WO1991018490A1 - Procede et dispositif de soudage de pieces a souder dans des positions precises sur un support - Google Patents

Procede et dispositif de soudage de pieces a souder dans des positions precises sur un support Download PDF

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Publication number
WO1991018490A1
WO1991018490A1 PCT/DE1990/001003 DE9001003W WO9118490A1 WO 1991018490 A1 WO1991018490 A1 WO 1991018490A1 DE 9001003 W DE9001003 W DE 9001003W WO 9118490 A1 WO9118490 A1 WO 9118490A1
Authority
WO
WIPO (PCT)
Prior art keywords
carrier
soldering
solder
auxiliary
auxiliary carrier
Prior art date
Application number
PCT/DE1990/001003
Other languages
German (de)
English (en)
Inventor
Karl Eidling
Michael Becker
Gerd Kohler
Egon Edinger
Georg Fröhlich
Original Assignee
Siemens Nixdorf Informationssysteme Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Nixdorf Informationssysteme Aktiengesellschaft filed Critical Siemens Nixdorf Informationssysteme Aktiengesellschaft
Priority to EP91901577A priority Critical patent/EP0530191B1/fr
Priority to DE59006325T priority patent/DE59006325D1/de
Publication of WO1991018490A1 publication Critical patent/WO1991018490A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0478—Simultaneously mounting of different components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0475—Molten solder just before placing the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to a device and a method for applying precisely positioned soldering parts to a carrier, the soldering parts for the soldering process being detachably and positioned against one another on an auxiliary carrier, being transferred to the carrier with the auxiliary carrier and the auxiliary carrier following the soldering process is removed.
  • LED lines such as those used in character generators.
  • Light-emitting diodes LEDs
  • Character generators of this type belong to the category of non-mechanical printers.
  • the accuracy of the positioning within the LED rows and relative to a carrier must be in the order of -3-10 ⁇ m in all three spatial directions.
  • the production of an electrically conductive and mechanically load-bearing connection between the LEDs and a carrier, for example a module plate can be done by gluing or by soldering.
  • the adhesive offers significant advantages.
  • the safe dissipation of the heat loss generated during operation requires an optimal thermal coupling, which can only be produced by soldering.
  • the displacements of the LEDs caused by the soldering during the soldering process reduce the yield.
  • the auxiliary carrier prepared in this way is positioned with the LED line on the actual metal carrier coated with solder at corresponding points.
  • the entire arrangement is fixed, the solderable rear side of the LEDs touching the solid solder on the metal carrier.
  • the solder melts and the LEDs are wetted by it or immersed in it up to a position specified by stops.
  • the fixation with a solid solder layer and the subsequent phase transition of the solder from the solid to the liquid phase regularly result in disuse.
  • the cause lies in the contact of the soldering partners when adjusting.
  • a force is generated on the auxiliary carrier by a weight placed on it, as a result of which the LEDs can be damaged before or during the soldering process. Since the entire unit with the parts positioned and fixed against one another has a relatively large total mass, handling becomes difficult, for example, in vapor phase soldering, and only one unit can be applied in a soldering system for one soldering operation.
  • the invention is based on the object of providing a device and a method with which the soldering partners can be joined together with the required positional accuracy and without damage.
  • the invention is based on the knowledge that the soldering part can be soldered without damage and with the required positional accuracy by only joining them together after the solder has melted.
  • the soldering device and the adjusting device which are independent units, are connected to or via the soldering part to form a system.
  • the adjusting device aligns the soldering partners against one another and the soldering device fixes them in the desired position.
  • the soldering device is separated from the adjusting device before it is brought into the soldering system.
  • soldering partners For the self-joining of the soldering partners, they are partially clamped in the soldering device on spring joints so that they can be moved against one another from a first position when the spring joints are blocked after the solder has melted into a second lowered or approximated position and are thus joined together.
  • spacer elements are used to block the spring elements, the effect of which can be controlled for a limited time.
  • a particularly advantageous embodiment of the invention provides for the use of melting disks instead of the spacer elements.
  • the melting disks are designed in such a way that they melt briefly after the solder has melted, thus releasing the blocking of the spring joints.
  • a further embodiment of the invention relates to the use of self-resetting melting elements as spacing elements.
  • These fusible elements can be used several times and in principle have two spacer elements that are used alternately.
  • the substance of the melting disks which is designed for a certain melting temperature, is located within the melting elements.
  • Upon melting of the substance is pressed substance under the action of an external force of the hat-shaped body formed in the substances, and thus canceled the spacing. This immersion can be reversed by means of an internal spring when the substance is melted.
  • the attachment of the soldered parts on the auxiliary carrier is preferably an adhesive.
  • the adhesive offers optimal prerequisites for a precise application and mutual alignment of the soldered parts.
  • the auxiliary carrier is designed in a special way with individually controllable suction chambers which are arranged next to one another and are designed to suck the soldering parts.
  • Such an auxiliary carrier eliminates the wet chemical processes for detaching and cleaning, as well as mechanical cleaning processes, after the soldering parts have been soldered onto the carrier.
  • the carrier and auxiliary carrier can be heated, the use of a conventional soldering system is in principle dispensed with.
  • the energy for melting the solder, as well as heating the soldering partners to approximately the same temperature, takes place directly on the carrier or on the auxiliary carrier. With approximately the same high heating, positionally accurate soldering is ensured, and reproducible positions between the soldering partners within the required tolerance ranges can be achieved even after the soldering partners have cooled.
  • FIG. 1 shows a soldering device 3 with an adjusting device 4 with auxiliary carrier 5 and carrier 6 in the front view
  • FIG. 2 shows a top view of a device corresponding to FIG. 1,
  • FIG. 3 shows a side view of the device, microscope slide 14 and measuring optics 17 being shown
  • FIG. 4 shows a self-resetting melting element 26
  • FIG. 5 shows a schematic front view of the device with an auxiliary carrier 5 consisting of suction chambers 30.
  • the solder parts 1 which are meanwhile fastened and aligned on the auxiliary carrier 5 are positioned at a predetermined distance in a first position in an approximately parallel orientation with respect to the surface of the carrier 6. There is a layer of solder 2 on the corresponding surface of the carrier 6.
  • the microscope slide 14 receives the adjusting device 4, which in turn carries the soldering device 3.
  • the carrier 6 and the auxiliary carrier 5 are mounted spaced apart from one another via lowering blocks 7.
  • the spacing provides two positions, the first being defined by spacing elements 9, which are introduced into the spring joints 24 belonging to the lowering blocks 7, and the second is produced by Z stops 21.
  • support tongues 8 are formed, with intermediate rollers 22 being present.
  • the auxiliary carrier 5 is clamped in relation to the soldering device 3 via spring-supported clamping elements 13, in which case balls 23 are temporarily stored.
  • the power transmission from the tensioning elements 13 to the auxiliary support 5 occurs via tensioning levers 20.
  • FIG. 1 essentially relates to the representation of the soldering device 3, which can be handled individually after the adjustment process and can thus be introduced into a soldering chamber without the adjustment device 4, for example.
  • FIG. 2 shows a top view of the arrangement corresponding to FIG. 1, the measuring optics 17 not being shown.
  • the carrier 6 is oriented relative to the adjusting device 4 via pins 16.
  • the adjusting device 4 contains the clamping elements 10, 11, 12, an adjusting element 18 and Y stops 15.
  • the position of the soldering device 3 relative to the adjusting device 4 is determined by means of stops 25 (FIG. 3) and pins 16, the stops 25 belong to the adjusting device 4 and the pins 16 to the carrier 6. This provides an exact positioning of the carrier 6 in the Y direction, the position of the carrier 6 relative to the adjusting device 4 being roughly adjusted in the X direction.
  • the carrier 6 is clamped by the clamping element 10 to the soldering device 3 and to the adjusting device 4, the level alignment of all three parts relative to one another being ensured.
  • the X direction is expediently the direction of travel of the microscope slide 14, the microscope slide moving overall parallel to the X, Y plane.
  • the auxiliary carrier 5 equipped with solder parts 1 is positioned in the Y direction by pressing on the Y stops 15 and by clamping between the clamping element 11 and the adjusting element 18 in the Y direction and by means of the measuring optics 17 finely adjusted in the X direction relative to the carrier 6.
  • the auxiliary carrier 5 is fixed over the center guide jaws 19.
  • FIG. 3 shows a side view of an arrangement according to the invention, the microscope slide 14, the adjusting device 4, the soldering device 3, the carrier 6 and the auxiliary carrier 5 being shown from below on a frame of a microscope with measuring optics 17.
  • the adjusting elements 4 include the clamping elements 10, 12, the Y stops 15 and the stops 25.
  • the clamping elements 13 of the soldering device 3 are not shown here.
  • FIG. 4 shows a lowering block 7 with a corresponding tensioning element 13, a hint of an auxiliary support 5 and a slide 27.
  • the slide 27 contains two spacer elements 9, which are designed as melting elements 26.
  • the advantage lies in the reusability.
  • the melting elements 26, which are movable in the guides of the slide 27, are spring-supported and a cavity located under the melting element 26 in the slide 27 contains an element filling 28.
  • the element filling 28 consists in a simple manner of solder, which is a defined one Has melting temperature. In the molten state, the melting element 26 is pressed upwards by the spring 29, the force of the spring 29, however, being less than the force applied via the tensioning element 13. A resetting of the melting element 26 in the relieved state is thus ensured by the spring 29 when the element filling has melted. If the element filling 28 has solidified and the melting element 26 protrudes from the slide 27, the entire arrangement acts as a spacer element 9.
  • FIG. 5 shows an arrangement according to the invention, the soldering device 3 and the adjusting device 4, as well as the microscope slide 14 and the measuring optics 17 being indicated in a simplified manner.
  • the auxiliary carrier 5 is equipped with suction chambers 30, each one Vacuum solder part 1 and hold it there. As described, the relative alignment between auxiliary carrier 5 and carrier 6 can be carried out for the measuring optics 17 and the through bores 31.
  • a transfer gripper 33 is indicated in FIG. 5, which can also suck up and hold solder parts 1 by means of a vacuum. With the transfer gripper 32, the solder parts 1 are positioned before the insertion of the auxiliary carrier 5 into the entire device under the auxiliary carrier 5 and transferred to each individual suction chamber 30.
  • This embodiment of the invention eliminates the need for gluing between solder parts 1 and auxiliary carrier 5, as a result of which damage due to mechanical and wet-chemical cleaning methods on the solder parts when removing the auxiliary carrier is avoided.
  • soldering device 3 and the adjusting device 4 it is possible to heat the carrier 6 and the auxiliary carrier 5 directly or indirectly and thus to provide the energy required to carry out the soldering process.
  • the transfer gripper 32 would expediently also be heated. With this configuration, the number of procedural steps with regard to adjustment and assembly is reduced; in addition, the entire process, including soldering, can be carried out in one setup. A previously used soldering system, for example a vapor phase soldering system, is no longer required. Readjustments are possible during the process.
  • a device according to the invention and the associated method are used in particular for the production of character generators for non-mechanical printers.
  • LED chips LED lines
  • the use of electrical or pneumatic, sensor-controlled actuators is unnecessary through the use of spacer elements 9, which are designed as melting disks or as melting elements 26.
  • the use of a center guide jaw 19 provides a central clamping which leads to a halving of the displacements caused by thermal expansion factors, caused by temperature differences during the solidification of the solder.
  • soldering systems there is better capacity utilization, since only the soldering device 3, but not the adjustment device 4 which can be separated according to the invention, has to be introduced into the soldering system.
  • rollers 22, balls 23 and spring-supported elements the device is designed to be free of play with constant clamping force.
  • the lowering movement of the auxiliary carrier 5 or the joining of the soldering partners can be exactly adjusted by specifying the melting point or the mass of the melting disks or the element filling 28.
  • the entire adjusting device 4 is not exposed to an elevated temperature or a soldering medium which could impair its function in the long run.
  • the soldering device 3 is additionally protected.
  • a typical case of a soldering process for producing a module plate equipped with LED lines provides a soldering temperature of 215 degrees Celsius.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

La fabrication de générateurs de caractères pour des imprimantes non-mécaniques requiert le soudage de puces à diodes électroluminescentes (DELs) dans des positions précises sur des plaques modulaires. La précision requise dans les trois dimensions se situe dans des limites comprises entre ± 3 et 10 νm. Un nouveau dispositif comprend un dispositif d'ajustement (4) relié de manière détachable à un dispositif de soudage (3) qui peut effectuer en tant qu'unité séparée une opération de soudage. Une rangée de DELs à souder sur une plaque modulaire est temporairement positionnée et fixée sur un support auxiliaire (5) et rapprochée pendant le soudage de la surface enduite de soudure de la plaque modulaire (support (6)) de sorte que les pièces à souder ne se rejoignent que lorsque la soudure (2) est fondue. A cet effet, on utilise des joints à ressort blocables dans deux positions prédéterminées, ainsi que des plaques fusibles intermédiaires qui se fondent sur la plaque modulaire immédiatement après la soudure (2), ce qui permet de maîtriser la jonction des pièces à souder. On évite ainsi des dommages mécaniques des rangées de DELs et on obtient une précision élevée de positionnement des rangées de DELs par rapport à la plaque modulaire.
PCT/DE1990/001003 1990-05-23 1990-12-21 Procede et dispositif de soudage de pieces a souder dans des positions precises sur un support WO1991018490A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP91901577A EP0530191B1 (fr) 1990-05-23 1990-12-21 Procede et dispositif de soudage de pieces a souder dans des positions precises sur un support
DE59006325T DE59006325D1 (de) 1990-05-23 1990-12-21 Vorrichtung und verfahren zum positionsgenauen löten von lötteilen auf einen träger.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP4016696.1 1990-05-23
DE4016696A DE4016696A1 (de) 1990-05-23 1990-05-23 Vorrichtung und verfahren zum positionsgenauen loeten von loetteilen auf einen traeger

Publications (1)

Publication Number Publication Date
WO1991018490A1 true WO1991018490A1 (fr) 1991-11-28

Family

ID=6407070

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1990/001003 WO1991018490A1 (fr) 1990-05-23 1990-12-21 Procede et dispositif de soudage de pieces a souder dans des positions precises sur un support

Country Status (3)

Country Link
EP (1) EP0530191B1 (fr)
DE (2) DE4016696A1 (fr)
WO (1) WO1991018490A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112475515A (zh) * 2020-10-23 2021-03-12 海宁瑞丰灯头股份有限公司 一种led灯焊锡设备

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109538983A (zh) * 2018-09-28 2019-03-29 佛山市南海区联合广东新光源产业创新中心 一种led灯条生产专用的贴片设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0214030A2 (fr) * 1985-08-12 1987-03-11 Digital Equipment Corporation Système de réparation automatisé pour la technologie de montage en surface
US4788403A (en) * 1986-01-20 1988-11-29 Hy-Bec Corporation Apparatus for automatic soldering
US4832250A (en) * 1987-05-28 1989-05-23 Srtechnologies, Inc. Electronic circuit board rework and repair system
WO1989008927A1 (fr) * 1988-03-15 1989-09-21 Siemens Aktiengesellschaft Procede de montage pour la fabrication de rangees de diodes electroluminescentes
US4868979A (en) * 1988-05-24 1989-09-26 Taiyo Yuden Co., Ltd. Method of and apparatus for mounting chips

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0214030A2 (fr) * 1985-08-12 1987-03-11 Digital Equipment Corporation Système de réparation automatisé pour la technologie de montage en surface
US4788403A (en) * 1986-01-20 1988-11-29 Hy-Bec Corporation Apparatus for automatic soldering
US4832250A (en) * 1987-05-28 1989-05-23 Srtechnologies, Inc. Electronic circuit board rework and repair system
WO1989008927A1 (fr) * 1988-03-15 1989-09-21 Siemens Aktiengesellschaft Procede de montage pour la fabrication de rangees de diodes electroluminescentes
US4868979A (en) * 1988-05-24 1989-09-26 Taiyo Yuden Co., Ltd. Method of and apparatus for mounting chips

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112475515A (zh) * 2020-10-23 2021-03-12 海宁瑞丰灯头股份有限公司 一种led灯焊锡设备

Also Published As

Publication number Publication date
EP0530191A1 (fr) 1993-03-10
DE59006325D1 (de) 1994-08-04
DE4016696A1 (de) 1991-11-28
EP0530191B1 (fr) 1994-06-29

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