WO1991012632A1 - Lichtalterungsstabiles halbleitermaterial auf der basis von amorphem germanium und verfahren zu seiner herstellung - Google Patents
Lichtalterungsstabiles halbleitermaterial auf der basis von amorphem germanium und verfahren zu seiner herstellung Download PDFInfo
- Publication number
- WO1991012632A1 WO1991012632A1 PCT/EP1991/000165 EP9100165W WO9112632A1 WO 1991012632 A1 WO1991012632 A1 WO 1991012632A1 EP 9100165 W EP9100165 W EP 9100165W WO 9112632 A1 WO9112632 A1 WO 9112632A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- semiconductor material
- germanium
- amorphous
- main group
- light
- Prior art date
Links
- 239000000463 material Substances 0.000 title claims abstract description 54
- 239000004065 semiconductor Substances 0.000 title claims abstract description 40
- 229910052732 germanium Inorganic materials 0.000 title claims description 36
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 title claims description 33
- 238000000034 method Methods 0.000 title claims description 15
- 238000004519 manufacturing process Methods 0.000 title description 7
- 229910052760 oxygen Inorganic materials 0.000 claims description 13
- 239000001301 oxygen Substances 0.000 claims description 13
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 12
- 229910052739 hydrogen Inorganic materials 0.000 claims description 12
- 239000001257 hydrogen Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 10
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 9
- 230000008021 deposition Effects 0.000 claims description 7
- 150000002500 ions Chemical class 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000007789 gas Substances 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 2
- 230000000737 periodic effect Effects 0.000 abstract 1
- 238000001556 precipitation Methods 0.000 abstract 1
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 6
- 230000032683 aging Effects 0.000 description 6
- 229910021417 amorphous silicon Inorganic materials 0.000 description 6
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 5
- 239000006096 absorbing agent Substances 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 238000000151 deposition Methods 0.000 description 5
- 238000009434 installation Methods 0.000 description 4
- 206010034972 Photosensitivity reaction Diseases 0.000 description 3
- 125000004429 atom Chemical group 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 230000036211 photosensitivity Effects 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 229910017817 a-Ge Inorganic materials 0.000 description 2
- 239000002800 charge carrier Substances 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- -1 germanium hydrogen fragment ions Chemical class 0.000 description 2
- 238000010348 incorporation Methods 0.000 description 2
- 238000002329 infrared spectrum Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910052711 selenium Inorganic materials 0.000 description 2
- 239000011669 selenium Substances 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 229910000676 Si alloy Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000010849 ion bombardment Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0376—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including amorphous semiconductors
- H01L31/03762—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including amorphous semiconductors including only elements of Group IV of the Periodic System
- H01L31/03765—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including amorphous semiconductors including only elements of Group IV of the Periodic System including AIVBIV compounds or alloys, e.g. SiGe, SiC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/20—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials
- H01L31/202—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials including only elements of Group IV of the Periodic System
- H01L31/204—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials including only elements of Group IV of the Periodic System including AIVBIV alloys, e.g. SiGe, SiC
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/548—Amorphous silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the invention relates to a new semiconductor material based on amorphous germanium, in particular for red-sensitive photovoltaic components, and a method for its production.
- the search is for suitable materials for thin-film solar cells based on amorphous semiconductors. These are intended to replace the powerful but equally expensive solar cells made of crystalline semiconductor material, which are not competitive with other energy sources. They have numerous advantages during manufacture and are characterized, for example, by low process temperatures of less than 250 * C and low material consumption. Layer thicknesses of less than 1 ⁇ m are sufficient for complete absorption of light. In addition, by means of suitable deposition processes, it is possible to produce large-area semiconductor films on inexpensive substrates, for example window glass.
- a disadvantage of amorphous solar cells is their relatively low efficiency compared to crystalline solar cells. With small areas it can reach 12 percent, with a 1000 c module only 9 percent. Another disadvantage is the poor light stability of the cells. Even the best of the known solar cells made of amorphous semiconductor material show an aging of 15 to 20 percent during field operation within the first few months, which is noticeable in a reduced efficiency.
- tandem cell A possible cell structure that avoids these disadvantages is the tandem cell.
- Several solar cells with different bandgap and therefore different spectral sensitivity are connected in series.
- a combination of amorphous silicon with a band gap of approximately 1.75 eV and one connected behind it would be suitable
- An amorphous semiconductor material which has a low band gap of 0.9 to 1.2 eV with a simultaneously low density of states of at most 5 x 10 15 defects / cm 3 eV within the band gap, is not known.
- the amorphous semiconductor material suitable for solar cells with the lowest band gap of 1.4 to 1.5 eV so far is an amorphous silicon-germanium alloy with a germanium content of up to 30 percent.
- a material with a higher germanium content and therefore a lower band gap is necessary.
- Such semiconductors produced by the glow discharge process however, have so far exhibited strong material inhomogeneities, a high density of states and a clear instability with respect to atmospheric moisture.
- the attempt to deposit amorphous germanium layers from a germanium target by reactive sputtering also yields a material with improved photoconductivity, which, however, proves to be unstable with regard to longer periods of strong illumination (light aging).
- this object is achieved by an amorphous semiconductor based on germanium, which has the features of patent claim 1. Further embodiments of the invention and a method for producing the semiconductor material can be found in the subclaims.
- the semiconductor material according to the invention has a band gap between 1.4 eV for a material with a silicon-germanium ratio of 30:70 and 0.9 eV for a silicon-free semiconductor material.
- the defect density is significantly reduced material within the band gap of the Halbleite ⁇ ', which leads to improved photoconductivity.
- a lower dark conductivity is observed, so that the overall photosensitivity is further improved.
- a prerequisite for these good properties is the low density of states of the material according to the invention, which in turn is attributed to the incorporation of an element of the sixth main group.
- the material contains such an element in a proportion of more than 5 ⁇ 10 cm ⁇ , which corresponds to the limit value of a contamination, for example of oxygen, which has been customary up to now and has been obtained in normal separating plants.
- a divalent group Vla element can now slide between the two germanium atoms of such an elongated bond and, due to the chemical affinity for them, form a firm bond.
- the electronic states lying within the band gap and thus disturbing are thereby eliminated.
- This plausible explanation also makes it clear that the size of the group six elements cannot be increased arbitrarily and must be adapted to the structure of the amorphous germanium.
- Another property of the semiconductor material according to the invention is its compact structure, which has no detectable cavities.
- Conventional amorphous germanium or an amorphous material with a high germanium content and a hydrogen content of more than 5 atomic percent has a special feature in the IR spectrum which is due to material cavities.
- a known, less compact material shows a further band at approx. 1980 cm " .
- This latter band is typical of a hydrogen bonded in material cavities and is therefore a Measure for low compactness This band has disappeared in the material according to the invention, therefore no voids can be detected in the semiconductor material.
- the IR spectrum is also used for characterization or suitable for the detection of the foreign atom of the sixth main group.
- Oxygen is shown, for example, by an absorption band between 700 and 800 cm " , which is due to germanium-oxygen bonds.
- the most important and most advantageous property for the use of the semiconductor material according to the invention in photovoltaic components is, however, its stability with respect to light aging. Under AM 1 illumination, photoconductivity and dark conductivity are observed separately from one another for more than 1000 hours. In the observation period, constant conductivity values are measured for the various different samples within the scope of the measurement accuracy. From this it can also be concluded that light aging stability is almost unlimited in time, since known amorphous semiconductors already have the majority of their age-related power loss during this time. The practically unchanged good photosensitivity of the new material shows the superiority of the amorphous germanium according to the invention or its alloy over known materials. In particular, for pure germanium or germanium without silicon content, which could not yet be represented in a form suitable for solar cells, this becomes particularly clear.
- the parameters are set such that, on the one hand, a compact material and, on the other hand, an increased content of foreign atoms of an element of the sixth main group is achieved.
- the deposition principle is the glow discharge known per se, or its variations. Decisive for the compactness of the semiconductor material according to the invention is the level of ion energy with which germanium or germanium hydrogen fragment ions strike the substrate. In contrast to the production of amorphous silicon with high electronic quality, in which the ion energy may not exceed 100 electron volts, an ion bombardment energy of at least 100 electron volts is now set according to the invention. Suitable separation energies are between 100 and 300 electron volts, with at the upper end of the loading In turn, losses in the quality of the semiconductor material produced can be observed.
- the other deposition conditions are typical for glow discharges and can be set in accordance with known methods.
- the deposition takes place at a pressure of 0.2 to 2 mbar, a substrate temperature of 100 to 300 * C in an atmosphere which contains 80 to 97.5 atomic percent hydrogen.
- Gaseous germanium hydrogen is selected as the germanium source, which can be present in the atmosphere in a proportion of 2.5 to 20 atomic percent.
- the germanium component can be partially replaced by silicon, or the germanium hydrogen can be enriched with silane. Silicon-germanium alloys produced in this way likewise show the advantageous properties of high photosensitivity with excellent long-term stability under illumination.
- the area of the electrode carrying the substrate can be reduced in a capacitively coupled glow discharge reactor. If the plasma is generated with varying DC voltage, the ion energy can be increased by applying an additional external accelerating electric field. A further possibility for increasing the ion energy is given by increasing the separation capacity under otherwise constant conditions. Since each of the mentioned embodiments has its own advantages and disadvantages, the method can be selected as required.
- an element of the sixth main group can be incorporated into the amorphous semiconductor by treating the semiconductor material produced on the substrate with a gas which contains an element or a compound of an element of the sixth main group.
- a gas which contains an element or a compound of an element of the sixth main group is added to add a corresponding gas to the glow discharge atmosphere during the deposition process and thus to include the foreign element when a semiconductor layer is being produced to install.
- Another possibility is to deposit the amorphous semiconductor layer without any foreign element and only then to introduce it into the layer by means of an appropriate treatment. For the installation of oxygen, for example, it is sufficient to have an appropriately oxygen-free separator
- Enrich layer with a temperature treatment in an oxygen atmosphere A similar treatment with hydrogen sulfide or selenium hydrogen leads to the subsequent incorporation of sulfur or selenium. If this treatment is carried out at a temperature in the range of approx.
- the semiconductor layer produced can be treated with a plasma containing the corresponding foreign element of the sixth main group.
- the gas used for this purpose, which contains the foreign element, is mixed with hydrogen.
- Oxygen can be incorporated, for example, by treating the semiconductor layer with a hydrogen-oxygen plasma.
- Figure 1 shows a possible structure for a tandem solar cell.
- An example is a tandem cell structure, the first blue-sensitive sub-cell of which consists of a conventional pin diode made of amorphous silicon (a-Si: H) with a band gap of 1.75 eV, while the second, red-sensitive sub-cell optically connected to it has a band gap of 1 , 0 to 1.2 eV and advantageously consists of the amorphous germanium according to the invention or an amorphous germanium-silicon alloy also according to the invention.
- Such an arrangement is referred to as optically connected, in that of the first sub-cell Long-wave light which has not been absorbed (h. v 2 ) can penetrate into the second sub-cell arranged behind it and then be absorbed there with the generation of charge carrier pairs.
- the two sub-cells can be separated from one another by an electrically insulating but transparent layer, independent connections then being provided for each sub-cell. In terms of process technology, however, it is easier to produce a tandem cell in which the two partial cells are deposited and produced directly one above the other.
- FIG. 1 shows the structure of such a tandem solar cell consisting of two sub-cells and stacked one above the other.
- a transparent electrode 2 for example a fluorine-doped indium tin oxide (TCO)
- TCO fluorine-doped indium tin oxide
- a known thin-film solar cell for example a pin structure 3 made of amorphous silicon, is then deposited in a glow discharge reactor. The short-wave component h. v ⁇ of the incident light hv is absorbed. Without further wiring or. Applying electrodes, a diode made of amorphous germanium is then applied to it while changing the deposition conditions. This essentially consists of an approx.
- absorber layer made of undoped or lightly doped, for example oxygen-containing amorphous germanium (a-Ge: H: 0).
- this absorber layer 5 is arranged between two p and n-doped layers 4 and 6, each approximately 5 to 20 nm thick.
- the latter consist of amorphous germanium or. the material according to the invention which contains a group Vla element.
- a modified absorber material can be used for the doped layers 4 and 6, which has a reduced optical absorption compared to the material of the absorber layer 5.
- This can be, for example, a microcrystalline germanium, the lower optical absorption of which ensures higher absorption in the actual absorber layer 5.
- the layer 5 has a low silicon content in order to increase the band gap to the desired value.
- tandem structure is provided with a highly reflective back contact 7, for example by sputtering or vapor deposition of a metal.
- the contacting of the torpedo cell takes place at layers 2 and 7.
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP90102434.9 | 1990-02-07 | ||
EP90102434 | 1990-02-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1991012632A1 true WO1991012632A1 (de) | 1991-08-22 |
Family
ID=8203610
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP1991/000165 WO1991012632A1 (de) | 1990-02-07 | 1991-01-29 | Lichtalterungsstabiles halbleitermaterial auf der basis von amorphem germanium und verfahren zu seiner herstellung |
Country Status (4)
Country | Link |
---|---|
US (1) | US5282993A (de) |
EP (1) | EP0514431A1 (de) |
JP (1) | JPH05504235A (de) |
WO (1) | WO1991012632A1 (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1135635C (zh) * | 1994-03-25 | 2004-01-21 | 阿莫科/恩龙太阳公司 | 增强光电器件和电子器件的光和电特性的等离子淀积工艺 |
JPH07335935A (ja) * | 1994-06-07 | 1995-12-22 | Canon Inc | 光電変換装置の製造方法 |
IT1277856B1 (it) * | 1995-02-09 | 1997-11-12 | Univ Roma | Rivelatore di radiazione ultravioletta in film sottile, con opzione di elevata selettivita' spettrale. |
US6087580A (en) * | 1996-12-12 | 2000-07-11 | Energy Conversion Devices, Inc. | Semiconductor having large volume fraction of intermediate range order material |
US6437403B1 (en) * | 1999-01-18 | 2002-08-20 | Sony Corporation | Semiconductor device |
US6646318B1 (en) * | 2002-08-15 | 2003-11-11 | National Semiconductor Corporation | Bandgap tuned vertical color imager cell |
US20080216885A1 (en) | 2007-03-06 | 2008-09-11 | Sergey Frolov | Spectrally adaptive multijunction photovoltaic thin film device and method of producing same |
US20090211622A1 (en) * | 2008-02-21 | 2009-08-27 | Sunlight Photonics Inc. | Multi-layered electro-optic devices |
US20090215215A1 (en) * | 2008-02-21 | 2009-08-27 | Sunlight Photonics Inc. | Method and apparatus for manufacturing multi-layered electro-optic devices |
US10211353B2 (en) * | 2008-04-14 | 2019-02-19 | Sunlight Photonics Inc. | Aligned bifacial solar modules |
US8110428B2 (en) * | 2008-11-25 | 2012-02-07 | Sunlight Photonics Inc. | Thin-film photovoltaic devices |
US8835748B2 (en) | 2009-01-06 | 2014-09-16 | Sunlight Photonics Inc. | Multi-junction PV module |
US20130224899A1 (en) * | 2012-02-28 | 2013-08-29 | International Business Machines Corporation | Enhancing efficiency in solar cells by adjusting deposition power |
US9214577B2 (en) | 2012-02-28 | 2015-12-15 | International Business Machines Corporation | Reduced light degradation due to low power deposition of buffer layer |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3212184A1 (de) * | 1981-04-17 | 1982-11-11 | Kawamura, Takao, Sakai, Osaka | Lichtempfindliches element |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56122123A (en) * | 1980-03-03 | 1981-09-25 | Shunpei Yamazaki | Semiamorphous semiconductor |
-
1991
- 1991-01-29 JP JP3503428A patent/JPH05504235A/ja active Pending
- 1991-01-29 WO PCT/EP1991/000165 patent/WO1991012632A1/de not_active Application Discontinuation
- 1991-01-29 EP EP91903637A patent/EP0514431A1/de not_active Ceased
- 1991-01-29 US US07/861,964 patent/US5282993A/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3212184A1 (de) * | 1981-04-17 | 1982-11-11 | Kawamura, Takao, Sakai, Osaka | Lichtempfindliches element |
Non-Patent Citations (3)
Title |
---|
JOURNAL OF APPLIED PHYSICS. vol. 65, no. 1, 01 Januar 1989, NEW YORK US Seiten 241 - 247; M.K.BHAN ET AL.: "ELECTRICAL, OPTICAL, AND STRUCTURAL PROPERTIES OF REACTIVE ION BEAM SPUTTERED HYDROGENATED AMORPHOUS GERMANIUM (a-Ge:H) FILMS" siehe das ganze Dokument * |
JOURNAL OF NON-CRYSTALLINE SOLIDS vol. 114, 1989, AMSTERDAM, NORTH-HOLLAND Seiten 477 - 479; F.H.KARG ET AL.: "INFLUENCE OF PLASMA DEPOSITION ON STRUCTURAL AND ELECTRONIC PROPERTIES OFa-Ge:H" siehe das ganze Dokument * |
PHYSICAL REVIEW, B. CONDENSED MATTER. vol. 31, no. 4, 15 Februar 1985, NEW YORK US Seiten 2190 - 2197; G.LUCOVSKY ET AL.: "CHEMICAL BONDING OF HYDROGEN AND OXYGEN IN GLOW-DISCHARGE-DEPOSITED THIN FILMS OF a-Ge:H and a-Ge:H,O" siehe das ganze Dokument siehe das ganze Dokument * |
Also Published As
Publication number | Publication date |
---|---|
US5282993A (en) | 1994-02-01 |
JPH05504235A (ja) | 1993-07-01 |
EP0514431A1 (de) | 1992-11-25 |
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