WO1995012643A1 - Electrically conductive adhesives - Google Patents

Electrically conductive adhesives Download PDF

Info

Publication number
WO1995012643A1
WO1995012643A1 PCT/US1994/002273 US9402273W WO9512643A1 WO 1995012643 A1 WO1995012643 A1 WO 1995012643A1 US 9402273 W US9402273 W US 9402273W WO 9512643 A1 WO9512643 A1 WO 9512643A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive
substrate
porous
resin
polyurethane
Prior art date
Application number
PCT/US1994/002273
Other languages
English (en)
French (fr)
Inventor
David Robert King
Original Assignee
W. L. Gore & Associates, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by W. L. Gore & Associates, Inc. filed Critical W. L. Gore & Associates, Inc.
Priority to DE69411940T priority Critical patent/DE69411940T2/de
Priority to AU66964/94A priority patent/AU6696494A/en
Priority to JP7513190A priority patent/JPH09504568A/ja
Priority to EP94914701A priority patent/EP0726925B1/de
Publication of WO1995012643A1 publication Critical patent/WO1995012643A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4827—Materials
    • H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29499—Shape or distribution of the fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0278—Polymeric fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249982—With component specified as adhesive or bonding agent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249982—With component specified as adhesive or bonding agent
    • Y10T428/249983—As outermost component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249982—With component specified as adhesive or bonding agent
    • Y10T428/249984—Adhesive or bonding component contains voids
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249982—With component specified as adhesive or bonding agent
    • Y10T428/249985—Composition of adhesive or bonding component specified
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2804—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers

Definitions

  • polymeric conductive adhesives such as epoxy resins loaded with conductive particles, such as carbon or silver or the like
  • conductive particles such as carbon or silver or the like
  • the amount of particles in the adhesive needs to be high, e.g., as high as 80% filler in some instances. The large amount of particles is needed to insure particle to particle contact through the resin matrix. This high amount of particles causes the resin/filler combination to be brittle or of weak bond strength.
  • this invention provides an electrically conductive adhesive comprising a porous substrate having numerous passages extending through the substrate, in which the walls of the substrate defining the passages are coated with a conductive metal so as to provide a continuous coating from one side of the substrate to the other, and in which the remaining passage volume is substantially filled with an adhesive resin.
  • Figure 1 is a cross-section of an adhesive film of the invention.
  • a substrate structure 10 which has passageways 11 extending from one side of the substrate to the other.
  • the substrate can be a fabric, a porous membrane, a foam, or the like. Preferably it should be resilient and compressible to provide compliance when used as an adhesive substrate.
  • the fabric can be a woven, nonwoven, knit or the like, provided it has the requisite passageways.
  • Representative fabrics can be polya ide, PTFE, polyester, polyurethane or polyimide, or the like.
  • An especially preferred substrate, for its strength, compressibility, temperature resistance, flame retardancy and chemical inertness is expanded porous polytetrafluoroethylene (PTFE) preferred as described in U.S. Patent 3,953,566 which has a microstructure of nodes interconnected by fibrils in the nodes and fibrils define the continuous passageways or pores.
  • PTFE polytetrafluoroethylene
  • the substrate will generally be between 0.3 and 40 mil thick (7.6 micrometers to 1 millimeter) and generally will take the form of a sheet, although the shape can be matched to the components that are being bonded together.
  • the walls of the passageways have adhered to them a conductive metal 12 (see Figure 1) which can be formed on the walls by an electroless plating procedure.
  • Representative conductive metals include copper, nickel, silver, gold, and the like.
  • the metal coating, or plating does not fill the passageway volume but only covers the material defining the passageways.
  • the substrate is a polymeric fabric such as a polyester fabric
  • conductive plated substrates are available from Monsanto Co., under the tradename Flectron materials.
  • the conductive plated substrate can be prepa ,-d as described generally in Manniso, U.S. Patent 4,557,957.
  • Suitable adhesives include epoxy resin, acrylic resin, urethane resin, silicone resin, polyimide resin, cyanate ester resin, or the like.
  • the adhesive is conveniently imbibed into the pores by immersing the substrate in a solution of the adhesive.
  • a suitable solvent is methylethylketone.
  • the resulting adhesive-filled, conductively coated substrate so prepared is useful as a conductive adhesive.
  • the adhesive can be used to bond components together. Commonly the adhesive is placed between two metallic surfaces and heat and pressure applied, as required, until a bond is formed. Because of the conductive coating extending from one side of the adhesive to the other, an electrical current flows from one metal surface to the other.
  • An electrically conductive adhesive was prepared using a substrate of a 5 mil (127 micrometer) thick sheet of plated porous PTFE made by W. L. Gore & Associates, Inc., Part Number NC17201-04- 1.
  • the sheet was impregnated with an epoxy adhesive resin (Nelco N-4205-2) in an methylethylketone (MEK) solvent (20% solids by weight) by immersing for 15 seconds at 25°C. The solvent was then evaporated at 163°C in an oven.
  • the epoxy imbibed sheet was determined to contain 30% epoxy resin by weight.
  • the adhesive product prepared as above was tested by bonding two aluminum plates together. Specifically, two aluminum plates that had not been treated with surface-treating chemicals, 2 inches in diameter (5.08 centimeters) were placed in an oven with a sheet of the adhesive product between them. Pressure of 1 psi (2.88 kg/cm 2 ) for 1 hour at 150°C was used to effect bonding. An electrical current was passed through the assembly from one plate to the other. A resistance of less than 0.01 ohms was measured through the aluminum and the conductive adhesive, which included the surface resistance of the aluminum.
  • An electrically conductive adhesive was prepared by using a 15 mil thick, nonwoven polyester fabric made by Monsanto and designated as Flectron nonwoven polyester fabric.
  • the Flectron fabric was 2.5 oz./sq. yd. total weight with a minimum of 0.64 oz./sq. yd. of metal weight.
  • the metal plating on the fabric was nickel plated over copper.
  • the interstices of the plated polyester were then impregnated with a high temperature epoxy adhesive resin (Nelco N-4205-6) in an MEK solvent (20% solids by weight) by immersing for 15 seconds at 25 C C. The solvent was evaporated by heating at 163°C, leaving a plated fabric that contained 30% resin by weight. This material formed the conductive adhesive.
  • the conductive adhesive was used to bond two aluminum plates together that were 3.0 inches in diameter. The bonding was done at 50 psi pressure and 176°C for 1.5 hours in the same apparatus as in Example 1. A resistance of less than 0.001 ohms was measured through the aluminum and the conductive adhesive.
  • a 3.8 mil thick woven polyester fabric made by Monsanto and designated as Flectron HI polyester taffetta was used. This material was coated with copper that had been antioxidant treated. No nickel under-coating was present. Imbibing with epoxy was carried out as described in Example 1. The resulting adhesive contained 30% by weight epoxy resin and 25% by weight metal. This material, consisting of resin coated, metallized, woven polyester formed the conductive adhesive. The conductive adhesive was used to bond two aluminum plates together that were 1.0" square. The bonding was done at 1 psi pressure and 176°C for 1 hour. A resistance of less than 0.5 ohms was measured through the aluminum and the conductive adhesive.
  • Example 4 A common commercially available electrically conductive adhesive (Ablefilm ECF-561-003 made by Ablestik, a division of National Starch and Chemical Company), which is made with an epoxy resin and silver particles, was used to bond two aluminum plates together that were 2.0 inch in diameter using the same types of plates and same lamination conditions as described in Example 1
  • Example 1 In addition to the adhesive demonstrated in Example 1 having only 3% of the resistance demonstrated by the commercially available adhesive, the adhesive demonstrated in Example 1 also has the following advantages: Non- corrosive against the aluminum, does not require cold storage; easier handling, and no free particles that can short adjacent parts.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
PCT/US1994/002273 1993-11-03 1994-03-03 Electrically conductive adhesives WO1995012643A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE69411940T DE69411940T2 (de) 1993-11-03 1994-03-03 Elektrisch leitfähige klebstoffe
AU66964/94A AU6696494A (en) 1993-11-03 1994-03-03 Electrically conductive adhesives
JP7513190A JPH09504568A (ja) 1993-11-03 1994-03-03 導電性接着剤
EP94914701A EP0726925B1 (de) 1993-11-03 1994-03-03 Elektrisch leitfähige klebstoffe

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14719693A 1993-11-03 1993-11-03
US08/147,196 1993-11-03

Publications (1)

Publication Number Publication Date
WO1995012643A1 true WO1995012643A1 (en) 1995-05-11

Family

ID=22520627

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1994/002273 WO1995012643A1 (en) 1993-11-03 1994-03-03 Electrically conductive adhesives

Country Status (7)

Country Link
US (1) US5604026A (de)
EP (1) EP0726925B1 (de)
JP (1) JPH09504568A (de)
CN (1) CN1103423A (de)
AU (1) AU6696494A (de)
DE (1) DE69411940T2 (de)
WO (1) WO1995012643A1 (de)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19642178A1 (de) * 1996-10-12 1998-04-16 Beiersdorf Ag Elektrisch leitfähiges Transfer-Tape
EP0841695A2 (de) * 1996-11-08 1998-05-13 W.L. GORE & ASSOCIATES, INC. Sehr ebene Basis niederen Aks und ihre Herstellung
WO1998020715A1 (en) * 1996-11-08 1998-05-14 W.L. Gore & Associates, Inc. Interconnected multi-layer circuit boards
US6195883B1 (en) 1998-03-25 2001-03-06 International Business Machines Corporation Full additive process with filled plated through holes
WO2015112532A1 (en) * 2014-01-24 2015-07-30 3M Innovative Properties Company Electrically conductive adhesive tapes and articles therefrom

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5814180A (en) * 1993-11-03 1998-09-29 W. L. Gore & Associates, Inc. Low temperature method for mounting electrical components
US5761053A (en) * 1996-05-08 1998-06-02 W. L. Gore & Associates, Inc. Faraday cage
CN1094030C (zh) * 1996-08-05 2002-11-06 精仁株式会社 导电性材料及其制造方法
EP1270694B1 (de) * 2000-01-13 2006-10-18 Nitto Denko Corporation Poröse klebefolie, halbleiterwafer mit poröser klebefolie sowie verfahren zu dessen herstellung
US6884833B2 (en) * 2001-06-29 2005-04-26 3M Innovative Properties Company Devices, compositions, and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents
JP2004051755A (ja) * 2002-07-18 2004-02-19 Ricoh Co Ltd 弾性導電樹脂及び弾性導電接合構造
DE20316736U1 (de) * 2003-10-30 2004-09-23 Muchar, Manfred, Dipl.-Kaufm. Beheizbarer Außenspiegel
JP5034206B2 (ja) * 2005-10-03 2012-09-26 株式会社デンソー 導電性接着剤
US20110132537A1 (en) * 2009-12-03 2011-06-09 3M Innovative Properties Company Composition, tape, and use thereof
CN103201352B (zh) * 2011-10-25 2014-07-09 3M创新有限公司 非织造粘合胶带以及由其制得的制品
US9056438B2 (en) 2012-05-02 2015-06-16 3M Innovative Properties Company Curable composition, articles comprising the curable composition, and method of making the same
KR20150036178A (ko) 2012-06-28 2015-04-07 쓰리엠 이노베이티브 프로퍼티즈 컴파니 열전도성 기재 물품
KR20180032220A (ko) * 2015-08-20 2018-03-29 쓰리엠 이노베이티브 프로퍼티즈 컴파니 가요성 전기전도성 본딩 필름
DE202016008798U1 (de) * 2015-10-08 2019-09-27 Laird Technologies, Inc. Selektiv plattierte Materialrollen
US10652996B2 (en) * 2015-12-21 2020-05-12 3M Innovative Properties Company Formable shielding film
KR20200017869A (ko) * 2018-08-09 2020-02-19 쓰리엠 이노베이티브 프로퍼티즈 캄파니 도전성 접착 필름 및 이의 제조 방법
KR102705039B1 (ko) * 2018-12-28 2024-09-10 삼성전자주식회사 접착 필름, 이를 이용한 반도체 장치, 및 이를 포함하는 반도체 패키지

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04242010A (ja) * 1991-01-14 1992-08-28 Sony Chem Corp 異方性導電剤による接続構造
EP0560072A2 (de) * 1992-03-13 1993-09-15 Nitto Denko Corporation Anisotropisch-elektroleitende Klebe-Schicht und diese verwendende Verbindungsstruktur

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE392582B (sv) * 1970-05-21 1977-04-04 Gore & Ass Forfarande vid framstellning av ett porost material, genom expandering och streckning av en tetrafluoretenpolymer framstelld i ett pastabildande strengsprutningsforfarande
DE3013991A1 (de) * 1980-04-11 1981-10-15 Bayer Ag, 5090 Leverkusen Grossflaechige photovoltaische zelle
US4557957A (en) * 1983-03-18 1985-12-10 W. L. Gore & Associates, Inc. Microporous metal-plated polytetrafluoroethylene articles and method of manufacture
US4912594A (en) * 1986-11-03 1990-03-27 The Boeing Company Integral lightning protection repair system and method for its use
US4857668A (en) * 1988-04-15 1989-08-15 Schlegel Corporation Multi-function gasket
US5202536A (en) * 1992-02-03 1993-04-13 Schlegel Corporation EMI shielding seal with partial conductive sheath
US5269810A (en) * 1992-06-19 1993-12-14 W. L. Gore & Associates, Inc. Patch electrode

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04242010A (ja) * 1991-01-14 1992-08-28 Sony Chem Corp 異方性導電剤による接続構造
EP0560072A2 (de) * 1992-03-13 1993-09-15 Nitto Denko Corporation Anisotropisch-elektroleitende Klebe-Schicht und diese verwendende Verbindungsstruktur

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 017, no. 009 (E - 1303) 8 January 1993 (1993-01-08) *

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6418616B2 (en) 1995-06-06 2002-07-16 International Business Machines Corporation Full additive process with filled plated through holes
DE19642178A1 (de) * 1996-10-12 1998-04-16 Beiersdorf Ag Elektrisch leitfähiges Transfer-Tape
US5939190A (en) * 1996-10-12 1999-08-17 Beiersdorf Ag Electroconductive transfer tape
EP0841695A2 (de) * 1996-11-08 1998-05-13 W.L. GORE & ASSOCIATES, INC. Sehr ebene Basis niederen Aks und ihre Herstellung
WO1998020715A1 (en) * 1996-11-08 1998-05-14 W.L. Gore & Associates, Inc. Interconnected multi-layer circuit boards
EP0841695A3 (de) * 1996-11-08 1998-05-20 W.L. GORE & ASSOCIATES, INC. Sehr ebene Basis niederen Aks und ihre Herstellung
US5830565A (en) * 1996-11-08 1998-11-03 W. L. Gore & Associates, Inc. High planarity and low thermal coefficient of expansion base for semi-conductor reliability screening
US6046060A (en) * 1996-11-08 2000-04-04 W. L. Gore & Associates, Inc. Method of making a high planarity, low CTE base for semiconductor reliability screening
US6195883B1 (en) 1998-03-25 2001-03-06 International Business Machines Corporation Full additive process with filled plated through holes
US6664485B2 (en) 1998-03-25 2003-12-16 International Business Machines Corporation Full additive process with filled plated through holes
WO2015112532A1 (en) * 2014-01-24 2015-07-30 3M Innovative Properties Company Electrically conductive adhesive tapes and articles therefrom

Also Published As

Publication number Publication date
AU6696494A (en) 1995-05-23
DE69411940D1 (de) 1998-08-27
DE69411940T2 (de) 1998-11-26
US5604026A (en) 1997-02-18
EP0726925B1 (de) 1998-07-22
CN1103423A (zh) 1995-06-07
EP0726925A1 (de) 1996-08-21
JPH09504568A (ja) 1997-05-06

Similar Documents

Publication Publication Date Title
EP0726925B1 (de) Elektrisch leitfähige klebstoffe
US5431571A (en) Electrical conductive polymer matrix
US5225265A (en) Environmentally durable lightning strike protection materials for composite structures
US5045249A (en) Electrical interconnection by a composite medium
US5798171A (en) Adherent film with low thermal impedance and high electrical impedance used in an electronic assembly with a heat sink
US20080064279A1 (en) Densified conductive materials and articles made from same
KR102321279B1 (ko) 도전성 접착제
US5294487A (en) Composite layered material containing a silicone resin substrate
US5519168A (en) Electromagnetic interference shielding
US20030020178A1 (en) Intergrated circuit chip bonding sheet and integrated circuit package
KR20090038994A (ko) 부도체를 지지체로 사용하는 도전성 양면테이프
US5814180A (en) Low temperature method for mounting electrical components
CN112930378A (zh) 电磁波屏蔽膜、电磁波屏蔽膜的制造方法及屏蔽印制线路板的制造方法
US4264669A (en) Bondable adhesive-coated poly(parabanic acid) film and laminates
JP3554249B2 (ja) 接着材およびこれを用いた電子部品
CN115038768B (zh) 导电性胶粘剂、电磁波屏蔽膜以及导电性粘结膜
CN110312770A (zh) 粘接剂膜
JPH036892A (ja) 多層プリント配線板
JP2787846B2 (ja) 印刷回路用積層板
KR102703059B1 (ko) 스퍼터링 도금을 이용한 전자방해잡음 차폐용 쿠션 테이프
Schoch et al. Electrical evaluation of conductive adhesives
JPS627190A (ja) フレキシブル配線用基板およびその製造方法
WO1998020715A1 (en) Interconnected multi-layer circuit boards
CN117813344A (zh) 具有低无源互调的导电粘结带
Patterson Development and evaluation of polyimide laminates for printed wiring board applications

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AT AU BB BG BR BY CA CH CZ DE DK ES FI GB HU JP KP KR KZ LK LU MG MN MW NL NO NZ PL PT RO RU SD SE SK UA VN

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH DE DK ES FR GB GR IE IT LU MC NL PT SE

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 1994914701

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 1994914701

Country of ref document: EP

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

NENP Non-entry into the national phase

Ref country code: CA

WWG Wipo information: grant in national office

Ref document number: 1994914701

Country of ref document: EP