WO1987004041A1 - Housing for contact elements - Google Patents

Housing for contact elements Download PDF

Info

Publication number
WO1987004041A1
WO1987004041A1 PCT/EP1986/000775 EP8600775W WO8704041A1 WO 1987004041 A1 WO1987004041 A1 WO 1987004041A1 EP 8600775 W EP8600775 W EP 8600775W WO 8704041 A1 WO8704041 A1 WO 8704041A1
Authority
WO
WIPO (PCT)
Prior art keywords
housing
solder
contact elements
solder bath
covered
Prior art date
Application number
PCT/EP1986/000775
Other languages
German (de)
French (fr)
Inventor
Gerhard Keller
Erich Huber
Rainer Junck
Original Assignee
Schaltbau Gesellschaft Mbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schaltbau Gesellschaft Mbh filed Critical Schaltbau Gesellschaft Mbh
Publication of WO1987004041A1 publication Critical patent/WO1987004041A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing

Definitions

  • the invention relates to a housing for electrical contact elements, ie plugs, sockets or contact springs, which are accommodated on this housing or in openings of the housing required for contacting and are connected to solder connections which penetrate the housing wall and which are intended for tinning in the solder bath are.
  • the invention is based on the object of specifying a housing for contact elements of the type described in the introduction, in which the corresponding parts of the solder connections can be tinned in the solder bath and a coating of the contact elements with tin is avoided.
  • the object is achieved according to the invention in that the housing consists of material which is resistant to the temperature of the solder bath, and the contact elements or the opening are covered with a film which is also resistant to the temperature of the solder bath and can be removed after the treatment in the solder bath .
  • a further, essential advantage of the housing covered with a foil according to the invention is the fact that the contact element can be placed on the carrier of a printed circuit in an automatic assembly machine with the aid of a suction nozzle, because the foil also engages the suction nozzle the parts of the housing that are otherwise not suitable.
  • solder connections intended for tinning are coated in the solder bath, it is advisable to coat the remaining parts of the solder connections with solder mask in a manner known per se.
  • Solder-repelling light metals, molding materials or elastomers, which are placed on with an adhesive or adhesive layer, have proven to be suitable as the material for the covering film.
  • the figures show, in a partially schematic representation, exemplary embodiments of housings according to the teaching of the invention.
  • the sockets 4 arranged in two rows have solder connections 5 which are to be soldered with their surfaces 6 to the circuit.
  • the surfaces 6 must be tinned.
  • the sockets 4 are also coated with tin, the openings 7 into which the sockets 4 are inserted are covered with a film 8 at least for the time of the treatment in the solder bath. As soon as the treatment is completed and the bushings 4 are to be made accessible again, the film 8 is removed.
  • FIG. 1 shows in its lower part of FIG.
  • a cross section through a connector strip 9 is shown, the housing 10 of which has an opening 11 into which a pair of connector pins 12 protrude and which can also receive a socket connector for contacting the connector pins.
  • the plug pins 12 end in solder connections 13, between which, for example, a European map can be inserted and which are connected to the circuit on the card in an electrically conductive manner by soldering.
  • the surfaces 14 of the solder connections 13 are tinned in the solder bath.
  • the opening 11 covered with a foil 15 should be avoided to coat the connector pins 12 with tin.
  • FIG. 2 shows a housing 17 for two rows of opposing contact pins 18, each of which has a solder connection 19.
  • the contact spring strip formed in this way can be fastened on a card in accordance with the socket strip 1 and connected to the connections 19 in an electrically conductive manner.
  • the opening 29 in which the contact springs 18 are contained is closed according to the invention with the film 20.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

A housing is made of a material which is resistant to the temperature of a soldering bath and the contact elements, or the openings which contain them, are covered with a removable foil equally resistant to the temperature of the soldering bath.

Description

Gehäuse für KontaktelementeHousing for contact elements
Gegenstand der Erfindung ist ein Gehäuse für elek¬ trische Kontaktelemente, ie Stecker, Buchsen oder Kontaktfedern, die an diesem Gehäuse oder in zur Kontaktgabe erforderlichen Öffnungen des Gehäuses untergebracht sind und mit die Gehäusewandung durch¬ setzenden Lötanschlüssen verbunden sind, die zum Verzinnen im Lötbad bestimmt sind.The invention relates to a housing for electrical contact elements, ie plugs, sockets or contact springs, which are accommodated on this housing or in openings of the housing required for contacting and are connected to solder connections which penetrate the housing wall and which are intended for tinning in the solder bath are.
Bei Anordnungen der eingangs beschriebenen Art besteht die Schwierigkeit, die zur Kontaktgabe nach außen be¬ stimmten Teile der Lötanschlusse im Lötbad zu verzinnen und dabei zu vermeiden, daß dabei auch die Kontakt¬ elemente selbst mit einer Zinnschicht bedeckt werden.In the case of arrangements of the type described at the outset, there is a difficulty in tinning the parts of the solder connections intended for making contact with the outside in the solder bath and thereby avoiding that the contact elements themselves are also covered with a layer of tin.
Der Erfindung liegt die Aufgabe zugrunde, ein Gehäuse für Kontaktelemente der eingangs beschriebenen Art an¬ zugeben, bei dem die entsprechenden Teile der Lötan¬ schlüsse im Lötbad verzinnt werden können und eine Beschichtung der Kontaktelemente mit Zinn vermieden wird. Die Aufgabe wird gemäß der Erfindung dadurch- gelöst, daß das Gehäuse aus gegen die Temperatur des Lötbades beständigem Material besteht,und die Kontaktelemente oder die Öffnung mit einer ebenfalls gegen die Tempe¬ ratur des Lötbades beständige und nach der Behandlung im Lötbad entfernbaren Folie abgedeckt sind.The invention is based on the object of specifying a housing for contact elements of the type described in the introduction, in which the corresponding parts of the solder connections can be tinned in the solder bath and a coating of the contact elements with tin is avoided. The object is achieved according to the invention in that the housing consists of material which is resistant to the temperature of the solder bath, and the contact elements or the opening are covered with a film which is also resistant to the temperature of the solder bath and can be removed after the treatment in the solder bath .
Der besondere Vorteil der erfindungsgemäßen Lösung ist darin zu sehen, daß die gestellte Aufgabe mit geringem Aufwand gelöst wird und darüber hinaus durch Anbringen der Folie schon bei der Herstellung des Gehäuses bis zum Einbau in eine Schaltung die Kontaktelemente gegen Verschmutzen und im gewissen Umfang auch gegen Be¬ schädigung geschützt sind. Da auch Schutz gegen korrodierende Medien gegeben ist, wird die Verwendung von Kontaktelementen aus weniger edelem Material als dem herkömmlichen ermöglicht.The particular advantage of the solution according to the invention can be seen in the fact that the object is achieved with little effort and, moreover, by attaching the film already during the manufacture of the housing until installation in a circuit, the contact elements against contamination and to a certain extent also against loading ¬ damage are protected. Since protection against corrosive media is also provided, the use of contact elements made of less noble material than the conventional one is made possible.
"Ein weiterer, wesentlicher Vorteil des erfindungs¬ gemäß mit einer Folie abgedeckten Gehäuses ist darin zu sehen, daß das Kontaktelement auf den Träger einer gedruckten Schaltung in einem Bestückungsautomaten mit Hilfe eines Saugrüssels aufgesetzt werden kann, weil die Folie eine Angriffsfläche für den Saugrüssel auch an den Teilen des Gehäuses bietet, die sonst dafür nicht geeignet sind. " A further, essential advantage of the housing covered with a foil according to the invention is the fact that the contact element can be placed on the carrier of a printed circuit in an automatic assembly machine with the aid of a suction nozzle, because the foil also engages the suction nozzle the parts of the housing that are otherwise not suitable.
Um zu bewirken, daß im Lötbad nur die zum Verzinnen vorgesehenen Teile der Lötanschlüsse beschichtet werden, empfiehlt es sich^in an sich bekannter Weise die übrigen Teile der Lötanschlüsse mit Lötstopplack zu beschichten.In order to ensure that only the parts of the solder connections intended for tinning are coated in the solder bath, it is advisable to coat the remaining parts of the solder connections with solder mask in a manner known per se.
Als Material für die abdeckende Folie haben sich Lot abstoßende Leichtmetalle, Formstoffe oder Elastomere bewährt, die mit einer Haft- oder Klebeschicht aufge¬ legt werden. Die Figuren zeigen in zum Teil schematischer Darstellung Ausführungsbeispiele von Gehäusen nach der Lehre der Erfindung.Solder-repelling light metals, molding materials or elastomers, which are placed on with an adhesive or adhesive layer, have proven to be suitable as the material for the covering film. The figures show, in a partially schematic representation, exemplary embodiments of housings according to the teaching of the invention.
Die Figur 1 zeigt in ihrem unteren Teil ein Gehäuse 2, das mit der Fläche 3 auf dem Träger einer gedruckten Schaltung, zum Beispiel einer Europakarte aufgesetzt werden kann. Die in zwei Reihen angeordneten Buchsen 4 haben Lötanschlüsse 5, die mit ihren Flächen 6 mit der Schaltung verlötet werden sollen. Zu diesem Zweck müssen die Flächen 6 verzinnt werden. Um zu vermeiden, daß beim Verzinnen der Flächen 6 im Lötbad die Buchsen 4 ebenfalls mit Zinn beschichtet werden, sind gemäß der Erfindung die Öffnungen 7 in die die Buchsen 4 eingesetzt sind, mindestens für die Zeit der Behandlung im Lötbad mit einer Folie 8 abgedeckt. Sobald die Behandlung abge¬ schlossen ist und die Buchsen 4 wieder zugänglich gemacht werden sollen, wird die Folie 8 abgezogen. Im oberen Teil der Figur 1 ist ein Querschnitt durch eine Stecker¬ leiste 9 dargestellt, deren Gehäuse 10 eine Öffnung 11 aufweist, in die ein Paar Steckerstifte 12 hineinragt und die auch eine Buchsenleiste zur Kontaktgabe mit den Steckerstiften aufnehmen kann. Die Steckerstifte 12 enden in Lötanschlüssen 13, zwischen die zum Beispiel eine Europakarte eingefügt werden kann und die mit der auf der Karte befindlichen Schaltung durch Verlöten elektrisch leitend verbunden werden. Zu diesem Zweck werden die Flächen 14 der Lötanschlüsse 13 im Lötbad verzinnt. Auch hier ist mindestens während der Behand¬ lung im Lötbad die Öffnung 11 mit einer Folie 15 abge¬ decktem eine Beschichtung der Steckerstifte 12 mit Zinn zu vermeiden. Sollten die beiden Wangen 16 des Gehäuses kürzer ausgeführt oder ganz weggelassen werden, so werden die Steckerstifte 12 in entsprechendem Umfang mit einer Folie bedeckt. Figur 2 zeigt ein Gehäuse 17 für zwei Reihen einander gegenüberliegender Kontaktstifte 18, deren jede einen Lötanschluß 19 aufweist. Die so gebildete Kontaktfeder¬ leiste kann entsprechend der Buchsenleiste 1 auf einer Karte befestigt werden und mit den Anschlüssen 19 elek¬ trisch leitend verbunden werden. Die Öffnung 29 in der die Kontaktfedern 18 enthalten sind, ist gemäß der Erfindung mit der Folie 20 verschlossen. 1 shows in its lower part a housing 2, which can be placed with the surface 3 on the carrier of a printed circuit, for example a map of Europe. The sockets 4 arranged in two rows have solder connections 5 which are to be soldered with their surfaces 6 to the circuit. For this purpose, the surfaces 6 must be tinned. In order to avoid that when tinning the surfaces 6 in the solder bath the sockets 4 are also coated with tin, the openings 7 into which the sockets 4 are inserted are covered with a film 8 at least for the time of the treatment in the solder bath. As soon as the treatment is completed and the bushings 4 are to be made accessible again, the film 8 is removed. In the upper part of FIG. 1, a cross section through a connector strip 9 is shown, the housing 10 of which has an opening 11 into which a pair of connector pins 12 protrude and which can also receive a socket connector for contacting the connector pins. The plug pins 12 end in solder connections 13, between which, for example, a European map can be inserted and which are connected to the circuit on the card in an electrically conductive manner by soldering. For this purpose, the surfaces 14 of the solder connections 13 are tinned in the solder bath. Here too, at least during the treatment in the solder bath, the opening 11 covered with a foil 15 should be avoided to coat the connector pins 12 with tin. If the two cheeks 16 of the housing are made shorter or are omitted entirely, the connector pins 12 are covered to a corresponding extent with a film. FIG. 2 shows a housing 17 for two rows of opposing contact pins 18, each of which has a solder connection 19. The contact spring strip formed in this way can be fastened on a card in accordance with the socket strip 1 and connected to the connections 19 in an electrically conductive manner. The opening 29 in which the contact springs 18 are contained is closed according to the invention with the film 20.

Claims

Patentansprüche Claims
1. Gehäuse für elektrische Kontaktelemente, wie Stecker, Buchsen oder Kontaktfedern, die an diesem Gehäuse oder in zur Kontaktgabe erforderlichen Öffnungen des Gehäuses untergebracht sind und mit die Gehäuse¬ wand durchsetzenden Lötanschlüssen verbunden sind, die zum Verzinnen im Lötbad bestimmt sind, dadurch gekennzeichnet, daß das Gehäuse (2,10,17) aus gegen die Temperatur des Lötbades beständigem Material besteht und die Kontaktelemente oder die Öffnungen (7,11, 29) mit einer ebenfalls gegen die Temperatur des Lötbades beständigen und nach der Behandlung im Lötbad entfernbaren Folie (8,15,20) abgedeckt sind.1. Housing for electrical contact elements, such as plugs, sockets or contact springs, which are accommodated on this housing or in openings of the housing required for contacting and are connected to the solder connections passing through the housing and which are intended for tinning in the solder bath, characterized in that that the housing (2, 10, 17) consists of material that is resistant to the temperature of the solder bath and the contact elements or the openings (7, 11, 29) are covered with a film that is also resistant to the temperature of the solder bath and that can be removed after the treatment in the solder bath ( 8,15,20) are covered.
2. Gehäuse nach Anspruch 1, dadurch gekennzeichnet, daß die Teile der Lötanschlüsse (5,13,19), die im Lötbad kein Lot aufnehmen sollen, mit Lötstopplack beschichtet sind.2. Housing according to claim 1, characterized in that the parts of the solder connections (5, 13, 19) which are not intended to take up any solder in the solder bath are coated with solder mask.
3. Gehäuse nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß die Folie (8,13,20) aus einem Lot abstoßenden Leichtmetall, Formstoff oder Elastomer besteht und durch eine lösbare Haft- oder Klebeschicht aufge- legt ist. 3. Housing according to claim 1 or 2, characterized in that the film (8,13,20) consists of a solder-repellent light metal, molding material or elastomer and is applied by a releasable adhesive or adhesive layer.
PCT/EP1986/000775 1985-12-21 1986-12-22 Housing for contact elements WO1987004041A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP3545734.1 1985-12-21
DE3545734 1985-12-21

Publications (1)

Publication Number Publication Date
WO1987004041A1 true WO1987004041A1 (en) 1987-07-02

Family

ID=6289355

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP1986/000775 WO1987004041A1 (en) 1985-12-21 1986-12-22 Housing for contact elements

Country Status (2)

Country Link
EP (1) EP0250516A1 (en)
WO (1) WO1987004041A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0405838A2 (en) * 1989-06-30 1991-01-02 E.I. Du Pont De Nemours And Company Header device
DE102005045896A1 (en) * 2005-09-26 2007-04-19 Siemens Audiologische Technik Gmbh Hearing device e.g. headset and programming socket has soldered joint sections for connection at printed circuit board of hearing device and infused in cover having opening which is designed rectangular or square

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3599326A (en) * 1969-01-27 1971-08-17 Philco Ford Corp Method of forming electrical connections with solder resistant surfaces
DE2129918A1 (en) * 1971-06-16 1972-12-21 Siemens Ag Protection device for electrical components
DE2610823A1 (en) * 1976-03-15 1977-09-22 Erni Elektroapp Plug connector with plug or socket assembly - is connected with edge of printed circuit board and has terminal conductor clamped by assembly itself

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3599326A (en) * 1969-01-27 1971-08-17 Philco Ford Corp Method of forming electrical connections with solder resistant surfaces
DE2129918A1 (en) * 1971-06-16 1972-12-21 Siemens Ag Protection device for electrical components
DE2610823A1 (en) * 1976-03-15 1977-09-22 Erni Elektroapp Plug connector with plug or socket assembly - is connected with edge of printed circuit board and has terminal conductor clamped by assembly itself

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0405838A2 (en) * 1989-06-30 1991-01-02 E.I. Du Pont De Nemours And Company Header device
EP0405838A3 (en) * 1989-06-30 1991-05-08 E.I. Du Pont De Nemours And Company Header device
US5096428A (en) * 1989-06-30 1992-03-17 E. I. Du Pont De Nemours And Company Header device
US5106313A (en) * 1989-06-30 1992-04-21 E. I. Du Pont De Nemours And Company Header device
DE102005045896A1 (en) * 2005-09-26 2007-04-19 Siemens Audiologische Technik Gmbh Hearing device e.g. headset and programming socket has soldered joint sections for connection at printed circuit board of hearing device and infused in cover having opening which is designed rectangular or square

Also Published As

Publication number Publication date
EP0250516A1 (en) 1988-01-07

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