WO1987006091A3 - Configurations de cartes de circuits empilees et de vehicules guides - Google Patents

Configurations de cartes de circuits empilees et de vehicules guides Download PDF

Info

Publication number
WO1987006091A3
WO1987006091A3 PCT/US1987/000317 US8700317W WO8706091A3 WO 1987006091 A3 WO1987006091 A3 WO 1987006091A3 US 8700317 W US8700317 W US 8700317W WO 8706091 A3 WO8706091 A3 WO 8706091A3
Authority
WO
WIPO (PCT)
Prior art keywords
cards
missile
electronics unit
unit
sensor platform
Prior art date
Application number
PCT/US1987/000317
Other languages
English (en)
Other versions
WO1987006091A2 (fr
Inventor
Ernest P Longerich
Agostino Saverio D
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of WO1987006091A2 publication Critical patent/WO1987006091A2/fr
Publication of WO1987006091A3 publication Critical patent/WO1987006091A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0005—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being of the fibre type
    • G02B6/001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being of the fibre type the light being emitted along at least a portion of the lateral surface of the fibre
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1434—Housings for electronics exposed to high gravitational force; Cylindrical housings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

La présente invention concerne la configuration d'une unité de circuits électroniques, dans laquelle plusieurs cartes de circuits circulaires sont alignées en parallèle. Dans chaque carte est ménagée une ouverture interne circulaire centrale. Plusieurs éléments d'espacement interne et externe soutiennent les périphéries interne et externe correspondantes des cartes. Les configurations conductrices situées sur les cartes comprennent plusieurs plots conducteurs disposés autour des périphéries interne et externe des cartes. Des connecteurs internes et externes circulaires en métal sur élastomère s'engagent dans l'un des éléments d'espacement internes et externes correspondant et les traces métalliques des connecteurs établissent un contact électrique avec les plots conducteurs alignés des cartes adjacentes. L'unité comprend une structure de couverture qui enveloppe la configuration de la carte de circuit, afin de former une unité étanche. Un liqude refroidissant électriquement isolant est placé dans l'unité étanche en contact direct avec les cartes de circuits et avec les composants électriques montés sur lesdites cartes, afin d'absorber la chaleur produite par la dissipation d'énergie électrique. L'unité de circuits électriques est particulièrement bien adaptée pour être utilisée avec une configuration de véhicules guidés, tels qu'un missile, dans laquelle un élément structural central tubulaire s'étend vers le haut à partir de l'arrière du missile, l'unité du circuit électronique étant assemblée avec l'élément tubulaire s'étendant à travers l'ouverture centrale ménagée dans l'unité de circuit électronique. L'élément de support tubulaire est contenu dans la plate-forme détectrice du missile à travers l'ouverture centrale. La plate-forme détectrice est fixée par un élément de fixation exerçant des forces de compression le long de l'axe central du missile, alignant ainsi la plate-forme détectrice avec l'arrière du missile contenant le système de propulsion du missile.
PCT/US1987/000317 1986-03-25 1987-02-17 Configurations de cartes de circuits empilees et de vehicules guides WO1987006091A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/843,965 US4922381A (en) 1986-03-25 1986-03-25 Stacked circuit cards and guided configurations
US843,965 1986-03-25

Publications (2)

Publication Number Publication Date
WO1987006091A2 WO1987006091A2 (fr) 1987-10-08
WO1987006091A3 true WO1987006091A3 (fr) 1987-11-05

Family

ID=25291436

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1987/000317 WO1987006091A2 (fr) 1986-03-25 1987-02-17 Configurations de cartes de circuits empilees et de vehicules guides

Country Status (7)

Country Link
US (1) US4922381A (fr)
AU (1) AU7166387A (fr)
CA (3) CA1270963A (fr)
EG (1) EG20042A (fr)
ES (1) ES2003019A6 (fr)
IL (1) IL81651A (fr)
WO (1) WO1987006091A2 (fr)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4891688A (en) * 1988-01-21 1990-01-02 Hughes Aircraft Company Very high-acceleration tolerant circuit card packaging structure
JPH055657Y2 (fr) * 1988-05-10 1993-02-15
US5077637A (en) * 1989-09-25 1991-12-31 The Charles Stark Draper Lab., Inc. Solid state directional thermal cable
DE3935047A1 (de) * 1989-10-20 1991-04-25 Siemens Ag Elektrische funktionseinheit insbesondere fuer die datentechnik
FR2673354B1 (fr) * 1991-02-27 1994-01-28 Telecommunications Sa Enceinte de reception de composants electroniques, embarquee sur un missile.
JPH04312962A (ja) * 1991-03-18 1992-11-04 Mitsubishi Electric Corp 液体封止半導体装置及びその組立方法
JPH04320509A (ja) * 1991-04-19 1992-11-11 Gurafuiko:Kk 並列処理装置
US5216361A (en) * 1991-07-10 1993-06-01 Schlumberger Technologies, Inc. Modular board test system having wireless receiver
US5479320A (en) * 1991-12-31 1995-12-26 Compaq Computer Corporation Board-to-board connector including an insulative spacer having a conducting surface and U-shaped contacts
US5499164A (en) * 1994-06-22 1996-03-12 Northrop Grumman Corporation High impact digital crash data recorder
DE4435121A1 (de) * 1994-09-30 1996-04-04 Siemens Ag An Datenbus betreibbare tragbare Datenträgeranordnung
FR2734405B1 (fr) * 1995-05-18 1997-07-18 Aerospatiale Dispositif electronique protege contre les chocs par capsulation
US5754405A (en) * 1995-11-20 1998-05-19 Mitsubishi Semiconductor America, Inc. Stacked dual in-line package assembly
US6119573A (en) * 1997-01-27 2000-09-19 Raytheon Company Carbon fiber flocking for thermal management of compact missile electronics
US5841638A (en) * 1996-02-15 1998-11-24 L3 Communications Stacked memory for flight recorders
US5847927A (en) * 1997-01-27 1998-12-08 Raytheon Company Electronic assembly with porous heat exchanger and orifice plate
JP3432497B2 (ja) * 1997-10-27 2003-08-04 ディスカバリー セミコンダクターズ インコーポレーテッド 集積回路超小型衛星
US6039581A (en) * 1997-12-30 2000-03-21 Honeywell Inc. Electrical connector for circuit card assemblies
US6744637B2 (en) 2001-11-30 2004-06-01 Alliant Techsystems Inc. Guided munitions electronics package and method
US6913472B2 (en) * 2002-06-28 2005-07-05 Siemens Vdo Automotive Corporation Method and apparatus for attaching a sensor assembly in a control unit
GB2395600B (en) * 2002-11-19 2004-10-20 Mbm Technology Ltd Ruggedised solid-state storage device
US7044461B2 (en) * 2003-04-30 2006-05-16 The Regents Of The University Of California Method and apparatus for adjustably induced biaxial strain
DE10324047B4 (de) * 2003-05-27 2013-02-28 Continental Automotive Gmbh Elektronikeinheit sowie Verfahren zur Herstellung einer Elektronikeinheit
US6892646B1 (en) 2003-07-11 2005-05-17 Raytheon Company Granular matter filled weapon guidance electronics unit
DE602004027731D1 (de) * 2004-09-30 2010-07-29 Saab Ab Verfahren zur kühlung elektronische Bauteile in einem unbemannten Flugkörper und Vorrichtung zur Durchführung des Verfahrens
US7260998B2 (en) * 2005-03-18 2007-08-28 The Boeing Company Apparatuses and methods for structurally testing fasteners
US8619434B2 (en) * 2008-02-13 2013-12-31 Cameron International Corporation Arrangement system
US8942005B2 (en) 2009-05-21 2015-01-27 Raytheon Company Low cost, high strength electronics module for airborne object
WO2011028924A2 (fr) * 2009-09-02 2011-03-10 University Of Washington Mousses thermoplastiques poreuses servant de matériaux de transfert de chaleur
US20180364071A1 (en) * 2017-06-16 2018-12-20 Daniel Rivera Photonic computer system comprised of stack disk arrays running on but not limited to quantum software
US10499524B2 (en) 2017-12-20 2019-12-03 Capital One Services, Llc Apparatus for mounting a processor for cluster computing
US11284522B2 (en) 2020-02-07 2022-03-22 Polaris Industries Inc. Electronic assembly for a vehicle display

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1261915B (de) * 1963-10-21 1968-02-29 Burndy Corp Anschlussvorrichtung fuer eine Vielzahl laenglicher Schaltplatten
US3851221A (en) * 1972-11-30 1974-11-26 P Beaulieu Integrated circuit package
FR2252668A1 (fr) * 1973-11-26 1975-06-20 Amp Inc
US4162818A (en) * 1977-12-28 1979-07-31 The United States Of America As Represented By The Secretary Of The Air Force Interconnection for planar electronic circuits
US4225900A (en) * 1978-10-25 1980-09-30 Raytheon Company Integrated circuit device package interconnect means

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2752537A (en) * 1952-08-29 1956-06-26 John W Wolfe Electrical apparatus wiring system
US2958014A (en) * 1957-02-12 1960-10-25 Sperry Rand Corp Interlocking systems
US2976806A (en) * 1958-03-05 1961-03-28 Gen Dynamics Corp Missile structure
US3139559A (en) * 1959-12-29 1964-06-30 Burroughs Corp Housing for packaging miniaturized modular electrical network assemblies
US3081416A (en) * 1961-04-19 1963-03-12 Itt Step-by-step switch
US4051414A (en) * 1964-12-28 1977-09-27 The United States Of America As Represented By The Secretary Of The Navy Missile adaptation kit assembly
US3434014A (en) * 1967-06-13 1969-03-18 Rca Corp Packaging of electrical equipment
US3596140A (en) * 1969-12-01 1971-07-27 Ronald A Walsh Demountable peripheral-contact electronic circuit board assembly
US3904934A (en) * 1973-03-26 1975-09-09 Massachusetts Inst Technology Interconnection of planar electronic structures
US3818280A (en) * 1973-05-23 1974-06-18 Gen Signal Corp Printed circuit connector and keying structure
US3999105A (en) * 1974-04-19 1976-12-21 International Business Machines Corporation Liquid encapsulated integrated circuit package
SU683040A1 (ru) * 1978-05-04 1979-08-30 Предприятие П/Я Г-4152 Устройство дл креплени
US4283754A (en) * 1979-03-26 1981-08-11 Bunker Ramo Corporation Cooling system for multiwafer high density circuit
GB2100064B (en) * 1981-05-29 1984-12-12 Ferranti Ltd Electrical circuit assembly
US4399488A (en) * 1981-08-03 1983-08-16 The United States Of America As Represented By The Secretary Of The Army Right circular substrate packaging

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1261915B (de) * 1963-10-21 1968-02-29 Burndy Corp Anschlussvorrichtung fuer eine Vielzahl laenglicher Schaltplatten
US3851221A (en) * 1972-11-30 1974-11-26 P Beaulieu Integrated circuit package
FR2252668A1 (fr) * 1973-11-26 1975-06-20 Amp Inc
US4162818A (en) * 1977-12-28 1979-07-31 The United States Of America As Represented By The Secretary Of The Air Force Interconnection for planar electronic circuits
US4225900A (en) * 1978-10-25 1980-09-30 Raytheon Company Integrated circuit device package interconnect means

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Electronics, Volume 50, No. 17, August 1977, (New York, US), "Rigid Assembly Takes Cannon-Launch 9", pages 50,52 see page 50, figure *

Also Published As

Publication number Publication date
WO1987006091A2 (fr) 1987-10-08
CA1304062C (fr) 1992-06-23
US4922381A (en) 1990-05-01
AU7166387A (en) 1987-10-20
CA1270963A (fr) 1990-06-26
ES2003019A6 (es) 1988-10-01
IL81651A0 (en) 1987-09-16
IL81651A (en) 1992-12-01
CA1301368C (fr) 1992-05-19
EG20042A (en) 1997-08-31

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