CN1313165A - 叠置芯片载体的激光切割 - Google Patents

叠置芯片载体的激光切割 Download PDF

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CN1313165A
CN1313165A CN01111476A CN01111476A CN1313165A CN 1313165 A CN1313165 A CN 1313165A CN 01111476 A CN01111476 A CN 01111476A CN 01111476 A CN01111476 A CN 01111476A CN 1313165 A CN1313165 A CN 1313165A
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F·D·埃吉图
J·S·克雷斯格
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Abstract

从板切割叠置芯片载体的方法和相关结构,板的厚度小于约100密耳。激光束聚焦在板的表面,板相对于激光束按几何图形移动,由此板的单元(例如,芯片载体)从板上切掉。

Description

叠置芯片载体的激光切割
本发明涉及从板切割叠置芯片载体的方法和相关结构。
由制造板切割叠置芯片载体的常规方法，例如使用机械布线和金刚石锯的方法，要求切割的芯片载体之间有“切口”或限定的间距，这样就限制了由给定板形成的芯片载体的数量。实际的切口宽度通常至少约1.5mm，但是由于如果切口宽度低于约1.5mm，那么制造成本变得过高过于昂贵。在目前的应用中，所述切口的最小宽度1.5mm约为5mm芯片载体宽度的30％。此外，包括新型材料(例如，铜-不胀钢-铜夹层结构)的芯片载体很难用机械的方法加工。
需要一种从板切割芯片载体的方法，其中该方法适用于目前在多层结构中使用的新型材料(例如，铜-不胀钢-铜夹层结构)，并且其中切口宽度很小可忽略。
本发明提供一种切割板的单元的方法，包括以下步骤：
在板的表面上聚焦激光束，其中激光束的波长在约500纳米和约600纳米之间；以及
相对激光束按几何图形移动板，由此至少切下板的一个单元。
本发明提供一种激光结构，包括：
具有两个相邻单元的有组织构形的板，其中所述相邻单元之间的切口宽度在约2纳米和约75纳米之间；以及
激光束聚焦在切口内，其中激光束的波长在约500纳米和约600纳米之间。
本发明具有提供一种由板形成芯片载体的方法，从而切口宽度很小可忽略的优点。
本发明具有适用于目前在多层结构中使用新型材料(例如，铜-不胀钢-铜夹层结构)的优点。
本发明具有相对便宜的优点，即，本发明具有较少或无消耗，而常规方法的刻模机钻头和金刚石锯必须定期更换。
图1为根据本发明的优选实施例由板切割单元的激光系统的前视截面图。
图2为图1板的俯视图，示出了单元和切口。
图3为图2部分板的放大图，示出了9个单元和连带的切口。
图4为图3切口的放大图。
图5为图4切口内的邮票构形。
图1示出了根据本发明的优选实施例由板30切割单元的激光系统10的前视截面图。板30包括图2所示有组织的单元结构。板30特别包括介质层(例如，聚酰亚胺、环氧树脂、聚四氟乙烯)和金属层(例如，铜、铝、不锈钢、钼、不胀钢)的分层结构。板30的厚度小于约100密耳。每个单元特别包括芯片载体。在图1中，激光系统10包括发出激光束14的激光源12。激光束14穿过将激光束14转变成扩展的激光束18的光束扩展器16。扩展激光束18射向转向镜20，转向镜20将扩展激光束18转向，如图所示。所得转向的激光束22由物镜24聚焦，所得聚焦的激光束26射向板30。板30搁在真空吸盘32上。在真空吸盘32中有大量的减压孔，产生真空使板固定在真空吸盘32上。真空吸盘32连接到台34。优选在垂直于聚焦的激光束26的方向36的平面中，手工控制或程序控制移动台34。聚焦激光束26的方向36与垂直于板30的方向38相差不超过约10度。由于板30由真空吸盘32固定在原位，板30随台34移动。通常，通过固定聚焦的激光束26，同时按几何图形移动板30，通过固定板30同时按几何图形移动聚焦的激光束26，或通过例如使用组合束定位器同时移动板30和聚焦的激光束26，使板30相对聚焦的激光束26移动。板30相对聚焦激光束26的运动切下了板30的至少一个单元。
聚焦激光束26的波长在约500纳米和约600纳米之间，脉冲宽度大于约100纳秒并小于约350纳秒，平均功率至少约1瓦，脉冲重复频率在约5,000脉冲/秒和约20,000脉冲/秒之间。
图1的激光系统10仅为从板30切割单元使用的多种类型激光系统结构的示例。本发明的激光可以是美国专利5,593,606(Owen等人，1997，在这里作为参考引入)第3栏31-34行中列举的激光类型中的任何一种。具体地，激光(图1中的激光源12)优选包括如Nd:YAG,Nd:YLF,Nd:YAP，或Nd:YVO4，等的固态激射工作物质，但此外可以包括掺有钬或铒的YAG晶体。
图2为图1板30的俯视图。板30包括单元，例如单元41-49。由长度L和宽度W表示的板30的总尺寸很大足以容纳至少一个单元。由L×W表示的通常使用的尺寸包括13英寸×18英寸，19.5英寸×24英寸，以及24英寸×28英寸。通过相对聚焦激光束26按几何图形移动板30，每个单元从板30上被切下。板30相对聚焦激光束26的运动可以在方向58中或在方向59中。沿方向58的运动产生沿方向58的切口，例如切口50。沿方向59的运动产生沿方向59的切口，例如切口51。切口(例如，切口50和51)构成由聚焦激光束26融化消耗的板材料的路径。在图2中，方向58和59基本相互垂直，反映出图2中的单元构成矩形阵列的事实。通常，板30的单元为有组织的构形，其中每个单元可以具有任何几何形状和尺寸。板30相对聚焦激光束26运动的几何图形通常反映出单元构形的几何特征。
图3为图2部分板的放大图，包括单元41-49以及分别具有切口宽度K1和K2的切口50和51。图3中的每个单元为长S的正方形。S至少约5mm。通常使用的S值包括5mm、10mm、27mm、35mm、42.5mm、52mm以及55mm。切口(例如，切口50和51)构成了由聚焦激光束26融化消耗的板材料的路径。切口为几个因素的结果，包括第一因素和第二因素。第一因素是聚焦激光束26在板30内的小圆圈处(“靶圆圈”)与板30的材料(“靶材料”)相互作用。靶圆圈具有数值为D的直径，称做“靶直径”，在约2微米和约30微米之间(见下文对图4的靶圆圈的说明)。定义“靶半径”R为D/2并指出靶圆圈内聚焦激光束26的能量按照guassian分布随距靶圆圈中心的半径距离降低，靶半径R数值上确定为能量为E0/e2处距靶圆圈中心的半径距离，其中E0为靶圆圈中心处的聚焦激光束26能量，其中e=2.718。第二因素是激光消融产生极高的局部温度(例如，高达约30,000°K)，融化或汽化了多余的靶材料并相对于靶直径有效地拓宽了切口。由此，切口宽度K通常超过D，在约2微米和约75微米之间。对于方形单元，消耗(“消耗量”)的板30区域的比值由下面的等式给出：
消耗量=[(S+K)2-S2]/(S+K)2    (1)
由于K＜＜S，等式(1)的消耗量由2K/S一级近似为K/S。由此如果S等于5mm，使用75微米的最大K，本发明的消耗量不大于约0.03。通常，本发明的消耗量不大于约0.15/S，其中S用毫米表示。相反，现有技术的机械切割技术的最小实际切口宽度约1.5mm。因此，如果S等于5mm(对应很薄的单元)并使用1.5mm的最小K，对于现有技术的机械切割技术，基于等式(1)的消耗量为0.41。由此如果S=5mm，本发明的消耗量比现有技术的机械切割技术的消耗量至少小约13倍。如果对S=55mm(对应很厚的单元)重复以上的计算，那么本发明的消耗量约0.0027，对于现有技术的机械切割技术约0.052。由此，如果S=55mm，那么本发明的消耗量比现有技术的机械切割技术的消耗量至少小约19倍。
如上所述，切口宽度K1在约2微米和约75微米之间。类似地，切口宽度K2在约2微米和约75微米之间。虽然切口宽度K1和K2优选基本相等，但K1和K2可以不同。
图4示出了图3切口50的放大图，示出了通过激光切割除去切口50内靶材料的本发明的实施例。激光切割包括将聚焦激光束26的靶圆圈依次定位在靶材料的重叠部分，由此连续脉冲的靶圆圈的中心之间的偏移H(“靶偏移”)小于靶直径D。例如，靶圆圈60(半径中心61)与靶圆圈65(半径中心66)重叠，使半径中心61和66之间的靶偏移H小于D。此外，靶偏移H可以大于靶直径D。通常，H为小于约2D的任何有限值。由于H取决于板30和聚焦激光束26之间可获得的最小相对速度(与靶直径D相比很小)和可获得的最高脉冲重复率(即，20,000脉冲/秒)，对H/D值的下限没有实际的限制。注意如果H＞D，由于不能由一次通过切掉切口内的所有材料聚焦激光束26的单次经过会留下“邮票”构形，那么需要在相同的切口上多次通过聚焦激光束26。图5为图4切口内的邮票构形。邮票构形70包括包含靶材料的材料部分72和中空部分74。板30相对于聚焦激光束26的第一次通过产生了邮票构形70。邮票构形70可以通过板30相对于聚焦激光束26的至少一次额外通过消除，导致单元41、44和47分别与相邻单元42、45和48(见图3)分离。此外，可以例如通过沿切口50内的路径撕开板30依次机械地除去邮票构形70，导致单元41、44和47分别与相邻单元42、45和48分离。对于给定H/D＞1，聚焦激光束26的第一次通过是否留下邮票构形70取决于融化的材料与聚焦激光束26的波长和能量的关系。
应该指出本发明的激光方法适用于目前在多层结构中使用的新型材料(例如，铜-不胀钢-铜夹层结构)。还应指出和现有技术的机械切割技术相比，本发明的激光方法较快并且板30的切割更清洁。
虽然为了说明的目的这里介绍了本发明的优选和特定实施例，但许多修改和改变对于本领域的技术人员来说很显然。因此，附带的权利要求书意在覆盖落入本发明的实质精神和范围内的所有这种修改和改变。

Claims (27)

1．一种切割板单元的方法，包括以下步骤：
在板的表面聚焦激光束，其中激光束的波长在约500纳米和约600纳米之间；以及
相对激光束按几何图形移动板，由此至少切掉板的一个单元。
2．根据权利要求1的方法，其中激光束的脉冲宽度大于约100纳秒并小于350纳秒。
3．根据权利要求1的方法，其中激光束的靶直径(D)在约2微米和约30微米之间。
4．根据权利要求1的方法，其中板的厚度小于约100密耳。
5．根据权利要求1的方法，其中至少一个单元包括两个相邻的单元，由此所述相邻单元之间切口的宽度在约2纳米和约75纳米之间。
6．根据权利要求5的方法，其中两个相邻的单元的每一个的宽度至少5毫米。
7．根据权利要求5的方法，其中激光束的连续脉冲之间的偏移小于约2D，其中D为激光束的靶直径。
8．根据权利要求5的方法，其中激光束的连续脉冲之间的偏移大于D并小于约2D，其中D为激光束的靶直径，并且其中移动步骤包括板相对于激光束的第一次通过，由此第一次通过在切口内产生邮票构形。
9．根据权利要求8的方法，其中移动步骤进一步包括板相对于激光束的至少一次额外通过，其中除去邮票构形，并且其中所述相邻单元被分开。
10．根据权利要求8的方法，进一步包括机械地除去邮票构形，其中所述相邻单元被分开。
11．根据权利要求5的方法，其中至少一个单元的每个单元为每边长为S的正方形，其中S用毫米表示，并且其中消耗量不大于约0.15/S。
12．根据权利要求1的方法，其中板包括含有介质层和金属层的叠层结构。
13．根据权利要求1的方法，其中激光束的激光源包括选自Nd:YAG、Nd:YLF、Nd:YAP、或Nd:YVO4组成的组的固态激射工作物质。
14．根据权利要求1的方法，其中至少一个单元是芯片载体。
15．根据权利要求1的方法，其中相对于垂直于板表面的线，激光束的角度不大于10度。
16．根据权利要求1的方法，其中移动步骤包括保持激光束在固定的位置，同时按照几何图形移动板。
17．根据权利要求1的方法，其中移动步骤包括保持板在固定的位置，同时按照几何图形移动激光束。
18．根据权利要求1的方法，其中移动步骤包括按照几何图形同时移动板和激光束。
19．一种激光结构，包括：
具有两个相邻单元的有组织构形的板，其中所述相邻单元之间的切口宽度在约2纳米和约75纳米之间；以及
激光束聚焦在切口内，其中激光束的波长在约500纳米和约600纳米之间。
20．根据权利要求19的激光结构，其中激光束的脉冲宽度大于约100纳米并小于350纳米。
21．根据权利要求19的激光结构，其中激光束的靶直径(D)在约2微米和约30微米之间。
22．根据权利要求19的激光结构，其中板的厚度小于约100密耳。
23．根据权利要求19的激光结构，其中至少两个相邻的单元的每一个的宽度至少5毫米。
24．根据权利要求19的激光结构，其中至少一个单元是芯片载体。
25．根据权利要求19的激光结构，其中板包括含有介质层和金属层的叠层结构。
26．根据权利要求19的激光结构，其中激光束的激光源包括选自Nd:YAG、Nd:YLF、Nd:YAP、或Nd:YVO4组成的组的固态激射工作物质。
27．根据权利要求19的激光结构，其中相对于垂直于板表面的线，激光束的角度不大于10度。
CN01111476A 2000-03-15 2001-03-14 叠置芯片载体的激光切割 Pending CN1313165A (zh)

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