WO1994029400A1 - Method of producing microchannel/microcavity structures - Google Patents

Method of producing microchannel/microcavity structures Download PDF

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Publication number
WO1994029400A1
WO1994029400A1 PCT/SE1994/000584 SE9400584W WO9429400A1 WO 1994029400 A1 WO1994029400 A1 WO 1994029400A1 SE 9400584 W SE9400584 W SE 9400584W WO 9429400 A1 WO9429400 A1 WO 9429400A1
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WO
WIPO (PCT)
Prior art keywords
materials
elements
bonding
solvent
microchannel
Prior art date
Application number
PCT/SE1994/000584
Other languages
French (fr)
Inventor
Ove ÖHMAN
Original Assignee
Pharmacia Biotech Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pharmacia Biotech Ab filed Critical Pharmacia Biotech Ab
Priority to JP50168695A priority Critical patent/JP3515784B2/en
Priority to DE69406020T priority patent/DE69406020T2/en
Priority to EP94919060A priority patent/EP0738306B1/en
Priority to US08/564,217 priority patent/US6126765A/en
Publication of WO1994029400A1 publication Critical patent/WO1994029400A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00055—Grooves
    • B81C1/00071—Channels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4895—Solvent bonding, i.e. the surfaces of the parts to be joined being treated with solvents, swelling or softening agents, without adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/53—Joining single elements to tubular articles, hollow articles or bars
    • B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
    • B29C66/5346—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat
    • B29C66/53461—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat joining substantially flat covers and/or substantially flat bottoms to open ends of container bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
    • B29C66/9192—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams
    • B29C66/91921—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature
    • B29C66/91931—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to the fusion temperature or melting point of the material of one of the parts to be joined
    • B29C66/91935—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to the fusion temperature or melting point of the material of one of the parts to be joined lower than said fusion temperature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
    • C08J5/124—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives using adhesives based on a macromolecular component
    • C08J5/125—Adhesives in organic diluents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N30/00—Investigating or analysing materials by separation into components using adsorption, absorption or similar phenomena or using ion-exchange, e.g. chromatography or field flow fractionation
    • G01N30/02—Column chromatography
    • G01N30/60—Construction of the column
    • G01N30/6095—Micromachined or nanomachined, e.g. micro- or nanosize
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/756—Microarticles, nanoarticles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0315—Cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0323—Grooves
    • B81B2203/0338—Channels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/019—Bonding or gluing multiple substrate layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/033—Thermal bonding
    • B81C2203/036—Fusion bonding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N30/00—Investigating or analysing materials by separation into components using adsorption, absorption or similar phenomena or using ion-exchange, e.g. chromatography or field flow fractionation
    • G01N30/02—Column chromatography
    • G01N30/60—Construction of the column
    • G01N30/6052—Construction of the column body
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
    • Y10T156/1039—Surface deformation only of sandwich or lamina [e.g., embossed panels]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/21—Circular sheet or circular blank
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24562—Interlaminar spaces

Definitions

  • the present invention relates to the production of microchannel and microcavity systems, and more particularly to an improved method of bonding plane layers together in such production.
  • Microchannel or microcavity structures are used in inter alia chemical analytical techniques, such as electrophoresis and chromatography.
  • a channel and/or cavity system is defined between two plane material layers, the recesses which correspond to the channels and cavities, respectively, being formed in one or both of the opposed layer surfaces.
  • the layers are usually bonded together by gluing.
  • the two layers consist of thermoplastic material, they may be fused together by the application of heat.
  • the object of the present invention is to overcome this problem by providing a method which permits convenient bonding together of the material layers substantially without affecting the channel or cavity system.
  • thermoplastic which surfaces when brought together define a channel and/or cavity system between them, there is applied to one or, preferably, both element surfaces a thin layer of another, preferably also thermoplastic, material dissolved in a solvent which does not dissolve the material of the two element surfaces.
  • This dissolved material should, on one hand, be capable of being fused with the material(s) of the two surfaces on which it has been coated, and, on the other hand, melt at a lower temperature than the melting temperature of the element surface material or materials.
  • the two surfaces are brought together, e.g. by rolling, whereupon the assembly is heated to a temperature that melts the intermediate (preferably thermoplastic) material but not the material of the element surfaces for effecting joining of the two element surfaces.
  • the applied solution layer should, of course, have a very small thickness in relation to the width and depth of the channels and icrocavities, respectively, which width and depth may be of the order of magnitude of 50 to 100 ⁇ , for example.
  • thermoplastic material When a thermoplastic material is used for the two material surfaces, this thermoplastic material is suitably closely related to the thermoplastic material responsible for the bonding of the channel/cavity structure.
  • thermoplastic material for the present purpose may be mentioned fluoroelastomers.
  • Figs. 1A to 1C show different substeps in the manufacture of a microfluidic structure
  • Fig. 2 is a cross-section of the final product.
  • Fig. 1A shows a plate 1 provided with an open channel system (not shown) , which plate together with an identical plate 2 without the channel system is intended to define a microchannel system between the two plates.
  • a thin layer 3 of a, preferably closely related, thermoplastic material e.g. a modified fluoroelastomer with a lower melting point, is first spun onto both plate surfaces. Then the solvent is baked off at an increased temperature (e.g. 135 °C) , as is illustrated in Fig. IB. The two plates treated in this way are then rolled together, as indicated in Fig.
  • microchannel structure is shown in Fig. 2.
  • the two plates 1, 2, which are held together by the material layer 3, define a channel system 4 between them.
  • the following specific Example, which describes the production of a microchannel structure, illustrates the method of the invention further.
  • EXAMPLE A polymer structure with closed straight channels having a height of 50 ⁇ m, a width of 250 ⁇ m and a length of about 80 mm was produced in the following manner.
  • a silicon mould having a surface relief structure corresponding to the desired channel geometry was manufactured in per se known manner.
  • the surface of a silicon plate was first oxidized at about 1100 °C to form an oxide layer of 8000 A thickness.
  • a photoresist layer was spun onto the oxide layer and was stabilized by baking in an oven.
  • a mask corresponding to the desired channel pattern was then placed on the plate surface, and the surface parts not covered by the mask were exposed to light. The exposed photoresist parts were then removed by developing solution to bare the oxide layer, and the remaining photoresist was hard-baked.
  • the bared oxide was then etched with hydrofluoric acid/ammonium fluoride to expose the silicon (the backside of the plate being protected by resistant tape) , whereupon the photoresist mask was removed by acetone.
  • the oxide-free silicon surfaces were then etched with potassium hydroxide solution for a sufficient time to produce the desired etch depth.
  • the resulting surface exhibited the desired channel pattern.
  • the silicon mould obtained was then pressed against a 2 mm thick film of Hostaflon TFB 7100 (refractive index about 1.36) at about 160 °C and 20 kp/cm 2 . (Hostaflon is a thermoplastic fluoroelastomer sold by Hoechst AG, Germany) .
  • the resulting channel structure was bonded to a base layer in the form of a plane plate of the same material by spinning a thin layer of Hostaflon TFB X-7200 (having a lower melting point than that of Hostaflon TFB 7100) dissolved in propylmethylketone onto the base layer and the channel structure, which were then allowed to dry at 130 °C for 10 minutes.
  • the channel structure and the base layer were then immediately rolled together, and the obtained sandwich was baked at about 140 °C for 10 minutes.
  • the polymer structure produced in this way exhibited intact closed channels.

Abstract

In a method of forming a microchannel and/or microcavity structure by bonding together two elements (1, 2) having opposed plane surfaces of the same or different materials, one or both surfaces having open channels and/or cavities, bonding is effected by applying to one or both element surfaces (1, 2) a thin layer (3) of a solution of a material capable of fusing with and having a lower melting point than that of the material or materials of the two element surfaces (1, 2) in a solvent which substantially does not dissolve the element surface material or materials. The solvent is then removed, and the two elements (1, 2) are brought together and heated to a temperature where the dissolved material is caused to melt but not the element surface material or materials.

Description

METHOD OP PRODUCING MICROCHANNEL/MICROCAVITY STRUCTURES
The present invention relates to the production of microchannel and microcavity systems, and more particularly to an improved method of bonding plane layers together in such production.
Microchannel or microcavity structures are used in inter alia chemical analytical techniques, such as electrophoresis and chromatography. In one type of such microfluidic structures, a channel and/or cavity system is defined between two plane material layers, the recesses which correspond to the channels and cavities, respectively, being formed in one or both of the opposed layer surfaces. The layers are usually bonded together by gluing. Alternatively, if the two layers consist of thermoplastic material, they may be fused together by the application of heat.
When very small channel dimensions are concerned, however, these conventional joining methods tend to deform the channel or cavity system to a great extent by partial clogging with glue or molten material.
The object of the present invention is to overcome this problem by providing a method which permits convenient bonding together of the material layers substantially without affecting the channel or cavity system.
According to the invention, this is achieved by a method of production which has the features defined in claim 1. Preferred embodiments are defined in the subclaims. The invention is based on the concept that in order to bond together two planar element surfaces of the same or different materials, preferably thermoplastic, which surfaces when brought together define a channel and/or cavity system between them, there is applied to one or, preferably, both element surfaces a thin layer of another, preferably also thermoplastic, material dissolved in a solvent which does not dissolve the material of the two element surfaces. This dissolved material should, on one hand, be capable of being fused with the material(s) of the two surfaces on which it has been coated, and, on the other hand, melt at a lower temperature than the melting temperature of the element surface material or materials. After evaporation of the solvent, the two surfaces are brought together, e.g. by rolling, whereupon the assembly is heated to a temperature that melts the intermediate (preferably thermoplastic) material but not the material of the element surfaces for effecting joining of the two element surfaces.
The applied solution layer should, of course, have a very small thickness in relation to the width and depth of the channels and icrocavities, respectively, which width and depth may be of the order of magnitude of 50 to 100 μ , for example.
When a thermoplastic material is used for the two material surfaces, this thermoplastic material is suitably closely related to the thermoplastic material responsible for the bonding of the channel/cavity structure. As an example of a suitable type of thermoplastic for the present purpose may be mentioned fluoroelastomers.
Suitable combinations of surface/bonding materials and solvents for practising the invention will readily be devised by the person skilled in the art guided by the present description.
The carrying out of the process of the invention is illustrated schematically in the accompanying drawings, wherein Figs. 1A to 1C show different substeps in the manufacture of a microfluidic structure, and Fig. 2 is a cross-section of the final product.
Fig. 1A shows a plate 1 provided with an open channel system (not shown) , which plate together with an identical plate 2 without the channel system is intended to define a microchannel system between the two plates. For bonding the two plates together, which preferably are made of a thermoplastic material, e.g. a fluoroelastomer, a thin layer 3 of a, preferably closely related, thermoplastic material, e.g. a modified fluoroelastomer with a lower melting point, is first spun onto both plate surfaces. Then the solvent is baked off at an increased temperature (e.g. 135 °C) , as is illustrated in Fig. IB. The two plates treated in this way are then rolled together, as indicated in Fig. 1C, and are allowed to be bonded together for some time, e.g. 5 minutes. The completed microchannel structure is shown in Fig. 2. As may be seen from the latter figure, the two plates 1, 2, which are held together by the material layer 3, define a channel system 4 between them. The following specific Example, which describes the production of a microchannel structure, illustrates the method of the invention further.
EXAMPLE A polymer structure with closed straight channels having a height of 50 μm, a width of 250 μm and a length of about 80 mm was produced in the following manner.
A silicon mould having a surface relief structure corresponding to the desired channel geometry was manufactured in per se known manner. Thus, the surface of a silicon plate was first oxidized at about 1100 °C to form an oxide layer of 8000 A thickness. After washing, dehydration in an oven and priming with hexamethylsilane, a photoresist layer was spun onto the oxide layer and was stabilized by baking in an oven. A mask corresponding to the desired channel pattern was then placed on the plate surface, and the surface parts not covered by the mask were exposed to light. The exposed photoresist parts were then removed by developing solution to bare the oxide layer, and the remaining photoresist was hard-baked. The bared oxide was then etched with hydrofluoric acid/ammonium fluoride to expose the silicon (the backside of the plate being protected by resistant tape) , whereupon the photoresist mask was removed by acetone. The oxide-free silicon surfaces were then etched with potassium hydroxide solution for a sufficient time to produce the desired etch depth. The resulting surface exhibited the desired channel pattern. The silicon mould obtained was then pressed against a 2 mm thick film of Hostaflon TFB 7100 (refractive index about 1.36) at about 160 °C and 20 kp/cm2. (Hostaflon is a thermoplastic fluoroelastomer sold by Hoechst AG, Germany) . The resulting channel structure was bonded to a base layer in the form of a plane plate of the same material by spinning a thin layer of Hostaflon TFB X-7200 (having a lower melting point than that of Hostaflon TFB 7100) dissolved in propylmethylketone onto the base layer and the channel structure, which were then allowed to dry at 130 °C for 10 minutes. The channel structure and the base layer were then immediately rolled together, and the obtained sandwich was baked at about 140 °C for 10 minutes. The polymer structure produced in this way exhibited intact closed channels.
The invention is, of course, not restricted to the embodiment described above and specifically shown in the drawing, but many modifications and changes may be made within the scope of the general inventive concept as it is stated in the following claims.

Claims

1. A method of forming a microchannel and/or microcavity structure by bonding together two elements (1, 2) having opposed plane surfaces of the same or different materials, one or both surfaces having open channels and/or cavities, characterized in that said bonding is effected by applying to one or both element surfaces (1, 2) a thin layer (3) of a solution of a material capable of fusing with and having a lower melting point than that of the material or materials of the two element surfaces (1, 2) in a solvent which substantially does not dissolve the element surface material or materials, removing the solvent, bringing the two elements (1, 2) together, and heating to a temperature where the dissolved material is caused to melt but not the element surface material or materials.
2. The method according to claim 1, characterized in that the two elements (1, 2) that are to be bonded together are of the same material.
3. The method according to claim 1 or 2, characterized in that the dissolved material (3) is thermoplastic.
4. The method according to any one of claims 1 - 3, characterized in that the material of the two elements (1, 2) is thermoplastic.
5. The method according to claim 4, characterized in that the material of the two elements (1, 2) and the dissolved material (3) are of substantially the same type.
6. The method according to claim 5, characterized in that the materials of the two elements (1, 2) and the dissolved material (3) are fluoroelastomers.
PCT/SE1994/000584 1993-06-15 1994-06-14 Method of producing microchannel/microcavity structures WO1994029400A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP50168695A JP3515784B2 (en) 1993-06-15 1994-06-14 Method of manufacturing microchannel / microcavity structure
DE69406020T DE69406020T2 (en) 1993-06-15 1994-06-14 METHOD FOR PRODUCING STRUCTURES WITH MICROCHANNELS / MICROHOLES
EP94919060A EP0738306B1 (en) 1993-06-15 1994-06-14 Method of producing microchannel/microcavity structures
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SE9302051-9 1993-06-15

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EP0738306A1 (en) 1996-10-23
SE9302051L (en) 1994-12-16
JP3688281B2 (en) 2005-08-24
US6620478B1 (en) 2003-09-16
SE501380C2 (en) 1995-01-30
DE69406020T2 (en) 1998-02-26
DE69406020D1 (en) 1997-11-06
EP0738306B1 (en) 1997-10-01
SE9302051D0 (en) 1993-06-15
ES2109706T3 (en) 1998-01-16
JP2004138621A (en) 2004-05-13
US6126765A (en) 2000-10-03
JPH09502795A (en) 1997-03-18
JP3515784B2 (en) 2004-04-05

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