JPH11337850A - Assembling method for polymer waveguide optical switch - Google Patents
Assembling method for polymer waveguide optical switchInfo
- Publication number
- JPH11337850A JPH11337850A JP14950598A JP14950598A JPH11337850A JP H11337850 A JPH11337850 A JP H11337850A JP 14950598 A JP14950598 A JP 14950598A JP 14950598 A JP14950598 A JP 14950598A JP H11337850 A JPH11337850 A JP H11337850A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- optical
- layer
- glass transition
- polymer material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
Landscapes
- Mechanical Light Control Or Optical Switches (AREA)
- Optical Integrated Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、光通信システム等
における光路設定・切替に用いられる光スイッチの製造
方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an optical switch used for setting and switching an optical path in an optical communication system or the like.
【０００２】[0002]
【従来の技術】光導波路層の互いに交差する光導波路の
交差部に設けられた溝に封入された屈折率整合液を、溝
近傍に設けた微小な薄膜ヒータを用いて移動させること
により、光路を切り替える光スイッチが提案されている
（「光スイッチ」：特開平９−１４１３３７号公報）。
この光スイッチは、溝の開口部を塞ぐように平板状の蓋
を光導波路層上部へ接合した後、この溝へ屈折率整合液
を封入して組み立てられる。しかし、この溝は大変幅が
狭いため、蓋接合に接着剤を用いると溝が接着剤で満た
されてしまう。そこで、蓋接合には接着剤を用いない、
直接接合法が採られる。2. Description of the Related Art An optical path is formed by moving a refractive index matching liquid sealed in a groove provided at an intersection of optical waveguides which intersect each other in an optical waveguide layer by using a small thin film heater provided near the groove. There has been proposed an optical switch for switching between the two modes ("optical switch": Japanese Patent Application Laid-Open No. 9-141337).
This optical switch is assembled by joining a flat lid to the upper part of the optical waveguide layer so as to cover the opening of the groove, and then filling the groove with a refractive index matching liquid. However, since this groove is very narrow, if an adhesive is used for lid joining, the groove will be filled with the adhesive. Therefore, do not use adhesive for lid joining,
The direct joining method is adopted.
【０００３】[0003]
【発明が解決しようとする課題】近年、この光スイッチ
の経済化を狙って、ポリマ光導波路を用いて前記光スイ
ッチを実現することが提案されている。このポリマ光ス
イッチの場合、ポリマ材料の特性を生かした熱圧着法
（ラミネーション法）が、蓋接合の候補の一つとして考
えられる。従来のラミネーション法は、ポリマ材料のガ
ラス転移温度以上に加熱しながら圧着することにより、
十分な接合強度を得ている。しかし、ガラス転移温度以
上の長時間の加熱は、光導波路の光学特性を劣化させて
しまうだけでなく、光導波路層と支持基板との接着性を
も劣化させてしまう。In recent years, it has been proposed to realize the optical switch by using a polymer optical waveguide in order to reduce the cost of the optical switch. In the case of this polymer optical switch, a thermocompression bonding method (lamination method) utilizing characteristics of the polymer material is considered as one of the candidates for the lid bonding. In the conventional lamination method, pressure bonding is performed while heating to a temperature higher than the glass transition temperature of the polymer material.
Sufficient bonding strength has been obtained. However, heating for a long time at or above the glass transition temperature not only deteriorates the optical characteristics of the optical waveguide, but also degrades the adhesiveness between the optical waveguide layer and the support substrate.
【０００４】以上のように、従来のラミネーション法に
よる蓋接合は光導波路の光学特性や光導波路層の接着性
を劣化させるといった問題がある。[0004] As described above, the lid bonding by the conventional lamination method has a problem that the optical characteristics of the optical waveguide and the adhesiveness of the optical waveguide layer are deteriorated.
【０００５】本発明は、前記従来技術の問題点に鑑み、
光導波路の光学特性や接着性に影響を与えない優れた光
スイッチの組立方法を提供することを目的とする。The present invention has been made in view of the above-mentioned problems of the prior art,
An object of the present invention is to provide an excellent optical switch assembling method that does not affect the optical characteristics and adhesiveness of an optical waveguide.
【０００６】[0006]
【課題を解決するための手段】前記課題を解決する本発
明の光スイッチの組立方法は、支持基板上の光導波路層
内で互いに交差する光導波路の交差部に設けられた駆動
管路内に光導波路と屈折率が等しい屈折率整合液が封入
され、この屈折率整合液を駆動管路内でヒータによる加
熱により移動させ、それにより互いに交差する光導波路
間で光路の切替を行う光スイッチにおいて、前記光導波
路層が有機高分子（ポリマ）材料により構成されること
を特徴とする光スイッチを組み立てる際に、前記光導波
路層内の最も表層にある上部クラッド層を、ポリマ材料
のガラス転移温度よりも低い温度での加熱によりあるい
は紫外線照射により硬化させた後、上部クラッド層を硬
化させたときの温度よりも高く、ポリマ材料のガラス転
移温度に近くかつガラス転移温度よりも低い温度で加熱
しながら、上部クラッド層上に蓋材を押しつけて接合す
ることを特徴とする。According to the present invention, there is provided a method of assembling an optical switch, comprising the steps of: providing a drive pipe provided at an intersection of optical waveguides which intersect each other in an optical waveguide layer on a support substrate; A refractive index matching liquid having the same refractive index as that of the optical waveguide is sealed, and the refractive index matching liquid is moved by heating with a heater in a drive pipe, thereby switching an optical path between optical waveguides crossing each other. When assembling an optical switch, wherein the optical waveguide layer is made of an organic polymer (polymer) material, the uppermost cladding layer in the optical waveguide layer is made to have a glass transition temperature of the polymer material. After curing by heating at a lower temperature or by irradiation with ultraviolet light, the temperature is higher than when the upper cladding layer is cured, close to the glass transition temperature of the polymer material, and While heating at a temperature lower than the glass transition temperature, characterized by joining pressing the lid member on the upper cladding layer.
【０００７】また、上記の光スイッチを組み立てる際
に、蓋材の接合面にポリマ材料を塗布し、ポリマ材料の
ガラス転移温度よりも低い温度での加熱によりあるいは
紫外線照射により硬化させた後、ポリマ材料を硬化させ
たときの温度よりも高く、ポリマ材料のガラス転移温度
に近くかつガラス転移温度よりも低い温度で加熱しなが
ら、上部クラッド層上に蓋材を押しつけて接合すること
を特徴とする。Further, when assembling the above optical switch, a polymer material is applied to the joint surface of the lid material, and the polymer material is cured by heating at a temperature lower than the glass transition temperature of the polymer material or by irradiating ultraviolet rays. While heating at a temperature higher than the temperature at which the material was cured, close to the glass transition temperature of the polymer material, and lower than the glass transition temperature, the lid material is pressed onto the upper cladding layer and joined. .
【０００８】[0008]
【作用】従来のラミネーション法は、ポリマ材料をその
ガラス転移温度以上に加熱し流動性を持たせた状態で被
接着物に押しつけ、被接着物表面凹凸に浸入・硬化させ
ることによって、ポリマ材料同士、もしくは、ポリマ材
料とガラス等の他材料とを接合させる方法である。従っ
て、この方法では、ガラス転移温度以下の接合温度では
十分な接合強度を得ることは出来ない。しかし、熱硬化
型および紫外線硬化型ポリマ材料の重合度が温度に依存
することを利用すれば、ガラス転移温度以下の接合温度
でも十分な接合強度を得ることが出来る。According to the conventional lamination method, the polymer materials are heated to a temperature higher than the glass transition temperature, pressed against the adherend in a state of having fluidity, and penetrated into the irregularities on the surface of the adherend to be cured. Alternatively, it is a method of joining a polymer material and another material such as glass. Therefore, with this method, a sufficient bonding strength cannot be obtained at a bonding temperature lower than the glass transition temperature. However, by utilizing the fact that the degree of polymerization of the thermosetting and ultraviolet curable polymer materials depends on the temperature, a sufficient bonding strength can be obtained even at a bonding temperature lower than the glass transition temperature.
【０００９】即ち、低温で硬化させたポリマ材料中には
接着剤として働く未重合な成分が活性なまま残ってお
り、この状態のポリマ材料を硬化させた温度（硬化温
度）よりも高く、ガラス転移温度よりも低い温度で加熱
しながら被接着物に押しつけることにより、未重合成分
が被接着物表面に接着硬化して十分な接合強度を得るこ
とが出来るからである。That is, the unpolymerized component acting as an adhesive remains active in the polymer material cured at a low temperature, and is higher than the curing temperature (curing temperature) of the polymer material in this state. By pressing against the adherend while heating at a temperature lower than the transition temperature, the unpolymerized component adheres and cures to the surface of the adherend, and a sufficient bonding strength can be obtained.
【００１０】この方法を用いて前記光スイッチを組み立
てる場合、蓋との接合層であり、熱硬化型あるいは紫外
線硬化型ポリマ材料から成る光導波路層の上部クラッド
層を低温で硬化させた後、もしくは、紫外線照射により
硬化させた後、ガラス転移温度以下で、且つ、硬化温度
よりも高い温度で蓋を接合することにより、十分な接合
強度を得ることが出来る。このとき、硬化温度と接合す
るときの温度（接合温度）との差を大きくすることによ
り、接合強度を大きくすることが出来る。従って、ガラ
ス転移温度以下のラミネーション法によって、光導波路
の光学特性や支持基板との接着性に影響を与えず、十分
な接合強度を得ることが出来る。When assembling the optical switch using this method, the upper clad layer of the optical waveguide layer, which is a bonding layer with the lid and is made of a thermosetting or ultraviolet-curing polymer material, is cured at a low temperature, or After curing by ultraviolet irradiation, by joining the lid at a temperature equal to or lower than the glass transition temperature and higher than the curing temperature, sufficient joining strength can be obtained. At this time, the joining strength can be increased by increasing the difference between the curing temperature and the joining temperature (joining temperature). Therefore, a sufficient bonding strength can be obtained by the lamination method having a glass transition temperature or less without affecting the optical characteristics of the optical waveguide and the adhesiveness to the supporting substrate.
【００１１】しかし、硬化温度の設定には次のような問
題がある。蓋を接合する前に、光導波路層へ反応性イオ
ンエッチング（ＲＩＥ）やプラズマ加工を用いて溝加工
を行うので、光導波路層を高温にさらしてしまう。この
場合、上部クラッド層の硬化温度は加工される温度にな
る。従って、この場合、上記のような硬化温度と接合温
度との差を大きく設定することが出来ない。またさら
に、溝加工時の上昇温度は上部クラッド層表面の凹凸の
発生や光導波路層の基板からの剥離の原因となることが
ある。即ち、上部クラッド層の硬化温度が溝加工時に経
験する温度よりも低いと、上部クラッド層が収縮して、
上部クラッド層の表面に亀裂やしわを発生させて平坦性
を損なわせたり、光導波路層全体を剥離させたりする。However, setting the curing temperature has the following problems. Before the lid is bonded, the optical waveguide layer is subjected to groove processing using reactive ion etching (RIE) or plasma processing, so that the optical waveguide layer is exposed to high temperatures. In this case, the curing temperature of the upper clad layer is the temperature at which it is processed. Therefore, in this case, the difference between the curing temperature and the bonding temperature as described above cannot be set large. Further, the rise in temperature during the groove processing may cause irregularities on the surface of the upper cladding layer or cause the optical waveguide layer to peel off from the substrate. That is, if the curing temperature of the upper cladding layer is lower than the temperature experienced during groove processing, the upper cladding layer shrinks,
Cracks and wrinkles are generated on the surface of the upper clad layer to impair flatness, or the entire optical waveguide layer is peeled off.
【００１２】これらを回避するためには、上部クラッド
層の硬化温度を溝加工時に経験する温度より高くすれば
よい。しかし、そうするとますます、硬化温度と接合温
度との差を確保しづらくなり、十分な接合強度を得るこ
とが出来ない。この問題を解決するために、本発明で
は、蓋側に低温で硬化されたポリマ材料から成る接合層
を設ける。この場合、光導波路層は、あらかじめガラス
転移温度以下で、且つ、溝加工時の経験温度以上で硬化
させておく。そうすれば、溝加工時の温度上昇による上
部クラッド層の表面平坦性の損失や光導波路層の剥離を
防ぐことができる。また、接合用のポリマ層を光導波路
層とは別に用意するので、接合層の硬化温度と接合温度
との差を大きく設定でき、十分な接合強度を得られる。
さらに、接合界面はポリマ材料同士の接着となるため、
ポリマ材料とガラス材料といったような異なる材料とを
接合した場合よりも大きな接合強度を得ることが出来
る。In order to avoid these problems, the curing temperature of the upper cladding layer may be set higher than the temperature experienced during groove processing. However, if it does so, it will become more and more difficult to secure the difference between the curing temperature and the joining temperature, and it will not be possible to obtain sufficient joining strength. In order to solve this problem, in the present invention, a bonding layer made of a polymer material cured at a low temperature is provided on the lid side. In this case, the optical waveguide layer is previously cured at a temperature equal to or lower than the glass transition temperature and equal to or higher than the empirical temperature at the time of groove processing. This can prevent loss of surface flatness of the upper clad layer and separation of the optical waveguide layer due to a rise in temperature during the groove processing. Further, since the bonding polymer layer is prepared separately from the optical waveguide layer, the difference between the curing temperature of the bonding layer and the bonding temperature can be set large, and sufficient bonding strength can be obtained.
Furthermore, since the bonding interface is an adhesion between polymer materials,
Greater bonding strength can be obtained than when different materials such as a polymer material and a glass material are bonded.
【００１３】[0013]
【実施例】以下、図面を参照して本発明の実施例を詳細
に説明する。Embodiments of the present invention will be described below in detail with reference to the drawings.
【００１４】（ガラス転移温度以下でのラミネーション
法による光スイッチの組立方法）図１は、ガラス転移温
度以下でのラミネーション法による光スイッチの組立方
法を示す図である。図１中、符号１は支持基板、２は下
部クラッド層、３はコア層、４は上部クラッド層、５は
溝、６は蓋である。(Method of Assembling Optical Switch by Lamination Below Glass Transition Temperature) FIG. 1 shows a method of assembling an optical switch by lamination below the glass transition temperature. In FIG. 1, reference numeral 1 denotes a support substrate, 2 denotes a lower cladding layer, 3 denotes a core layer, 4 denotes an upper cladding layer, 5 denotes a groove, and 6 denotes a lid.
【００１５】図１中の（１）〜（４）の順に、光スイッ
チの組立方法について説明する。The method of assembling the optical switch will be described in the order of (1) to (4) in FIG.
【００１６】（１）ガラスやＳｉ等の支持基板１上へ、
熱硬化型もしくは紫外線硬化型ポリマ材料から成る下部
クラッド層２を塗布し、加熱硬化させる。同様に、下部
クラッド層２上へコア層３を塗布硬化させる。さらに、
所望のコアパターンを得るために、ＲＩＥ等のフォトリ
ソグラフィ技術によりコアの加工を行う。(1) On a support substrate 1 made of glass, Si, or the like,
A lower clad layer 2 made of a thermosetting or ultraviolet curable polymer material is applied and cured by heating. Similarly, the core layer 3 is applied and cured on the lower clad layer 2. further,
In order to obtain a desired core pattern, the core is processed by a photolithography technique such as RIE.
【００１７】（２）コア層３の上に熱硬化型もしくは紫
外線硬化型ポリマ材料から成る上部クラッド層４を塗布
する。溝５の加工時の光導波路層の剥離を防ぐため、蓋
６との接合層である上部クラッド層４を溝加工時の上昇
温度Ｔ2以上の温度Ｔ1で加熱硬化させる。熱硬化型の場
合、加熱収縮による内部応力を緩和するため徐々に温度
を上げて硬化させる。これに対して、紫外線硬化型の場
合、紫外線照射により短時間でほぼ重合が完了するた
め、紫外線照射後、温度Ｔ1で短時間加熱することによ
り硬化させることが出来る。(2) An upper clad layer 4 made of a thermosetting or ultraviolet curable polymer material is applied on the core layer 3. To prevent separation of the optical waveguide layer during processing of the groove 5, is cured by heating the upper cladding layer 4 is a bonding layer of the lid 6 at elevated temperature T 2 above the temperature T 1 of the at grooving. In the case of the thermosetting type, the temperature is gradually increased to cure the internal stress due to heat shrinkage, and the resin is cured. In contrast, in the case of UV-curable, in order to substantially polymerization is completed in a short time by ultraviolet irradiation, after ultraviolet irradiation, it can be cured by brief heating at a temperature T 1.
【００１８】（３）ＲＩＥなどのフォトリソグラフィ技
術により、溝５の加工を行う。溝加工時の上部クラッド
層４表面の温度は、イオンの衝突により上昇する
（Ｔ2）。(3) The groove 5 is processed by a photolithography technique such as RIE. The temperature of the surface of the upper cladding layer 4 during the groove processing rises due to ion collision (T 2 ).
【００１９】（４）ガラス転移温度Ｔg以下で、且つ、
Ｔgに近い温度で加熱しながら、蓋６を上部クラッド層
に圧着する。(4) a glass transition temperature T g or lower, and
The lid 6 is pressed against the upper clad layer while heating at a temperature close to T g .
【００２０】各々の加工における温度の関係は図２のグ
ラフに示すとおりである。上部クラッド層形成時の加熱
温度Ｔ1は、溝加工による上昇温度Ｔ2よりも高く、ガラ
ス転移温度Ｔgよりも十分低い温度である。蓋接合のた
めの加熱温度Ｔ3は、ガラス転移温度Ｔg以下で、かつ、
Ｔgに近い温度である。これにより、光導波路をガラス
転移温度Ｔg以上に加熱することなく、上部クラッド層
の硬化温度、Ｔ1と接合温度Ｔ3との差を大きく取ること
が出来るので、光導波路の光学特性に影響を与えること
なく、十分な強度を持つ蓋接合を行うことが出来る。The relationship between the temperatures in each processing is as shown in the graph of FIG. The heating temperature T 1 at the time of forming the upper cladding layer is higher than the rising temperature T 2 due to the groove processing and sufficiently lower than the glass transition temperature T g . The heating temperature T 3 for lid joining is equal to or lower than the glass transition temperature T g , and
A temperature close to T g . Thus, without heating the optical waveguide above the glass transition temperature T g, the curing temperature of the upper cladding layer, it is possible to obtain a large difference between T 1 and the junction temperature T 3, the influence on the optical properties of the optical waveguide The cover can be joined with a sufficient strength without giving the cover.
【００２１】（蓋側に接合層を設けた光スイッチの組立
方法）図３は、蓋の接合面にポリマ材料を設けたガラス
転移温度以下のラミネーション法による光スイッチの組
立方法を示す図である。図３中、符号７は蓋の接合面に
設けた接合層である。(Method of Assembling Optical Switch Having Bonding Layer on Lid Side) FIG. 3 is a diagram showing a method of assembling an optical switch by a lamination method at a glass transition temperature or lower in which a polymer material is provided on the bonding surface of the lid. . In FIG. 3, reference numeral 7 denotes a bonding layer provided on the bonding surface of the lid.
【００２２】図３中の（５）〜（８）の順に、光スイッ
チの組立方法について説明する。The method of assembling the optical switch will be described in the order of (5) to (8) in FIG.
【００２３】（５）ガラスやＳｉなどの支持基板１上
へ、熱硬化型もしくは紫外線硬化型ポリマ材料から成る
下部クラッド層２を塗布し、加熱硬化させる。同様に、
コア３層を下部クラッド２層上に塗布硬化させる。この
コア３層を、ＲＩＥ等のフォトリソグラフィ技術により
所望の形状に加工する。さらに、コア層３上に上部クラ
ッド層４を塗布硬化させる。熱加工に対する光導波路層
の光学特性の安定性及び長期信頼性を確保するために、
クラッド層２，４とコア層３をガラス転移温度Ｔ g以下
で、且つ、ガラス転移温度Ｔgに近い温度Ｔ4で硬化させ
る。(5) On the support substrate 1 made of glass, Si or the like
Made of thermosetting or UV-curable polymer material
The lower cladding layer 2 is applied and cured by heating. Similarly,
The three core layers are applied and cured on the two lower cladding layers. this
The core 3 layer is formed by photolithography technology such as RIE
Process into the desired shape. Further, the upper cladding is placed on the core layer 3.
The coating layer 4 is applied and cured. Optical waveguide layer for thermal processing
In order to ensure the stability and long-term reliability of the optical characteristics of
The glass transition temperature T gLess than
And the glass transition temperature TgTemperature T close toFourCured with
You.
【００２４】（６）光導波路層（下部クラッド、コア、
上部クラッド層）へＲＩＥ等のフォトリソグラフィ技術
により溝５の加工を行う。この溝加工により上部クラッ
ド層４の表面の温度は上昇する（Ｔ2）。(6) Optical waveguide layer (lower clad, core,
The grooves 5 are formed on the upper cladding layer by a photolithography technique such as RIE. By this groove processing, the temperature of the surface of the upper cladding layer 4 rises (T 2 ).
【００２５】（７）ガラスなどの平板状の蓋５の片面に
熱硬化型もしくは紫外線硬化型ポリマ材料を薄く塗布
し、流動性を持たせない程度に硬化させた接合層７を形
成する。熱硬化型の場合、加熱温度Ｔ5を調節すること
により、また、紫外線照射型の場合は、紫外線照射量を
調節することにより、蓋の接合層を所望の重合度で硬化
させることが出来る。(7) A thermosetting or ultraviolet curable polymer material is thinly applied to one side of the flat lid 5 made of glass or the like to form a bonding layer 7 which is hardened so as not to have fluidity. If thermosetting, by adjusting the heating temperature T 5, In the case of ultraviolet irradiation type, by adjusting the amount of ultraviolet irradiation, it is possible to cure the bonding layer of the lid in the desired degree of polymerization.
【００２６】（８）蓋５に塗布されたポリマ材料（接合
層７）を接合面として、ガラス転移温度Ｔg以下の温度
Ｔ3で加熱しながら、蓋５を圧着する。(8) Using the polymer material (bonding layer 7) applied to the lid 5 as a bonding surface, the lid 5 is press-bonded while heating at a temperature T 3 below the glass transition temperature T g .
【００２７】各々の加工における温度の関係は図４のグ
ラフに示すとおりである。コア層とクラッド層形成時の
加熱温度Ｔ4はガラス転移温度Ｔg以下で、かつ、Ｔg付
近の温度である。接合層形成時の加熱温度Ｔ5は、ガラ
ス転移温度Ｔgに比べて大変低い温度である。蓋接合時
の加熱温度Ｔ3は、ガラス転移温度Ｔg以下で、且つ、Ｔ
gに近い温度である。接合層を設けたことにより、接合
層の硬化温度Ｔ5と接合温度Ｔ3との温度差を大きくする
ことができ、接合層を設けない場合よりも大きな接合強
度を得ることが出来る。また、蓋と光導波路層との接合
界面の密着性を高め、より大きな強度で蓋接合を行うこ
とが出来る。The relationship between the temperatures in each processing is shown in FIG.
It is as shown in the rough. When forming the core layer and cladding layer
Heating temperature TFourIs the glass transition temperature TgLess than and TgAttached
Near temperature. Heating temperature T when forming bonding layerFiveIs a gala
Transition temperature TgIt is a very low temperature compared to. At lid joint
Heating temperature TThreeIs the glass transition temperature TgBelow and T
gTemperature close to By providing a bonding layer,
Curing temperature T of the layerFiveAnd junction temperature TThreeIncrease the temperature difference between
Higher bonding strength than without a bonding layer
You can get a degree. Also, the joint between the lid and the optical waveguide layer
It is necessary to improve the adhesion of the interface and perform lid bonding with greater strength.
Can be.
【００２８】[0028]
【発明の効果】以上述べたように、本発明によれば、ポ
リマ光導波路のガラス転移温度以下の温度でラミネーシ
ョンできるため、光導波路の光学特性や基板との接着性
を劣化させることなく蓋接合を行うことが出来る。ま
た、蓋側に接合層を設けることにより、より多くの未重
合な接合成分を利用し、また、接合面の密着性を高める
ことが出来る。これにより、より強固な蓋接合を実現す
ることが出来る。As described above, according to the present invention, the lamination can be performed at a temperature lower than the glass transition temperature of the polymer optical waveguide, so that the lid bonding can be performed without deteriorating the optical characteristics of the optical waveguide and the adhesiveness to the substrate. Can be performed. Further, by providing the bonding layer on the lid side, more unpolymerized bonding components can be used, and the adhesion of the bonding surface can be improved. Thereby, stronger lid joining can be realized.
【図１】本発明に係わるガラス転移温度以下のラミネー
ション法による光スイッチの組立方法を説明する図。FIG. 1 is a diagram illustrating a method of assembling an optical switch by a lamination method with a glass transition temperature or lower according to the present invention.
【図２】前記実施例における各工程における温度の関係
を示す図。FIG. 2 is a diagram showing a temperature relationship in each step in the embodiment.
【図３】本発明に係わる蓋側に接合層を設けた光スイッ
チの組立方法を説明する図。FIG. 3 is a view for explaining a method of assembling the optical switch according to the present invention in which a bonding layer is provided on a lid side.
【図４】前記実施例における各工程における温度の関係
を示す図。FIG. 4 is a diagram showing a temperature relationship in each step in the embodiment.
１ 支持基板 ２ 下部クラッド層 ３ コア層 ４ 上部クラッド層 ５ 溝 ６ 蓋 ７ 接合層 DESCRIPTION OF SYMBOLS 1 Support substrate 2 Lower clad layer 3 Core layer 4 Upper clad layer 5 Groove 6 Lid 7 Bonding layer
Claims (2)
る光導波路の交差部に設けられた駆動管路内に光導波路
と屈折率が等しい屈折率整合液が封入され、この屈折率
整合液を駆動管路内でヒータによる加熱により移動さ
せ、それにより互いに交差する光導波路間で光路の切替
を行う光スイッチにおいて、 前記光導波路層が有機高分子（ポリマ）材料により構成
され、前記光スイッチを組み立てる際に、 前記光導波路層内で最も表層にある上部クラッド層を、
ポリマ材料のガラス転移温度よりも低い温度での加熱に
よるかあるいは紫外線照射により硬化させた後、前記上
部クラッド層を硬化させたときの温度よりも高く、かつ
ポリマ材料のガラス転移温度に近くかつ該ガラス転移温
度よりも低い温度で加熱しながら、上部クラッド層上に
蓋材を押しつけて接合することを特徴とする光スイッチ
の組立方法。1. A refractive index matching liquid having a refractive index equal to that of an optical waveguide is sealed in a drive pipe provided at an intersection of optical waveguides crossing each other in an optical waveguide layer on a support substrate. An optical switch in which a liquid is moved by heating by a heater in a driving conduit, thereby switching an optical path between optical waveguides crossing each other, wherein the optical waveguide layer is made of an organic polymer material, and When assembling the switch, the upper clad layer, which is the outermost layer in the optical waveguide layer,
After curing by heating at a temperature lower than the glass transition temperature of the polymer material or by irradiation with ultraviolet light, the temperature is higher than the temperature at which the upper clad layer is cured, and close to and close to the glass transition temperature of the polymer material. A method for assembling an optical switch, wherein a lid material is pressed onto an upper clad layer and joined while heating at a temperature lower than the glass transition temperature.
に、 蓋材の接合面にポリマ材料を塗布し、該ポリマ材料のガ
ラス転移温度よりも低い温度での加熱によるかあるいは
紫外線照射により硬化させた後、前記ポリマ材料を硬化
させたときの温度よりも高く、かつポリマ材料のガラス
転移温度に近くかつ該ガラス転移温度よりも低い温度で
加熱しながら、上部クラッド層上に蓋材を押しつけて接
合することを特徴とする光スイッチの組立方法。2. When assembling the optical switch according to claim 1, a polymer material is applied to the joint surface of the lid material, and cured by heating at a temperature lower than the glass transition temperature of the polymer material or by irradiating ultraviolet rays. After heating, the lid material is pressed onto the upper cladding layer while heating at a temperature higher than the temperature at which the polymer material was cured, and close to and lower than the glass transition temperature of the polymer material. A method for assembling an optical switch, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14950598A JP3429196B2 (en) | 1998-05-29 | 1998-05-29 | Assembly method of polymer waveguide optical switch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14950598A JP3429196B2 (en) | 1998-05-29 | 1998-05-29 | Assembly method of polymer waveguide optical switch |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11337850A true JPH11337850A (en) | 1999-12-10 |
| JP3429196B2 JP3429196B2 (en) | 2003-07-22 |
Family
ID=15476620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14950598A Expired - Fee Related JP3429196B2 (en) | 1998-05-29 | 1998-05-29 | Assembly method of polymer waveguide optical switch |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3429196B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6519381B2 (en) | 2000-12-06 | 2003-02-11 | Mitsubishi Denki Kabushiki Kaisha | Optical switch and method of producing the same |
| KR100402990B1 (en) * | 2001-10-26 | 2003-10-23 | 한국과학기술연구원 | The optical switching manufacture method using UV LIGA |
| KR100446625B1 (en) * | 2002-03-27 | 2004-09-04 | 삼성전자주식회사 | Manufacture method of optical switch |
| US6804427B2 (en) | 2001-09-03 | 2004-10-12 | Mitsubishi Denki Kabushiki Kaisha | Optical switch |
| US6873754B2 (en) | 2002-03-15 | 2005-03-29 | Mitsubishi Denki Kabushiki Kaisha | Optical switch and method of manufacturing the same |
-
1998
- 1998-05-29 JP JP14950598A patent/JP3429196B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6519381B2 (en) | 2000-12-06 | 2003-02-11 | Mitsubishi Denki Kabushiki Kaisha | Optical switch and method of producing the same |
| US6804427B2 (en) | 2001-09-03 | 2004-10-12 | Mitsubishi Denki Kabushiki Kaisha | Optical switch |
| KR100402990B1 (en) * | 2001-10-26 | 2003-10-23 | 한국과학기술연구원 | The optical switching manufacture method using UV LIGA |
| US6873754B2 (en) | 2002-03-15 | 2005-03-29 | Mitsubishi Denki Kabushiki Kaisha | Optical switch and method of manufacturing the same |
| KR100446625B1 (en) * | 2002-03-27 | 2004-09-04 | 삼성전자주식회사 | Manufacture method of optical switch |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3429196B2 (en) | 2003-07-22 |
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