CN1135635C - 增强光电器件和电子器件的光和电特性的等离子淀积工艺 - Google Patents
增强光电器件和电子器件的光和电特性的等离子淀积工艺 Download PDFInfo
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- Y02B10/10—Photovoltaic [PV]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/548—Amorphous silicon PV cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
Description
构件 | 材料 | 厚度 | ||
最大值 | 中间值 | 优选值 | ||
基底 | 通常用Zn或SnO2,有些环境中可要求用其它透明导体 | <2000埃 | ||
p-层 | p掺杂的SiC | <150埃 | <100埃 | |
p-i界面层 | i-SiC,有时分级为i-Si | 2000埃 | <250埃 | <100埃 |
i-层 | i-Si | <10000埃 | 500-7500埃 | 2500-4500埃 |
n-层 | n-Si | <400埃 | <150埃 | |
背面接触 | 金属,通常用Al或Ag,常用透明氧化物,铟锡氧化物或ZnO可夹在n层与金属层之间 | <3000埃 |
构件 | 材料 | 厚度 | |
最大值 | 优选值 | ||
基底 | 玻璃 | ||
透明氧化物 | 与表1所列相同 | ||
p-层 | 与表1所列相同 | ||
i1-第1本征层 | i-Si | 100-2000埃 | 2500-4500埃 |
第1复合结 | 包括自第1结来的n-层和来自第2结的p-层。但是,n和/或p-层可以是微晶,也可以是引入的附加层。 | <500埃 | <300埃 |
i2-第2本征层 | i-Si | 900-10000埃 | 2000-5000埃 |
第2复合结 | 见上页 | ||
i3-第3本征层 | i-SiGe | 500-5000埃 | 1200-4500埃 |
n3-层 | n-Si | ||
背面接点 | 与表1同 |
构件 | 材料 | 厚度 | |
最大值 | 优选值 | ||
基底 | 玻璃 | ||
透明氧化物 | 同表1 | ||
P1-层 | 同表1 | ||
i1-层 | i-Si | 100-2000埃 | 600-1000埃 |
复合结 | 见表2 | ||
i2-层 | i-Si | 1500-10000埃 | 2500-4000埃 |
n2-层 | n-Si |
构件 | 材料 | 厚度 | |
最大值 | 优选值 | ||
基底 | 玻璃 | ||
透明氧化物 | 与表1相同 | ||
P1-层 | 与表1相同 | ||
i1-层 | i-Si | 300-4000埃 | 600-1750埃 |
复合结 | 与表2相同 | ||
i2-层 | i-SiGe | 750-5000埃 | 1200-3000埃 |
n2-层 | n-Si |
淀积条件 | Voc | 负荷系数 | Jsc | 效率 |
低温,最佳淀积 | 0.925 | 0.705 | 13.9 | 9.06 |
标准淀积,270℃ | 0.864 | 0.698 | 14.2 | 8.56 |
器件# | Voc(伏) | Jsc(mA/cm2) | 负荷系数 | 效率 | i层厚度(埃) |
A2351-1 | 0.97 | 7.20 | 0.75 | 5.24 | -750 |
A2357-1 | 1.00 | 7.40 | 0.74 | 5.48 | -900 |
A3007-1 | 1.03 | 5.40 | 0.73 | 4.06 | -900 |
A2357-3 | 1.04 | 5.80 | 0.72 | 4.51 | -900 |
A3008-3 | 1.04 | 5.40 | 0.70 | 3.93 | -1000 |
淀积参数 | 宽范围 | 中等范围 | 优选范围 |
RF功率密度(mW/cm2) | 5-1000 | 20-150 | 40-80 |
基底温度(℃) | 20-250 | 80-180 | 120-150 |
淀积压力(乇) | 0.2-50 | 0.8-20 | ~6-12 |
H2(氢气)稀释比 | 5-1000 | 20-400 | 40-200 |
总气体流速(sccm) | 10-10,000 | 50~4,000 | 1,000-2,500 |
淀积速率(埃/sec) | 0.1-20 | 0.3-4.0 | 0.5-2.5 |
AC电频率(MHz) | 0.1-10,000 | 2-500 | 10-100 |
电极间隙(cm) | 0.2-10 | 0.5-4 | 1.2-2.5 |
范围 | 淀积温度℃ | 淀积压力Torr | 稀释比 | 电流密度A/cm2 | 流动cccm | 厚度埃 | |
(H2∶SiH4) | (实际电流密度) | SiH4 | H2 | ||||
宽广的 | 室温至500 | 0-20 | 0.5∶1-200∶1 | .01-5 | <100 | <20000 | <10000 |
中等的 | 80-300 | .1T-10 | 1∶1-50∶1 | .03-0.5 | <100 | <5000 | 500-7500 |
优选的 | 120-210 | .5T-2.5 | 5∶1-20∶1 | .05-0.1 | <50 | <1000 | 2500-4500 |
器件结构 | 淀积条件 |
CTO/p/i/n/ZnO/Ag | 基底温度100至180℃ |
P层是a-SiC:H或a-SiO:H | H2稀释比>100∶1(至500∶1) |
a-SiC:Hi层厚度900-1200埃 | 腔室压力8-10乇 |
在三结电池中~7mA/cm2作为前单元 | RF功率密度.40-100mW/cm2 |
电池I.D. | i厚度(埃) | Voc(V) | FF | JDC(mA/cm2) | 效率(Voc×FF×JSC) | 说明 |
A2351-2 | ~700-800 | 0.97 | 0.75 | 7.20 | 5.24 | 低碳含量 |
A2337-1 | ~900 | 1.00 | 0.74 | 7.40 | 5.48 | |
A3007-3 | ~1000 | 1.00 | 0.74 | 8.30 | 6.14 | 来自共淀积单元 |
A2351-1 | 900-1000 | 1.01 | 0.74 | 6.90 | 5.16 | 带隙~1.9eV |
A3051-1 | <800-900 | 1.02 | 0.72 | 6.20 | 4.55 | |
A2357-2 | ~900 | 1.03 | 0.73 | 5.40 | 4.06 | 薄电池 |
A2357-3 | ~1000 | 1.03/1.040 | 0.72/0.73 | 5.80 | 4.51 | 高Voc&FF |
A3008-3 | ~1000 | 1.04 | 0.70 | 5.40 | 3.93 | 带隙近2.0eV |
电池I.D. | i层类型 | i层厚度(埃) | 曝光(小时) | Voc(V) | Jsc(mA/cm2) | FF | 效率(%) | 说明 |
A3007-2 | a:Si:H W/O缓冲 | ~1000 | 0 | 0.96 | 8.7 | 0.724 | 6.06 | TS=150℃,8.5乇 |
1000 | 0.954 | 8.4 | 0.707(.69) | 5.66 | 7%降低 | |||
A3008-1 | a-Si:H W/O缓冲 | 800-1000 | 0 | 0.983 | 7.1 | 0.723 | 5.05 | TS=100℃短路! |
960 | 0.971 | 6.8 | 0.68 | 4.49 | <11%降低 | |||
A3007-3 | a-SiC:H电池 | ~1000 | 0 | 0.991 | 8.3 | 0.712 | 5.86 | 150℃,8.5乇 |
1000 | 0.977 | 8.0 | 0.68 | 5.09 | 13%降低 | |||
A3008-2 | 具有a-SiC:H缓冲的a-Si:H | 800-1000 | 0 | 1.001 | 6.8 | 0.743 | 5.06 | TS=110℃短路! |
960 | 0.979 | 6.5 | 0.691 | 4.4 | 13%降低 | |||
A3011-3 | a-Si:H原电池 | 3300~3600 | 0 | 0.97 | 10.4 | 0.627 | 6.3(30 | TS=110℃ |
500 | 1.005 | 9.6(5) | 0.58 | 5.6(20 | 11-12%降低 |
淀积参数 | A-Si:HA3007-2 | a-Si:HA3112-3 | a-SiC:HA3007-3 | a-SiC:HA2357-3 |
功率(mW/cm2) | 40 | 63 | 40 | 45 |
基底温度(℃) | 150 | 140 | 150 | 145 |
压力(乇) | 8.5 | 20 | 8.5 | 9 |
H2稀释比 | 139∶1 | 250∶1 | 100∶1 | 87∶1 |
气体流速 | 1250H2+9.0SiH4 | 2000H2+8.0SiH4) | 1300H2+9SiH4+4CH4 | 1300H2+7.5SiH4+7.5CH4 |
淀积速率(埃/sec) | -0.7 | -0.45 | -0.6 | -0.5 |
厚度(埃) | ~1,000 | ~1400 | ~1000-1200 | ~900-1000 |
Voc(V) | 0.96 | 0.97 | 1.00(0.998) | 1.04 |
FF | 0.724 | 0.74 | 0.74 | 0.72 |
JSC(mA/cm2) | 8.7 | 9.2 | 8.3 | 5.9 |
说明 | 标准条件 | 高压和高H2 | 最稳定a-SiC:H电池 | 所观察到的最高Voc |
电池# | 基底温度 | H2稀释 | 厚度 | 降低小时 | Voc(V) | JSC(mA/cm2) | FF(%) | Eff(%) |
D-30607-1 | 210℃ | 10∶1 | 1900埃 | 0 | 0.886 | 13.40 | 70.7 | 8.39 |
519 | 0.887 | 13.05 | 64.7 | 7.49(89.3%*) | ||||
D-30603-4 | 150℃ | 10∶1 | 2200埃 | 0 | 0.945 | 12.58 | 73.6 | 8.75 |
519 | 0.938 | 12.14 | 65.4 | 7.45(85.1%*) | ||||
D-30604-3 | 150℃ | 20∶1 | 2000埃 | 0 | 0.952 | 12.15 | 71.5 | 8.28 |
519 | 0.973 | 11.49 | 66.1 | 7.39(89.3%*) | ||||
D-30602-2 | 150℃ | 30∶1 | 1800埃 | 0 | 0.951 | 10.70 | 68.9 | 7.02 |
519 | 0.983 | 10.24 | 61.5 | 6.49(92.15%*) | ||||
D-30603-2 | 150℃ | 50∶1 | 1700埃 | 0 | 0.956 | 10.33 | 72.0 | 7.11 |
519 | 0.986 | 9.99 | 66.2 | 6.52(91.7%*) |
类型 | i1/(i2)厚度 | 在1000小时后的损耗 | ||
i1 | i2 | 整个 | ||
Si单结(4000埃),高温无H2稀释 | 4000埃 | 40% | - | 40% |
Si单结(6000埃),高温无H2稀释 | 6000埃 | 60% | - | 60% |
Si单结(4000埃),低温,H2稀释 | 4000埃 | 27% | - | 27% |
Si单结(6000埃),低温,H2稀释 | 6000埃 | 35% | - | 35% |
Si/Si串联(200埃/3300埃)高温无H2稀释 | 700埃/3300埃 | 7% | 33% | 20% |
Si/Si串联(800埃/5200埃)高温无H2稀释 | 800埃/5200埃 | 8% | 52% | 30% |
Si/Si串联(200埃/3300埃)低温,H2稀释 | 700埃/3300埃 | 7% | 23% | 15% |
i/Si串联(800埃/5200埃)低温,H2稀释 | 800埃/5200埃 | 8% | 33% | 20% |
Claims (9)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US21779994A | 1994-03-25 | 1994-03-25 | |
US08/217,799 | 1994-03-25 |
Publications (2)
Publication Number | Publication Date |
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CN1144573A CN1144573A (zh) | 1997-03-05 |
CN1135635C true CN1135635C (zh) | 2004-01-21 |
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US (2) | US5646050A (zh) |
JP (3) | JPH09512665A (zh) |
CN (1) | CN1135635C (zh) |
DE (1) | DE19581590T1 (zh) |
FR (1) | FR2721754B1 (zh) |
GB (1) | GB2301939B (zh) |
IT (1) | IT1278061B1 (zh) |
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Cited By (2)
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Families Citing this family (74)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1135635C (zh) * | 1994-03-25 | 2004-01-21 | 阿莫科/恩龙太阳公司 | 增强光电器件和电子器件的光和电特性的等离子淀积工艺 |
FR2738334A1 (fr) * | 1995-09-05 | 1997-03-07 | Motorola Semiconducteurs | Dispositif allumeur a semiconducteur, pour declenchement pyrotechnique, et procede de formation d'un tel dispositif |
US6087580A (en) * | 1996-12-12 | 2000-07-11 | Energy Conversion Devices, Inc. | Semiconductor having large volume fraction of intermediate range order material |
US6224787B1 (en) * | 1997-03-10 | 2001-05-01 | Dai Nippon Printing Co., Ltd. | Liquid crystalline charge transport material |
US5982020A (en) | 1997-04-28 | 1999-11-09 | Lucent Technologies Inc. | Deuterated bipolar transistor and method of manufacture thereof |
US6252270B1 (en) | 1997-04-28 | 2001-06-26 | Agere Systems Guardian Corp. | Increased cycle specification for floating-gate and method of manufacture thereof |
US6531193B2 (en) | 1997-07-07 | 2003-03-11 | The Penn State Research Foundation | Low temperature, high quality silicon dioxide thin films deposited using tetramethylsilane (TMS) for stress control and coverage applications |
US5972765A (en) * | 1997-07-16 | 1999-10-26 | International Business Machines Corporation | Use of deuterated materials in semiconductor processing |
US6121541A (en) * | 1997-07-28 | 2000-09-19 | Bp Solarex | Monolithic multi-junction solar cells with amorphous silicon and CIS and their alloys |
US6077722A (en) * | 1998-07-14 | 2000-06-20 | Bp Solarex | Producing thin film photovoltaic modules with high integrity interconnects and dual layer contacts |
JP3792903B2 (ja) * | 1998-07-22 | 2006-07-05 | 株式会社カネカ | 半導体薄膜および薄膜デバイス |
US6111189A (en) * | 1998-07-28 | 2000-08-29 | Bp Solarex | Photovoltaic module framing system with integral electrical raceways |
US6274461B1 (en) * | 1998-08-20 | 2001-08-14 | United Solar Systems Corporation | Method for depositing layers of high quality semiconductor material |
JP3046965B1 (ja) | 1999-02-26 | 2000-05-29 | 鐘淵化学工業株式会社 | 非晶質シリコン系薄膜光電変換装置の製造方法 |
US6365511B1 (en) | 1999-06-03 | 2002-04-02 | Agere Systems Guardian Corp. | Tungsten silicide nitride as a barrier for high temperature anneals to improve hot carrier reliability |
US6412292B2 (en) | 2000-05-09 | 2002-07-02 | Toc Technology, Llc | Computer rack heat extraction device |
US6557357B2 (en) | 2000-02-18 | 2003-05-06 | Toc Technology, Llc | Computer rack heat extraction device |
WO2001062060A1 (en) | 2000-02-18 | 2001-08-23 | Rtkl Associates Inc. | Computer rack heat extraction device |
US6574970B2 (en) | 2000-02-18 | 2003-06-10 | Toc Technology, Llc | Computer room air flow method and apparatus |
JP4510242B2 (ja) * | 2000-07-11 | 2010-07-21 | キヤノン株式会社 | 薄膜形成方法 |
US7223676B2 (en) * | 2002-06-05 | 2007-05-29 | Applied Materials, Inc. | Very low temperature CVD process with independently variable conformality, stress and composition of the CVD layer |
US20070042580A1 (en) * | 2000-08-10 | 2007-02-22 | Amir Al-Bayati | Ion implanted insulator material with reduced dielectric constant |
WO2002071497A1 (de) * | 2001-03-01 | 2002-09-12 | Stmicroelectronics Nv | Optoelektronisches bauelement |
US6605529B2 (en) | 2001-05-11 | 2003-08-12 | Agere Systems Inc. | Method of creating hydrogen isotope reservoirs in a semiconductor device |
US20040253777A1 (en) * | 2001-08-30 | 2004-12-16 | Hidenori Miyoshi | Method and apparatus for forming film |
US8209185B2 (en) * | 2003-09-05 | 2012-06-26 | Emc Corporation | Interface for management of auditory communications |
DE102004003761A1 (de) * | 2004-01-23 | 2005-08-25 | Forschungszentrum Jülich GmbH | Herstellungsverfahren für Siliziumsolarzellen umfassend µc-Siliziumschichten |
JPWO2006006368A1 (ja) * | 2004-07-12 | 2008-04-24 | 株式会社カネカ | 薄膜光電変換装置の製造方法 |
DE102004061360A1 (de) * | 2004-12-21 | 2006-07-13 | Forschungszentrum Jülich GmbH | Verfahren zur Herstellung einer Dünnschichtsolarzelle mit mikrokristallinem Silizium sowie Schichtfolge |
US7312162B2 (en) * | 2005-05-17 | 2007-12-25 | Applied Materials, Inc. | Low temperature plasma deposition process for carbon layer deposition |
US20060260545A1 (en) * | 2005-05-17 | 2006-11-23 | Kartik Ramaswamy | Low temperature absorption layer deposition and high speed optical annealing system |
US7109098B1 (en) * | 2005-05-17 | 2006-09-19 | Applied Materials, Inc. | Semiconductor junction formation process including low temperature plasma deposition of an optical absorption layer and high speed optical annealing |
US7422775B2 (en) * | 2005-05-17 | 2008-09-09 | Applied Materials, Inc. | Process for low temperature plasma deposition of an optical absorption layer and high speed optical annealing |
US7429532B2 (en) * | 2005-08-08 | 2008-09-30 | Applied Materials, Inc. | Semiconductor substrate process using an optically writable carbon-containing mask |
US7312148B2 (en) * | 2005-08-08 | 2007-12-25 | Applied Materials, Inc. | Copper barrier reflow process employing high speed optical annealing |
US7323401B2 (en) * | 2005-08-08 | 2008-01-29 | Applied Materials, Inc. | Semiconductor substrate process using a low temperature deposited carbon-containing hard mask |
US7335611B2 (en) * | 2005-08-08 | 2008-02-26 | Applied Materials, Inc. | Copper conductor annealing process employing high speed optical annealing with a low temperature-deposited optical absorber layer |
WO2007078802A2 (en) * | 2005-12-22 | 2007-07-12 | Asm America, Inc. | Epitaxial deposition of doped semiconductor materials |
EP2383368A2 (en) | 2006-04-14 | 2011-11-02 | Silica Tech, LLC | Plasma deposition apparatus and method for making solar cells |
US20070256734A1 (en) * | 2006-05-08 | 2007-11-08 | United Solar Ovonic Llc | Stabilized photovoltaic device and methods for its manufacture |
US20090183771A1 (en) * | 2006-06-23 | 2009-07-23 | Hitoshi Sannomiya | Plasma processing apparatus, plasma processing method and photoelectric conversion element |
US20080072953A1 (en) * | 2006-09-27 | 2008-03-27 | Thinsilicon Corp. | Back contact device for photovoltaic cells and method of manufacturing a back contact device |
US8203071B2 (en) * | 2007-01-18 | 2012-06-19 | Applied Materials, Inc. | Multi-junction solar cells and methods and apparatuses for forming the same |
JP4484886B2 (ja) * | 2007-01-23 | 2010-06-16 | シャープ株式会社 | 積層型光電変換装置の製造方法 |
US7993700B2 (en) * | 2007-03-01 | 2011-08-09 | Applied Materials, Inc. | Silicon nitride passivation for a solar cell |
WO2008150769A2 (en) * | 2007-05-31 | 2008-12-11 | Thinsilicon Corporation | Photovoltaic device and method of manufacturing photovoltaic devices |
US7741144B2 (en) * | 2007-11-02 | 2010-06-22 | Applied Materials, Inc. | Plasma treatment between deposition processes |
WO2009059240A1 (en) * | 2007-11-02 | 2009-05-07 | Applied Materials, Inc. | Intrinsic amorphous silicon layer |
US8198528B2 (en) | 2007-12-14 | 2012-06-12 | Sunpower Corporation | Anti-reflective coating with high optical absorption layer for backside contact solar cells |
US7955890B2 (en) * | 2008-06-24 | 2011-06-07 | Applied Materials, Inc. | Methods for forming an amorphous silicon film in display devices |
CN102138220A (zh) * | 2008-08-29 | 2011-07-27 | 欧瑞康太阳Ip股份公司(特吕巴赫) | 用于为具有降低的光致衰退的光伏器件淀积非晶硅膜以改进稳定性能的方法 |
CN102165604A (zh) * | 2008-09-29 | 2011-08-24 | 薄膜硅公司 | 单片集成太阳能电池组件 |
KR101531700B1 (ko) * | 2008-12-01 | 2015-06-25 | 주성엔지니어링(주) | 박막형 태양전지의 제조방법 |
DE102008064134B4 (de) * | 2008-12-19 | 2016-07-21 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Beschichtung von Gegenständen mittels eines Niederdruckplasmas |
MY152718A (en) * | 2009-03-30 | 2014-11-28 | Sanyo Electric Co | Solar cell |
WO2010129163A2 (en) * | 2009-05-06 | 2010-11-11 | Thinsilicon Corporation | Photovoltaic cells and methods to enhance light trapping in semiconductor layer stacks |
US20110114156A1 (en) * | 2009-06-10 | 2011-05-19 | Thinsilicon Corporation | Photovoltaic modules having a built-in bypass diode and methods for manufacturing photovoltaic modules having a built-in bypass diode |
US20100313952A1 (en) * | 2009-06-10 | 2010-12-16 | Thinsilicion Corporation | Photovoltaic modules and methods of manufacturing photovoltaic modules having multiple semiconductor layer stacks |
US8535760B2 (en) * | 2009-09-11 | 2013-09-17 | Air Products And Chemicals, Inc. | Additives to silane for thin film silicon photovoltaic devices |
KR101262871B1 (ko) * | 2010-03-26 | 2013-05-09 | 한국철강 주식회사 | 플렉서블 기판 또는 인플렉서블 기판을 포함하는 광기전력 장치 및 그의 제조 방법 |
CN102034897B (zh) * | 2010-10-15 | 2012-08-08 | 苏州阿特斯阳光电力科技有限公司 | 晶体硅太阳能电池片电致衰减老化装置及老化方法 |
US20120222730A1 (en) * | 2011-03-01 | 2012-09-06 | International Business Machines Corporation | Tandem solar cell with improved absorption material |
US20130019929A1 (en) * | 2011-07-19 | 2013-01-24 | International Business Machines | Reduction of light induced degradation by minimizing band offset |
US8778448B2 (en) * | 2011-07-21 | 2014-07-15 | International Business Machines Corporation | Method of stabilizing hydrogenated amorphous silicon and amorphous hydrogenated silicon alloys |
US9234857B2 (en) | 2011-11-14 | 2016-01-12 | First Solar, Inc. | Method and apparatus providing temperature uniformity |
US9040340B2 (en) * | 2011-11-14 | 2015-05-26 | International Business Machines Corporation | Temperature grading for band gap engineering of photovoltaic devices |
CN102496663A (zh) * | 2011-12-29 | 2012-06-13 | 普乐新能源(蚌埠)有限公司 | 降低非晶硅太阳能电池衰减率的方法 |
GB2502311A (en) | 2012-05-24 | 2013-11-27 | Ibm | Photovoltaic device with band-stop filter |
JP6306411B2 (ja) * | 2014-04-17 | 2018-04-04 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理装置およびプログラム |
CN104152864B (zh) * | 2014-08-22 | 2016-11-16 | 中国科学院宁波材料技术与工程研究所 | 硅薄膜的制备方法 |
DE102015114298A1 (de) * | 2015-08-27 | 2017-03-02 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und Vorrichtung zum Stabilisieren einer photovoltaischen Silizium-Solarzelle |
AU2017286995A1 (en) * | 2016-06-30 | 2019-01-17 | Yehi Or Light Creation Limited | High efficiency light system |
EP3375017B1 (en) | 2016-10-24 | 2021-08-11 | Indian Institute of Technology, Guwahati | A microfluidic electrical energy harvester |
US11502217B1 (en) | 2021-05-24 | 2022-11-15 | Gautam Ganguly | Methods and apparatus for reducing as-deposited and metastable defects in Amorphousilicon |
Family Cites Families (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4317844A (en) * | 1975-07-28 | 1982-03-02 | Rca Corporation | Semiconductor device having a body of amorphous silicon and method of making the same |
US4064521A (en) * | 1975-07-28 | 1977-12-20 | Rca Corporation | Semiconductor device having a body of amorphous silicon |
US4142195A (en) * | 1976-03-22 | 1979-02-27 | Rca Corporation | Schottky barrier semiconductor device and method of making same |
US4109271A (en) * | 1977-05-27 | 1978-08-22 | Rca Corporation | Amorphous silicon-amorphous silicon carbide photovoltaic device |
US4217148A (en) * | 1979-06-18 | 1980-08-12 | Rca Corporation | Compensated amorphous silicon solar cell |
US4339470A (en) * | 1981-02-13 | 1982-07-13 | Rca Corporation | Fabricating amorphous silicon solar cells by varying the temperature _of the substrate during deposition of the amorphous silicon layer |
JPS5853865A (ja) * | 1981-09-28 | 1983-03-30 | Komatsu Denshi Kinzoku Kk | アモルフアスシリコン太陽電池の製造方法 |
US4450787A (en) * | 1982-06-03 | 1984-05-29 | Rca Corporation | Glow discharge plasma deposition of thin films |
US4451538A (en) * | 1983-05-13 | 1984-05-29 | Atlantic Richfield Company | High hydrogen amorphous silicon |
US4481230A (en) * | 1983-10-27 | 1984-11-06 | Rca Corporation | Method of depositing a semiconductor layer from a glow discharge |
US4609771A (en) * | 1984-11-02 | 1986-09-02 | Sovonics Solar Systems | Tandem junction solar cell devices incorporating improved microcrystalline p-doped semiconductor alloy material |
KR910003169B1 (ko) * | 1985-11-12 | 1991-05-20 | 가부시끼가이샤 한도다이 에네르기 겐뀨소 | 반도체 장치 제조 방법 및 장치 |
US4776894A (en) * | 1986-08-18 | 1988-10-11 | Sanyo Electric Co., Ltd. | Photovoltaic device |
JPS6384075A (ja) * | 1986-09-26 | 1988-04-14 | Sanyo Electric Co Ltd | 光起電力装置 |
US4816082A (en) * | 1987-08-19 | 1989-03-28 | Energy Conversion Devices, Inc. | Thin film solar cell including a spatially modulated intrinsic layer |
JPH0650734B2 (ja) * | 1988-03-14 | 1994-06-29 | 富士電機株式会社 | 非晶質シリコン太陽電池の薄膜製造装置 |
JPH0249474A (ja) * | 1988-05-25 | 1990-02-19 | Tonen Corp | 太陽電池及びその製造方法 |
US5264710A (en) * | 1989-03-21 | 1993-11-23 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Amorphous semiconductor, amorphous semiconductor device using hydrogen radicals |
DE4027236B4 (de) * | 1989-08-31 | 2005-03-31 | Sanyo Electric Co., Ltd., Moriguchi | Verfahren zur Herstellung von Filmen aus amorphem Silicium und einen solchen Film verwendende Photohalbleiter-Vorrichtung |
WO1991012632A1 (de) * | 1990-02-07 | 1991-08-22 | Siemens Aktiengesellschaft | Lichtalterungsstabiles halbleitermaterial auf der basis von amorphem germanium und verfahren zu seiner herstellung |
JP2719036B2 (ja) * | 1990-08-10 | 1998-02-25 | 株式会社富士電機総合研究所 | 非晶質光電変換装置およびその製造方法 |
AU632241B2 (en) * | 1990-09-06 | 1992-12-17 | Mitsui Toatsu Chemicals Inc. | Amorphous silicon solar cell and method for manufacturing the same |
US5133986A (en) * | 1990-10-05 | 1992-07-28 | International Business Machines Corporation | Plasma enhanced chemical vapor processing system using hollow cathode effect |
JP3068276B2 (ja) * | 1991-09-04 | 2000-07-24 | 鐘淵化学工業株式会社 | 非単結晶タンデム型太陽電池の製法及びそれに用いる製造装置 |
US5242505A (en) * | 1991-12-03 | 1993-09-07 | Electric Power Research Institute | Amorphous silicon-based photovoltaic semiconductor materials free from Staebler-Wronski effects |
US5230753A (en) * | 1991-12-03 | 1993-07-27 | Princeton University | Photostable amorphous silicon-germanium alloys |
US5231048A (en) * | 1991-12-23 | 1993-07-27 | United Solar Systems Corporation | Microwave energized deposition process wherein the deposition is carried out at a pressure less than the pressure of the minimum point on the deposition system's paschen curve |
JP3162781B2 (ja) * | 1992-03-04 | 2001-05-08 | 三洋電機株式会社 | 半導体薄膜の形成方法及びこの膜の形成装置 |
JP3209789B2 (ja) * | 1992-03-28 | 2001-09-17 | 鐘淵化学工業株式会社 | ポリシリコン薄膜堆積物およびその製法 |
JP2951146B2 (ja) * | 1992-04-15 | 1999-09-20 | キヤノン株式会社 | 光起電力デバイス |
US5358755A (en) * | 1993-08-13 | 1994-10-25 | Amoco Corporation | Amorphous hydrogenated silicon-carbon alloys and solar cells and other semiconductor devices produced therefrom |
CN1135635C (zh) * | 1994-03-25 | 2004-01-21 | 阿莫科/恩龙太阳公司 | 增强光电器件和电子器件的光和电特性的等离子淀积工艺 |
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- 1995-03-09 JP JP7525183A patent/JPH09512665A/ja active Pending
- 1995-03-09 GB GB9619784A patent/GB2301939B/en not_active Expired - Fee Related
- 1995-03-09 DE DE19581590T patent/DE19581590T1/de not_active Withdrawn
- 1995-03-09 WO PCT/US1995/003119 patent/WO1995026571A1/en active Application Filing
- 1995-03-24 FR FR9503516A patent/FR2721754B1/fr not_active Expired - Fee Related
- 1995-03-24 IT IT95RM000184A patent/IT1278061B1/it active IP Right Grant
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI619149B (zh) * | 2015-10-12 | 2018-03-21 | 上海新昇半導體科技有限公司 | 磊晶層的形成方法 |
CN111477721A (zh) * | 2020-03-04 | 2020-07-31 | 杭州电子科技大学 | 一种利用变化的电场来控制氢钝化的方法 |
CN111477721B (zh) * | 2020-03-04 | 2021-06-01 | 杭州电子科技大学 | 一种利用变化的电场来控制氢钝化的方法 |
Also Published As
Publication number | Publication date |
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JPH09512665A (ja) | 1997-12-16 |
JP2008153646A (ja) | 2008-07-03 |
DE19581590T1 (de) | 1997-04-17 |
US5942049A (en) | 1999-08-24 |
GB2301939A (en) | 1996-12-18 |
FR2721754A1 (fr) | 1995-12-29 |
FR2721754B1 (fr) | 1997-12-05 |
JP2006080557A (ja) | 2006-03-23 |
WO1995026571A1 (en) | 1995-10-05 |
ITRM950184A1 (it) | 1996-09-24 |
ITRM950184A0 (it) | 1995-03-24 |
GB9619784D0 (en) | 1996-11-06 |
GB2301939B (en) | 1998-10-21 |
IT1278061B1 (it) | 1997-11-17 |
CN1144573A (zh) | 1997-03-05 |
US5646050A (en) | 1997-07-08 |
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