WO1994027188A1 - Dispositif permettant de masquer des substrats a traiter - Google Patents

Dispositif permettant de masquer des substrats a traiter Download PDF

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Publication number
WO1994027188A1
WO1994027188A1 PCT/DE1994/000511 DE9400511W WO9427188A1 WO 1994027188 A1 WO1994027188 A1 WO 1994027188A1 DE 9400511 W DE9400511 W DE 9400511W WO 9427188 A1 WO9427188 A1 WO 9427188A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
film
masking
areas
mask
Prior art date
Application number
PCT/DE1994/000511
Other languages
German (de)
English (en)
Inventor
Bernhard DRÖGE
Original Assignee
Etablissement Voralp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Etablissement Voralp filed Critical Etablissement Voralp
Publication of WO1994027188A1 publication Critical patent/WO1994027188A1/fr

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/12—Production of screen printing forms or similar printing forms, e.g. stencils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks

Definitions

  • the invention relates to a device for masking substrates to be processed according to the preamble of patent claim 1.
  • Masks play an important role in various areas of technology. Thus, a mask made of opaque material is used in photography to mask certain parts of a photosensitive layer, i. H. to cover.
  • a photosensitive film is applied under pressure to a substrate to be processed and then exposed to light rays (FR-A-2 221 755).
  • the photosensitive film consists of a film with a translucent base, an opaque color layer being applied to those points on the translucent base that do not correspond to those points which the desired
  • the photosensitive film which is located on the substrate, is then irradiated with activating rays in order to harden the photosensitive layer in the relief regions. Subsequently, the upper layers, which are formed by the translucent base layer, are removed, the opaque layer and the lift-off layer being the photosensitive layer Preserve the layer on the substrate. A washing solution is then applied to the photosensitive layer which adheres to the substrate in order to remove the uncured photosensitive layer by washing.
  • a masking film which consists of a transparent base and carries a masking layer (EP-B-0 168 924).
  • the masking layer consists of a vinyl chloride-vinyl acetate copolymer and a polyurethane, which is formed from an aromatic diisocyanate by reaction with a diol-containing polyester, the masking layer being applied directly to the transparent base.
  • a substrate is provided on which there is a pressure-sensitive adhesive layer (EP-A-0 352 079).
  • a lightfast, peelable layer is applied to the adhesive layer, which contains dialkyl phthalate, nitrocellulose and a lightfast color.
  • a multilayer material for the production of a complete, flat mask which can be used in the graphics industry and in the production of printed circuits (EP-A-0 420 318).
  • the material has a first backing layer, which consists of a smooth film that ranges from -50 to
  • a second layer consists of a flexible film, the dimensions of which remain stable at -50 to 60 ° C. and is impervious to radiation of 200 to 400 nm.
  • a third layer which consists of a plastic adhesive layer, is between inserted the first and second layers.
  • Masking layer comprising a component made of cellulose ester, an alphatic polyester-based polyurethane and one or more dyes (US Pat. No. 4,921,740).
  • a known method of applying a solder mask to the surface a printed circuit board, this surface having highlighted areas, consists in that a film is used which has a cover film, this cover film being provided on the top with a coating which in turn contains a light-sensitive layer which after exposure cures (US-A-5 164284).
  • the known masking techniques always fail when the size and / or nature of the substrate make it difficult to process.
  • a resistance sensor to a windshield (cf. US Pat. No. 4,705,998, FIG. 4; DE-A-2 057 062, US Pat. No. 4,665,351), which is used to control a windshield wiper , in itself not required that this sensor cover the entire pane. Rather, it is sufficient that it is only in a small area of the disk. In such a case, it would be expensive to process the entire windshield for coating, exposure and development of the mask.
  • the invention has for its object to provide a device which makes it possible to mask certain areas within a substrate surface in a simple manner. This object is achieved in accordance with the features of patent claim 1.
  • the advantage achieved by the invention is, in particular, that masking is possible without any problems, even on curved substrates. This is made possible by masking by applying a finished mask.
  • 1 is a plan view of a masking film with which a resistance
  • FIG. 2 shows a section through the masking film according to FIG. 1; 3 shows a detail from a windshield on which the masking film is applied; Fig. 4 shows a device with which a resistance sensor on a
  • Windshield can be applied using the masking film.
  • This slide 1 shows a film 1 which consists of two layers, of which one layer is a clear plastic layer serving as a carrier film and the other layer is an exposed layer. Since both layers are on top of each other, they cannot be recognized as separate layers.
  • This slide 1 is z. B. manufactured in such a way that two layers are superimposed, one of which is sensitive to light and the other insensitive to light. The film is then exposed on the side that is sensitive to light, in accordance with a specific pattern. The exposed film is then subjected to a development process and the developed areas are separated from the undeveloped ones.
  • a negative pattern of a resistance sensor is shown, as z. B. Fig. 2 of patent application WO 90/08680 shows. All bright spots 2, 3, 4 of the slide 1 are later, i.e. H. after coating by a sputtering process or the like, to electrical conductors, while all dark spots 5 become electrical non-conductors.
  • the mask can be removed again. If the electrically conductive sensor is to be plated through the glass pane, all known plated-through methods can be used.
  • the wafer can be doped with conductive elements at the via locations.
  • FIG. 2 shows the film shown in FIG. 1 again with a view of the narrow side and in section.
  • the first layer 6 is a clear plastic film on which the opaque layer 7 is located. This layer 7 is broken through at two points 2, 3.
  • the film 1 shown in FIGS. 1 and 2 is produced in a conventional manner.
  • a piece of a glass sheet 8 is shown, which is z. B. is the windshield of a motor vehicle.
  • the film 1 shown in FIG. 2 is rotated by 180 degrees and placed with the layer 7 on the glass pane 8. This layer adheres to the pane 8 by adhesion or by means of an adhesive. After the film 1 has been applied to the pane 8, the layer 6 is removed, as is indicated by the arrow 9.
  • the layer remaining on the disc 8 is - with the exception of points 2, 3 - for radiation, for. B. ion radiation, impermeable. 4 shows one of numerous possibilities of how a motor vehicle window can be provided with a sensor resistor using the layer 7.
  • the glass pane 8, which is provided with the layer 7, is located in a sputtering system as described, for example, in principle in DE-OS 38 21 207.
  • the glass pane 8 is provided with a thin layer 7, which has a relatively low ohmic resistance and is clear-sighted, e.g. B. an ITO layer.
  • the disc 8 is opposite a target 41 which is to be atomized.
  • the target 41 is connected via a section U-shaped element 40 to an electrode 42, which rests on a yoke 36, which includes three permanent magnets 37, 38, 39 between it and the element 40.
  • the polarities of the poles of the three permanent magnets 37, 38, 39 directed at the target 41 alternate, so that in each case the south poles of the two outer permanent magnets 37, 39 with the north pole of the central permanent magnet 38 create an approximately circular magnetic field through the Effect target 41.
  • This magnetic field compresses the plasma in front of the target 41, so that it has its greatest density where the magnetic fields have the maximum of their circular arc.
  • the ions in the plasma are accelerated by an electric field that builds up on the basis of a direct voltage that is emitted by a direct current source 10.
  • the negative pole of this direct current source 10 is connected to the electrode 42 via two inductors 11, 12.
  • the electric field is perpendicular to the surface of the target 41 and accelerates the positive ions of the plasma in the direction of this target. As a result, more or fewer atoms or particles are knocked out of the target 41, in particular from the areas 13, 14 where the magnetic fields have their maxima.
  • the atomized atoms or particles migrate into
  • the particles knocked out of the target 41 react in a space 15 with certain gases which come from gas containers 16, 17 via valves 18, 19 and Inlet ports 20, 21 are guided into this space 15 by means of gas supply lines 22, 23.
  • This space 15 is formed by two containers 24, 25, one of which includes the disc 8, while the other container 24 ends in front of the disc 8 and forms an aperture 26. Both containers 24, 25 and thus also the disc 8, which rests on the bottom of the container 25, lie electrical to ground. Also connected to ground is the second connection 27 of the direct current source 10, the first connection 28 of which, in addition to the inductors 11, 12, is also connected to a capacitor 29 which in turn is connected to ground.
  • a high-frequency source 30 can also be electrically connected with a connection 31 to the electrode 42, specifically via two controllable capacitors 33, 34, between which an inductor 35 is also connected, which is connected to ground.
  • the connection point of the two other inductances 11, 12 is connected to a capacitor 32 which, like the second connection 36 of the high-frequency source 30, is also connected to ground.
  • the capacitances 29 and 32 and the included inductance 11 form a low-pass filter which prevents high frequencies from passing through.
  • the inductance 12 still supports this effect.
  • the capacitances 33 and 34 and the inductance 35 form an adaptation network for the high-frequency feed to the cathode 42. At the same time, they act as high-pass filters, i. H. the direct voltage cannot reach the alternating current source 30.
  • the gas reaches the space between the first and the second container 25, 24, but it could also be supplied to the second container 24 via a gas distribution system surrounding the cathode 42.
  • a process computer which processes measurement data and issues control commands.
  • Process computers can, for example, be supplied with the values of the measured partial pressure in the process chamber 25. Based on this and other data, he can, for example, regulate the gas flow via the valves 18, 19 and set the combination of direct and alternating voltage at the cathode.
  • the process computer is also able to regulate all other variables, for example cathode current, high-frequency power and magnetic field strength. Since such process computers are known, a description of their construction is omitted.
  • the masking film prefabricated according to the invention can be used particularly advantageously in the case of curved substrates, such as, for. B. windshields or lenses, because this prevents bubbles, etc.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

L'invention concerne un dispositif permettant de masquer des substrats à traiter, notamment à masquer des pare-brise, pour les munir de capteurs. Le masquage, par exemple pour imprimer des tracés conducteurs sur la vitre, est préfabriqué sous forme de film double. Le film double est appliqué sur la vitre où il adhère sous l'effet de forces d'adhérence ou à l'aide d'un adhésif. Une partie du film double est ensuite ôtée en étant tirée, afin qu'il ne reste plus sur la vitre que la partie contenant le motif du tracé conducteur lui-même. La vitre peut alors être soumise à un processus de revêtement, par exemple à un processus de pulvérisation cathodique pour imprimer les tracés conducteurs sur ledit pare-brise.
PCT/DE1994/000511 1993-05-07 1994-05-05 Dispositif permettant de masquer des substrats a traiter WO1994027188A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP4315136.1 1993-05-07
DE4315136A DE4315136A1 (de) 1993-05-07 1993-05-07 Vorrichtung für die Maskierung von zu bearbeitenden Substraten

Publications (1)

Publication Number Publication Date
WO1994027188A1 true WO1994027188A1 (fr) 1994-11-24

Family

ID=6487421

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1994/000511 WO1994027188A1 (fr) 1993-05-07 1994-05-05 Dispositif permettant de masquer des substrats a traiter

Country Status (2)

Country Link
DE (1) DE4315136A1 (fr)
WO (1) WO1994027188A1 (fr)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2204147A (en) * 1934-05-24 1940-06-11 Eastman Kodak Co Photographic stencil material
GB1357910A (en) * 1971-06-14 1974-06-26 Wells I G Electrochemical marking
GB2004385A (en) * 1977-09-12 1979-03-28 Standex Int Corp Embossing surfaces, e.g. of moulds and dies, by etching
US4310615A (en) * 1974-11-13 1982-01-12 Minnesota Mining And Manufacturing Company Image transfer element having release layer
US4430416A (en) * 1980-06-27 1984-02-07 Asahi Kasei Kogyo Kabushiki Kaisha Transfer element for sandblast carving
US4668083A (en) * 1985-11-18 1987-05-26 The Perkin-Elmer Corporation Contact lithographic fabrication of patterns on large optics
DE3708577A1 (de) * 1987-03-17 1988-09-29 Ver Glaswerke Gmbh Mit einer elektrisch leitenden und waermestrahlen reflektierenden schicht versehene autoglasscheibe
EP0347567A2 (fr) * 1988-06-23 1989-12-27 Leybold Aktiengesellschaft Dispositif de revêtement d'un diélectrique sur un substrat

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1462511A (en) * 1973-03-15 1977-01-26 Kansai Paint Co Ltd Forming relief patterns using stripping materials
GB8415782D0 (en) * 1984-06-20 1984-07-25 Autotype Int Ltd Masking films
GB8800377D0 (en) * 1988-01-08 1988-02-10 Autotype Int Ltd Masking films
US5164284A (en) * 1988-02-26 1992-11-17 Morton International, Inc. Method of application of a conforming mask to a printed circuit board
US5009944A (en) * 1988-07-20 1991-04-23 Somar Corporation Lightsafe masking film
IT1231965B (it) * 1989-09-29 1992-01-16 Reprochim Srl Materiale multistrato per preparare maschere a fondi pieni per l'industria grafica e per la produzione di circuiti stampati.

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2204147A (en) * 1934-05-24 1940-06-11 Eastman Kodak Co Photographic stencil material
GB1357910A (en) * 1971-06-14 1974-06-26 Wells I G Electrochemical marking
US4310615A (en) * 1974-11-13 1982-01-12 Minnesota Mining And Manufacturing Company Image transfer element having release layer
GB2004385A (en) * 1977-09-12 1979-03-28 Standex Int Corp Embossing surfaces, e.g. of moulds and dies, by etching
US4430416A (en) * 1980-06-27 1984-02-07 Asahi Kasei Kogyo Kabushiki Kaisha Transfer element for sandblast carving
US4668083A (en) * 1985-11-18 1987-05-26 The Perkin-Elmer Corporation Contact lithographic fabrication of patterns on large optics
DE3708577A1 (de) * 1987-03-17 1988-09-29 Ver Glaswerke Gmbh Mit einer elektrisch leitenden und waermestrahlen reflektierenden schicht versehene autoglasscheibe
EP0347567A2 (fr) * 1988-06-23 1989-12-27 Leybold Aktiengesellschaft Dispositif de revêtement d'un diélectrique sur un substrat

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
K.S. DESAI ET AL.: "photolithographic process using a disposable nonmetallic mask", IBM TECHNICAL DISCLOSURE BULLETIN., vol. 16, no. 8, January 1974 (1974-01-01), NEW YORK US, pages 2644 - 45 *

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Publication number Publication date
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