WO1989007508A1 - Procede et cassette d'usinage par abrasion de la surface de pieces - Google Patents

Procede et cassette d'usinage par abrasion de la surface de pieces Download PDF

Info

Publication number
WO1989007508A1
WO1989007508A1 PCT/SU1988/000039 SU8800039W WO8907508A1 WO 1989007508 A1 WO1989007508 A1 WO 1989007508A1 SU 8800039 W SU8800039 W SU 8800039W WO 8907508 A1 WO8907508 A1 WO 8907508A1
Authority
WO
WIPO (PCT)
Prior art keywords
parts
base
cassette
housing
casing
Prior art date
Application number
PCT/SU1988/000039
Other languages
English (en)
Russian (ru)
Inventor
Boris Iosifovich Batiashvili
David Semenovich Butskhrikidze
Gennady Levanovich Mamulashvili
Original Assignee
Gruzinsky Politekhnichesky Institut Imeni V.I.Leni
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gruzinsky Politekhnichesky Institut Imeni V.I.Leni filed Critical Gruzinsky Politekhnichesky Institut Imeni V.I.Leni
Priority to EP19880904709 priority Critical patent/EP0383910A4/de
Priority to JP50420488A priority patent/JPH02503174A/ja
Priority to PCT/SU1988/000039 priority patent/WO1989007508A1/fr
Publication of WO1989007508A1 publication Critical patent/WO1989007508A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B11/00—Machines or devices designed for grinding spherical surfaces or parts of spherical surfaces on work; Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings

Definitions

  • the means of processing the processed parts are also known :; ⁇ base; ⁇ -
  • the height of the housing is equal to the thickness of the casing, the installation and installation of the installation, the thickness of the housing determines the depth of the nest.
  • the cradle, the laying and the base of the hard drive are connected between the screws.
  • the task at hand resolves that: _, that in the process of abrasive processing .. the detail;:, and at all
  • a good solution gives the opportunity to abrasive parts because of the marginally small thickness of the device and significant increase in the volume of the device.
  • FIG. 2 schematically illustrates a cassette for an abrasive 10 processing, as per the invention
  • Fig. 5 shows the transfer of parts from one cassette to another:
  • Fig. ⁇ shows the processing of parts with a total speed of 20 parts.
  • the variant of the cassette, according to the invention (Fig. 2), separates the remote washers 13, mounted on the connectors between the hats 7 and the disconnected I.
  • ⁇ asse ⁇ z, ⁇ imenyaemaya of s ⁇ s ⁇ be for ⁇ b ⁇ azivn ⁇ ⁇ b ⁇ a- b ⁇ i, s ⁇ glasn ⁇ iz ⁇ b ⁇ e ⁇ eniyu, ⁇ ab ⁇ ae ⁇ ⁇ b ⁇ az ⁇ m follows: on ⁇ ze ⁇ n ⁇ s ⁇ ⁇ b ⁇ ymy 4 ( ⁇ g.Z) without ⁇ ien ⁇ atsii nasy ⁇ ayu ⁇ ⁇ b ⁇ aba ⁇ yvaemye Degas 10 and lib ⁇ ⁇ achz ⁇ elnymi ⁇ adialnym ⁇ ⁇ assegy movements, movements lib ⁇ ⁇ ug ⁇ vymi ⁇ u ⁇ i s ⁇ - s ⁇ bs ⁇ vuyug ⁇ adaniyu de ⁇ aley 10 into slots 9. Those remaining on the surface of the boom 4 degaly dump.
  • the components with parts 10 are optimized for abrasive tool 15 (fig. ⁇ ), so that
  • a cassette with convenient parts from one part (10) is combined with a similar empty cassette
  • the cartridge cassettes are divided. ⁇ measure ⁇ ⁇
  • '5 ⁇ azlichnymi is ⁇ dnymi ⁇ lschi ⁇ ami, vys ⁇ avlenie ⁇ b ⁇ iiy 4- ⁇ n ⁇ si ⁇ eln ⁇ ⁇ b ⁇ 2 ⁇ i increase uc ⁇ ⁇ dn ⁇ y ⁇ lschiny s de ⁇ ale ⁇ 10 ⁇ izv ⁇ dya ⁇ ⁇ u ⁇ em umenyieniya ⁇ lschiny ⁇ dis ⁇ an tsi ⁇ nn ⁇ y washer 13 at the same amount or gu na ⁇ b ⁇ .
  • the optical glass ⁇ it is convenient.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Nitrogen And Oxygen Or Sulfur-Condensed Heterocyclic Ring Systems (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

Procédé d'usinage par abrasion la surface de pièces (10) placées dans le logement (4), dans lequel on crée une pression pour appliquer l'instrument abrasif (15) contre les pièces (10) à usiner et qui consiste à réaliser leurs mouvements réciproques tout en assurant, en plus, un contact permanent entre l'instrument abrasif (15) et le logement (4), et à atténuer les mouvements de ce dernier dans la direction de la base (1), la valeur maximale des mouvements du logement (4) par rapport à la base étant égale ou supérieure à l'épaisseur nominale des pièces (10) à usiner. On décrit également une cassette pour la mise en oeuvre du procédé, comportant un logement (4) avec des boîtiers (9), ainsi qu'une base (1) entre lesquels on place au moins un élément élastique (5) précomprimé. La cassette est pourvue d'éléments de limitation du mouvement du logement (4) dans le sens de la détente de l'élément élastique (5), la profondeur du boîtier (9) étant inférieure ou égale à la valeur de l'allongement équidistant du logement (4) depuis le plan de la base (1).
PCT/SU1988/000039 1988-02-17 1988-02-17 Procede et cassette d'usinage par abrasion de la surface de pieces WO1989007508A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP19880904709 EP0383910A4 (en) 1988-02-17 1988-02-17 Method and cassette for abrasive machining of the surface of parts
JP50420488A JPH02503174A (ja) 1988-02-17 1988-02-17 工作片表面の研摩方法と該方法を実施するためのジグ
PCT/SU1988/000039 WO1989007508A1 (fr) 1988-02-17 1988-02-17 Procede et cassette d'usinage par abrasion de la surface de pieces

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SU1988/000039 WO1989007508A1 (fr) 1988-02-17 1988-02-17 Procede et cassette d'usinage par abrasion de la surface de pieces

Publications (1)

Publication Number Publication Date
WO1989007508A1 true WO1989007508A1 (fr) 1989-08-24

Family

ID=21617198

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SU1988/000039 WO1989007508A1 (fr) 1988-02-17 1988-02-17 Procede et cassette d'usinage par abrasion de la surface de pieces

Country Status (3)

Country Link
EP (1) EP0383910A4 (fr)
JP (1) JPH02503174A (fr)
WO (1) WO1989007508A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7029382B2 (en) 1999-03-03 2006-04-18 Ebara Corporation Apparatus for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5205082A (en) * 1991-12-20 1993-04-27 Cybeq Systems, Inc. Wafer polisher head having floating retainer ring
US5443416A (en) * 1993-09-09 1995-08-22 Cybeq Systems Incorporated Rotary union for coupling fluids in a wafer polishing apparatus
JP3724869B2 (ja) * 1995-10-09 2005-12-07 株式会社荏原製作所 ポリッシング装置および方法
KR100485002B1 (ko) 1996-02-16 2005-08-29 가부시키가이샤 에바라 세이사꾸쇼 작업물폴리싱장치및방법
US6231428B1 (en) 1999-03-03 2001-05-15 Mitsubishi Materials Corporation Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU592582A1 (ru) * 1976-01-12 1978-02-15 Ленинградское Особое Конструкторское Бюро Автоматов И Револьверных Станков Устройство дл установки микрошлифов на доводочных станках
SU715307A1 (ru) * 1977-06-27 1980-02-15 Ордена Трудового Красного Знамени Завод Чистых Металлов Им.50-Летия Ссср Кассета плоскодоводочного станка дл односторонней обработки деталей

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53140698A (en) * 1978-05-22 1978-12-07 Hitachi Ltd Method and device for wafer lapping
SU831580A1 (ru) * 1979-07-09 1981-05-23 Горьковский Политехнический Институтим.A.A.Жданова Устройство дл доводки плоскихпОВЕРХНОСТЕй дЕТАлЕй
JPS59196161A (ja) * 1983-04-21 1984-11-07 Tohoku Metal Ind Ltd 研麿方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU592582A1 (ru) * 1976-01-12 1978-02-15 Ленинградское Особое Конструкторское Бюро Автоматов И Револьверных Станков Устройство дл установки микрошлифов на доводочных станках
SU715307A1 (ru) * 1977-06-27 1980-02-15 Ордена Трудового Красного Знамени Завод Чистых Металлов Им.50-Летия Ссср Кассета плоскодоводочного станка дл односторонней обработки деталей

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP0383910A4 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7029382B2 (en) 1999-03-03 2006-04-18 Ebara Corporation Apparatus for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
US7311586B2 (en) 1999-03-03 2007-12-25 Ebara Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure

Also Published As

Publication number Publication date
EP0383910A1 (fr) 1990-08-29
JPH02503174A (ja) 1990-10-04
EP0383910A4 (en) 1991-04-17

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