WO1987004041A1 - Logement pour elements de contact - Google Patents

Logement pour elements de contact Download PDF

Info

Publication number
WO1987004041A1
WO1987004041A1 PCT/EP1986/000775 EP8600775W WO8704041A1 WO 1987004041 A1 WO1987004041 A1 WO 1987004041A1 EP 8600775 W EP8600775 W EP 8600775W WO 8704041 A1 WO8704041 A1 WO 8704041A1
Authority
WO
WIPO (PCT)
Prior art keywords
housing
solder
contact elements
solder bath
covered
Prior art date
Application number
PCT/EP1986/000775
Other languages
German (de)
English (en)
Inventor
Gerhard Keller
Erich Huber
Rainer Junck
Original Assignee
Schaltbau Gesellschaft Mbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schaltbau Gesellschaft Mbh filed Critical Schaltbau Gesellschaft Mbh
Publication of WO1987004041A1 publication Critical patent/WO1987004041A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing

Definitions

  • the invention relates to a housing for electrical contact elements, ie plugs, sockets or contact springs, which are accommodated on this housing or in openings of the housing required for contacting and are connected to solder connections which penetrate the housing wall and which are intended for tinning in the solder bath are.
  • the invention is based on the object of specifying a housing for contact elements of the type described in the introduction, in which the corresponding parts of the solder connections can be tinned in the solder bath and a coating of the contact elements with tin is avoided.
  • the object is achieved according to the invention in that the housing consists of material which is resistant to the temperature of the solder bath, and the contact elements or the opening are covered with a film which is also resistant to the temperature of the solder bath and can be removed after the treatment in the solder bath .
  • a further, essential advantage of the housing covered with a foil according to the invention is the fact that the contact element can be placed on the carrier of a printed circuit in an automatic assembly machine with the aid of a suction nozzle, because the foil also engages the suction nozzle the parts of the housing that are otherwise not suitable.
  • solder connections intended for tinning are coated in the solder bath, it is advisable to coat the remaining parts of the solder connections with solder mask in a manner known per se.
  • Solder-repelling light metals, molding materials or elastomers, which are placed on with an adhesive or adhesive layer, have proven to be suitable as the material for the covering film.
  • the figures show, in a partially schematic representation, exemplary embodiments of housings according to the teaching of the invention.
  • the sockets 4 arranged in two rows have solder connections 5 which are to be soldered with their surfaces 6 to the circuit.
  • the surfaces 6 must be tinned.
  • the sockets 4 are also coated with tin, the openings 7 into which the sockets 4 are inserted are covered with a film 8 at least for the time of the treatment in the solder bath. As soon as the treatment is completed and the bushings 4 are to be made accessible again, the film 8 is removed.
  • FIG. 1 shows in its lower part of FIG.
  • a cross section through a connector strip 9 is shown, the housing 10 of which has an opening 11 into which a pair of connector pins 12 protrude and which can also receive a socket connector for contacting the connector pins.
  • the plug pins 12 end in solder connections 13, between which, for example, a European map can be inserted and which are connected to the circuit on the card in an electrically conductive manner by soldering.
  • the surfaces 14 of the solder connections 13 are tinned in the solder bath.
  • the opening 11 covered with a foil 15 should be avoided to coat the connector pins 12 with tin.
  • FIG. 2 shows a housing 17 for two rows of opposing contact pins 18, each of which has a solder connection 19.
  • the contact spring strip formed in this way can be fastened on a card in accordance with the socket strip 1 and connected to the connections 19 in an electrically conductive manner.
  • the opening 29 in which the contact springs 18 are contained is closed according to the invention with the film 20.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

Un logement est fait en un matériau résistant à la température d'un bain de soudure et les éléments de contact, ou les ouvertures les contenant, sont recouverts d'une pellicule amovible également résistante à la température du bain de soudure.
PCT/EP1986/000775 1985-12-21 1986-12-22 Logement pour elements de contact WO1987004041A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP3545734.1 1985-12-21
DE3545734 1985-12-21

Publications (1)

Publication Number Publication Date
WO1987004041A1 true WO1987004041A1 (fr) 1987-07-02

Family

ID=6289355

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP1986/000775 WO1987004041A1 (fr) 1985-12-21 1986-12-22 Logement pour elements de contact

Country Status (2)

Country Link
EP (1) EP0250516A1 (fr)
WO (1) WO1987004041A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0405838A2 (fr) * 1989-06-30 1991-01-02 E.I. Du Pont De Nemours And Company Système d'embase
DE102005045896A1 (de) * 2005-09-26 2007-04-19 Siemens Audiologische Technik Gmbh Hörgeräteprogrammierbuchse zur automatischen Leiterplattenbestückung

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3599326A (en) * 1969-01-27 1971-08-17 Philco Ford Corp Method of forming electrical connections with solder resistant surfaces
DE2129918A1 (de) * 1971-06-16 1972-12-21 Siemens Ag Schutzvorrichtung fuer elektrische Bauteile
DE2610823A1 (de) * 1976-03-15 1977-09-22 Erni Elektroapp Elektrische steckverbindung

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3599326A (en) * 1969-01-27 1971-08-17 Philco Ford Corp Method of forming electrical connections with solder resistant surfaces
DE2129918A1 (de) * 1971-06-16 1972-12-21 Siemens Ag Schutzvorrichtung fuer elektrische Bauteile
DE2610823A1 (de) * 1976-03-15 1977-09-22 Erni Elektroapp Elektrische steckverbindung

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0405838A2 (fr) * 1989-06-30 1991-01-02 E.I. Du Pont De Nemours And Company Système d'embase
EP0405838A3 (en) * 1989-06-30 1991-05-08 E.I. Du Pont De Nemours And Company Header device
US5096428A (en) * 1989-06-30 1992-03-17 E. I. Du Pont De Nemours And Company Header device
US5106313A (en) * 1989-06-30 1992-04-21 E. I. Du Pont De Nemours And Company Header device
DE102005045896A1 (de) * 2005-09-26 2007-04-19 Siemens Audiologische Technik Gmbh Hörgeräteprogrammierbuchse zur automatischen Leiterplattenbestückung

Also Published As

Publication number Publication date
EP0250516A1 (fr) 1988-01-07

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