material for making a PWB laminate comprising a UD prepreg layer of the type indicated above, wherein the reinforcing fibres have a diameter of below 30 ⁇ m, and a layer of a conductive metal foil, such as copper foil, the layer of conductive metal foil being bonded to the UD prepreg layer.
- the layer of conductive metal foil makes for a UD prepreg material having sufficient strength perpendicular to the fibres direction to prevent tearing during handling. If the foil is laminated onto the UD prepreg prior to its being cut to size, the problem of handling a thin copper foil is solved too.
- the invention pertains to a basic material for making a PWB laminate.
- This basic material comprises a layered structure, the two consecutive layers bonded to each other being a layer of a metal foil, such as copper foil, and a layer of parallel, unidirectionally oriented fibres impregnated with not yet fully consolidated matrix resin.
- prepreg is well-known in the art and generally indicates a reinforcing material impregnated with resin and (semi)cured. It usually is still in a tacky stage.
- not yet fully consolidated matrix material indicates that the resin can be further cured still. In the case of a thermoset resin, it generally refers to the matrix resin being in the B stage.
- the several matrix material (matrix resin) stages are customarily identified in the art as the “A”, "B”, and “C” stages, the A stage indicating unsolidified resin (i.e., in the case of a thermoset resin: the uncured stage), the B stage generally indicating partial solidification (in the case of a thermoset resin: the reaction has proceeded through the formation of longer chains, but not to full network formation), and the C stage indicating a solidified (cured) stage.
- the terms A stage, B stage and C stage are known to the person of ordinary skill in the art and require no further elucidation here.
- the foiled prepreg of the invention can be laminated with other prepreg layers or with layers of a consolidated material.
- other layers comprise a woven fabric reinforcement, but if the advantages of UD reinforcement are to be enjoyed in full, the other layers should have UD parallel fibres as well, i.e., should be UD prepreg layers or consolidated (non-flowing) UD composite layers such as disclosed in WO 92/22191.
- Woven glass fibres are impregnated with a solution of epoxy resin in MEK.
- the resulting prepreg is cut to length and stacked between two copper foils.
- This package is cured under pressure at elevated temperature in a multidaylight press.
- the laminate coated with copper on both sides manufactured in this manner is then formed into a printed wire board by etching.
- PWB laminates on the basis of the UD prepreg according to the invention can be manufactured in essentially analogous manner.
- the preparation of the UD prepreg basic material deviates from the process of impregnating and curing a woven fabric.
- the UD prepreg can be conveniently prepared by coating a copper foil with matrix resin to form a foiled resin layer, heating the foiled resin layer so as to ensure that the resin is sufficiently flowable for impregnation of filaments to occur, and applying parallel filaments onto the resin to form a foiled UD-reinforced resin layer.
- the impregnation can also be carried through inversely, viz.
- the foiled UD-reinforced resin layer is either further heated or subjected to actinic radiation to effect partial curing of the resin (e.g., to the B-stage) or cooled down in order for the resin to solidify (e.g., with a thermoplastic resin that is solid at room temperature).
- the resulting foiled UD prepreg is easier to handle than both the bare copper foil and the corresponding non-foiled UD prepreg.
- the foiled prepreg is cut to length and ready to be stacked and laminated with other, non- foiled, UD layers.
- the non-foiled UD layers will form the inner laminae and be sandwiched between two foiled UD prepregs (with the Cu-foil layers on the outer surfaces).
- the invention also pertains to a method of making a PWB laminate wherein several layers comprising parallel, unidirectionally oriented reinforcing fibres contained in a resin matrix are stacked and pressed.
- the layers forming the outer surfaces of the laminate are formed of a foiled UD-prepreg comprising a layer of a conductive metal foil bonded to a UD-prepreg layer, the conductive metal foil being on the outside of the laminate.
- the layers forming the inner laminae of the PWB laminate are prepreg layers comprising parallel, unidirectionally oriented reinforcing fibres impregnated with not yet fully consolidated matrix resin, i.e., non-foiled UD prepreg.
- the layers forming the inner laminae of the laminate are formed of non-flowing UD-composite layers or non-flowing UD crossply laminates.
- non-flowing UD composite is used to indicate a composite material comprising unidirectionally oriented reinforcing fibres enclosed in a matrix material which has been solidified (consolidated) to the extent that it is not brought to flow again during the 96/09158 PCI7EP95/03652
- the non-flowing UD composite is under such conditions of pressure and temperature as to be in a state below its softening point (i.e., below Tg or apparent Tg), or solidified to a stage in which flow no longer can occur.
- Tg softening point
- solidification of the non- flowing UD composite it is preferred for the solidification of the non- flowing UD composite to have reached the C stage, or for such resins to be used as those comprising rigid molecular chains in which, under regular storage and processing conditions, a non-flowing state may already be attained at a stage still called the B stage.
- a stage material can be employed.
- these laminae can be prepared in accordance with WO 92/22191. It is also possible to stack and laminate foiled UD prepreg in accordance with the invention using intermediate substrates such as disclosed in WO 92/22192, which may be coated with adhesive or not.
- UD crossply laminates preferably are balanced and symmetric.
- the term "balanced” indicates equal properties in perpendicular directions (e.g., an equal number of filaments in the x and y directions)
- the term "symmetric” indicates mirror image symmetry over the thickness of the laminate, i.e., the laminate is mid-plane symmetric.
- the plane of symmetry which runs through the centre of the laminate and is parallel to the laminate's outer surfaces, is either the boundary between two UD layers or an imaginary plane running through one UD layer, depending on the number and order of UD layers over the thickness of the laminate.
- a major advantage of such a balanced and mid-plane symmetric laminate provided with crosswise applied UD-reinforced layers consists in the isomorphism of its properties in the x and y directions (i.e., the two fibre directions perpendicular to each other). More particular preference is given to the laminate being so composed that the UD-reinforced layers are oriented as specified in one of the following models, with 0° and 90° standing for orthogonal orientational directions and the relative thickness of the layers being indicated by repeating the given orientation where necessary: 0°/90°90°/0°
- the UD-reinforced layers in the laminate according to the invention will each have a thickness in the range of 6 to 800 ⁇ m, preferably of about 12.5 to 400 ⁇ m.
- the outer layers of the crossply laminate will be formed by a foiled UD prepreg in accordance with the present invention, i.e., a layered structure having a layer of metal foil (say; Cu) and a UD layer (say; 0°) .
- the inner UD layers have a double thickness as compared with the outer UD layers
- the inner layers can be built up of a UD prepreg.
- the UD layers of double thickness do not display the same handling problems as a UD layer of single thickness (which problem is solved in accordance with the invention by applying metal foil).
- the inner layers are the above-identified non-flowing UD composite layers in accordance with WO 92/22191.
- the stack of non- foiled UD layers sandwiched between two foiled UD prepregs is such that the UD-reinforced layers are oriented as specified in one of the above models, i.e., Cu0°/90 o 90 o /0°Cu, or Cu0°/90 o 90 o /0 o 0 o /90°90 o /0°Cu.
- the lamination may be conducted in a multidaylight press, an autoclave, a vacuum press, a double belt press, or in any other suitable apparatus.
- the PWB laminates made on the basis of the foiled UD-prepreg in acccordance with the present invention are suitable to be used in multilayer PWBs (MLBs), e.g., as disclosed in WO 92/22192.
- MLBs multilayer PWBs
- the materials employed in carrying through the present invention are not especially critical. Preferably, use is made of the materials discussed hereinafter.
- the matrix material is a thermoplastic or a ther osetting polymer, preference being given to thermosetting resins. More preferred is the use of an epoxy resin based matrix material, but other resins are also useful in principle. Examples include cyanate esters, unsaturated polyester (UP) resins, vinyl ester resins, acrylate resins, BT epoxy resin, bismaleimide resin (BMI), polyi ide (PI), phenol resins, triazines, polyurethanes, silicone resin, biscitraconic resin (BCI). Alternatively, combinations of said resins may be employed, and it is also possible to mix the aforementioned resins with certain appropriate thermoplasts, such as PPO, PES, PSU, and PEI among others.
- thermosetting resins More preferred is the use of an epoxy resin based matrix material, but other resins are also useful in principle. Examples include cyanate esters, unsaturated polyester (UP) resins, vinyl ester resins, acrylate resins, BT epoxy resin, bismaleimide resin (BMI
- interpenetrating polymer networks may be suitable. It is of advantage to incorporate compounds into the matrix material to render it flame resistant, such as phosphorus or halogen-(particularly bromine-) containing compounds.
- a particular matrix material which is preferred for its favourable flow and curing properties comprises about 100 parts by weight of Epikote ® 828 EL, about 73 parts by weight of Epikote ® 5050, and about 4 parts by weight of a complex of boron trifluoride and onoethyl amine.
- the preferred reinforcing material consists of filament yarns
- non-continuous fibres may also be employed.
- the reinforcing yarns are preferably selected from the following group of materials: glass, e.g., E-glass, A-glass, C-glass, D-glass, AR-glass, R-glass, Sl-glass, and S2-glass, and various ceramic materials, such as alumina and silicon carbide.
- polymer based fibres more particularly so-called liquid- crystalline polymers, such as paraphenylene terephthalamide (PPDT), polybenzobisoxazole (PBO), polybenzobisthiazole (PBT), and polybenzoimidazole (PBI), as are fibres based on polyethylene naphthalate (PEN), polyethylene terephthalate (PET), and polyphenylene sulphide (PPS).
- the fibres (filaments) should have a diameter of below 30 ⁇ m, e.g. 20 ⁇ m. Typical diameters more particularly range from 3 to 15 ⁇ m, and preferably are of from 5 to 13 ⁇ m.
- the fibre content in the matrix is about 10-90 vol .%, preferably in the range of about 40 to about 70 vol.%.
- a fibre volume fraction of about 50 vol .% is highly satisfactory.
- the composite laminates manufactured using the process according to the invention are also suited to be used in a flexible panel or laminate and in rigid-flex laminates.
- woven fabrics undergo cracking at the junctions of warp and weft fibres, due to the fact that fibres oriented in the bending direction are interwoven with fibres perpendicular to the bending direction, this adverse effect being enhanced by the high fibre concentration at these junctions, which leads to cracking at a relatively low degree of bending.
- Such cracks cause a high concentration of stress in the conductive traces present on the flexible laminate, and consequently a high risk of cracking, which leads to circuit breakage.
- the orientation of the outer UD layers preferably parallels the desired bending direction.
- the present UD crossply laminates are pre-eminently suited to be used as supporting material in devices with various integrated circuits provided thereon (multichip modules). This is notably due to the favourable TCEs, which mostly are the result of the high fibre volume fraction that can be obtained when crossply laminates are used and may be close to the TCEs of electronic components (chips) used in conjunction with PWBs, more particularly MLBs. Such components may be provided on top of an MLB (chip-on-board) or else be embedded in a substrate such as an intermediate substrate according to WO 92/22192 (chip-in-board) .
- Fig. 1 shows a foiled UD prepreg (1) in accordance with the invention.
- a foiled UD prepreg (1) in accordance with the invention.
- copper foil (2) which is applied onto a UD prepreg layer (3) made up of parallel, unidirectionally oriented reinforcing fibres (4) impregnated with not yet fully consolidated matrix resin (5).
- Fig. 2 shows a non-flowing UD composite (6) in accordance with WO 92/22191.
- x and y cross-sections are two layers made up of UD fibres (7) impregnated with non-flowing matrix resin (8).
- Fig. 3 shows a CuO°/90°90°/0°Cu PWB laminate made by stacking and laminating the non-flowing UD composite (6), with two foiled UD prepregs (1).
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Mechanical Engineering (AREA)
- Textile Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8510579A JPH10508720A (ja) | 1994-09-19 | 1995-09-18 | 箔を貼られたud−プリプレグ及びそれから作られたプリント配線板用積層板 |
KR1019970701433A KR970705465A (ko) | 1994-09-19 | 1995-09-18 | 박막형 ud-프리프레그 및 그로부터 제조되는 pwb 적층판(foiled udprepreg and pwb laminate prepared therefrom) |
EP95932765A EP0782500A1 (en) | 1994-09-19 | 1995-09-18 | Foiled ud-prepreg and pwb laminate prepared therefrom |
MX9702059A MX9702059A (es) | 1994-09-19 | 1995-09-18 | Material preimpregnado orientado unidireccionalmente de lamina delgada y unidad laminar para tablero de alambrado impreso preparada a partir del mismo. |
AU35684/95A AU694564B2 (en) | 1994-09-19 | 1995-09-18 | Foiled UD-prepreg and PWB laminate prepared therefrom |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP94202688.1 | 1994-09-19 | ||
EP94202688 | 1994-09-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1996009158A1 true WO1996009158A1 (en) | 1996-03-28 |
Family
ID=8217206
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP1995/003652 WO1996009158A1 (en) | 1994-09-19 | 1995-09-18 | Foiled ud-prepreg and pwb laminate prepared therefrom |
Country Status (9)
Country | Link |
---|---|
EP (1) | EP0782500A1 (ko) |
JP (1) | JPH10508720A (ko) |
KR (1) | KR970705465A (ko) |
CN (1) | CN1158101A (ko) |
AU (1) | AU694564B2 (ko) |
CA (1) | CA2200314A1 (ko) |
MX (1) | MX9702059A (ko) |
TW (1) | TW371285B (ko) |
WO (1) | WO1996009158A1 (ko) |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51111879A (en) * | 1975-03-27 | 1976-10-02 | Mitsubishi Gas Chemical Co | Manufacture of metal foillclad preepreg |
WO1983001755A1 (en) * | 1981-11-18 | 1983-05-26 | Chabrier, Gilbert | Method for the manufacture of sections made of fiber-containing thermoplastic resin, installation for the implementation thereof and sections obtained thereby |
EP0372505A2 (en) * | 1988-12-07 | 1990-06-13 | Phillips Petroleum Company | Method for producing reinforced thermoplastic composite-metallic foil laminated articles |
JPH04329132A (ja) * | 1991-04-30 | 1992-11-17 | Tonen Corp | ハイブリッドプリプレグ |
WO1994002306A1 (en) * | 1992-07-21 | 1994-02-03 | Akzo Nobel N.V. | A method of manufacturing a ud-reinforced pwb laminate |
-
1994
- 1994-11-02 TW TW083110086A patent/TW371285B/zh active
-
1995
- 1995-09-18 WO PCT/EP1995/003652 patent/WO1996009158A1/en not_active Application Discontinuation
- 1995-09-18 MX MX9702059A patent/MX9702059A/es unknown
- 1995-09-18 CN CN95195145A patent/CN1158101A/zh active Pending
- 1995-09-18 CA CA002200314A patent/CA2200314A1/en not_active Abandoned
- 1995-09-18 JP JP8510579A patent/JPH10508720A/ja active Pending
- 1995-09-18 KR KR1019970701433A patent/KR970705465A/ko not_active Application Discontinuation
- 1995-09-18 AU AU35684/95A patent/AU694564B2/en not_active Ceased
- 1995-09-18 EP EP95932765A patent/EP0782500A1/en not_active Ceased
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51111879A (en) * | 1975-03-27 | 1976-10-02 | Mitsubishi Gas Chemical Co | Manufacture of metal foillclad preepreg |
WO1983001755A1 (en) * | 1981-11-18 | 1983-05-26 | Chabrier, Gilbert | Method for the manufacture of sections made of fiber-containing thermoplastic resin, installation for the implementation thereof and sections obtained thereby |
EP0372505A2 (en) * | 1988-12-07 | 1990-06-13 | Phillips Petroleum Company | Method for producing reinforced thermoplastic composite-metallic foil laminated articles |
JPH04329132A (ja) * | 1991-04-30 | 1992-11-17 | Tonen Corp | ハイブリッドプリプレグ |
WO1994002306A1 (en) * | 1992-07-21 | 1994-02-03 | Akzo Nobel N.V. | A method of manufacturing a ud-reinforced pwb laminate |
Non-Patent Citations (2)
Title |
---|
DATABASE WPI Week 7646, Derwent World Patents Index; AN 76-86180X * |
PATENT ABSTRACTS OF JAPAN vol. 17, no. 168 (M - 1391) 31 March 1993 (1993-03-31) * |
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Also Published As
Publication number | Publication date |
---|---|
CN1158101A (zh) | 1997-08-27 |
AU694564B2 (en) | 1998-07-23 |
JPH10508720A (ja) | 1998-08-25 |
EP0782500A1 (en) | 1997-07-09 |
KR970705465A (ko) | 1997-10-09 |
MX9702059A (es) | 1997-06-28 |
AU3568495A (en) | 1996-04-09 |
CA2200314A1 (en) | 1996-03-28 |
TW371285B (en) | 1999-10-01 |
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