Classifications

• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
  • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
  • H03H9/02—Details
  • H03H9/05—Holders or supports
  • H03H9/10—Mounting in enclosures
  • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
  • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
  • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
  • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
  • H01L23/495—Lead-frames or other flat leads
  • H01L23/49596—Oscillators in combination with lead-frames
• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
  • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
  • H03H9/02—Details
  • H03H9/05—Holders or supports
  • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
  • H03H9/0542—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement
• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
  • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
  • H03H9/02—Details
  • H03H9/05—Holders or supports
  • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
  • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
  • H03H9/0552—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement the device and the other elements being mounted on opposite sides of a common substrate
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/4805—Shape
  • H01L2224/4809—Loop shape
  • H01L2224/48091—Arched
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/481—Disposition
  • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
  • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/30—Technical effects
  • H01L2924/301—Electrical effects
  • H01L2924/3025—Electromagnetic shielding

Definitions

• the present invention relates to a press-fit type piezoelectric vibrator in which a quartz-crystal vibrating piece is sealed using a system that is press-fitted into a case, a resin-molded piezoelectric vibrator in which the press-fit type piezoelectric vibrator is packaged in a resin, and a press-fit type.
• the present invention relates to a case-inserted piezoelectric vibrator in which a piezoelectric vibrator is inserted in another case, and a piezoelectric oscillator in which a press-fit type piezoelectric vibrator is resin-sealed together with an IC having an oscillation circuit.
• conventional press-fit type piezoelectric vibrators use a bonding method with an adhesive 101 or solder with a Sn: Pb ratio of 6: 4 or 9: 1 as shown in Fig. 15
• the fixing method was used.
• a press-fitting method in which the solder 102 or gold is pressed into a case, a welding or pressure welding method, and the like have been used.
• a conventional resin-molded press-fit type piezoelectric vibrator had a structure as shown in FIG. This is done by using an adhesive such as polyimide to fix the piezoelectric vibrating piece 103 to the inner lead 105 of the stem 104.
• the stem 104 and the case 106 The seal is made of gold as the shield material 10 mm, and the press-fit type piezoelectric vibrator of the above precaution is fixed to the lead frame by welding, and a piezoelectric vibrator integrally molded with resin is used. there were.
• a conventional piezoelectric oscillator has a structure as shown in FIG. 17 and uses a press-fit piezoelectric vibrator 109 described above to electrically oscillate the press-fit piezoelectric vibrator i09.
• the resin and the lead frame that electrically connects them are made of resin. Was shaped.
• the basic problem is that the entire component reaches 220 to 260, and if the solder has a lead content of 40% or less, it will melt. And other organic components released from the solder paste during high-temperature aging
• the case and the stem are soldered with 90-% or more lead.
• the piezoelectric vibrating reed is fixed to the half of the stem
• a press-fit type piezoelectric vibrator hermetically sealed by a press-fit method as a material.
• the electric vibrating reed is fixed by melting the solder that is inserted into the inner lead of the stem.
• the case and the stem are further formed by using the solder as a shield material.
• the press frame is fixed, and the press-fit type piezoelectric vibrator and the lead frame are connected.
• the case and the stem are soldered with 90% or more lead.
• the piezoelectric vibrating reed is fixed to the half of the stem
• the case and the stem are hermetically sealed by a press-fitting method using the solder as a shield material.
• Case insertion type with a rectangular case with a cross section of at least one corner and a thickness in the range of 0.05 to 1.5 on the outer peripheral part other than the lead part of the cylindrical press-fit type piezoelectric vibrator. It becomes a piezoelectric vibrator.
• the case and the stem are soldered with 90% or more lead, and the fixing of the piezoelectric vibrating reed is performed by melting the solder fixed to the inner lead of the stem.
• the case and the stem further include a press-fit type piezoelectric vibrator hermetically sealed by a press-fitting method using the solder as a shield material, a semiconductor (IC) for electrically oscillating the press-fit type piezoelectric vibrator, and a lead frame.
• the frame becomes a resin-molded piezoelectric oscillator.
• FIG. 1 is a structural view of a press-fit type piezoelectric vibrator of the present invention.
• Fig. 2 shows the solder state diagram
• FIG. 3 is a structural view showing another embodiment of the press-fit type piezoelectric vibrator of the present invention.
• FIG. 4 is a structural view showing another embodiment of the press-fit type piezoelectric vibrator of the present invention.
• FIG. 5 is a structural view of a resin-molded piezoelectric vibrator of the present invention.
• FIG. 6 is a perspective view of a resin-molded piezoelectric vibrator of the present invention.
• FIG. 7 is a structural diagram of an application example of the tree-shaped piezoelectric vibrator of the present invention.
• FIG. 8 is a perspective view of an application example of the resin-molded piezoelectric vibrator of the present invention.
• FIG. 9 is a perspective view showing another embodiment of the resin-molded piezoelectric vibrator of the present invention.
• FIG. 10 is a structural view of a case insertion type piezoelectric vibrator of the present invention.
• FIG. 11 (a) is a cross-sectional view of a case insertion type piezoelectric vibrator of the present invention.
• FIG. 11 (b) is a cross-sectional view showing another example of the case-inserted piezoelectric vibrator of the present invention.
• FIG. 11 (c) is a cross-sectional view showing another example of the case-inserted piezoelectric vibrator of the present invention.
• FIG. 12 is a perspective view of a piezoelectric oscillator using the press-fit type piezoelectric vibrator of the present invention.
• FIG. 13 (a) is a sectional view of a piezoelectric oscillator using a press-fit type piezoelectric vibrator of the present invention.
• Fig. 13 is a main plan view of the assembly of a piezoelectric oscillator using the press-fit type piezoelectric vibrator of the present invention.
• Fig. 14 is a plan view of the main components of the piezoelectric oscillator of this study.
• FIG. 14 (b) is a main sectional view of the piezoelectric oscillator of the present invention.
• FIG. 15 is a cross-sectional view of a conventional press-fit type piezoelectric vibrator.
• Fig. 16 is a structural view of a conventional resin-molded piezoelectric vibrator.
• Fig. 17 is a main sectional view of a conventional piezoelectric oscillator. BEST MODE FOR CARRYING OUT THE INVENTION
• FIG. 1 is a structural view of a quartz oscillator as one embodiment of a press-fit type piezoelectric oscillator of the present invention.
• a tuning fork-type quartz vibrating piece 1 made by photolithography from a quartz plate was attached to a lead 3 of a stem 2 in which a lead 3 was sealed to a metal ⁇ 7 by glass, and an Sn pair shown in a soldering state diagram of FIG.
• the case 6 in which the high-temperature solder 5 is plated on the stem 2 is vacuum-sealed by a press-fitting method to complete the crystal unit. ⁇
• the solder When the amount of Pb is large, the solder not only improves the heat resistance-it is stable even at extremely low temperatures. This is because Sn can be cracked and cracked by an extremely low-grade phoenix. Since heat resistance and workability are important for solder, high-temperature solder containing not only Sn and Pb but also a third metal such as Ag may be used.
• the soldering method of the press-fit type stem and the case uses the face-turning method, so that the solder is adhered to the entire metal part of the stem 2 and the case 6.
• the solder when the solder is melted, the organic components of the solder are released as a gas, and the adhesion of the gas causes vibration. This may occur on the moving piece or the degree of vacuum may be reduced to cause deterioration of characteristics. This characteristic deterioration occurs even when the solder plating is applied only to the inner peripheral portion, not the entire metal portion of the case 6, as shown in FIG. For this reason, as shown in FIG. 4, the high-temperature solder 4 is used only for the fixing portion between the crystal resonator element 1 and the lead 3, and the high-temperature solder 5 is used only for the sealing portion 5 of the stem 2 and the case 6. It is more desirable.
• the crystal vibrating piece 1 If the solder is plated over the entire metal part of the case and stem by plating, if the crystal vibrating piece 1 is hermetically sealed, it will remain at a high temperature (from room temperature to 260 ° C.). As a result, the equivalent resistance value increases extremely (sometimes reaches 100% or more), causing significant frequency aging, which may cause oscillation to stop.
• the baking temperature is the temperature in the shaded area surrounded by the eutectic line ab, liquidus line ac, and lead content of 90% or more in Fig. 2, and baking is performed in this state. By doing so, it is possible to sufficiently release the organic components. As a result, the increase in the equivalent resistance value at a high temperature can be suppressed to several percent or less.
• the high-temperature solder is plated only on the case side of the sealing portion, so that the airtightness can be maintained.
• the metal ring of the stem may be not only a high-temperature solder but also a metal such as Ni or Cu.
• the manufacturing technology can be the same as that of the conventional one, the material can be inexpensive and mass production is possible, and miniaturization can be easily achieved. This is because a load is likely to be applied to the step of fixing the quartz-crystal vibrating piece 0, so that the solder melting method simplifies the manufacturing.
• the press-fitting method for the encapsulation method it is easy to manufacture with inexpensive materials.
• the tree-shaped piezoelectric vibrator is fixed to the lead frame 10 by, for example, melting the solder of the outer leads 9 of the press-fit type piezoelectric vibrator 8 as shown in FIG. At this time, it is preferable that welding is performed because stronger bonding can be achieved.
• These are integrally molded with an epoxy-based resin 11 to complete a resin-molded piezoelectric vibrator.
• Fig. 6 shows this perspective view. This is the lead on the end face
• FIG. 8 is this perspective view.
• the markings such as the corners of a square, should be marked.
• FIG. 9 is a perspective view showing another embodiment of the resin-molded piezoelectric vibrator of the present invention.
• the structure of the surface mount type is adopted, but the insert lead type may be used in this way.
• the case-insertable piezoelectric vibrator has a rectangular case 36 attached to the outer periphery of the above-described press-fit piezoelectric vibrator zo, and the lead 34 is bent. .
• the thickness of the square case 36 is in the range of 0.05 sm to 1.5 ⁇ m, and if it is thick, it can be easily formed by a method such as pressing.
• the square case 36 is not limited to metal, but may be resin or the like.
• the square case is fixed to the press-fit type piezoelectric vibrator by welding, fixing with an adhesive or fitting.
• the square case of Z5 shape can be not only four sides but also three-sided and eight-sided polygons. Good. If the square case is made of metal, it can be used as a ground.
• FIGS. 12 and 13 a press-fit type piezoelectric vibrator 12 and a press-fit type piezoelectric vibrator are shown.
• a semiconductor 13 for electrically oscillating the rotor 12 is arranged in a plane, and the wire bonding of the fine metal wire 15 and the press-fit type piezoelectric vibrator 12 are performed via a lead frame 14.
• the press-fit type piezoelectric vibrator 12 and the semiconductor 13 are electrically connected by a method such as melting the solder of the outer lead 16 to form an oscillation surface.
• a press-fit type piezoelectric vibrator 12, a semiconductor 13, a lead frame 14, and a thin metal wire 15 are formed of resin 17.
• the press-fit type piezoelectric vibrator 1 2 The press-fit type piezoelectric vibrator 1 2
• the lead frame 14 When the lead frame 14 is fixed to the drum 14, the lead frame 14 may not be strong enough to cause wire cutting. Therefore, as shown in FIG. 13 (b), the lead frame 14 is located on the opposite side of the semiconductor 13. It is desirable to place the lead 41 near the outer frame 42 of the frame.
• a press-fit type piezoelectric vibrator 18 and a semiconductor for electrically oscillating the press-fit type piezoelectric vibrator 18 The tabs 19 of the lead frame 20 to which the semiconductor 19 is fixed are pushed out toward the piezoelectric vibrator 18 side, and the press-fit type piezoelectric
• the press-fit type piezoelectric vibrator 18 is in parallel with the vibrator 18 to ensure electrical insulation clarity between the press-fit type piezoelectric vibrator 18 and the plurality of lead frames 20. This not only prevents electrical continuity between the piezoelectric vibrator 18 and the plurality of lead frames 20, but also prevents shorts between the lead frames 20.
• the assembly is made to be about 1 ⁇ 2 in the plane and the minimum total thickness of the components in the thickness direction.
• the piezoelectric vibrator 1 8, semiconductor 1 9, the entire Nde Complex 5 Lee Zadoff frame 2 0 and 2 1 are molded Ri by the heat-resistant resin 2 2.
• the piezoelectric oscillator described in the embodiment is a key point of assembly.
• the soldering part of the mounting piece, the case and the stem, and the connection between the lead of the press-fit type piezoelectric vibrator and the lead frame all have a heat resistance of 260 ° C or more, including the components. It has a configuration.
• the overall shape of the embodiment is a lead frame shape called a gull wing of a flat package compatible with SMT as shown in Fig. 12, application to a lead shape as a plug-in component is also considered.
• a lead frame shape called a gull wing of a flat package compatible with SMT as shown in Fig. 12
• application to a lead shape as a plug-in component is also considered.
• Another example is the application of a flat package to a J-bend lead frame shape.
• the press-fit type piezoelectric vibrator of the present invention 90% or more of lead is soldered to the case and the stem, and the piezoelectric vibrating reed is fixed to the inner lead of the stem.
• the solder and the case are melted, and the case and the stem are hermetically sealed by a press-fitting method using the solder as a shielding material, so that an adhesive or the like is used for fixing the piezoelectric vibrator. Without using it, it is performed directly by the solder 15 plated on the lead, and it is directly press-fitted by the solder plated on the case and the stem, so material cost and manufacturing cost are low, and heat resistance is low.
• a sufficient press-fit type piezoelectric vibrator can be obtained.
• the resin-molded piezoelectric vibrator of the present invention 90% or more lead is soldered to the case and the stem, and the piezoelectric vibrating reed is fixed to the stem inner lead.
• the case and stem are solder-sealed, and the solder and the shield are sealed by a press-fit type piezoelectric vibrator.
• One lead and lead frame are fixed, press-fit type piezoelectric vibrator and lead frame It is said that by integrally molding the resin with the resin, an inexpensive, high-quality, sufficiently heat-resistant piezoelectric vibrator can be obtained, and it is easy to handle, such as by automatic mounting. According to the type piezoelectric vibrator, 90% or more lead is soldered on the case and the stem, and the sticking of the piezoelectric vibrating reed is performed by melting the solder attached to the inner lead of the stem.
• case and the stem have a cross-section of one or more corners on the outer peripheral part other than the lead part of the press-fit type piezoelectric vibrator hermetically sealed by the press-fitting method using solder as a shield material and have a thick wall.
• solder having a lead content of 90% or more is applied to the case and the stem of the piezoelectric vibrator, and is used as a mounting material of the vibrating piece and a sealing material.
• the press-fit type piezoelectric vibrator and the semiconductor are arranged on both sides of the lead frame, and the tab of the lead frame is pushed out to secure insulation between the press-fit type piezoelectric vibrator and the metal lead. This has the effect of providing a compact piezoelectric oscillator with excellent heat resistance.

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• Physics & Mathematics (AREA)
• Acoustics & Sound (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Engineering & Computer Science (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
• Oscillators With Electromechanical Resonators (AREA)

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Citations (6)

• 1988
  • 1988-02-19 WO PCT/JP1988/000170 patent/WO1988006818A1/ja unknown
  • 1988-02-19 CH CH411988A patent/CH678471A5/fr not_active IP Right Cessation

Patent Citations (6)

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