WO1985002629A1 - Installation pour le traitement d'objets au moyen d'un liquide - Google Patents

Installation pour le traitement d'objets au moyen d'un liquide Download PDF

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Publication number
WO1985002629A1
WO1985002629A1 PCT/EP1984/000367 EP8400367W WO8502629A1 WO 1985002629 A1 WO1985002629 A1 WO 1985002629A1 EP 8400367 W EP8400367 W EP 8400367W WO 8502629 A1 WO8502629 A1 WO 8502629A1
Authority
WO
WIPO (PCT)
Prior art keywords
liquid
nozzle
objects
individual
control valves
Prior art date
Application number
PCT/EP1984/000367
Other languages
German (de)
English (en)
Inventor
Hans HÖLLMÜLLER
Original Assignee
Hoellmueller Hans
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoellmueller Hans filed Critical Hoellmueller Hans
Publication of WO1985002629A1 publication Critical patent/WO1985002629A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/068—Apparatus for etching printed circuits

Definitions

  • the invention relates to a device for treating objects by means of a liquid, in particular an etching or developing machine for the production of printed circuit boards, the objects having a layer on the surface which is partially removed under the action of the liquid with the formation of a pattern with at least one nozzle assembly containing a plurality of nozzles, with at least one liquid sump, with at least one
  • the object of the present invention is to design a device of the type mentioned at the outset in such a way that a more variable spray pattern which can be better matched to the particular material to be treated is achieved, so that local over- or under-treatments can be avoided.
  • each nozzle is assigned an individual liquid supply line which leads to the liquid collecting line;
  • the invention is based on the knowledge that the disadvantages described above are inherent in the known devices of the type mentioned above mainly because the nozzles are arranged there directly on the liquid collecting line and their individual liquid throughput cannot be influenced.
  • liquid paths are provided which are individually assigned to the individual nozzles, it is possible to add a separate control valve to each nozzle, with which the amount of liquid flowing through this nozzle can be individually adjusted. In this way, spray patterns can be achieved that could not be achieved with known machines. In particular, certain areas of the material to be treated can be sprayed more or less; puddles can also be reliably avoided in this way.
  • control valves can be operated by hand and are arranged as a battery on the outside of the device.
  • control valves are electrically operated.
  • they can also be arranged directly on the nozzle, as a result of which the individual supply lines to the nozzles become particularly short.
  • Figure 1 schematically the side view of the etchant system of an etching machine
  • Figure 2 the top view of Figure 1, partially in section
  • the etchant system comprises a nozzle assembly 1, which is plate-shaped in the example shown.
  • the nozzle stock 1 carries in a regular arrangement twenty nozzles D1 to D20, the spray openings of which are directed downwards in FIG. 1.
  • Each nozzle D1 to D20 is connected to a connection A1 to A20 via an individual channel K1 to K20 which is assigned to it and runs in the nozzle assembly 1.
  • FIGS. 1 and 2 only the connections A3, A4 and A20 are drawn in FIGS. 1 and 2; the connections A1, A2 and A5 to AI9 were not shown in order to relieve the drawing.
  • connections A1 to A20 which are all located on the same longitudinal side of the nozzle assembly 1, are connected via flexible hose pieces S1 to S20, in each case a flow meter M1 to M20 and in each case a control valve V1 to V20 to an etching agent collecting line 2.
  • a flow meter M1 to M20 in each case a flow meter M1 to M20 and in each case a control valve V1 to V20 to an etching agent collecting line 2.
  • the collecting line 2 leads to a pump 3 which is immersed in the etching sump 4 of the etching machine.
  • the flow rate measurement can also be replaced by a dynamic pressure measurement upstream of the throttle point using the Bernoulli equation.
  • the flow meters M1 to M20 which are designed as pressure gauges, would have to be - unlike in the drawing upstream are installed by control valves V1 to V20 directly behind the pump '.
  • the use of pressure sensors operating as flow meters is advantageous for cost reasons and because of the simplicity with which the output signal can be processed further.
  • the pump 3 conveys etchant from the sump 4 to the collecting line 2. This branches there and flows via the control valves V1 to V20, the flow meters M1 to M20, the hose sections S1 to S20 and the channels K1 to K20 to the Nozzles D1 to D20.
  • the control valves V1 to V20 not only make it possible to shut off entire rows of nozzles D1 to D20. In this way, in the case of etching machines operating in a continuous process, the residence time of the etched material within the etching zone can be changed. In addition, the amount of etching agent emerging from each individual nozzle D1 to D20 can be adjusted individually, thereby achieving a spray pattern of the nozzle assembly 1 that is adapted to the specific etched material becomes. In this way, certain areas of the etched material can thus be exposed to the etchant in a targeted manner to a greater extent, while others can be exposed to the etchant, which in particular prevents undesired puddling.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

Installation pour le traitement d'objets au moyen d'un liquide, en particulier une machine de gravure ou de développement pour la fabrication de cartes de circuit imprimés, où la quantité de liquide de traitement qui coule vers les différentes buses placées dans une tige de buses peut être réglée séparément pour chaque buse. A cet effet est adjointe à chaque buse une conduite individuelle d'amenée de liquide dans laquelle est disposée une vanne de régulation. De cette façon, il est possible d'obtenir des modèles de pulvérisation pouvant être adaptés à l'objet à traiter d'une manière qui était jusqu'ici impossible.
PCT/EP1984/000367 1983-12-14 1984-11-23 Installation pour le traitement d'objets au moyen d'un liquide WO1985002629A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19833345206 DE3345206A1 (de) 1983-12-14 1983-12-14 Vorrichtung zur behandlung von gegenstaenden mittels einer fluessigkeit
DEP3345206.7 1983-12-14

Publications (1)

Publication Number Publication Date
WO1985002629A1 true WO1985002629A1 (fr) 1985-06-20

Family

ID=6216906

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP1984/000367 WO1985002629A1 (fr) 1983-12-14 1984-11-23 Installation pour le traitement d'objets au moyen d'un liquide

Country Status (3)

Country Link
EP (1) EP0164377A1 (fr)
DE (1) DE3345206A1 (fr)
WO (1) WO1985002629A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0611483A1 (fr) * 1991-11-07 1994-08-24 ATOTECH USA INC. (a Delaware corp.) Procede et appareil d'attaque chimique par pulverisation regulee

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0354266B1 (fr) * 1988-08-12 1993-10-20 International Business Machines Corporation Procédé et appareil pour le décapage de pièces composées au moins partiellement de métal
EP1885138B1 (fr) * 2006-07-11 2012-06-06 Hewlett-Packard Development Company, L.P. Passerelle de signalisation

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2001790A1 (de) * 1969-07-14 1971-02-18 Buckbee Mears Co Einrichtung und Verfahren zum gesteuerten AEtzen ohne AEtzmittelabdecker

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2001790A1 (de) * 1969-07-14 1971-02-18 Buckbee Mears Co Einrichtung und Verfahren zum gesteuerten AEtzen ohne AEtzmittelabdecker

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0611483A1 (fr) * 1991-11-07 1994-08-24 ATOTECH USA INC. (a Delaware corp.) Procede et appareil d'attaque chimique par pulverisation regulee
EP0611483A4 (fr) * 1991-11-07 1995-05-03 Chemcut Corp Procede et appareil d'attaque chimique par pulverisation regulee.

Also Published As

Publication number Publication date
DE3345206A1 (de) 1985-06-27
EP0164377A1 (fr) 1985-12-18

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