WO1990001392A1 - Making an elongate cut using high energy radiation - Google Patents

Making an elongate cut using high energy radiation Download PDF

Info

Publication number
WO1990001392A1
WO1990001392A1 PCT/GB1989/000942 GB8900942W WO9001392A1 WO 1990001392 A1 WO1990001392 A1 WO 1990001392A1 GB 8900942 W GB8900942 W GB 8900942W WO 9001392 A1 WO9001392 A1 WO 9001392A1
Authority
WO
WIPO (PCT)
Prior art keywords
cut
radiation
making
plane
elongate
Prior art date
Application number
PCT/GB1989/000942
Other languages
English (en)
French (fr)
Inventor
Martin Cooper
Andrew David Garry Stewart
Original Assignee
Anstalt Gersan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anstalt Gersan filed Critical Anstalt Gersan
Priority to JP89509001A priority Critical patent/JPH05506185A/ja
Priority to DE1989606265 priority patent/DE68906265T2/de
Publication of WO1990001392A1 publication Critical patent/WO1990001392A1/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/362Laser etching
    • B23K26/364Laser etching for making a groove or trench, e.g. for scribing a break initiation groove

Definitions

  • the present invention relates to making an elongate cut using high energy radiation focussed to a focal spot in the cut, the radiation usually being a laser beam.
  • a blind groove or hole may be formed in the workpiece, or the workpiece may be cut or pierced right through.
  • the invention has general applicability and in general terms, unnecessary material removal must be avoided as this slows down the cutting process; however, the invention is particularly applicable to gemstones, where it is specially important to avoid unnecessary material removal, and it is also necessary to avoid applying excessive thermal stress; in addition, a particular problem with gemstones such as diamond is that usually only a small percentage of the radiation may be absorbed, so it is important that coupling of the energy to the workpiece be as effective as possible.
  • the laser cutting can be referred to as forming a kerf (a groove, either for cleaving or for later sawing), or sawing (cutting right through).
  • a blind hole or a through-hole may be formed in order to employ the stone as a bearing.
  • a fundamental problem is that the energy density in the focal spot should be as great as possible, but a smaller focal spot (and thus higher energy density) can only be obtained by increasing the cone angle of the focussed beam (i.e. higher numerical aperture).
  • the machined V-section has then to be wider, otherwise the laser energy focussed into the cut is apertured (vignetted) at the entrance to the cut as the depth increases.
  • a system which converges the radiation at a substantially greater angle of convergence in the plane in which the cut lies than in the plane transverse to the cut.
  • the energy density of the focal spot can be increased without widening the machined V-section, as the uninterrupted access provided longitudinally of the cut is utilised. Consequently the angle of the V-section may be reduced and rate of propagation of the cut increased.
  • the amount of laser energy entering the cut can be increased by cylindrically compressing a spherically expanded beam in the transverse direction. This allows the use of higher spherical beam expansion ratios than is possible without use of the invention because the effect of vignetting by the cut opening is reduced.
  • the numerical aperture of the optical system is higher in the longitudinal direction than in the transverse direction.
  • the focii must be at the same depth in each plane (transverse and longitudinal).
  • the focal spot (as seen on the flat bottom of the cut) will be an ellipse with its major axis transverse of the longitudinal direction of the cut.
  • the size of the focal spot in the major axis (transverse) direction will be larger than that without using the invention.
  • the full advantage of the invention cannot be observed unless the spherical beam expansion coefficient is increased, so that the focal spot area is reduced without a proportional reduction in the energy entering the cut.
  • the beam can be expanded and then focused in both planes in order to achieve a sufficiently high focal spot energy density.
  • any increase in energy density resulting from a reduction in focal spot area will be at least partially offset by a reduction in energy entering the cut, due to vignetting at the opening, as cutting progresses.
  • the ratio of convergence angles (included angle) of the transverse to longitudinal directions can be any value less than unity but the preferred values are from 0.5 to 0.25.
  • cylindrical optics may be used, preferably with a beam compressor or beam expander having cylindrical lenses.
  • Figure 1 is a schematic view, showing the optical system ar, ⁇ a stone being cut, in section transversely to the cut; and Figure 2 is a schematic view of the optical system, as seen in section normal to that of Figure 1.
  • a cut 1 is being formed in a diamond 2.
  • the optical system includes a laser 3. a spherical beam expander 4, a beam contractor formed by two lenses 5,6, and a focussing lens 7.
  • the lenses 5,6 are cylindrical lenses, forming a beam compressor for contracting the beam in the plane of Figure 1 but not in the plane of
  • the focussing lens 7 can be a conventional spherical lens.
  • the laser 3 can be a high-power
  • magnification values of 10 to 20x have been used for the beam expander 4 and 0.25 to 0.5x for the beam contractor 5,6. If the width of the beam between the laser 3 and the beam expander 4 is w, it is typically 3w - 5w between the lenses 6,7 in Figure 1 and lOw - 20w between the lenses 6,7 in Figure 2.
  • the present invention has been described above purely by way of example, and modifications can be made within the spirit of the invention.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
PCT/GB1989/000942 1988-08-15 1989-08-15 Making an elongate cut using high energy radiation WO1990001392A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP89509001A JPH05506185A (ja) 1988-08-15 1989-08-15 高エネルギー放射線を使用する細長い切削部製造方法
DE1989606265 DE68906265T2 (de) 1988-08-15 1989-08-15 Herstellung eines laenglichen schnittes mittels hoher energiestrahlung.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB8819351.1 1988-08-15
GB888819351A GB8819351D0 (en) 1988-08-15 1988-08-15 Making elongate cut using high energy radiation

Publications (1)

Publication Number Publication Date
WO1990001392A1 true WO1990001392A1 (en) 1990-02-22

Family

ID=10642146

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB1989/000942 WO1990001392A1 (en) 1988-08-15 1989-08-15 Making an elongate cut using high energy radiation

Country Status (10)

Country Link
US (1) US5248877A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (1) EP0428609B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPH05506185A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
AU (1) AU628073B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CA (1) CA1325042C (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
GB (1) GB8819351D0 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
IL (1) IL91320A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
IN (1) IN174289B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
WO (1) WO1990001392A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
ZA (1) ZA896206B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2504809C2 (ru) * 2012-03-26 2014-01-20 Открытое Акционерное Общество "Научно-Исследовательский Институт Технического Стекла" Технологический объектив для лазерной обработки

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6489589B1 (en) * 1994-02-07 2002-12-03 Board Of Regents, University Of Nebraska-Lincoln Femtosecond laser utilization methods and apparatus and method for producing nanoparticles
TWI248244B (en) * 2003-02-19 2006-01-21 J P Sercel Associates Inc System and method for cutting using a variable astigmatic focal beam spot
JP4402708B2 (ja) * 2007-08-03 2010-01-20 浜松ホトニクス株式会社 レーザ加工方法、レーザ加工装置及びその製造方法
US20130256286A1 (en) * 2009-12-07 2013-10-03 Ipg Microsystems Llc Laser processing using an astigmatic elongated beam spot and using ultrashort pulses and/or longer wavelengths
CN111843237A (zh) * 2020-07-24 2020-10-30 广州三义激光科技有限公司 一种人工钻石激光切割工艺

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1565144A1 (de) * 1965-09-18 1970-02-19 Telefunken Patent Anordnung zur Materialbearbeitung mit Laserstrahlen

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3422246A (en) * 1965-08-18 1969-01-14 Kearney & Trecker Corp Laser cutting machine tool
GB1196414A (en) * 1966-07-25 1970-06-24 Wickman Mach Tool Sales Ltd Component Loading Devices on Automatic Machine Tools
US3941973A (en) * 1974-06-26 1976-03-02 Raytheon Company Laser material removal apparatus
US4099830A (en) * 1976-12-15 1978-07-11 A. J. Bingley Limited Optical systems including polygonal mirrors rotatable about two axes
GB2052369B (en) * 1979-06-08 1983-02-02 Gersan Ets Working gemstones
US4401876A (en) * 1980-05-20 1983-08-30 Martin Cooper Working gemstones
GB2076334B (en) * 1980-05-20 1983-06-08 Gersan Ets Working gemstones
US4468551A (en) * 1982-07-30 1984-08-28 Armco Inc. Laser treatment of electrical steel and optical scanning assembly therefor
JPS59150684A (ja) * 1983-02-18 1984-08-28 Hitachi Ltd レ−ザ加工装置
US4546231A (en) * 1983-11-14 1985-10-08 Group Ii Manufacturing Ltd. Creation of a parting zone in a crystal structure
JPS6237350A (ja) * 1985-08-12 1987-02-18 Toshiba Corp 表面熱処理装置
JPS62104693A (ja) * 1985-10-31 1987-05-15 Toyota Motor Corp レ−ザ−切断方法
US4806724A (en) * 1986-08-15 1989-02-21 Kawasaki Steel Corp. Laser beam machining device
CA1325041C (en) * 1988-08-15 1993-12-07 Michael Peter Gaukroger Cutting using high energy radiation

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1565144A1 (de) * 1965-09-18 1970-02-19 Telefunken Patent Anordnung zur Materialbearbeitung mit Laserstrahlen

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
IBM TECHNICAL DISCLOSURE BULLETIN. vol. 14, no. 9, February 1972, NEW YORK US pages 2641 - 2642; M.A. GRIMM: "Optical system for laser machining of narrow slots" see the whole document *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2504809C2 (ru) * 2012-03-26 2014-01-20 Открытое Акционерное Общество "Научно-Исследовательский Институт Технического Стекла" Технологический объектив для лазерной обработки

Also Published As

Publication number Publication date
AU4077489A (en) 1990-03-05
CA1325042C (en) 1993-12-07
US5248877A (en) 1993-09-28
EP0428609A1 (en) 1991-05-29
IL91320A (en) 1993-03-15
AU628073B2 (en) 1992-09-10
IN174289B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1994-10-29
ZA896206B (en) 1990-05-30
EP0428609B1 (en) 1993-04-28
IL91320A0 (en) 1990-03-19
JPH05506185A (ja) 1993-09-16
GB8819351D0 (en) 1988-09-14

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