Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
  • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
  • B29C45/14065—Positioning or centering articles in the mould
  • B29C45/14073—Positioning or centering articles in the mould using means being retractable during injection
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
  • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
  • B29C45/14819—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being completely encapsulated
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
  • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
  • B29C2045/1486—Details, accessories and auxiliary operations
  • B29C2045/14942—Floating inserts, e.g. injecting simultaneously onto both sides of an insert through a pair of opposed gates

Definitions

• the present invention relates to a floating insert molding method and apparatus.
• an electromagnetic shielding case used for covering electrical and electronic devices, parts, and elements that require electromagnetic shielding, such as high-frequency transformers, has electromagnetic shielding performance.
• Floating insert molding method and molding for integrally molding a core layer made of an electrically conductive material (metal, conductive resin, etc.), and an inner layer and an outer layer made of a synthetic resin or the like superposed on the inner and outer sides. It concerns the device.
• composite food in which the outside of the built-in food is integrally covered with food materials of the same or different material, cushion material in which a core layer made of elastic material is embedded integrally with foamed resin, and around seeds Of nutrients-body type seeds that are covered with nutrients necessary for germination and growth, as well as a method of molding electronic function packages and the like in which electronic components and the like are integrally covered with synthetic resin and the like, and an apparatus for performing the method It is about.
• the shape method is that the core eyebrows are made of metal, conductive resin, etc.
• the two-color molding method of b) (also called multicolor molding method) is the core layer
• the core layer is made of conductive resin or the like.
• an object of the present invention is to provide a molding method and a molding apparatus for a molded article that meets the requirements 1) to 4) ′ described above and has a low electromagnetic shielding effect.
• the present invention as means for achieving the above object, comprises a fixed die mounted on a fixed die mounting plate, and a movable die forming a pair with a fixed die mounted on a movable die mounting plate.
• the movable mold is moved to open the mold, and is produced in advance in the space between the molded product forming sections of the pair of molds. Predetermined position only by floating insert holding device during molding
• a movable floating insert holding device located in the forming section
• Material is supplied by the supply device, and it is fixed to the floating insert.
• a fixed mold is installed as an apparatus for performing the above molding method.
• the tip of the probe directly contacts the fixed surface of the floating insert for measurement.
• a fixed mold equipped with a mold pressure measuring device and a movable mold
• a floating insert holding device on the movable mold side having a movable insert side, and a movable insert side displacement measuring device for measuring by directly contacting the tip of the floating insert on the movable surface of the floating insert.
• a movable mold provided with a movable mold side pressure measuring device on the movable mold side located in the forming section; and a floating mold provided on one of the fixed mold and the movable mold or the rain mold.
• a floating insert molding device consisting of an insert molded product ejection device and a floating insert holding force maintaining device that functions in conjunction with the floating insert holding device of both the fixed mold and the movable mold.
• the feature of the present invention is that a floating insert prepared in advance is located in both fixed and movable molds A and B, and these are closed by both molds, so that a space is provided between the floating insert and the fixed and movable molds.
• the molten material is supplied from both sides into the space, and it is possible to produce an integrated molded product consisting of the outer layer, the core layer (floating insert) and the inner layer in a single molding with a pair of molds. What you do. .
• FIG. 1 shows an apparatus for carrying out the method of the present invention, in particular, a state where a mold is opened and a floating insert C is introduced.
• FIG. 2 shows a state in which the floating insert C is held by the floating insert holding device and the floating insert holding force maintaining device (in FIGS. 2 to 6, the timer is omitted).
• FIG. 3 shows a state in which the mold is closed.
• Fig. 4 shows the state during filling of the molten material.
• FIG. 5 shows a state in which the filling of the welding material is completed.
• Fig. 6 shows the floating insert molded product protruding and being unloaded.
• Fig. 7 to Fig. 9 are illustrations of the manufacturing method of a kamaboko with a plate using built-in food as a floating insert.
• FIGS. 10 to 13 are explanatory views showing the structure of a chair or the like in which an air spring or the like is used as a floating insert.
• FIGS. 14 to 15 are explanatory diagrams of a production method in which a seed is used as a floating insert and an outer layer is used as a nutrient material.
• Fig. 16 to Fig. 19 are illustrations of the method of manufacturing electronic components using the electronic functional body as a floating insert.
• FIG. 1 shows an apparatus for carrying out the method according to the invention.
• the “floating insert” is a space in which a pair of molding dies for molding a fusible molding material is opened, and only a holding device of both molding dies is used. It is an insert (insert) that is directly held, fixed in a predetermined molding position, closed, closed in a mold with a fusible material, and built in.
• the “floating insert molding method” refers to a molding method using a floating insert
• the “floating insert molded product” refers to a molded product made by the floating insert molding method.
• the floating insert holding force maintaining device D and the driving device of the movable mold mounting plate 3 by hydraulic pressure or the like are omitted.
• ⁇ is a fixed die mounted on a fixed die mounting plate (hereinafter referred to as fixed platen)
• B is a movable die mounted on a movable die mounted plate (hereinafter referred to as movable platen) 3
• C is a floating insert
• E is a floating insert molded product protruding device, which is provided in either one of the fixed mold A and the movable mold B, or both molds However, it is provided on the fixed mold A in the figure.
• D is a floating insert holding force maintaining device, which works in conjunction with the floating insert holding devices 6 and 11 of both the fixed mold A and the movable mold B.
• the molding apparatus according to the present invention comprises the following essential components: a fixed mold A, a movable mold B, a floating insert molded product projecting device E, and a floating insert holding force maintaining device D. It is configured.
• the fixed mold A is fixed to the movable mold B by a fixed inverted molten material supply device 2 via a fixed plate 1, and the movable mold B is integrally assembled by being strongly pressed.
• the molten material is supplied from the movable-side molten material supply device 4 which moves together with the molten material through the molten material supply receiving portions 8 and 18 and the molten material supply flow passage portions 16 and 17 respectively. Is done.
• the fixed mold A includes the fixed-side molten material supply receiving section 8, the fixed-side molten material flow path section 16, and the fixed-side floating insert holding device 6 operated by fluid pressure or the like. Similarly, a fixed-side floating insert displacement measuring device 5 operated by fluid pressure, etc., a fixed-side mold internal pressure measuring device 7 and other structural members and parts required for a molding die (not shown). Is provided.
• the movable mold B includes a movable-side molten material supply receiving portion 18, a movable-side molten material supply passage portion 17, and a movable-side floating insert holding device 11 1 operated by fluid pressure or the like.
• a movable insert floating displacement measuring device 10 which is operated by fluid pressure or the like, a movable mold internal pressure measuring device 12 and other structural members required for a molding die (not shown) , Parts, etc.
• the molding device is shown as being of a horizontal type, but it may be of a vertical type.
• the fixed mold mounting plate is on the left side in the horizontal type. In the vertical type, this is the upper side, but may differ depending on the specifications.
• the molten material supply devices 2 and 4 on the fixed side and the movable side are each shown as a single unit parallel to the central axis of the molding apparatus, but may be provided obliquely or perpendicular to the central axis, or may be plural. You can do this.
• the molten material receiving parts 8 and 18 are provided on the side surfaces of the mold other than the butting surface (referred to as a “parting surface”) of the fixed mold A and the movable mold B by the molten material supply devices 2 and 4. It can be installed to correspond to the installation situation, and the molten material supply flow passages 16 and 17, the floating insert holding devices 6 and 11 and their tips, and the floating insert molded product protruding device E, its tip, and the quantity, position, structure, etc. of the mold internal pressure measuring devices 7 and 12, etc. are appropriately examined according to the specifications of the target floating insert molded product, such as size, weight, shape, etc. Will be implemented.
• the floating insert C which is produced in conjunction with this system or separately produced, can be used as a float. It is accurately supplied to the space between the pair of dies A and B determined by the idle insert transport supply / unloading device 13 and stopped. At this time, the floating insert holding force maintenance device D does not function interlockingly.
• the floating insert on the fixed side is The leading ends of the holding device 6 and the floating insert holding device 11 on the movable side are respectively advanced toward the floating insert C by operating a fluid pressure cylinder or the like, and each of the floating inserts C is moved forward.
• the floating insert C is fixed and held precisely at a predetermined position in the space between the dies A and B by tightly pressing the surface.
• the floating insert holding force maintaining device D is activated, and the floating insert holding device 6, 11 operates on the fixed side and the movable side in conjunction with each other, thereby maintaining the floating insert holding force. Let me keep it.
• the floating insert held by the fixed insert and floating insert holding devices 6 and 11 and floating insert small holding force holding device D with an appropriate fixed holding force. While maintaining the fixed holding force of the insert C, move the floating insert holding device 11 on the movable side in the forward direction, and move the floating insert holding device 6 on the fixed side in the retreating direction by the required distance. Transfer accurately to the predetermined position where insert molding is performed. During this time, the floating insert holding force maintaining device D works in conjunction with the floating insert holding devices 6, 11 on the fixed side and the movable side, respectively.
• the fixed-side and movable-side internal pressures differ due to the fixed-side and movable-side internal mold pressure measuring devices 7 and 12 installed at the required positions in the mold. As soon as the normal internal pressure value is measured, the molten material supply device 2
• the predetermined limit outlier is measured and detected.
• Each tip of the floating insert holding device can be any shape
• the tip of the unit for measuring displacement is flush with the surface of each mold.
• the material supply described above reaches a predetermined amount and the measuring device continuously filters the material.
• the floating insert C a conductive material having electromagnetic shielding performance as a core layer in the electromagnetic shielding case has been described as an example.
• the present invention is not limited to the electromagnetic shield case, but can be applied to the following examples (a) to (e).
• Fig. 7 to Fig. 9 show built-in food products as processed products of solid materials
• This figure shows a vertical molding device with a built-in -kamaboko.
• the upper part is the fixed side
• the lower part is the movable side
• the molded part forming part fa of the fixed upper mold Aa is movable.
• Fig. 7 the upper mold Aa and the lower mold Ba are opened, and the built-in food as the prepared floating insert Ca is supplied by the floating insert carton feeding and unloading device 13a. Shown is a card that is introduced from the side and held at predetermined positions by the floating insert holding devices 6a and 11a.
• the hook 19 as a normal insert is mounted in the lower mold Ba in the previous step, and the through hole 20 for the lower mold floating insert holding device provided in the kamaboko 19 is provided. Then, the tip of the lower mold floating insert holding device 11a rises to hold the floating insert Ca.
• the lower mold molten material supply flow path portion 17a is fitted into a predetermined position of the molten material supply flow path portion through hole 21 on the lower mold Ba side of the Kamaboko board 19.
• Fig. 8 shows the upper mold movable molded product forming part: fa descends, lower mold Ba rises, the upper and lower molds Aa, Ba are completely closed, and the upper and lower molten material supply flow passages 16a, From 17a, the floating insert Ca, in which the molten material is held in place, and the upper and lower dies Aa, Ba and the spaces 14a, 15a of the kamaboko plate 19 are simultaneously press-fitted and filled once at a time. It is in a molded state.
• Fig. 9 shows that the upper and lower molds Aa and Ba are opened and the lower mold protrudes.
• the device Ea allows the kamaboko plate 19 to protrude out of the mold and the floating insert molded product filled and molded on the kamaboko plate 19 at the same time, and carries the floating insert molded product. This shows the state of being carried out by 13a.
• foods of different materials or foods with different appearances are built into their interiors in a uniform shape and in the exact amount and at the correct position, and are inexpensive for agricultural, marine, and livestock products.
• the processed food can be obtained by the floating insert molding method and the molding apparatus of the present invention.
• FIGS. 10 to 12 show examples in which the present invention is applied to the manufacture of seats or back members of seats for reception chairs or automobiles.
• a so-called air spring incorporating air or the like in a closed container 22 having elasticity as the floating insert Cb, or an elastic material molded from a foamed material or the like, and a foamed material or the like on the outside is used. It is one that was covered by one.
• Fig. 11 shows the relationship between the floating insert Cb under no load and the outer layer of foam material, etc.
• Fig. 12 shows the load This shows the rendition of the curtain.
• Reference numeral 24 in the figure is a trace of the holding device receiving portion used at the time of floating insert molding.
• an air spring or the like can be embedded as a floating insert Cb, which is compared to a conventional type having a spring 25 attached to the back or bottom as shown in Fig. 13. It can exhibit extremely ergonomic performance.
• FIGS. 14 to 15 show that the present invention uses seeds for sowing of rice and wheat as direct floating inserts, or puts the seeds in a soluble sealed container (encapsulation) and coats them with a soluble material.
• the primary insert such as rounded grains, is used as a floating insert, and the outer layer is covered with various nutrients necessary for germination and growth of seeds for sowing, and is manufactured by the floating insert molding method of the present invention.
• the primary insert such as rounded grains
• the nutrients in the outer layer are mixed at standard component ratios or at specific site component ratios, while taking into account the performance (solubility, preservability, etc.) required of the seed hulls for sowing, and also as a flocculant, coloring agent It makes it easy to carry out the floating insert molding method as a fusible material produced by adding necessary additives and mixing and kneading.
• FIG. 14 shows that seeds for sowing such as rice and wheat are directly used as floating inserts Cc according to the present invention, and a molten material having necessary nutrients and the like is obtained by a floating insert molding method. Mold Here is an example.
• the floating insert supply device 26 supplies a certain number of seeds Cc as floating inserts (one each in the case of the example in the figure), and the natural tip of the seeds is supplied.
• the outlet 27 of the drop and the passage moves just above the center of the lower mold Be to supply the seed, and is dropped on the lower mold Be. Since the falling distance is small and the seed Cc is light, the lower mold Be is not damaged or the seed does not pop out.However, the seed is irregular, so it stops at the bottom of the mold. The position is indeterminate and is not always located at the center of the lower mold seat.
• the tip of the lower mold floating insert holding device (also serving as a protruding device) (Fig. 15) 29 that forms a part of the lower mold seat is When the microvibration is performed, it can be positioned at the deepest part of the mold seat, that is, at the center of the mold seat.
• Fig. 14 (c) the upper mold movable molded product forming part fc is lowered, the lower mold Be is raised, the upper and lower molds Ac and Be are completely closed, and the upper and lower mold floating inserts are inserted.
• the holding devices 28 and 29 are lowered and raised, and stopped at a position where a predetermined gap S is obtained at a position facing the mold separation surface as a center. Clearance S E between each of the parties Ngurai down surface, S 2 is equal to this of course.
• FIG. 14 (f) the upper and lower dies Ac and Be are opened, and the upper mold movable molded product forming part: c is raised, and the lower mold floating insert device and the protruding device 29 form an air passage.
• 3 2 Fig. 15
• the floating insert molded product is protruded out of the mold, and the floating insert molded product lot transfer device 3 1 and carry seeds for sowing such as rice and wheat Then, a granular coated seed comprising an outer layer having various nutrients and the like is obtained.
• FIGS. 16 to 19 show electronic component parts having various functions using the floating insert molding method and molding apparatus of the present invention, various functional circuits using the same, and further integrating them.
• electronic functional bodies By shielding a part or the whole of various combined functional components and products (hereinafter referred to as electronic functional bodies), an electronic functional body with good shielding can be obtained.
• the overall sealing (hereinafter referred to as the IC package) of a molding material such as a synthetic resin of the IC, which is an electronic functional body, will be described below.
• FIG. 16 (a) to (e) show the process of molding an IC package having a new structure into a vertical form using a floating insert molding method and molding equipment using a molding material such as synthetic resin.
• FIG. 4 is a schematic explanatory view of a necessary process, in which an upper part is a fixed side, a lower part is a movable side, and a molded article forming part fd of the upper mold Ad is movable.
• Fig. 17 is an illustration of the use of the new structure IC package for thermal management during use.
• Fig. 18 is the use of the new structure IC package for thermal management in the immersion plating process.
• FIG. FIG. 19 is a schematic illustration of the main steps of molding an IC package having a conventional structure using the floating insert molding method and molding apparatus of the present invention.
• Fig. 16 (a) shows the device chip 33 mounted and the bond This shows a state in which the IC with the installation of the wing wire 33a has been completed and the upper and lower internal force bars 34a and 34b with elastic sealing materials 35a and 35b attached to the periphery thereof.
• the upper and lower inner covers 34a and 34b are mounted at predetermined positions of the lead frame 36 by the mounting device (1), so that no displacement occurs due to the transfer process or the like. And shows the assembled state.
• This assembly is designated as floating insert Cd.
• the transfer between these steps and the transfer to the next forming step are stopped by the floating insert Cd and the floating insert carrying / conveying / forging device 37.
• Figure 16 (c) The floating insert Cd is carried in at a predetermined position in the space between the dies Ad and Bd and stopped, and the upper and lower die floating insert holding devices 38a and 38b are lowered and raised, respectively.
• G shows a state where Cd is held at a predetermined position.
• the floating insert Cd and the floating insert molded product carrying-in / out device 37 escape from the space between the upper and lower dies Ad and Bd.
• Fig. 16 (d) shows the upper and lower molds after the upper and lower dies are completely closed at the predetermined positions while the floating insert Cd is held at the predetermined positions by the floating insert holding devices 38a and 38b.
• Various measuring devices function to perform remolding under optimal molding conditions What we do is as described above.
• Fig. 16 (e) shows the upper and lower mold floating insert holding devices 38a, 38b at the end of the predetermined molding process, after being raised or lowered to a predetermined position and stopped. Further, the molten material is press-filled and filled into the entire space between the upper and lower dies Ad, Bd and the floating insert Cd, and the molding is completed.
• the IC package as a floating insert molded product is obtained. It is in a state where it is.
• the upper and lower dies A, Bd are opened, and the floating insert molded product is protruded by the protruding device, and the floating insert molded product carrying / unloading device 37 is used for the upper and lower dies A, Bd. You can get away from it.
• Processing time is short because it is possible to use a filled shield molding material that has only one molding and has optimal molding performance for forming the outer layer.
• Upper and lower inner covers 34a, 34b and elastic sealing materials 35a, 35b are limited to items that can be easily mass-produced and are inexpensive, and that have low characteristics required for maintaining IC characteristics for filled shield molding materials. The cost of the material is low.
• the shield of the electronic functional body is doubled (the shield by the elastic sealing material and the shielding by the filling shield molding material). High reliability and described in 2) As described above, the performance of the filled shield molding material can be easily improved, and the adhesion can be increased.
• the microstructure of the electronic functional body is held in the space defined by the upper and lower inner covers 34a, 34b and the lead frame 36, so there is no deformation or damage.
• the material, shape, and properties of the upper and lower internal force bars, elastic sealing material, shield molding material, etc. it is possible to improve and improve moisture resistance, heat dissipation, and electromagnetic performance. Needless to say
• the element chip can be used for continuous use under severe conditions. And the like can be maintained under appropriate conditions, and the functions of the element chip and the like can be protected under more severe conditions such as immersion plating as shown in FIG.
• Fig. 19 shows the floating insert molding of the present invention for the production of IC packages using molding materials such as synthetic resin of the conventional structure. The method and the molding equipment were applied and used.
• the molding is performed by using the floating insert molding and apparatus of the present invention with the chip down (the element chip is on the lower side).
• Fig. 19 (a) shows the IC mounted on the lead frame as the floating insert Cd and having been wire-bonded, using the upper and lower mold floating insert holding devices 41a and 41b.
• the upper and lower dies Ad and Bd are completely closed at the predetermined position by the re-chip down method and the upper and lower dies Ad and Bd are completely closed to the same position.
• Fig. 19 (b) shows the same packaging material grade after a predetermined time, which is the same as material 43 with the required properties other than low stress, and sufficiently satisfactory with material 43 This shows a state in which a material 44 having a high affinity and capable of increasing the press-in speed has been started to be filled into the upper space at a press-in speed higher than that of the upper mold molten material supply channel portion 45.
• Fig. 19 (c) shows that materials 43 and 44 are filled in their respective spaces, and while performing sufficient treatment to discharge residual air, Apply pressure and press-fit to complete the molding, and
• the package is made of low-stress material for microstructures such as element chips.
• the molding performance is high and the total molding time is
• the effect is significant because many factors ⁇ ⁇ ⁇ ⁇ can be improved among multiple factors that are correlated.
• the surface of the electronic functional body is not limited.
• the same can be applied by pre-binding them.
• the floating sensor of the present invention is applied to all other electronic functional bodies.
• the injection molding method and molding equipment are effective and appropriate for electronic functional bodies.
• the material of the floating insert is changed.
• the material that can be dissolved by heat or dissolving the solvent and by making the inner and outer layers insoluble in the above-mentioned heat and solvent, etc. Obviously, a hollow molded product can be obtained.
• the floating insert molding method and apparatus As described above, according to the floating insert molding method and apparatus according to the present invention, not only the electromagnetic shield case molded article having a single core layer but also the material layer having the electromagnetic shield ability is formed as the outer layer, and the electrical insulation ability is obtained.
• a floating insert molded article is manufactured by using a material layer having a magnetic layer as a core layer and a material layer having an electromagnetic shielding ability as an inner layer, and using the material layer as a core layer, a floating insert molding method and a molding apparatus therefor.
• the present invention can provide an electromagnetic shield case stably and inexpensively, for example, a molded product of a double electromagnetic shield case can be stably obtained at low cost.
• the floating insert as a built-in food and covering the outside of the built-in food with a food material of a different material or the same material, a composite food in which the built-in food is correctly positioned can be easily obtained.
• the floating insert as an elastic material and integrally embedding the outer side of the elastic material with a foamed resin material or the like, a cushion in which the elastic material is correctly positioned at an appropriate position is provided. Material can be obtained easily.
• the floating insert is used as a seed, and the outside of the seed is By covering with nutrients necessary for germination and growth, it has become possible to mass-produce sowing seeds that can germinate reliably.
• the floating insert is used as an electronic functional body, and the outside is integrally covered with a synthetic resin layer, etc., so that a large amount of highly functional electronic functional body packages with extremely high sealing performance can be produced. Now you can.

Landscapes

• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Mechanical Engineering (AREA)
• Injection Moulding Of Plastics Or The Like (AREA)
• Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Priority Applications (3)

Applications Claiming Priority (1)

Publications (1)

Family

ID=13986599

Family Applications (1)

Country Status (2)

Cited By (3)

Families Citing this family (4)

Citations (2)

Family Cites Families (4)

• 1990
  • 1990-06-27 DE DE19904092623 patent/DE4092623C2/de not_active Expired - Fee Related
  • 1990-06-27 DE DE19904092623 patent/DE4092623T1/de active Pending
  • 1990-06-27 WO PCT/JP1990/000836 patent/WO1992000178A1/ja active Application Filing

Patent Citations (2)

Also Published As

Similar Documents

Legal Events